CN1317659A - 电磁阀集合体 - Google Patents

电磁阀集合体 Download PDF

Info

Publication number
CN1317659A
CN1317659A CN01112495A CN01112495A CN1317659A CN 1317659 A CN1317659 A CN 1317659A CN 01112495 A CN01112495 A CN 01112495A CN 01112495 A CN01112495 A CN 01112495A CN 1317659 A CN1317659 A CN 1317659A
Authority
CN
China
Prior art keywords
electromagnetic valve
substrate
intergrated circuit
aggregate
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN01112495A
Other languages
English (en)
Inventor
远藤胜久
源马宏一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SMC Corp
Original Assignee
SMC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18619875&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1317659(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SMC Corp filed Critical SMC Corp
Publication of CN1317659A publication Critical patent/CN1317659A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B13/00—Details of servomotor systems ; Valves for servomotor systems
    • F15B13/02—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors
    • F15B13/06—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors for use with two or more servomotors
    • F15B13/08—Assemblies of units, each for the control of a single servomotor only
    • F15B13/0803—Modular units
    • F15B13/0832—Modular valves
    • F15B13/0839—Stacked plate type valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/06—Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B13/00—Details of servomotor systems ; Valves for servomotor systems
    • F15B13/02—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors
    • F15B13/06—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors for use with two or more servomotors
    • F15B13/08—Assemblies of units, each for the control of a single servomotor only
    • F15B13/0803—Modular units
    • F15B13/0807—Manifolds
    • F15B13/0817—Multiblock manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B13/00—Details of servomotor systems ; Valves for servomotor systems
    • F15B13/02—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors
    • F15B13/06—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors for use with two or more servomotors
    • F15B13/08—Assemblies of units, each for the control of a single servomotor only
    • F15B13/0803—Modular units
    • F15B13/0821—Attachment or sealing of modular units to each other
    • F15B13/0825—Attachment or sealing of modular units to each other the modular elements being mounted on a common member, e.g. on a rail
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B13/00—Details of servomotor systems ; Valves for servomotor systems
    • F15B13/02—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors
    • F15B13/06—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors for use with two or more servomotors
    • F15B13/08—Assemblies of units, each for the control of a single servomotor only
    • F15B13/0803—Modular units
    • F15B13/0846—Electrical details
    • F15B13/0853—Electric circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B13/00—Details of servomotor systems ; Valves for servomotor systems
    • F15B13/02—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors
    • F15B13/06—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors for use with two or more servomotors
    • F15B13/08—Assemblies of units, each for the control of a single servomotor only
    • F15B13/0803—Modular units
    • F15B13/0846—Electrical details
    • F15B13/0857—Electrical connecting means, e.g. plugs, sockets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B13/00—Details of servomotor systems ; Valves for servomotor systems
    • F15B13/02—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors
    • F15B13/06—Fluid distribution or supply devices characterised by their adaptation to the control of servomotors for use with two or more servomotors
    • F15B13/08—Assemblies of units, each for the control of a single servomotor only
    • F15B13/0803—Modular units
    • F15B13/0875—Channels for electrical components, e.g. for cables or sensors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8376—Combined
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87885—Sectional block structure

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Magnetically Actuated Valves (AREA)
  • Valve Housings (AREA)

Abstract

基板(24a到24e)安装在固定于构成电磁阀集合体(10)的集合块(12a到12e)上的电磁阀(16a到16e)上，其中每个基板上装有包含耦合集成电路(32a到32e)的裸芯片状态的全部或部分电子元件(30)。因此，能够使电磁阀集合体(10)小型化。

