CN1307859C - Micro channel circulation neat excharging system based on thermoelectric actice control - Google Patents
Micro channel circulation neat excharging system based on thermoelectric actice control Download PDFInfo
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- CN1307859C CN1307859C CNB2004100730388A CN200410073038A CN1307859C CN 1307859 C CN1307859 C CN 1307859C CN B2004100730388 A CNB2004100730388 A CN B2004100730388A CN 200410073038 A CN200410073038 A CN 200410073038A CN 1307859 C CN1307859 C CN 1307859C
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Abstract
The present invention discloses a microchannel circulation and heat exchange system based on thermoelectric active control. The microchannel circulation and heat exchange system comprises a control drive part, a heat exchange execution part and a power supply, wherein the control drive part is mainly composed of four temperature sensors, an active controller and two power driving devices; the heat exchange execution part is mainly composed of two microchannel heat exchangers, a temperature-controlled element, a thermoelectric heat exchanger, a wind cooling heat radiator and a miniature water pump. The active controller is respectively and electrically connected with the miniature water pump and the thermoelectric heat exchanger by two power driving devices. The execution voltage of the thermoelectric heat exchanger is controlled by the voltage controller. When the system lies in the temperature of-40 DEG C to 52 DEG C or-28 DEG C to 2 DEG C, or the temperature-controlled element lies in the temperature of 40 DEG C to 80 DEG C, the heat radiation component lies in the environmental temperature of 22 DEG C, and the temperature of the temperature-controlled element is controlled to 10 DEG C to 60 DEG C. The microchannel circulation and heat exchange system has the characteristics of small volume, high heat exchange efficiency and high reliability, and the microchannel circulation and heat exchange system can be used for exchanging heat of high-density information devices in adverse temperature environments.
Description
Technical field
The present invention relates to heat-exchange device, specifically is a kind of microchannel cycle heat exchange system based on thermoelectric ACTIVE CONTROL, is applicable to the temperature control of electronic information equipment in the harsh high and low temperature environment.
Background technology
Microminaturization along with electronic information equipment, the encapsulation integration density of the packaging density of components and parts and chip is more and more high, although power constantly reduces, but dwindling of volume makes that the density of heat flow rate of conducting heat is increasing, cause local temperature rise of system increasing, restricted the raising of electronic system functional reliability.
To be controlled in the normal range (NR) by the temperature of the electronic system of the heat radiation of the solid-state emission source of temperature control components and parts such as computer CPU chip, Connectors for Active Phased Array Radar antenna, chip High Density Packaging and high-effect laser etc. is the target that engineering circle is pursued always, and traditional heat transfer technology has wind-cooling heat dissipating, water-cooling, heat pipe heat radiation etc.Air-cooled radiator cost low heat emission effect is obvious, but owing to have air channel, volume big, can not satisfy the heat exchange of thermal control object High Density Packaging or that shield gasket is arranged, when ambient temperature is higher or lower than the components and parts temperature, to not had the temperature control ability by the temperature control components and parts.Good heat dissipation effect, the system of the wind-cooling heat dissipating that water-filled radiator compares do not have fan, and noise is low, but its volume is big, are not suitable for High Density Packaging equally by the temperature control object.Heat-pipe radiator has that thermal conduction effect is good, not power consumption, lightweight advantage, but because of its capacity of heat transmission depends on capillary effect, general length 10-20cm also is not suitable for the longer application conditions of thermally conductive pathways between Cooling and Heat Source.Thermoelectric heat exchanger, the micro-channel heat exchanger that occurs compared with traditional heat transfer technology in the recent period, have that thermal response is rapid, reliability is high, the little noiselessness of volume, the equal may command of high and low temperature and the sense of current of adjusting DC power supply can heat up or advantage such as cooling, be applicable to that some needs accurately control temperature or the more abominable occasion of environment for use.The topmost shortcoming of wherein thermoelectric heat exchanger is that the coefficient of performance is low, and power consumption is big, makes to use to be restricted.
The eighties in 20th century, American scholar T uckerman and Pease have reported a kind of Thermal Performance of Micro Channels structure [TuckermannD.B., Pease R.F., " Optimized convective cooling using micromachined structure ", Journal ofElectro-Chamical Society, 1982,129 (3), 98C], this structure adopts the material (silicon) of high thermal conductivity coefficient to be made, its heat transfer process conducts in the passage through conduit wall for the heat that adds in the bottom surface, and the liquid (water) that is compelled to convection current is then taken away, and its heat exchange property surpasses the level that traditional heat transfer technology can reach.In recent years, Chinese Academy of Sciences's Shanghai optical precision Research Institute a kind of microchannel cooling heat sink, can be applicable to the heat radiation of semiconductor laser device and array device thereof, large scale integrated circuit.
It is strong that Micro Channel Architecture has an exchange capability of heat, adapted to high heat flux by the needs that the temperature control components and parts encapsulate, and is a kind of high efficient heat exchanging technology that heat in electronic devices and components or the chip can be taken away, and has structure and the simple advantage of manufacturing process.Its limitation is: only by micro-channel heat exchanger self, still can not solve the heat transfer problem under the higher temperature environment, must realize its heat exchange property efficiently by adding low-temperature receiver.
Summary of the invention
The technical problem to be solved in the present invention is the deficiency that overcomes existing heat transfer technology, a kind of microchannel cycle heat exchange system based on thermoelectric ACTIVE CONTROL is provided, make it have the high efficient heat exchanging ability, can satisfy the heat exchange needs of electronics and IT products under the rugged surrounding temperature condition.
