CN116578138A - Two-stage temperature control device suitable for optical chip - Google Patents
Two-stage temperature control device suitable for optical chip Download PDFInfo
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- CN116578138A CN116578138A CN202310374218.2A CN202310374218A CN116578138A CN 116578138 A CN116578138 A CN 116578138A CN 202310374218 A CN202310374218 A CN 202310374218A CN 116578138 A CN116578138 A CN 116578138A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 76
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 230000033228 biological regulation Effects 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000001514 detection method Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 77
- 238000001816 cooling Methods 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 16
- 239000000110 cooling liquid Substances 0.000 claims description 13
- 239000003570 air Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
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- 239000012080 ambient air Substances 0.000 claims description 2
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- 238000011896 sensitive detection Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 239000013307 optical fiber Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
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- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a two-stage temperature control device suitable for optical chip, is applicable to optical chip's two-stage temperature control, includes one-level chip temperature control module, second grade environment temperature control module, one-level chip temperature control module contains two modules: the TEC temperature control module is matched with the heat conduction module working with the TEC; the TEC temperature control module comprises: a metal heat-conducting plate, a temperature sensor, a TEC and a TEC temperature controller; the shape and the size of the metal heat-conducting plate are matched and are larger than those of the packaged optical chip, the thickness of the metal heat-conducting plate is slightly larger than the diameter of the detection end of the temperature sensor, the upper part of the metal heat-conducting plate is adhered to the substrate of the optical chip, the lower part of the metal heat-conducting plate is adhered to the TEC refrigerating end, and the metal heat-conducting plate and the TEC refrigerating end are adhered and fixed by heat-conducting glue; the secondary environment temperature control module comprises a closed container, a second temperature sensor, a temperature controller and a temperature regulation executing mechanism. The sensitive detection, the rapid feedback and the accurate temperature control of the optical chip are realized, and the optical chip works in an environment with stable temperature.
Description
Technical Field
The invention relates to the fields of quantum information technology, photoelectron technology, automatic control, heat dissipation technology and the like, in particular to a temperature control device of an optical chip.
Background
The optical chip is widely applied in the information processing fields of quantum computation, optical communication and the like, and comprises a silicon optical chip, a silicon nitride optical chip, a lithium niobate optical chip and the like. Compared with the bulk optical scheme, the optical chip integrates various micro-nano photoelectric devices on the chip and has the advantages of small volume, convenient expansion, good stability, strong operability and the like. The manipulation of an optical chip is usually performed by applying an electrical signal to an optical phase shifter on the chip and controlling the optical phase therein by using a thermo-optical effect or the like. The control process requires that the overall temperature of the optical chip be kept constant and that rapid and accurate regulation feedback can be achieved. With the increase of the optical chip scale, the number of phase shifters is increased, the chip power is increased, the problems of thermal crosstalk, unstable chip temperature and the like are highlighted, and the operation accuracy of the optical chip is poor and the operation is unstable. Therefore, how to make the whole temperature of the optical chip constant and realize accurate regulation becomes a necessary condition for the stable operation of the optical chip.
The existing temperature control scheme for the optical chip has the main defects that the temperature cannot be accurately regulated and controlled and is greatly influenced by the ambient temperature by utilizing a passive heat dissipating device comprising a heat dissipating block, air cooling, water cooling and the like; the second is that a local temperature control device which utilizes a semiconductor refrigerator (TEC), a metal heat conducting piece and other combinations is used, the scheme can only ensure that the side of the optical chip close to the TEC is relatively stable and adjustable, the whole temperature control of the chip can not be realized, and the working efficiency is low by simply relying on the TEC and the metal heat conducting piece under the condition that the set temperature of the TEC and the environmental temperature have a large difference.
Disclosure of Invention
The purpose of the invention is that: in order to solve the problems that the optical chip is greatly influenced by the ambient temperature, the whole temperature is unstable, the optical chip cannot be accurately regulated and controlled, the working efficiency is low, the two-stage temperature control device suitable for the optical chip is provided, the optical chip can be prevented from being influenced by the ambient temperature, the whole temperature is stable, and the optical chip can be accurately regulated and controlled and fed back rapidly.