Description

电磁阀集合体
本发明涉及一种电磁阀集合体(manifold)。更确切地讲，本发明涉及一种电磁阀集合体，其中，一基板上装有裸芯片状态的包含耦合集成电路(耦合IC)的电子元件，上述基板安装在电磁阀或者集合体上，因而可以有效地实现小型化。
在通常情况下，当执行连续传输时，一电磁阀集合体包含多个固定在一集合体上的电磁阀，其中，带有光耦合元件的驱动电路分别在多个电磁阀上操作。而且，集合体包含一个将串联信号转换为并联信号的串/并联转换器，其中还设置有用在信号线路和电源线路上的电连接件和其它元件。
然而，就这种电磁阀集合体来说，用于驱动电磁阀的驱动回路的基板是分别为多个电磁阀设置的。而且，用于串/并联转换器的基板设置在集合体上，其中基板与包含耦合集成电路的电子元件组装在一起。因此，为了使电磁阀集合体进一步小型化，就必须减小基板的尺寸。
本发明的总的目的是提供一种电磁阀集合体，其中全部或者部分包含耦合集成电路的电子元件以裸芯片状态安装在基板上，并且，基板安装在电磁阀或者集合体上，可以减小电磁阀集合体的体积，因此，成功地实现小型化。
下面，通过结合附图对本发明进行说明，本发明的上述和其它目的、特点和优点会更清楚地显示出来，在附图中，通过说明性的实例示出了本发明的一个优选实施例。
图1表示本发明第一优选实施例的电磁阀集合体的透视图；
图2表示用于图1所示的电磁阀集合体的基板的放大透视图；
图3表示另一种基板的放大透视图；
图4表示再一种基板的放大透视图；
图5表示又一种基板的放大透视图；
图6表示图1所示的电磁阀集合体的线路图；
图7表示图1所示的电磁阀集合体的修改实施例的透视图，其表示出将基板安装在每个集合块内部的一种状态；
图8表示本发明第二实施例的电磁阀集合体的透视图；
图9表示图8所示的电磁阀集合体的修改实施例的透视图，其表示出将基板安装在每个电磁阀内部的一种状态；
图10表示本发明第三实施例的电磁阀集合体的透视图；
图11表示图10所示的电磁阀集合体的修改实施例的透视图，其表示出将基板安装在中间单元内部的一种状态；
图1表示出本发明一实施例中的电磁阀集合体10。如图1所示，电磁阀集合体10包含多个集合块12a到12e，这些集合块相邻地并排平行设置，从而构成一集合体34，该集合体安装在导轨14上。电磁阀16a到16b分别安装在集合块12a到12e上。一中间单元20安装在集合块12a的一侧表面上，其中，该中间单元与一端板18整体安装在导轨14上。安装在导轨14上的端板22与集合块12e的一侧表面相连。
如图2所示，基板24装有多个电子元件30和裸芯片状态的耦合集成电路32(下面称为“耦合IC32”)。借助销钉(未示出)，将基板24安装于在集合块12a到12e的相应侧表面上形成的每个凹部26a到26e内。如图7所示，借助于未示出的销钉，可以将基板24a到24e固定在集合块12a到12e的内部。
在这一方案中，如图6所示的线路图，各个基板24a到24e借助于连接件60a到60e(在图6中，连接件60c,60d省略)彼此电连接。基板28装有一个后面将讲到的DC/DC转换器56，该基板28与中间单元20的侧表面相连。如图6所示，基板28与连接件44,46,60a连接。如图11所示，基板28可以设置在中间单元20内部。
图3表示一基板38，其上装有多个电子元件30和以裸芯片状态模压形成的耦合集成电路32，以避免破损和防止灰尘或者类似物侵入。图4表示一基板40，其中，整个基板模压形成，并带有全部或部分是裸芯片状态的耦合集成电路32和电子元件30。图5表示一元件42，其中，整个基板构成一个集电成路，并带有全部或部分是裸芯片状态的耦合集成电路32和多个电子元件30。
图6表示图1所示的电磁阀集合体10的线路图。参照附图6，中间单元20设置有连接件44,46。连接件44包含一电源线48，其设有24伏和0伏的直流(DC)电源；一第一信号线50，其将一个从控制装置(未示出)例如顺序控制器传输的传输信号S1输送给电磁阀16a到16e的各个耦合集成电路32a到32e，并向下一个装置(例如未表示出的电磁阀)传输信号；以及一第二信号线52，其将从另一个控制设备例如一电磁阀发出的传输信号S2通过耦合集成电路32a到32e传送给下一装置例如一电磁阀。