For solving the problems of the technologies described above, technical scheme provided by the invention comprises the controlling and driving part, carries out heat exchanging part and power supply, and described controlling and driving part is made up of temperature sensor, active controller and two analog line drivers; Described execution heat exchanging part is by two micro-channel heat exchangers, formed by temperature control components and parts, thermoelectric heat exchanger, air-cooled radiator and micro pump; Described active controller is electrically connected with micro pump, thermoelectric heat exchanger respectively by above-mentioned two analog line drivers, and provides operating voltage for it; One of described micro-channel heat exchanger be fixed as one by the temperature control components and parts, another and air-cooled radiator are fixed with two working faces of thermoelectric heat exchanger respectively, communicating pipe draws from micro pump, be communicated with above-mentioned two micro-channel heat exchangers successively, return micro pump, form the heat exchange circulatory system, under controlling and driving is partly controlled, finish the heat exchange of system.
The active controller of controlling and driving part comprises data acquisition unit, processor, control signal follower and man-machine interface, and its annexation is that data acquisition unit, processor and control signal follower are connected successively; Processor is connected with man-machine interface is two-way; Described data acquisition unit is made up of eight temperature-voltage changers, analog switch, operational amplifier and A/D A-D converter; Described control signal follower comprises two output channels, the i.e. thermoelectric heat exchanger channel that constitutes of the micro pump passage that constitutes by " D/A-1---operational amplifier " and " D/A-2---operational amplifier ", these two passages link to each other with two analog line drivers respectively; Described man-machine interface comprises keyboard and LCD, the parameter that keyboard is set to the processor input, the job information of LCD real-time display system operation.Described processor is restrained with the voltage control of variation of ambient temperature according to the execution voltage of thermoelectric heat exchanger, the temperature data amount that the data collector is sent here is handled, generation is to the execution voltage digital amount Data of thermoelectric heat exchanger, zoom into the execution voltage of thermoelectric heat exchanger through D/A-2 digital-to-analogue conversion, operational amplifier, power amplifier, control system is carried out heat exchange.By above-mentioned control, can make controlled temperature components and parts working temperature be controlled at 10 ℃ of-60 ℃ of scopes, and thermoelectric heat exchanger power consumption is less.
From technique scheme as can be seen, the present invention organically gathers thermoelectric heat transfer technology and Thermal Performance of Micro Channels technology in same heat-exchange system, both advantage superpositions have been realized, bring out one's strengths to make up for one's weaknesses, compared with prior art, have that volume is little, heat exchange efficiency is high, the two-way heat exchange function of advantage that reliability is high and refrigeration heating.According to actual heat and the temperature controlled needs of control, adopt voltage control rule heat exchanging system to control, can under rugged environment temperature conditions extremely, will be controlled at 10 ℃～60 ℃ scopes, make thermoelectric heat exchanger power consumption minimum by the temperature of temperature control components and parts.The present invention has These characteristics, can be used widely in following field:
1. microchannel of the present invention and microfluid are very approaching by the temperature control components and parts, form the very little heat transfer path of thermal resistance, thereby heat transfer efficiency is very high, the length of heat-transfer path is very little to the influence of heat output, use and realize micro-channel heat exchanger and communicating pipe the microfluid circulation, can be used for length between cold and heat source apart from heat transfer, applicable to bigger, the cold and hot position of height temperature difference apart from each other, such as the electronic information equipment under the space environment; Volume is very little in addition; The occasion of the long distance conduction heat exchange that is well suited for the shield gasket requirement and is difficult for passing through;
2. heat-exchange system volume of the present invention is little, and the reliability height is applicable to the heat exchange of High Density Packaging parts; Can be installed in the product key position as, multicore sheet High Density Packaging, the computer CPU chip, the solid-state emission source of Connectors for Active Phased Array Radar antenna, high-effect laser, localized heat control is carried out at positions such as magnetic disc store, printhead, ink gun, heat-transferring head;
3. the decision of the sense of current of thermoelectric heat exchanger of the present invention heats up or cooling, adjusts the sense of current and can make the local temperature of working position be below or above ambient temperature, has very strong thermal environment adaptability.Be specially adapted to the thermal control of key components in the electronic information equipment under the most evil bad ambient temperature;
Description of drawings
Fig. 1 is that cycle heat exchange of the present invention system constitutes schematic diagram
Fig. 2 is the schematic top plan view that the present invention carries out heat exchanging part
Fig. 3 is micro-channel heat exchanger structure of the present invention and assembling schematic diagram
Fig. 4 is temperature sensor 1 an installation site schematic diagram of the present invention
Fig. 5 is temperature sensor 2,3 installation site schematic diagrames of the present invention
Fig. 6 is an active controller composition frame chart of the present invention
Fig. 7 is a data acquisition unit composition frame chart of the present invention
Fig. 8 is data acquisition unit temperature/voltage converter circuit figure of the present invention
Fig. 9 is a control signal follower block diagram of the present invention
Figure 10 is power driver circuit figure of the present invention
Figure 11 is a processor voltage control signal stream block diagram of the present invention
Figure 12 is a voltage control rule curve under the normal boot-strap operating mode,
Figure 13 is by temperature control components and parts temperature variation curve under the normal boot-strap operating mode
Figure 14 is a voltage control rule curve under the antifreeze operating mode of shutdown
Figure 15 is by temperature control components and parts temperature variation curve under the antifreeze operating mode of shutdown
Figure 16 is hot-cool environment and deposits voltage control rule curve under the operating mode
Figure 17 is hot-cool environment and deposits under the operating mode by temperature control components and parts temperature variation curve
Figure 18 is a control system flow chart of the present invention
Embodiment
Below in conjunction with accompanying drawing structure of the present invention and concrete enforcement are described in detail.