In order to achieve the above purpose, the technical scheme of the invention is as follows: the two-stage temperature control device suitable for the optical chip comprises a one-stage chip temperature control module and a two-stage environment temperature control module, and is specifically shown in fig. 1: the primary chip temperature control module comprises two modules: the TEC temperature control module and the heat conduction module which cooperates with the TEC work.
The TEC temperature control module comprises: a metal heat-conducting plate, a temperature sensor, a TEC and a TEC temperature controller; the shape and the size of the metal heat-conducting plate are matched and are larger than those of the packaged optical chip, the thickness of the metal heat-conducting plate is slightly larger than the diameter of the detection end of the temperature sensor, the upper part of the metal heat-conducting plate is adhered to the substrate of the optical chip, the lower part of the metal heat-conducting plate is adhered to the TEC refrigerating end, and the metal heat-conducting plate and the TEC refrigerating end are adhered and fixed by heat-conducting glue; the temperature sensor is arranged in the metal heat conducting plate and is close to the optical chip, and the signal output end of the temperature sensor is connected with the TEC temperature controller; the TEC heating end faces downwards, and a TEC input lead of the TEC heating end is connected with the output of a TEC temperature controller; the temperature sensor is used for detecting the temperature close to the lower surface layer of the optical chip and feeding back the temperature to the TEC temperature controller, the TEC is used for refrigerating or heating the optical chip, and the TEC temperature controller controls the refrigerating or heating power of the TEC;
the heat conduction module matched with the TEC comprises a metal heat conduction block, water cooling liquid, a liquid guide pipe, a water pump and a cold exhaust fan. The metal heat conduction block comprises a water cooling head, the upper surface area of the water cooling head is slightly larger than that of the TEC, the water cooling head is arranged below the TEC, the water cooling head is fixedly bonded with the heating end of the TEC through heat conduction glue, and the water cooling head is hollow; the water pump provides water pressure to promote water cooling liquid to circulate among the water cooling head, the water pump and the cold exhaust fan in the metal heat conduction block through the liquid guide pipe, the water outlet of the water pump is connected with the water inlet of the water cooling head through the liquid guide pipe, and the water inlet of the water pump is connected with the water outlet of the cold exhaust fan through the liquid guide pipe; the cold exhaust fan is internally provided with a fine pipeline, the heat exchange between the water cooling liquid in the pipeline and the surrounding air can be accelerated by the rotation of the fan, and the water inlet of the cold exhaust fan is connected with the water outlet of the water cooling head through a liquid guide pipe; and a fan is not generally adopted to directly dissipate heat of the heating end of the TEC. Because the TEC is close to the optical chip, the optical chip is often coupled with an optical fiber array, and wind blows the optical fiber to cause unstable parameters such as polarization and phase of light in the optical fiber. The metal heat conducting block can be made of copper, aluminum and a combination thereof.
The secondary environment temperature control module comprises a closed container, a second temperature sensor, a temperature controller and a temperature regulation executing mechanism; a window of the closed container is provided with a temperature adjusting executing mechanism, and a light chip and a primary chip temperature control module are arranged in the window, so that an environment which is relatively insulated from the outside is formed in the container; the second temperature sensor is arranged in the sealable container, is used for detecting the temperature in the container and is fed back to the temperature controller; the temperature controller controls the temperature adjusting executing mechanism by detecting the temperature of the second temperature sensor and combining the set temperature; the temperature adjusting executing mechanism can adjust heat conduction power between the inside of the container and the environment outside the container, and execute heat absorption or heat dissipation, so that the purposes of controlling the temperature in the closed container and stabilizing are finally achieved.
The temperature adjusting actuator adopts a cold and hot air conditioner. In practical application, a TEC and a fan combination can be adopted.