连接件46包含一条从电源线48分支出来的电源线54，该电源线向下一个装置(例如一电磁阀)输入24伏和0伏的直流电；一第一信号线50；以及一第二信号线52。连接件44,46与基板28连接。DC/DC转换器56装在与中间单元20相连的基板28上。DC/DC转换器56将流过电源线48的24伏和0伏的直流电压转换为5伏和0伏的直流电压，而后，通过电源线58将5伏和0伏的直流电压输送到耦合集成电路32a到32e。
连接件60a到60e(在图6中，省略了连接件60c,60d)设置在由集合块12a到12e(在图6中，省略了集合块12b,12c,12d)构成的集合体34上并且，安装在端板22上的连接件62设置有电源线48、第一信号线50、第二信号线52和电源线58。
安装在端板22上的连接件62包含的回路64、66与中间单元20的连接件44,46连接，回路的第一端与基板24e连接，它们的第二端使第一信号线50和第二信号线52分别从耦合集成电路32a到32e输入/输出。
电磁阀16a到16e分别设置有第一线圈68a到68e和第二线圈70a到70e。从24伏直流电源线48分支出来的各个电源线72a到72e分别与第一线圈68a到68e和第二线圈70a到70e连接。晶体管74a到74e、76a到76e的集电极分别与上述线圈连接。晶体管74a到74e、76a到76e的基极分别与引向耦合集成电路32a到32e的信号线78a到78e、80a到80e连接。各个晶体管74a到74e、76a到76e的发射极分别与从0伏电源线48分支出来的电源线82a到82e连接。附图标记84a到84e代表同时操纵第一线圈68a到68e和第二线圈70a到70e的每个转换开关，或者进行转换，从而使任一线圈都处于工作状态。当转换开关84a到84e断开时，第一线圈68a到68e和第二线圈70a到70e同时工作。当转换开关84a到84e接通时，第一线圈68a到68e和第二线圈70a到70e中的任何一个都处于工作状态。
上面所描述的是本发明实施例中电磁阀集合体10的基本结构。下面，参照附图6所示的线路图，说明其工作过程、功能和作用。
将操纵电磁阀16a到16e之一的数字信号命令从外部通过连接件44和第一信号线50输送到耦合集成电路32a到32e之一。对于耦合集成电路32a到32e，例如当数字信号输入到耦合集成电路32a时，接通信号从耦合集成电路32a通过信号线78a、80a分别经过晶体管74a、76a基极。晶体管74a、76a的集电极和发射极彼此分别连通。电流流过电磁阀16a的每个第一线圈68a和第二线圈70a。因此，控制电磁阀16a的操作。在这个实施例中，当电磁阀16a的第一线圈68a和第二线圈70a中的任何一个操作时，都可以事先将转换开关84a接通。
其它电磁阀16b到16e以与电磁阀16a相同的方式进行操作，在此不再赘述。
另一方面，将通过连接件46从另一个电磁阀输送的第二信号线52中的数字信号输送到耦合集成电路32e到32a上。借助于连接件44，数字信号通过耦合集成电路32e到32a输送到下一个未示出的电磁阀上。
图8表示本发明第二实施例中的电磁阀集合体90。各个基板24a到24e安装到在电磁阀16a到16e上部形成的凹部36a到36e上，而且，基板彼此用电线连接。如图9所示，基板24a到24e可以安装在电磁阀16a到16e的内部。
图10表示本发明第三实施例中的电磁阀集合体100的示意图。各个基板24a到24e基本上沿着中间单元20的侧表面顺序固定，而且，它们彼此用电线连接。如图11所示，基板24a到24e可以安装在中间单元20的内部。
当然，在本发明中，基板24a到24e的安装位置不仅局限于上面所涉及的图1和图7到11所示的电磁阀集合体10,10a,90,90a,100,100a上的部分，基板可以很好地与任何部分相连，例如集合块12a到12e、电磁阀16a到16e以及其它元件的内部和外侧表面上。
按照第一到第三实施例，例如基板24,24a到24e,38,40或者元件42都安装在集合体34(集合块12a到12e)或者电磁阀16a到16e上。进一步讲，包含耦合集成电路32,32a到32e的所有或者部分电子元件30都可以在基板24,24a到24e,38,40内小型化。因此，可以减小电磁阀集合体10,10a,90,90a,100,100a的体积。从而，能使电磁阀集合体10,10a,90,90a,100,100a实现小型化。