As shown in Figure 1 and Figure 2, the present invention mainly is made of controlling and driving part I, execution heat exchanging part II and power supply 17.Controlling and driving part I is made up of temperature sensor 1, active controller 2 and analog line driver 3, analog line driver 4.Carry out heat exchanging part II by being formed by temperature control components and parts 5, two micro-channel heat exchangers 6, air-cooled radiator 10 and micro pumps 7.Active controller 2 is electrically connected with thermoelectric heat exchanger 9 and micro pump 7 respectively by power drive 3, analog line driver 4.The quantity of temperature sensor 1 is four, is used for detecting the temperature by temperature control components and parts 5 respectively, the temperature of the temperature of thermoelectric heat exchanger cool and heat ends and detection external environment; The temperature acquisition point that A among the figure, B, four points of C, D are the said temperature transducer.Temperature sensor is delivered to active controller 2 with the temperature data of gathering and is handled, and produces the control voltage signal, is transported to thermoelectric heat exchanger 9 and micro pump 7 by analog line driver 3, analog line driver 4 after amplifying, and drives its work.In above-mentioned figure, micro-channel heat exchanger 6 be fixed as one by temperature control components and parts 5; Another micro-channel heat exchanger 6 and air-cooled radiator 10 are separately fixed on two working faces of thermoelectric heat exchanger 9.In order to reduce contact heat resistance, with the contact-making surface of thermoelectric heat exchanger 9 on all scribble heat-conducting silicone grease.Communicating pipe 8 draws from micro pump 7, is communicated with above-mentioned two micro-channel heat exchangers 6 successively, is connected to micro pump 7, forms the heat exchange circulatory system.For improving system's operational reliability and reducing volume as far as possible, the NF60KPDC type membrane pump that the micro pump 7 of carrying out heat exchanging part II selects for use German KNF company to produce, it adopts 5V～24V powered by direct current, and maximum stream flow is 400ml/min, and it is 100Kpa that maximum pump pressure is provided.Regulate its flow by the supply power voltage of adjusting pump, to change the flow velocity of water in communicating pipe and the microchannel.Described air-cooled radiator 10 is used for strengthening thermoelectric heat exchanger 9 and external environment heat exchange, and the air-cooled radiator 10 that the present invention selects for use is axial-flow type air-cooled radiator, its good heat dispersion performance.Described power supply 17 is a DC power supply, can provide for heat-exchange system ± 24V voltage.
Referring to Fig. 2, on communicating pipe 8, be connected with six three-way connections 11, as the test interface of heat-exchange system water temperature and hydraulic pressure.Wherein, the three-way connection of measuring communicating pipe hydraulic pressure is four, by measuring hydraulic pressure controlled water flow speed.The three-way connection of measuring water temperature is two, is respectively applied for water outlet and the return water temperature of measuring the microchannel circulator 6 that is connected with thermoelectric heat exchanger 9.Adopt communicating pipes 8 heat-proof quality flexible pipe preferably, as plastic tube or silicone tube, to reduce the heat exchange amount with external environment.
Referring to Fig. 3, two micro-channel heat exchangers 6 of the present invention have identical material, structure and size.The material of described micro-channel heat exchanger 6 is a duralumin, hard alumin ium alloy, and its structure is made up of heat exchanger substrate 12, one group of microchannel 13, cover plate 14.Heat exchanger substrate 12 and cover plate 14 usefulness resin glues are bonded to integral body, have good airproof performance, not water funk, intensity is high, resistant to elevated temperatures characteristics.Offer aqueous medium at the dual-side of micro-channel heat exchanger 6 and go out/enter the mouth 15, going out/entering the mouth a microchannel joint 16 respectively is installed on 15, in the middle of microchannel joint 16 a cylinder aperture is arranged, communicating pipe 8 is passed this hole; Describedly go out/enter the mouth an end of 15 and be communicated with microchannel 13, the other end then is communicated with communicating pipe 8 through microchannel joint 16.Constitute the closed circulation passage of heat exchange aqueous medium.
Referring to the installation site of Fig. 4 and temperature sensor 1 shown in Figure 5, wherein, a temperature sensor is installed in by between temperature control components and parts 5 and the micro-channel heat exchanger 6, in order to measure by the temperature of temperature control components and parts; Two temperature sensors are installed between thermoelectric heat exchanger 9 and the micro-channel heat exchanger 6 respectively and between thermoelectric heat exchanger 9 and the air-cooled radiator 10, in order to measure the temperature of thermoelectric heat exchanger 9 cool and heat ends; Also have a temperature sensor to place heat-exchange system outer (figure does not draw), be used for measuring in real time ambient temperature.The present invention adopts model PT100 platinum resistance thermometer sensor, as temperature sensor, to be satisfied with the temperature survey of native system small space.
Referring to Fig. 6, active controller 2 of the present invention is made up of data acquisition unit, processor, control signal follower, man-machine interface.Described data acquisition unit is the front end of active controller 2, and it is connected with the control signal follower successively with processor.Processor is connected with man-machine interface is two-way.