When the TEC temperature controller monitors that the temperature sensor measures that the temperature of the chip is greater than a set temperature value, the TEC temperature controller controls TEC refrigeration, heat is transmitted from the chip and a metal heat-conducting plate below to a TEC refrigeration end, then to a TEC heating end, then to a metal heat-conducting block and a water cooling head thereof, then to a water pump and a cold exhaust fan, and then dissipated into the internal environment air of the secondary environment temperature control module, and when the temperature detected by the secondary environment temperature control module is different from the set value by more than 0.5 ℃, the secondary environment temperature control module starts refrigeration to reduce the temperature difference. When the TEC temperature controller monitors that the temperature sensor measures that the temperature of the chip is smaller than the set temperature value, the TEC temperature controller controls the TEC to heat, and the heat flow direction is opposite. The temperature control precision of the primary chip temperature control module can reach +/-0.01 ℃. The temperature control precision of the secondary environment temperature control module can reach +/-0.5 ℃. In general, the temperature of the water cooling liquid is the same as or close to the internal environment temperature of the secondary temperature control module.
The temperature sensor is an NTC (negative temperature coefficient) thermistor.
The invention has the beneficial effects that: the primary chip temperature control module is adopted to be close to the chip, so that the sensitive detection, the rapid feedback and the accurate temperature control of the optical chip can be realized, and the accurate control of the temperature of the optical chip can be further realized. The light chip and the first-level chip temperature control module are accommodated in the secondary environment temperature control module, so that stable working environment temperature is provided for the whole light chip, and the light chip is not influenced by external large environment temperature change. The temperature control precision of the optical chip (shown in fig. 4) can reach +/-0.01 ℃, so that the optical phase of the optical chip can be accurately controlled by utilizing the thermo-optical effect and the like. The control process of the invention requires that the overall temperature of the optical chip is kept constant and can realize rapid and accurate adjustment feedback. The thermo-optic effect and thermal modulation application of the photo chip are very convenient.
Drawings
Fig. 1 is a schematic diagram of a two-stage temperature control device suitable for use in an optical chip according to the present invention.
Fig. 2 is a device diagram of an embodiment of a two-stage temperature control device suitable for use in an optical chip according to the present invention.
Fig. 3 is a schematic diagram of an embodiment of a bidirectional temperature control module of a primary chip according to the present invention.
Fig. 4 is a silicon-based optical quantum chip to which embodiments of the present invention are applicable.
Detailed Description
The invention is described in further detail below with reference to the drawings and specific embodiments, it being apparent that the embodiments selected are only used to assist in illustrating the invention and are not intended to limit the scope of the invention. Equivalent modifications and equivalent substitutions based on the scope of the present disclosure are included in the scope of the present invention defined in the appended claims.
A two-stage temperature control device (as shown in fig. 2) suitable for an optical chip comprises a one-stage chip temperature control module and a two-stage environment temperature control module, and is particularly characterized in that: the primary chip temperature control module (as shown in fig. 3) comprises two modules: the TEC temperature control module and the heat conduction module which cooperates with the TEC work. The device comprises an optical chip 1, a liquid guide tube 2, a water pump 3, a fan 4, a secondary environment temperature control module 5, an upper computer 6, a copper block 7, a TEC temperature controller 8 and a TEC 9.TEC hot end 9-1TEC cold end 9-2, copper sheet 10, NTC thermistor 11, water-cooling head 12;1-1 gold wire, 1-2 thermo-optical phase shifter, 1-3 optical waveguide, 1-4 silicon substrate.
The TEC temperature control module comprises: a metal heat-conducting plate, a temperature sensor, a TEC and a TEC temperature controller; the metal heat-conducting plate adopts a copper plate, the shape and the size of the copper plate are specially customized according to the packaging condition of the optical chip, the thickness of the copper plate is slightly larger than the diameter of the detection end of the temperature sensor, the upper part of the copper plate is adhered to the optical chip substrate, the lower part of the copper plate is adhered to the cooling end of the TEC, and the copper plate and the TEC are adhered and fixed by heat-conducting adhesive; the temperature sensor is arranged in the copper plate and is close to the optical chip, and the signal output end of the temperature sensor is connected with the TEC temperature controller; the TEC comprises a refrigerating sheet and two ends of a heating sheet which are mutually attached, the refrigerating end faces upwards and is close to the light quantum chip, the heating end faces downwards, and wires at the refrigerating end and the heating end are connected with a TEC temperature controller.