Claims (16)

1．一种电磁阀集合体，包含：多个与集合体(34)相连的电磁阀(16a到16e)，以及一中间单元(20)，其与所述集合体(34)相邻并列设置，其中：
一基板(24a到24e,38,40,42)装配在构成所述集合体(34)的集合块(12a到12e)的外表面上形成的每个凹槽(26a到26e)内，其中基板上装有包含耦合集成电路(32,32a到32e)的电子元件(30)。
2．根据权利要求1所述的电磁阀集合体，其中，所述基板(24a到24e)安装于在所述电磁阀(16a到16e)的外表面上形成的每个凹槽(36a到36e)内。
3．根据权利要求1所述的电磁阀集合体，其中，所述基板(24a到24e)基本上顺序地沿着所述中间单元(20)的外侧表面而安装。
4．根据权利要求1所述的电磁阀集合体，其中，所述基板(38)包含一个经模压成型的耦合集成电路(32)。
5．根据权利要求1所述的电磁阀集合体，其中，所述基板(40)包含一个与所述电子元件(30)一起模压成型的耦合集成电路(32)。
6．根据权利要求1所述的电磁阀集合体，其中，所述基板由一元件(42)构成，其中所述整个基板形成一个集成电路，在该集成电路上装有所述电子元件(30)和所述耦合集成电路(32)。
7．根据权利要求1所述的电磁阀集合体，其中，所述耦合集成电路(32)设置为裸芯片状态。
8．根据权利要求1所述的电磁阀集合体，还包含用于使所述邻接的集合块(12a到12e)彼此电连接的连接件(60a到60e)。
9．一种电磁阀集合体，包含：多个与集合体(34)相连的电磁阀(16a到16e)，以及一中间单元(20)，其与所述集合体(34)相邻并列设置，其中：
一基板(24a到24e,38,40,42)装配在构成所述集合体(34)的每个集合块(12a到12e)的内部，其中基板上安装有包含耦合集成电路(32,32a到32e)的电子元件(30)。
10．根据权利要求9所述的电磁阀集合体，其中，所述基板(24a到24e)安装在每个所述电磁阀(16a到16e)的内部。
11．根据权利要求9所述的电磁阀集合体，其中，所述基板(24a到24e)安装在所述中间单元(20)的内部。
12．根据权利要求9所述的电磁阀集合体，其中，所述基板(38)包含一个经模压成型的耦合集成电路(32)。
13．根据权利要求9所述的电磁阀集合体，其中，所述基板(40)包含一个与所述电子元件(30)一起模压成型的耦合集成电路(32)。
14．根据权利要求9所述的电磁阀集合体，其中，所述基板由一元件(42)构成，其中所述整个基板形成一个集成电路，在该集成电路上装有所述电子元件(30)和所述耦合集成电路(32)。
15．根据权利要求9所述的电磁阀集合体，其中，所述耦合集成电路(32)设置为裸芯片状态。
16．根据权利要求9所述的电磁阀集合体，还包含用于使所述邻接的集合块(12a到12e)彼此电连接的连接件(60a到60e)。
CN01112495A 2000-04-07 2001-04-06 电磁阀集合体 Pending CN1317659A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP106758/2000 2000-04-07
JP2000106758 2000-04-07

Publications (1)

Publication Number Publication Date
CN1317659A true CN1317659A (zh) 2001-10-17

Family

ID=18619875

Family Applications (1)

Application Number Title Priority Date Filing Date
CN01112495A Pending CN1317659A (zh) 2000-04-07 2001-04-06 电磁阀集合体

Country Status (4)

Country Link
US (1) US6513547B2 (zh)
KR (1) KR20010091050A (zh)
CN (1) CN1317659A (zh)
DE (1) DE10114439B4 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100381741C (zh) * 2004-10-15 2008-04-16 Smc株式会社 电磁阀
CN101324280B (zh) * 2007-06-15 2011-12-28 Smc株式会社 带截止阀的集成式电磁阀装置
CN103629416A (zh) * 2012-08-20 2014-03-12 Smc株式会社 电磁阀控制装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3947968B2 (ja) * 2002-04-19 2007-07-25 Ｓｍｃ株式会社 マニホールドの接続機構
ES2296117T3 (es) * 2005-04-07 2008-04-16 FESTO AG & CO. Aparato de control electrofluidico.
JP4256884B2 (ja) * 2006-06-23 2009-04-22 東京エレクトロン株式会社 気化器への原料液供給ユニット
US10006557B2 (en) * 2013-03-15 2018-06-26 Asco, L.P. Valve manifold circuit board with serial communication and control circuit line
WO2014143002A1 (en) * 2013-03-15 2014-09-18 Numatics, Incorporated Valve manifold circuit board with serial communication circuit line
GB201613901D0 (en) 2016-08-12 2016-09-28 Artemis Intelligent Power Ltd Valve for fluid working machine, fluid working machine and method of operation
DE102017106892A1 (de) * 2017-03-30 2018-10-04 Bürkert Werke GmbH & Co. KG Ventilinsel
MX2020011154A (es) * 2018-04-27 2020-11-11 Smc Corp Sistema de valvulas electromagneticas.
JP7330121B2 (ja) * 2020-03-11 2023-08-21 株式会社コガネイ マニホールド電磁弁およびバルブベース
EP4119822A4 (en) * 2020-03-11 2024-04-10 Koganei Ltd ELECTROMAGNETIC DISTRIBUTION VALVE AND VALVE BASE
JP7454527B2 (ja) * 2021-06-25 2024-03-22 Ckd株式会社 電磁弁マニホールド