As shown in Figure 7, the temperature information that described data acquisition unit is used to gather, conversion temperature sensor 1 is measured.Its composition is made up of a plurality of temperature-voltage changers, analog switch, operational amplifier and A/D A-D converter.For reserving enough amount of redundancys, designed 8 tunnel temperature-voltage changer to temperature survey.Because what temperature sensor 1 adopted is platinum resistance thermometer sensor,, for the convenience that detects, by temperature-voltage changer platinum resistance thermometer sensor, is represented that the resistance value of temperature is converted to voltage signal, its circuit as shown in Figure 8.Temperature-voltage changer has adopted difference input mode (OP07-1), and has carried out secondary amplification (OP07-2), and VCC is the 5V source of stable pressure among Figure 12, Rt is a temperature sensor, and R1～R4 is precision resistance (R1=5k Ω, R2=100 Ω, R3=1k Ω, R4=20k Ω), R4 is a 20k Ω potentiometer; When ambient temperature was 0 ℃, Rt=100 Ω made that operational amplifier OP07-2 is 0V at 0 ℃ of output Voutl.The temperature information of all collections is handled the voltage signal that generates through temperature-voltage changer, carry out channel selecting by analog switch ADG508, via operational amplifier amplification, A/D analog to digital conversion, just obtain the digital quantity of respective channel temperature again, flow to processor processing.In order to improve the precision of data acquisition, operational amplifier has selected for use high accuracy, low temperature to float the amplifier that model is OP07, and A/D has selected the analog to digital converter AD574 of 16 precision for use.
Referring to Fig. 9, the control signal follower comprises two output channels, i.e. the thermoelectric heat exchanger channel that constitutes of " D/A-1---operational amplifier " micro pump passage of constituting and " D/A-2---operational amplifier ".These two passages link to each other with analog line driver 4, analog line driver 3 respectively.The major function of described control signal follower is that the control signal that will send here from processor is carried out digital to analog conversion, zoomed into the control signal of analog line driver 3 and analog line driver 4.Because it is not too high that the present invention requires the control precision of micro pump 7, so D/A-1 selected 12 figure place weighted-voltage D/A converter DAC0832 for use, and its control precision can reach 24/2
12V (＜6mV).In actual applications, D/A-1 is output as definite value, make the execution voltage of micro pump also be definite value, thereby the flow velocity of water is normal value in the microchannel.Because thermoelectric heat exchanger 9 power consumption are big, belong to crucial controlled device, must improve control precision, so D/A-2 16 D/A digital to analog converter DAC811 have been selected for use to its row voltage.
Described man-machine interface is two-way the connection with processor.This man-machine interface comprises keyboard and LCD.Keyboard comprises voltage control rule calculating formula and relevant parameter to processor input system setup parameter, and operating mode is set, the water flow velocity of microchannel etc.Keyboard has 10 numeric keys (0～9), minus sign ("-"), decimal point (". ") and four hot keys, and (F1～F4) amounts to ten six press keys.LCD is used for the display system job information, as ambient temperature, by flow velocity of temperature control components and parts temperature, the cold and hot end temperature of thermoelectric heat exchanger and microchannel water etc.
Referring to Figure 10, described analog line driver 3, analog line driver 4 are important component parts of controlling and driving part I, and they provide voltage for thermoelectric heat exchanger 9 and micro pump.It is that the amplifier of OPA541 is the main devices of power amplifier that its drive circuit is selected model for use, peripherally only needs a few components just can satisfy to export requirement (R6 is a 10k Ω resistance, and R7 is a 50k Ω potentiometer, and R8 is 0.1 Ω/4W resistance).OPA541 is actually a powerful operational amplifier, ± 10V～± power supply of 40V under work, the single channel analog line driver can be exported the electric current of 5A continuously.And the execution voltage of thermoelectric heat exchanger 9 might surpass 5A, therefore need drive by the two-way power driving circuit is in parallel, to satisfy the operating current of thermoelectric heat exchanger 9.
Because reliability and its working temperature of electronic information equipment components and parts are closely related,, to stipulate normal temperature range such as T usually when under rugged environment temperature extremely
* 1～T
* h, the normal working temperature by temperature control components and parts 5 of native system is got T
* 1=10 ℃, T
* h=60 ℃.Thus, system's active temperature controlled target is to make by the temperature of temperature control components and parts 5 to satisfy 10 ℃～60 ℃.Because the outstanding defective of thermoelectric heat exchanger 9 is that power consumption is big, the basic controlling strategy of system is to reach control target temperature by controlling the execution voltage of thermoelectric heat exchanger 9, making by the temperature control object, and thermoelectric heat exchanger power consumption is as far as possible little.ACTIVE CONTROL of the present invention is mainly finished by the processor of active controller 2.
Referring to Figure 11, processor is made of chip, and the chip model is 8031.Processor is the core component of active controller 2, the curve that it changes with ambient temperature according to the execution voltage of thermoelectric heat exchanger 9, i.e. voltage control rule V=C
0+ C
1T
∞+ C
2T
∞ 2+ ...+C
nT
∞ nSystem is carried out ACTIVE CONTROL.In the formula, V is the execution voltage of thermoelectric heat exchanger 9, T
∞Be ambient temperature, C
0～C
nBe ambient temperature corresponding points fitting parameter.Processor receives from the temperature information of data acquisition unit input, use above-mentioned voltage control rule to handle, produce and carry out voltage control quantity Data, amplify, zoom into by power amplifier again the execution voltage of the thermoelectric heat exchanger 9 of driving through digital to analog conversion, the operational amplifier of D/A-2.When the residing ambient temperature of system is higher, needed refrigeration by temperature control components and parts 5, processor passes to forward voltage (at design circuit time set) by analog line driver 3 to thermoelectric heat exchanger 9, thermoelectric heat exchanger 9 becomes low-temperature receiver, to micro-channel heat exchanger 6 refrigeration that are attached thereto, aqueous medium cooling in communicating pipe 8, and then pass through another micro-channel heat exchanger 6 coolings by temperature control components and parts 5, make by temperature control components and parts 5 and be cooled to set point, realize refrigeration system.Otherwise, in the time of need be heated by temperature control components and parts 5 working temperatures, pass to reverse voltage for thermoelectric heat exchanger 9 when ambient temperature is lower, thermoelectric heat exchanger becomes thermal source again, the above-mentioned circulation canal of process also is heated by temperature control components and parts 5, thereby now finishes the heat exchange of system.Because thermoelectric heat exchanger 9 can be according to the conversion of the sense of current, become the thermal source or the low-temperature receiver of system, the present invention is combined as a system with itself and micro-channel heat exchanger 6, thermoelectric heat exchanger 9 provides cold and heat source for micro-channel heat exchanger 6, make it under higher or lower ambient temperature, bring into play its high efficiency exchange capability of heat effectively.
The present invention carries out the voltage control rule V=C of ACTIVE CONTROL
0+ C
1T
∞+ C
2T
∞ 2+ ...+C
nT
∞ nCan obtain from following examples.
May residing most evil bad ambient temperature according to the heat exchange circulatory system, ambient temperature that the present invention is preferred is-40 ℃～52 ℃ a normal boot-strap operating mode; Ambient temperature is-28 ℃～2 ℃ the antifreeze operating mode of shutdown; Be operated in 40 ℃～80 ℃ of hot environments, thermal component in the hot-cool environment of 22 ℃ of lower temperatures and three kinds of operating modes of depositing by temperature control components and parts (5), under arbitrary operating mode, by selecting different ambient temperature points, control is by the different temperatures of temperature control components and parts 5, adjust the execution voltage of thermoelectric heat exchanger 9, resulting execution voltage is with obtaining the voltage control rule in the curve of ambient temperature variation.
In an embodiment of the present invention, simulate thermoelectric heat exchanger 9, with high cryostat environmental test temperature with electrothermal module.
Embodiment one, and ambient temperature is under-40 ℃～52 ℃ the normal boot-strap operating mode, finds the solution the voltage control rule.
By simulation analysis and the experiment as can be known, when system's ambient temperature of living in is higher, by temperature control components and parts 5 need the refrigeration so that its temperature reaches normal operating temperature range＜T
* h, setting at this moment, electrothermal module 9 applies with forward voltage; When ambient temperature is low, though by 5 heatings of temperature control components and parts, not enough so that it reaches minimum normal working temperature T
* 1, at this moment need be heated by temperature control components and parts 5, electrothermal module 9 is applied in reverse voltage; Certainly will there be a temperature section (T like this
1～T
h), electrothermal module 9 does not need to power up, and just can be in (T in the normal working temperature scope by the temperature of temperature control components and parts 5
* 1～T
* h).Thus, can be with ambient temperature T
∞Be divided into three sections:
High temperature section, T
h＜T
∞＜T
* h, execution voltage V＞0 of electrothermal module 9;
Middle-temperature section, T
1＜T
∞＜T
h, the execution voltage V=0 of electrothermal module 9;
Low-temperature zone, T
* 1＜T
∞＜T
1, execution voltage V＜0 of electrothermal module 9.
1. select high temperature section (T
h＜T
∞＜T
* h) the curve fit point of voltage control rule:
(1) as the ambient temperature T of system
∞ 1＞T
hAnd when reaching 52 ℃, adjust the execution voltage V of electrothermal module 9, make V=V
1, make by the temperature of temperature control components and parts 5 to reach T
* h(60 ℃)
(2) the ambient temperature T of selective system
∞ 2=T
h+ 2 (T
∞ 1-T
h)/3 and T
∞ 3=T
h+ (T
∞ 1-T
h)/3 are test point, adjust the execution voltage V of electrothermal module 9, make V=V respectively
2And V=V
3The time, make just to be reached to be about T by the temperature of temperature control components and parts 5
* h(60℃)
2. select middle-temperature section (T
h～T
1) the curve fit point of voltage control rule:
(1) electrothermal module 13 does not power up, and adjusts ambient temperature, treats system stability after about 20 minutes, and monitoring is by the temperature of temperature control components and parts 5; When ambient temperature is T
hThe time, control is reached by the temperature of temperature control components and parts 5 and is about T
* h(native system is got 60 ℃);
(2) electrothermal module 13 does not power up, and adjusts ambient temperature, treats system stability after about 20 minutes, and monitoring is by 5 temperature of temperature control unit's device; When ambient temperature is T
1The time, control is reached by the temperature of temperature control components and parts 5 and is about T
* 1(native system is got 10 ℃).
3. select low-temperature zone (T
* 1＜T
∞＜T
1) the curve fit point of voltage control rule
(1) as the ambient temperature T of system
∞ 4Hang down when reaching-40 ℃, adjust the execution voltage V=V of electrothermal module 9
4, make to be reached to be about T by temperature control components and parts 5 temperature
* 1(10 ℃)
(2) the ambient temperature T of selective system
∞ 5=T
∞ 4+ (T
1-T
∞ 4)/3 and T
∞ 6=T
∞ 4+ 2 (T
1-T
∞ 4)/3 are test point, adjust the execution voltage V of electrothermal module 9, make V=V respectively
5And V=V
6The time, make to be reached to be about T by temperature control components and parts 5 temperature
* 1(10 ℃).
Referring to Figure 12, obtain electrothermal module 9 and carry out the temperature variant curve of voltages from the point data that fits of said temperature section, the voltage control rule that obtains the electrothermal module of each temperature section of this operating mode according to this curve is:
High temperature section
Middle-temperature section
V＝0 (2)
Low-temperature zone
Use above-mentioned measurement data: T
h, T
1, T
∞ 1-T
∞ 6, V
1-V
6Respectively high temperature section and low-temperature zone are set up the curve fitting parameter solving equation:
High temperature section:
Low-temperature zone:
According to formula (4), obtain that each parameter is in the high temperature segmentation (1):
C
0h＝-4183.699999，C
1h＝264.791667，C
2h＝-5.6000，C
3h＝0.039583
According to formula (5), obtain that each parameter is in the low temperature segmentation (3):
C
0/＝8.515375，C
1/＝1.170832，C
2/＝0.027183，C
3/＝0.000247
Referring to Figure 13, under the control of this operating mode voltage control rule, in high temperature section, the temperature of controlled components and parts 5 is controlled in about 60 ℃; In low temperature section, the temperature of quilt control components and parts 5 is controlled in about 10 ℃; When middle-temperature section did not power up, scope had rising from 10 ℃ to 60 ℃ by the working temperature of temperature control components and parts; But all be controlled at effectively≤60 ℃ of scopes.
Embodiment two, and ambient temperature is-28 ℃～2 ℃ the antifreeze operating mode of shutdown, find the solution the voltage control rule.Following measurement point in selected this ambient temperature range is electrothermal module voltage control rule curve fit point:
(1) as the ambient temperature T of system
∞ 1When reaching 2 ℃, adjust the execution voltage V=V of electrothermal module 9
1, it (is T that control is reached about 10 ℃ by temperature control components and parts 5 (simulation thermal source) temperature
* 1);
(2) as the ambient temperature T of system
∞ 2When reaching-8 ℃, adjust the execution voltage V=V of electrothermal module 9
2, make that to be reached about 10 ℃ by temperature control components and parts 5 (simulation thermal source) temperature (be T
* 1);
(3) as the ambient temperature T of system
∞ 3When reaching-18 ℃, adjust the execution voltage V=V of electrothermal module
3, make that to be reached about 10 ℃ by temperature control components and parts 8 (simulation thermal source) temperature (be T
* 1);
(4) as the ambient temperature T of system
∞ 4When reaching-28 ℃, adjust the execution voltage V=V of electrothermal module 9
4, make that to be reached about 10 ℃ by temperature control components and parts 5 (simulation thermal source) temperature (be T
* 1).
Referring to Figure 14, fit point data from said temperature and obtain the temperature variant curve of electrothermal module 9 execution voltages, the voltage control rule that obtains this operating mode electrothermal module according to this curve is:
According to the curve fitting parameter solving equation, try to achieve that each parameter is in the formula (6):
C
0＝-1.378400，C
1＝0.643267，C
2＝0.022200，C
3＝0.000383
By shown in Figure 15, use this operating mode voltage control rule, when ambient temperature changes, the voltage of control electrothermal module 9 can effectively be controlled by temperature control components and parts 5 temperature about 10 ℃.
Embodiment three, are operated in 40 ℃～80 ℃ of hot environments by temperature control components and parts 5, and thermal component is at the hot-cool environment of 22 ℃ of lower temperatures and deposit under the operating mode, find the solution the voltage control rule.
To be placed into the simulation thermal environment by temperature control components and parts 5 and fixing with it micro-channel heat exchanger 6 together---in the high cryostat, temperature regulating range is 40 ℃～80 ℃; And thermal component micro pump 7, electrothermal module 9 and connected micro-channel heat exchanger 6 are placed on outside the high cryostat, promptly are in temperature and are 22 ℃ room temperature condition.Selected following measurement point obtains the voltage control curve fit point of electrothermal module.
(1) electrothermal module 9 does not power up (V
1=0), since 40 ℃ of calorstat temperatures that progressively raise to T
∞ 1When (native system is 72 ℃), control is about T by temperature control components and parts 5 temperature
* h
(2) as calorstat temperature T
∞ 2=(80+T
∞ 1During)/2 (native system is 76 ℃), control is reached T by temperature control components and parts 5 temperature
* h, the execution voltage V=V of adjustment electrothermal module 9
2
(3) as calorstat temperature T
∞ 3When reaching 80 ℃, make by temperature control components and parts 5 temperature to reach T
* h, the execution voltage V=V of adjustment electrothermal module 9
3
Referring to Figure 16, obtain electrothermal module 9 from the above-mentioned data that fit a little and carry out the temperature variant curve of voltage, the voltage control rule that obtains the electrothermal module of each temperature section of this operating mode according to this curve is:
40℃＜T
∞＜＝T
∞1
V＝0 (7)
T
∞1＜T
∞＜80℃
According to the curve fitting parameter solving equation, try to achieve that each parameter is in the formula (8): C
0=642.600, C
1=17.925, C
2=0.125
Referring to the curve of Figure 17, under the control of this operating mode voltage control rule, when not powering up or powering up, all be controlled at effectively≤60 ℃ of scopes by the working temperature of temperature control components and parts 5.
In the first and the 3rd embodiment, not making alive of a very wide temperature section electrothermal module 9 is all arranged, but still in control range, fluctuateed by temperature control components and parts 5 temperature.Only when being approached 10 ℃ or 60 ℃ by the temperature of temperature control components and parts 5, the ability making alive is controlled, and this just greatly reduces the power consumption of electrothermal module 9.
The resulting voltage control rule of comprehensive the various embodiments described above can obtain the general formula that voltage control is restrained:
V＝C
0+C
1T
∞+C
2T
∞ 2+......+C
nT
∞ n。The voltage control rule of the electrothermal module 9 that the present invention will obtain from the foregoing description is used to control the execution voltage of thermoelectric heat exchanger 9, can realize that heat-exchange system is under above-mentioned each operating mode, to be controlled at 10 ℃～60 ℃ scopes by the temperature of temperature control components and parts 5, make the power consumption minimum of thermoelectric heat exchanger 9.Undoubtedly, enforcement of finding the solution the voltage control rule provided by the invention is in no way limited to described three kinds of operating modes, also be not limited to 10 ℃～60 ℃ scopes by temperature control components and parts 5 temperature control equally, every employing the present invention finds the solution other operating mode that the design of voltage control rule sets and should be in category of the present invention by other temperature range of temperature control components and parts 5.
Referring to Figure 18, the ACTIVE CONTROL process of heat exchanging system is carried out according to the following steps:
The 1st step: energized 17, heat-exchange system brings into operation;
The 2nd step: system initialization mainly is the initialization of hardware interfaces such as analog switch, keyboard and LCD;
The 3rd step: by keyboard to set up and import parameters such as voltage control rule under flow velocity, system condition and each operating mode of water in the microchannel;
The 4th step: to the D/A-1 value of sending, control the execution voltage of micro pump 7 according to the flow velocity of setting water in the microchannel;
The 5th step: the residing operating mode of decision-making system, Case=1 represents that system works is in the normal boot-strap operating mode; Case=2 represents that system works is in the antifreeze operating mode of shutdown; Case=3 represents that system works is at hot-cool environment and deposit operating mode.This step mainly is a direction of determining the system works flow process according to the setting in the 3rd step.
The 6th step:, be provided with three control branches according to the operating mode difference:
First branch: Case=1 enters the control procedure of normal boot-strap operating mode;
Second branch: Case=2, enter the shutdown antifreeze operating mode control procedure;
The 3rd branch: Case=3 enters hot-cool environment and deposits the control procedure of operating mode;
Under three kinds of different operating modes, processor adopts each operating mode voltage control rule to calculate the execution voltage digital amount V of thermoelectric heat exchanger 9 respectively;
The 7th step: calculate v (in the formula, v is the magnitude of voltage after D/A-2 changes Data, and k1 is the operational amplifier multiplication factor, and k2 is the multiplication factor of power amplifier) according to formula v=V/ (k1k2);
The 8th step: according to the corresponding relation between v and the Data, controlled signal Data exports to D/A-2; (driving the analog quantity V that generates execution voltage) through D/A conversion, operational amplifier amplification and analog line driver
The 9th step: keyboard scan judges whether power cut-off, and ' being ' turned to for the 10th step, and ' denying ' turned to for the 5th step;
The 10th step: control finishes.
Claims (8)
1. microchannel cycle heat exchange system based on thermoelectric ACTIVE CONTROL, comprise controlling and driving part (I), carry out heat exchanging part (II) and power supply (17), it is characterized in that controlling and driving partly (I) form by temperature sensor (1), active controller (2) and two analog line drivers (3), (4); Carry out heat exchanging part (II) by being formed by temperature control components and parts (5), two micro-channel heat exchangers (6), thermoelectric heat exchanger (9), air-cooled radiator (10) and micro pump (7); Described active controller (2) is electrically connected with thermoelectric heat exchanger (9), micro pump (7) respectively by analog line driver (3), analog line driver (4) and provides operating voltage for it; A described micro-channel heat exchanger (6) be fixed as one by temperature control components and parts (5), another micro-channel heat exchanger (6) and air-cooled radiator (10) are fixed with two working faces of thermoelectric heat exchanger (9) respectively; Communicating pipe (8) draws from micro pump (7), is communicated with above-mentioned two micro-channel heat exchangers (6) successively, is connected to micro pump (7), forms the heat exchange circulatory system, finishes the heat exchange of system under the control of controlling and driving part (I).
2. cycle heat exchange according to claim 1 system is characterized in that being connected with on described communicating pipe (8) six three-way connections (11), and as the test interface of heat-exchange system water temperature and hydraulic pressure, wherein, four three-way connections are used to measure hydraulic pressure; Two three-way connections are used for measuring water temperature; Communicating pipe (8) can be adopted heat-proof quality flexible pipe preferably, to reduce the heat exchange amount with external environment.
3. cycle heat exchange according to claim 1 system, it is characterized in that described micro-channel heat exchanger (6) is made up of heat exchanger substrate (12), one group of microchannel (13), cover plate (14), described heat exchanger substrate (12) and cover plate (14) are bonded to integral body with resin glue; Offer aqueous medium at the dual-side of micro-channel heat exchanger (6) and go out/enter the mouth (15), going out/enter the mouth a microchannel joint (16) respectively is installed on (15), in the middle of the described microchannel joint (16) a cylinder aperture is arranged, communicating pipe (8) is passed this hole; Describedly go out/end of enter the mouth (15) is communicated with microchannel (13), and the other end is communicated with communicating pipe (8) through microchannel joint (16).
4. the microchannel cycle heat exchange system of thermoelectric ACTIVE CONTROL according to claim 1, it is characterized in that described temperature sensor (1) is provided with four, one of them temperature sensor is contained in by between temperature control components and parts (5) and the micro-channel heat exchanger (6), in order to measure by the temperature of temperature control components and parts; Two temperature sensors are separately fixed between thermoelectric heat exchanger (9) and another micro-channel heat exchanger (6) and the air-cooled radiator (10), in order to measure the temperature of thermoelectric heat exchanger (9) cool and heat ends; Also have a temperature sensor to place outside the heat-exchange system, be used to measure ambient temperature.
5. cycle heat exchange according to claim 1 system, it is characterized in that described active controller (2) is made up of data acquisition unit, processor, control signal follower and man-machine interface, described data acquisition unit, processor, control signal follower connect successively; Processor is two-way the connection with man-machine interface.
6. cycle heat exchange according to claim 5 system is characterized in that described data acquisition unit is made up of temperature-voltage changer, analog switch, operational amplifier and A/D A-D converter, is used for gathering, inversion temperature information; Described processor is made of chip; Described control signal follower carries out digital-to-analogue conversion with the signal of sending here that processor generates, it comprises two output channels, the i.e. thermoelectric heat exchanger channel that constitutes of " D/A-1---operational amplifier " micro pump passage of constituting and " D/A-2---operational amplifier ", these two passages link to each other with analog line driver (4), analog line driver (3) respectively; Described man-machine interface comprises keyboard and liquid crystal display, the setup parameter of key entry system, and liquid crystal display is used for the job information of real-time display system operation.
7. according to claim 5 or 6 described cycle heat exchange systems, it is characterized in that described processor restrains V=C according to voltage control
0+ C
1T
∞+ C
2T
∞ 2+ ... .+C
nT
∞ nThe data collector is sent here temperature information handle, generate execution voltage digital amount Data, through the D/A-2 digital-to-analogue conversion to thermoelectric heat exchanger (9), operational amplifier, power amplifier zoom into the execution voltage of thermoelectric heat exchanger successively, control system is carried out heat exchange, and in the formula, V is for carrying out voltage; T
∞Be ambient temperature; C
0～C
nBe the corresponding parameter of each ambient temperature point curve match.
8. cycle heat exchange according to claim 7 system is characterized in that described voltage control rule can be respectively-40 ℃～52 ℃ normal boot-strap operating mode from ambient temperature; Ambient temperature is-28 ℃～2 ℃ the antifreeze operating mode of shutdown; Be operated in 40 ℃～80 ℃ of hot environments by temperature control components and parts (5), thermal component is at the hot-cool environment of 22 ℃ of lower temperatures and deposit operating mode under arbitrary operating mode of totally three kinds of operating modes, by selecting different ambient temperature points, control is obtained in the curve of the resulting execution voltage of execution voltage with the ambient temperature variation of the different temperature points of temperature control components and parts (5) and the thermoelectric heat exchanger of adjustment (9).
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| CNB2004100730388A CN1307859C (en) | 2004-08-30 | 2004-08-30 | Micro channel circulation neat excharging system based on thermoelectric actice control |
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| CN1307859C true CN1307859C (en) | 2007-03-28 |
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| CN101547587B (en) * | 2008-03-25 | 2011-08-03 | 和舰科技(苏州)有限公司 | Power supply cooling system improved by utilizing thermoelectric cooler |
| CN101778554B (en) * | 2010-01-04 | 2012-07-18 | 北京交通大学 | Radiating system |
| FR2954971B1 (en) | 2010-01-06 | 2012-02-10 | Paul Benoit | ELECTRICAL RADIATOR USING CALCULATING PROCESSORS AS HOT SOURCE. |
| CN101835367B (en) * | 2010-05-11 | 2012-04-25 | 电子科技大学 | Air-cooling and liquid-cooling combined type heat radiating system |
| CN102573404A (en) * | 2010-12-31 | 2012-07-11 | 苏州昆拓热控系统股份有限公司 | Air conditioner special for equipment cabinet and control method for air conditioner |
| CN105682434A (en) * | 2016-04-20 | 2016-06-15 | 电子科技大学 | Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling |
| CN109932392A (en) * | 2019-03-07 | 2019-06-25 | 中国电子科技集团公司第五十八研究所 | A kind of fluid channel radiator performance test and monitoring system and its application |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999066282A1 (en) * | 1998-06-18 | 1999-12-23 | 3M Innovative Properties Company | Microchanneled heat exchanger |
| CN1507039A (en) * | 2002-12-11 | 2004-06-23 | 中国科学院广州能源研究所 | Thermally driven heat exchanger |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999066282A1 (en) * | 1998-06-18 | 1999-12-23 | 3M Innovative Properties Company | Microchanneled heat exchanger |
| CN1507039A (en) * | 2002-12-11 | 2004-06-23 | 中国科学院广州能源研究所 | Thermally driven heat exchanger |
Non-Patent Citations (1)
| Title |
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| 微纳电子技术(微通道的流动阻力分析) 康春霞 黄新波，39.41，2004 * |
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