The copper plate is used as a temperature equalizing plate, has good heat conducting property and is used for fixing or switching the optical chip, the temperature sensor and the TEC. The temperature sensor is used for detecting the temperature close to the lower surface layer of the optical chip and feeding back the temperature to the TEC temperature controller, the TEC is used for refrigerating or heating the chip, and the TEC temperature controller controls the refrigerating or heating power of the TEC.
The heat conduction module matched with the TEC comprises a metal heat conduction block, water cooling liquid, a liquid guide pipe, a water pump and a cold exhaust fan. The metal heat conduction block adopts a copper block, the copper block comprises a copper water cooling head, the upper surface area of the water cooling head is slightly larger than that of the TEC, the water cooling head is arranged below the TEC and fixedly bonded with the heating end of the TEC through heat conduction glue, and the water cooling head is hollow; the water pump provides water pressure to promote water cooling liquid to circulate among the water cooling head, the water pump and the cold exhaust fan in the metal heat conduction block through the liquid guide pipe, the water outlet of the water pump is connected with the water inlet of the water cooling head through the liquid guide pipe, and the water inlet of the water pump is connected with the water outlet of the cold exhaust fan through the liquid guide pipe; the cold exhaust fan is internally provided with a fine pipeline, the heat exchange between the water cooling liquid in the pipeline and the surrounding air can be accelerated by the rotation of the fan, and the water inlet of the cold exhaust fan is connected with the water outlet of the water cooling head through a liquid guide pipe; the fan is not generally used for directly radiating the heat of the heating end of the TEC, and because the TEC is close to the optical chip, the optical chip is often coupled with an optical fiber array, and the wind blows the optical fiber to cause unstable parameters such as polarization and phase of light in the optical fiber.
The secondary environment temperature control module comprises a closed container, a second temperature sensor, a temperature controller and a temperature regulation executing mechanism; a window of the closed container is provided with a temperature adjusting executing mechanism, and a light chip and a primary chip temperature control module are arranged in the window, so that an environment which is relatively insulated from the outside is formed in the container; the second temperature sensor is arranged in the sealable container, is used for detecting the temperature in the container and is fed back to the temperature controller; the temperature controller controls the temperature adjusting executing mechanism by detecting the temperature of the second temperature sensor and combining the set temperature; the temperature adjusting executing mechanism can adjust heat conduction power between the inside of the container and the environment outside the container, and execute heat absorption or heat dissipation, so that the purposes of controlling the temperature in the closed container and stabilizing are finally achieved. When the TEC temperature controller monitors that the temperature sensor measures that the temperature of the chip is greater than a set temperature value, the TEC temperature controller controls TEC refrigeration, heat is transmitted to a TEC refrigeration end from the chip and a copper plate below, then to a TEC heating end, then to a copper block and a water cooling head thereof, then to a water pump and a cold exhaust fan, and then dissipated into the ambient air in the secondary environment temperature control module, and when the secondary environment temperature control module detects that the temperature difference between the temperature sensor and the set temperature value is greater than 0.5 ℃, the secondary environment temperature control module starts to refrigerate and reduce the temperature difference. When the TEC temperature controller monitors that the temperature sensor measures that the temperature of the chip is smaller than the set temperature value, the TEC temperature controller controls TEC heating (the current direction of the TEC device determines that the hot end and the cold end can be interchanged), and the heat flow direction is opposite.
The temperature of the TEC temperature control setting is set according to the target performance of the chip to be tested: for example, we set 25℃for calibrating the phase shifter on the equal arm Mach-Zehnder interferometer, and we set 29℃for calibrating the phase shifter on the unequal arm Mach-Zehnder interferometer for filtering. The temperature value of the secondary environment temperature control setting generally adopts the temperature of the TEC temperature control setting.
Preferably, the temperature sensor is an NTC thermistor, and optionally AMETHERM ACC, 104.
Preferably, the heat-conducting glue can be heat-conducting silicone grease with high heat conductivity, and gaps among the heat-conducting silicone grease are filled to accelerate heat conduction.
Preferably, the power of the TEC-12709 is about 77W, and the overall dimension is 40 x 3.5mm. The optical chip applied in the experiment of the invention has 270 thermal phase shifters, the heat generating power can reach up to approximately 40W, and the optical chip is matched with the selected TEC-12709.
Preferably, the resolution and stability of the selectable TCM-M115 of the TEC temperature controller can reach 0.002 ℃, and the selectable TCM-M can be connected with an upper computer, so that the data can be conveniently displayed, controlled and recorded in real time.
Preferably, the water pump is optional SC-P67D, and the maximum lift is 4 meters.
Preferably, the water-cooling liquid is an insulating water-cooling liquid, and the water-cooling liquid is the optional B-IWCF-X.
Preferably, the cold exhaust fan is 240V2-RGB.
Preferably, the closed container may be a standard cabinet.
Preferably, the temperature and humidity regulation system of the optional MRAC-02 matching cabinet comprises a temperature sensor, a temperature controller and a temperature regulation executing mechanism.
The overall temperature control precision of the primary chip temperature control module can reach +/-0.01 ℃, and the temperature control precision of the secondary environment temperature control module can reach +/-0.5 ℃.
An optical chip suitable for use in the embodiment will now be described with reference to the following examples (e.g. fig. 4):
the length and the width of the silicon-based optical quantum chip are millimeter level, and an electric signal is applied to each thermo-optical phase shifter through two gold wires, so that the temperature of the thermo-optical phase shifters is changed, the refractive index of the corresponding optical waveguide is further changed, the purpose of controlling the optical phase in the waveguide is achieved, and finally the control of the functions of the silicon-based optical quantum chip is realized. The silicon material has higher heat conductivity and thermo-optical coefficient, and the whole control process is required to be in a constant temperature environment, so that the optical chip can be sensitively detected, quickly fed back and accurately controlled in temperature.
The foregoing examples are provided for the purpose of illustration only and are not intended to limit the scope of the invention, but any modifications, equivalents, based on the spirit and principles of the invention are intended to be included within the scope of the invention as defined in the claims appended hereto.
Claims (5)
1. The two-stage temperature control device suitable for the optical chip is characterized by comprising a one-stage chip temperature control module and a two-stage environment temperature control module, wherein the one-stage chip temperature control module comprises two modules: the TEC temperature control module is matched with the heat conduction module working with the TEC;
the TEC temperature control module comprises: a metal heat-conducting plate, a temperature sensor, a TEC and a TEC temperature controller; the shape and the size of the metal heat-conducting plate are matched and are larger than those of the packaged optical chip, the thickness of the heat-conducting plate is larger than the diameter of the detection end of the temperature sensor, the upper part of the metal heat-conducting plate is adhered to the substrate of the optical chip, the lower part of the metal heat-conducting plate is adhered to the TEC refrigerating end, and the metal heat-conducting plate and the TEC refrigerating end are adhered and fixed by heat-conducting glue; the temperature sensor is arranged in the metal heat conducting plate and is close to the optical chip, and the signal output end of the temperature sensor is connected with the TEC temperature controller; the TEC heating end faces downwards, and a TEC input lead of the TEC heating end is connected with the output of a TEC temperature controller; the temperature sensor is used for detecting the temperature close to the lower surface layer of the optical chip and feeding back the temperature to the TEC temperature controller, the TEC is used for refrigerating or heating the optical chip, and the TEC temperature controller controls the refrigerating or heating power of the TEC;