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69232566T3 (de) * 1991-09-10 2008-11-06 Smc K.K. Flüssigkeitsdruckvorrichtung
EP0860609B1 (en) * 1991-09-10 2005-11-30 Smc Kabushiki Kaisha Fluid pressure apparatus
EP0655575B2 (en) * 1993-11-30 2007-03-28 Smc Corporation Electromagnetic pilot type selector valve
JP3323344B2 (ja) * 1994-11-22 2002-09-09 エスエムシー株式会社 ダブルソレノイド形電磁弁
JP3437300B2 (ja) * 1994-12-02 2003-08-18 Ｓｍｃ株式会社 電磁弁制御装置
JP3323349B2 (ja) * 1994-12-27 2002-09-09 エスエムシー株式会社 切換弁集合体
JPH08233144A (ja) * 1995-02-28 1996-09-10 Toyooki Kogyo Co Ltd 電磁弁装置
US5495871A (en) * 1995-04-03 1996-03-05 The Aro Corporation Multiple valve manifold with plural power supplies
TW371026U (en) * 1996-05-23 1999-09-21 Smc Corp Solenoid valve with switch
JP3676499B2 (ja) * 1996-05-28 2005-07-27 Ｓｍｃ株式会社 スイッチ機構付き電磁弁マニホールド
JPH10110852A (ja) * 1996-10-08 1998-04-28 Ckd Corp パイロット形電磁弁の給電装置
JP3837205B2 (ja) * 1997-03-14 2006-10-25 Ｓｍｃ株式会社 封止形切換弁組立体
JPH11325296A (ja) * 1998-05-14 1999-11-26 Smc Corp ベース搭載形電磁弁
JP3323455B2 (ja) * 1999-03-31 2002-09-09 エスエムシー株式会社 シリアル信号駆動のマニホールド形電磁弁

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100381741C (zh) * 2004-10-15 2008-04-16 Smc株式会社 电磁阀
CN101324280B (zh) * 2007-06-15 2011-12-28 Smc株式会社 带截止阀的集成式电磁阀装置
CN103629416A (zh) * 2012-08-20 2014-03-12 Smc株式会社 电磁阀控制装置
CN103629416B (zh) * 2012-08-20 2016-01-13 Smc株式会社 电磁阀控制装置

Also Published As

Publication number Publication date
DE10114439A1 (de) 2002-01-31
US6513547B2 (en) 2003-02-04
KR20010091050A (ko) 2001-10-22
US20010027813A1 (en) 2001-10-11
DE10114439B4 (de) 2005-12-15

Similar Documents

Publication Publication Date Title
CN1317659A (zh) 电磁阀集合体
CN100343563C (zh) 带传感器的集装阀
CN1157665C (zh) 信号输入/输出装置
CN1240055A (zh) 用于便携式无线电话的双频带天线耦合器
CN1092308C (zh) 设置有开关的电磁阀
EP1070892A3 (en) Electric power supply apparatus for solenoid valve manifold
CN1064444C (zh) 设置有开关的电磁阀多阀箱
CN1469070A (zh) 具有位置检测机构的集装阀
CN1136405C (zh) 串行信号驱动的集成式电磁阀
ATE130407T1 (de) Fluidische anschlussleiste mit grundplattenmodulen und jeweils einem magnetventil.
CN1251408C (zh) 高频开关
CN209593950U (zh) 一种pcb机械背钻孔防焊塞孔的加工装置
CN1366440A (zh) 携带电话的用户识别模块卡安装结构
CN1759641A (zh) 用于汽车天线设备的天线放大器的拱形电路板
CN1025103C (zh) 一种使用接触器的设备的控制和测试系统
CN1248558C (zh) 高频装置
CN1332487A (zh) 不可逆电路装置及其安装结构
CN2709992Y (zh) 电缆测试平台
CN1672458A (zh) 带有内置式变换器电路的电声变换器
CN2836224Y (zh) 一种电磁继电器衔铁部件
CN219371654U (zh) Fpc排线拔取设备
CN1290987A (zh) 永磁直流电机电磁兼容抗干扰装置
KR102623968B1 (ko) 연성인쇄회로기판 단자 결합용 압착지그
CN2563885Y (zh) 电路板测试线的布线改良结构
CN219928942U (zh) 一种搬运设备以及流水线

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication