CN1507039A - Thermally driven heat exchanger - Google Patents
Thermally driven heat exchanger Download PDFInfo
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- CN1507039A CN1507039A CNA02149603XA CN02149603A CN1507039A CN 1507039 A CN1507039 A CN 1507039A CN A02149603X A CNA02149603X A CN A02149603XA CN 02149603 A CN02149603 A CN 02149603A CN 1507039 A CN1507039 A CN 1507039A
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- heat exchanger
- micro channel
- heat
- drives
- microchannel
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Abstract
The present invention provides one kind thermally driven heat exchanger capable of being used as heat dissipating cooler for electronic element and device, especially electronic element and device with high heat flow density. The heat exchanger includes micro channel heat exchanger, two micro non-return valves and liquid storage. The micro channel heat exchanger has one metal base with high heat conducting coefficient and micro channel closed inside the base. The thermally driven heat exchanger is one monodirectional circulating loop from liquid storage, through inlet micro non-return valve, micro channel and outlet non-return valve and to the liquid storage, and has liquid work medium circulating in the loop. The thermally driven heat exchanger is used for dissipating heat in fields with high heat producing strength but limited volume, such as for the heat dissipation of computer chip.
Description
Technical field
The invention belongs to the heat radiation cooling device of electronic devices and components, especially for the heat radiation cooling device of high heat flux electronic devices and components.
Background technology
According to the size of electronic devices and components power density, the method for various control components and parts used heat is arranged.These cooling meanss roughly can be classified as follows: heat conduction, direct or indirect air cooling system (nature or forced convection), directly or indirectly single-phase liquid cooling, and phase-change liquid cooling.Free convection is being brought into play important effect in the electronic devices and components cooling.But because its thermal transmission coefficient is lower, natural convection air is only applicable to the lower occasion of power density.When the higher thermal transmission coefficient of needs, people adopt forced convertion.In direct liquid cools scheme, electronic devices and components or its encapsulation directly contact with cooling liquid, and directly cooling means can be removed higher density of heat flow rate, pollute and the higher shortcoming of cost but exist.The liquid cools scheme is the method between air nature or forced convection and direct liquid cools scheme indirectly, is to be accepted and welcome method by electronic industry at present.
At present, people generally adopt heat pipe, micro heat pipe technology to solve the heat dissipation problem of laptop computer cpu chip, communication base station, high-power electronic component, but the density of heat flow rate that can remove remains lower.Heat exchanger for generally adopting at present generally needs pump, heat exchanger, condenser etc.Pump is pumped into heat exchanger as power source with heat-transfer working medium, and its shortcoming is that equipment is numerous and diverse, needs pipeline connecting parts, valve etc., has correspondingly increased operation and maintenance cost, and has taken bigger volumetric spaces.
Summary of the invention
The objective of the invention is to propose a kind of power source such as pump that do not need, device structure is simple, and the heat that is suitable for the cooling of high heat flux electronic devices and components drives heat exchanger.
Purpose of the present invention is achieved by the following technical programs: whole heat exchanger apparatus comprises micro channel heat exchanger, two little check-valves (exporting little check-valves and the little check-valves of inlet) and receivers with unidirectional conducting function, said micro channel heat exchanger has a metal base that high thermal conductivity coefficient is arranged, on the plane of this pedestal, be laid with the microchannel that is enclosed in the base body, this heat drives heat exchanger and presses receiver, little check-valves enters the mouth, the microchannel of micro channel heat exchanger, export little check-valves, the order that returns receiver is concatenated into a unidirectional circulation circuit with pipeline, and the liquid working substance that fills in the loop is circulated in the loop.
Microchannel in the said base body is generally the degree of depth and width is millimeter level or micron-sized miniature conduit.Pedestal can adopt copper coin or aluminium sheet, generally can process all miniature conduits below 3mm of the degree of depth and width on copper or aluminum plate foundation Cuo plane, and becomes minitype channel through encapsulation.
Said miniature conduit can have multiple shape and structure form, and also can there be multiple arrangement form the microchannel that these conduits form, and various bathtub constructions and various channel arrangement form can be combined to form the structure and the form of more complexity according to application need again.
Being shaped as that the cross section of the miniature conduit described in the micro channel heat exchanger of the present invention is commonly used is square, triangle, trapezoidal, circular arc etc.
Below be the arrangement form commonly used of microchannel:
1, the microchannel is made of the parallel Boulez of the miniature conduit of multiple tracks, and the miniature conduit of multiple tracks can parallel with one another or mutual series connection;
2, microchannel circulating type Boulez in the shape of a spiral.
Can adopt caliber in order to the pipeline that connects each parts in this heat driving heat exchanger is the flexible plastics capillary of 2mm to 3mm.
Operation principle and process that heat of the present invention drives heat exchanger are as follows: when initial, fill in whole device with liquid working substance (for example water), micro channel heat exchanger is placed on the heating electronic component with high heat flux.Carry out under high heat flux owing to be heated, when liquid still is in subcool state in the microchannel (its temperature is lower than the saturation temperature under the corresponding pressure), the process that promptly comes to life is referred to as subcooling boiling.Because the boiling heat absorption produces a large amount of steam bubbles, has increased the pressure between two check-valves greatly.Increased pressure will export little check-valves and open, and working medium begins to discharge to receiver by pipeline.On the other hand, when steam bubble moves in pipeline, steam bubble contacts with underheat liquid phase in the pipeline, the underheat condensation takes place, because condensation, system pressure descends and is low below atmospheric pressure, thereby make the outlet closure of check ring, little check-valves that enters the mouth is opened, fresh liquid in the receiver is inhaled into micro channel heat exchanger, reenter next new cyclic process, promptly subcooling boiling → little check-valves of pressure increases → outlet open → working medium discharging → steam bubble condensation → little check-valves of inlet opens → periodic process of fresh liquid injection.Owing to produce periodically subcooling boiling process in the microchannel, thereby the density of heat flow rate that can remove is very high.
This heat drives heat exchanger can be suitable for calorific intensity height such as the interior electronic chip of cabinet, and the very restricted occasion of volume.As be applied in the computer chip heat radiation.Receiver is made by copper or aluminium, and its outer wall is a fin, thereby has both played storage liquid effect, again the heat of system finally is delivered in the atmospheric environment simultaneously and goes, and whole device is very compact.In order to save the space, receiver can be placed on outside the cabinet, and heat finally is dispersed into atmospheric environment like this, helps reducing the air themperature in the cabinet.
Heat of the present invention drives heat exchanger and has following technique effect:
1, adopt hot drive principle, realized that no pump carries liquid to heat exchanger, make the device compactness, simply, reliability is high.
2, the subcooling boiling process takes place in the micro channel heat exchanger, can be to the realization coolings such as electronic devices and components of high density of heat flow rate.
3, because the effect of two one way stop peturn valves, owing to raising, the pressure that causes of boiling makes outlet non-return valve open to cause the working medium discharging in the system, the pressure that the underheat condensation of steam bubble in pipeline causes descends and makes outlet non-return valve close, inlet non-return valve is opened, cause the suction of fresh liquid, thereby realized the periodic cycle of working medium in micro channel heat exchanger.
4, this device belongs to passive device, does not have mechanical moving component, and is reliable, and noiselessness does not have wearing and tearing, and the life-span is long.
5, micro channel heat exchanger size and chip are complementary, and whole cooling device volume is very little.Owing to adopt the external receiver, reduced the volume of cabinet greatly.
Description of drawings
Fig. 1 is a technical schematic diagram of the present invention;
Fig. 2 is one embodiment of the present of invention structural representation;
Fig. 3, Fig. 4, Fig. 5, Fig. 6 are respectively the 4 kinds of arrangement forms commonly used in microchannel in the micro channel heat exchanger.
Embodiment
Be described in further detail below in conjunction with the CONSTRUCTED SPECIFICATION of accompanying drawing the embodiment of the invention:
The structure of this heat driving heat exchanger embodiments as shown in Figure 2, comprise micro channel heat exchanger 1, export little check-valves 2, little check-valves 3 and receiver 4 enter the mouth, said micro channel heat exchanger 1 is that to process some degree of depth on the dull and stereotyped pedestal 12 of copper material be 0.8mm, width is the miniature conduit 11 of 0.3mm, constitute with copper coin encapsulation again on it, the layout shape of miniature conduit 11 as shown in Figure 3, constitute by the parallel miniature conduit of multiple tracks Boulez in parallel, this heat drives each parts of heat exchanger and presses receiver 4 by flexible plastics capillary 5, little check-valves 3 enters the mouth, the microchannel 11 of micro channel heat exchanger 1, export little check-valves 2, the order that returns receiver 4 is concatenated into a unidirectional circulation circuit, and the liquid working substance that fills in the loop is circulated in the loop.This heat driving heat exchanger employing caliber is the flexible plastics capillary about 2mm, and check-valves adopts the miniature check valve product of U.S. Lee company, the about 10mm of its diameter, and the about 2mm of thickness adopts plastic material to make.This heat drives heat exchanger and can be applicable in the heat radiation of computer chip, is about to micro channel heat exchanger 1 and places on the euthermic chip 6.
The arrangement form of the miniature conduit 11 in the micro channel heat exchanger 1 of the embodiment of the invention also can replace with any form shown in Fig. 4 (the parallel miniature conduit series connection of multiple tracks Boulez), Fig. 5 (the miniature conduit of multiple tracks arc Boulez in parallel) or Fig. 6 (spiral surrounding formula Boulez).
Claims (8)
1. a heat drives heat exchanger, it is characterized in that comprising micro channel heat exchanger (1), export little check-valves (2), little check-valves (3) and receiver (4) enter the mouth, said micro channel heat exchanger (1) has a metal base that high thermal conductivity coefficient is arranged, on the plane of this pedestal, be laid with the microchannel (11) that is enclosed in the base body, this heat drives heat exchanger and presses receiver (4), little check-valves (3) enters the mouth, the microchannel (11) of micro channel heat exchanger (1), export little check-valves (2), the order that returns receiver (4) is concatenated into a unidirectional circulation circuit with pipeline, and the liquid working substance that fills in the loop is circulated in the loop.