the heat conduction module matched with the TEC comprises a metal heat conduction block, water cooling liquid, a liquid guide pipe, a water pump and a cold exhaust fan. The metal heat conduction block comprises a water cooling head, the upper surface area of the water cooling head is slightly larger than that of the TEC, the water cooling head is arranged below the TEC, the water cooling head is fixedly bonded with the heating end of the TEC through heat conduction glue, and the water cooling head is hollow; the water pump provides water pressure to promote water cooling liquid to circulate among the water cooling head, the water pump and the cold exhaust fan in the metal heat conduction block through the liquid guide pipe, the water outlet of the water pump is connected with the water inlet of the water cooling head through the liquid guide pipe, and the water inlet of the water pump is connected with the water outlet of the cold exhaust fan through the liquid guide pipe; the cold exhaust fan is internally provided with a fine pipeline, the heat exchange between the water cooling liquid in the pipeline and the surrounding air can be accelerated by the rotation of the fan, and the water inlet of the cold exhaust fan is connected with the water outlet of the water cooling head through a liquid guide pipe;
the secondary environment temperature control module comprises a closed container, a second temperature sensor, a temperature controller and a temperature regulation executing mechanism; a window of the closed container is provided with a temperature adjusting executing mechanism, and a light chip and a primary chip temperature control module are arranged in the window, so that an environment which is relatively insulated from the outside is formed in the container; the second temperature sensor is arranged in the sealable container, is used for detecting the temperature in the container and is fed back to the temperature controller; the temperature controller controls the temperature adjusting executing mechanism by detecting the temperature of the second temperature sensor and combining the set temperature; the temperature adjusting executing mechanism can adjust heat conduction power between the inside of the container and the environment outside the container, and execute heat absorption or heat dissipation, so that the purposes of controlling the temperature in the closed container and stabilizing are finally achieved.
2. The two-stage temperature control device for optical chips as defined in claim 1, wherein the temperature adjusting actuator is an air conditioning heat exchanger.
3. The two-stage temperature control device for optical chips of claim 1, wherein when the TEC temperature controller monitors that the temperature sensor measures that the temperature of the chip is greater than a set temperature value, the TEC temperature controller controls the TEC to cool, heat is transferred from the chip and a metal heat-conducting plate below to a TEC cooling end, to a TEC heating end, to a metal heat-conducting block and a water cooling head, to a water pump and a cooling fan, and then dissipated into the ambient air in the secondary ambient temperature control module, and when the temperature detected by the secondary ambient temperature control module is greater than 0.5 ℃ different from the set temperature, the secondary ambient temperature control module begins to cool to shrink the temperature difference. When the TEC temperature controller monitors that the temperature sensor measures that the temperature of the chip is smaller than the set temperature value, the TEC temperature controller controls the TEC to heat, and the heat flow direction is opposite.
4. The two-stage temperature control device for optical chips as defined in claim 1, wherein the temperature sensor is an NTC thermistor.
5. The two-stage temperature control device for optical chips as defined in claim 1, wherein the temperature control accuracy of the one-stage chip temperature control module is up to + -0.01 ℃. The temperature control precision of the secondary environment temperature control module can reach +/-0.5 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310374218.2A CN116578138A (en) | 2023-04-10 | 2023-04-10 | Two-stage temperature control device suitable for optical chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310374218.2A CN116578138A (en) | 2023-04-10 | 2023-04-10 | Two-stage temperature control device suitable for optical chip |
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| CN116578138A true CN116578138A (en) | 2023-08-11 |
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| CN202310374218.2A Pending CN116578138A (en) | 2023-04-10 | 2023-04-10 | Two-stage temperature control device suitable for optical chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117091316A (en) * | 2023-10-19 | 2023-11-21 | 成都电科星拓科技有限公司 | High-low temperature working condition simulation module, chip reliability automatic test system and method |
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2023
- 2023-04-10 CN CN202310374218.2A patent/CN116578138A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117091316A (en) * | 2023-10-19 | 2023-11-21 | 成都电科星拓科技有限公司 | High-low temperature working condition simulation module, chip reliability automatic test system and method |
| CN117091316B (en) * | 2023-10-19 | 2024-01-26 | 成都电科星拓科技有限公司 | High-low temperature working condition simulation module, chip reliability automatic test system and method |
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