2. heat according to claim 1 drives heat exchanger, it is characterized in that the microchannel (11) in the said base body is that the degree of depth and width are a millimeter level or a micron-sized miniature conduit.
3. heat according to claim 1 and 2 drives heat exchanger, it is characterized in that the microchannel (11) in described micro channel heat exchanger (1) pedestal is made of the parallel Boulez of the miniature conduit of multiple tracks.
4. heat according to claim 3 drives heat exchanger, it is characterized in that the miniature conduit of multiple tracks in described micro channel heat exchanger (1) pedestal is parallel with one another.
5. heat according to claim 3 drives heat exchanger, it is characterized in that the miniature conduit of multiple tracks in described micro channel heat exchanger (1) pedestal is connected mutually.
6. heat according to claim 1 drives heat exchanger, it is characterized in that microchannel (11) the circulating type Boulez in the shape of a spiral in described micro channel heat exchanger (1) pedestal.
7. heat according to claim 1 drives heat exchanger, it is characterized in that described micro channel heat exchanger (1) for processing all miniature conduits below 3mm of the degree of depth and width on copper or aluminium sheet base plane, and forms through encapsulation.
8. heat according to claim 1 drives heat exchanger, it is characterized in that described is that caliber is the flexible plastics capillary of 2mm to 3mm in order to the pipeline that connects each parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02149603 CN1278414C (en) | 2002-12-11 | 2002-12-11 | Thermally driven heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02149603 CN1278414C (en) | 2002-12-11 | 2002-12-11 | Thermally driven heat exchanger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1507039A true CN1507039A (en) | 2004-06-23 |
| CN1278414C CN1278414C (en) | 2006-10-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02149603 Expired - Fee Related CN1278414C (en) | 2002-12-11 | 2002-12-11 | Thermally driven heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1278414C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307859C (en) * | 2004-08-30 | 2007-03-28 | 西安电子科技大学 | Micro channel circulation neat excharging system based on thermoelectric actice control |
| CN100444369C (en) * | 2006-10-13 | 2008-12-17 | 无锡江南计算技术研究所 | High power integrated ciruit chip cooling device |
| CN100450336C (en) * | 2007-03-26 | 2009-01-07 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN100453952C (en) * | 2004-09-24 | 2009-01-21 | 蒋毅 | Separated heat pipe |
| CN1821051B (en) * | 2005-02-14 | 2011-02-02 | 精工爱普生株式会社 | Microchannel structure and its manufacturing method, light source device, and projector |
| CN105299938A (en) * | 2015-11-06 | 2016-02-03 | 中国电子科技集团公司第二十九研究所 | Small-sized compression refrigerating system based on micro-channel heat exchanger |
| CN106445033A (en) * | 2016-10-31 | 2017-02-22 | 成都华府科技有限公司 | Computer cluster heat dissipation system |
| CN111141096A (en) * | 2020-01-20 | 2020-05-12 | 中国科学院上海光学精密机械研究所 | Integrated reflective active cooling device for optical grating |
| CN111572821A (en) * | 2020-05-08 | 2020-08-25 | 清华大学 | Thermal protection wall plate, plate-shaped thermal protection system and annular thermal protection system |
-
2002
- 2002-12-11 CN CN 02149603 patent/CN1278414C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307859C (en) * | 2004-08-30 | 2007-03-28 | 西安电子科技大学 | Micro channel circulation neat excharging system based on thermoelectric actice control |
| CN100453952C (en) * | 2004-09-24 | 2009-01-21 | 蒋毅 | Separated heat pipe |
| CN1821051B (en) * | 2005-02-14 | 2011-02-02 | 精工爱普生株式会社 | Microchannel structure and its manufacturing method, light source device, and projector |
| CN100444369C (en) * | 2006-10-13 | 2008-12-17 | 无锡江南计算技术研究所 | High power integrated ciruit chip cooling device |
| CN100450336C (en) * | 2007-03-26 | 2009-01-07 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN105299938A (en) * | 2015-11-06 | 2016-02-03 | 中国电子科技集团公司第二十九研究所 | Small-sized compression refrigerating system based on micro-channel heat exchanger |
| CN105299938B (en) * | 2015-11-06 | 2017-11-14 | 中国电子科技集团公司第二十九研究所 | A kind of compact refrigeration system based on micro-channel heat exchanger |
| CN106445033A (en) * | 2016-10-31 | 2017-02-22 | 成都华府科技有限公司 | Computer cluster heat dissipation system |
| CN111141096A (en) * | 2020-01-20 | 2020-05-12 | 中国科学院上海光学精密机械研究所 | Integrated reflective active cooling device for optical grating |
| CN111572821A (en) * | 2020-05-08 | 2020-08-25 | 清华大学 | Thermal protection wall plate, plate-shaped thermal protection system and annular thermal protection system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1278414C (en) | 2006-10-04 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061004 Termination date: 20111211 |