CN210005703U - Constant temperature device of temperature sensitive devices - Google Patents
Constant temperature device of temperature sensitive devices Download PDFInfo
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- CN210005703U CN210005703U CN201920484317.5U CN201920484317U CN210005703U CN 210005703 U CN210005703 U CN 210005703U CN 201920484317 U CN201920484317 U CN 201920484317U CN 210005703 U CN210005703 U CN 210005703U
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Abstract
The constant temperature device of the temperature sensitive device comprises a shell, a semiconductor refrigeration component and a heat dissipation component, wherein the shell is provided with a sealed cavity, the temperature sensitive device is arranged in the cavity, the semiconductor refrigeration component is arranged on the boundary of the cavity and connected with the temperature sensitive device and used for adjusting the temperature of the temperature sensitive device so that the temperature value of the temperature sensitive device is within a preset range, and the heat dissipation component is connected with the semiconductor refrigeration component and used for absorbing heat energy generated by the semiconductor refrigeration component.
Description
Technical Field
The disclosure relates to the technical field of temperature sensitive devices, in particular to a constant temperature device of temperature sensitive devices.
Background
Silicon photomultiplier (SiPM) is kinds of novel photoelectric detector devices, consists of avalanche diode arrays working in geiger mode, and has the characteristics of high gain, high sensitivity, low bias voltage, insensitivity to magnetic field, compact structure and the like, thus obtaining -field application.
However, silicon photomultipliers are temperature sensitive devices, and nuclear radiation detectors based on silicon photomultipliers are sensitive to temperature and are greatly affected by environmental temperature fluctuation when outdoor tasks are executed.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The purpose of this disclosure is to provide kinds of constant temperature equipment that can make temperature-sensitive device be in preset temperature state steadily.
According to aspects of the present disclosure, there is provided a thermostat of kinds of temperature sensitive devices, the thermostat comprising:
the temperature sensor comprises a shell, a temperature sensor and a temperature sensor, wherein an sealed cavity is formed in the shell, and a temperature sensor is arranged in the cavity;
the semiconductor refrigeration assembly is arranged on the boundary of the cavity, is connected with the temperature sensitive device and is used for adjusting the temperature of the temperature sensitive device so as to enable the temperature value of the temperature sensitive device to be within a preset range;
and the heat dissipation assembly is connected with the semiconductor refrigeration assembly and is used for absorbing heat energy generated by the semiconductor refrigeration assembly.
In exemplary embodiments of the present disclosure, the thermostat further comprises:
the temperature sensor is arranged in the cavity and used for acquiring the temperature of the temperature sensitive device and outputting temperature signals;
the controller is used for outputting the refrigeration signal to the semiconductor refrigeration assembly according to the temperature signal, and the semiconductor refrigeration assembly responds to the refrigeration signal to adjust the temperature of the temperature sensitive device.
In exemplary embodiments of the present disclosure, an insulating layer is provided on the inner wall of the housing.
In exemplary embodiments of the present disclosure, the semiconductor refrigeration assembly comprises:
a semiconductor refrigeration sheet;
heat transfer element and second heat transfer element respectively arranged at two sides of the semiconductor refrigeration piece, the second heat transfer element is connected with the heat dissipation component.
In exemplary embodiments of the present disclosure, the heat dissipation assembly includes:
the section of the water flow pipeline passes through the second heat transfer element and is tightly attached to the second heat transfer element, and heat exchange liquid absorbs heat from the second heat transfer element when passing through the pipeline attached to the second heat transfer element;
the radiator comprises a heat dissipation flow channel, wherein the end of the water flow pipeline is connected with the inlet of the heat dissipation flow channel, and the other end of the water flow pipeline is connected with the outlet of the heat dissipation flow channel.
In exemplary embodiments of the present disclosure, the heat dissipation assembly further comprises:
and the fan is arranged opposite to the radiator and used for increasing the air flow speed on the surface of the radiator.
In exemplary embodiments of the present disclosure, the water flow line is a flexible line.
In exemplary embodiments of the present disclosure, the temperature sensitive device includes:
a PCB board;
the silicon photomultiplier array is arranged on the PCB;
and the crystal array is arranged on the side of the silicon photomultiplier array far away from the PCB.
In exemplary embodiments of the present disclosure, the substrate material of the PCB board is a thermally conductive material.
In exemplary embodiments of the present disclosure, the thermostat further comprises:
and the drying bin is arranged in the cavity and is internally provided with a drying agent.
When the semiconductor refrigeration component cools the temperature sensitive device, the heat dissipation component can discharge heat energy of the temperature sensitive device from the cavity in time so as to ensure that the semiconductor refrigeration component does cooling operation on the temperature sensitive device.
It is to be understood that both the foregoing -general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the present disclosure and, together with description , serve to explain the principles of the disclosure.
FIG. 1 is a schematic view of a thermostat for a temperature sensitive device provided in embodiments of the present disclosure;
FIG. 2 is a schematic view of a thermostat for a temperature sensitive device provided in embodiments of the present disclosure;
fig. 3 is a cross-sectional view of a thermostat for a temperature sensitive device provided in embodiments of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Although relative terms such as "upper" and "lower" may be used herein to describe the relative relationship of elements of an icon to another element, such terms are used for convenience only and for example, with respect to the orientation of the examples depicted in the figures, it is to be understood that an element described as "upper" would be an element that is "lower" if the device of the icon were turned upside down.
The terms "", "", "the", "said" and "at least " are used to indicate that or more elements/components/etc. are present, the terms "including" and "having" are used to indicate open-ended inclusion and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc., the terms "", "second" and "third" etc. are used merely as labels, not as a limitation on the number of their objects.
The constant temperature device comprises a shell 101, a semiconductor refrigeration component and a heat dissipation component, wherein a closed cavity is formed in the shell 101, the temperature sensitive device is arranged in the cavity, the semiconductor refrigeration component is arranged on the boundary of the cavity and is connected with the temperature sensitive device and used for adjusting the temperature of the temperature sensitive device so that the temperature value of the temperature sensitive device is within a preset range, and the heat dissipation component is connected with the semiconductor refrigeration component and used for absorbing heat energy generated by the semiconductor refrigeration component.
The disclosure provides a constant temperature device of a temperature sensitive device, wherein the temperature sensitive device is positioned in a cavity and is relatively isolated from the external environment, and a semiconductor refrigeration component can reduce or improve the temperature of the temperature sensitive device so as to maintain the temperature of the temperature sensitive device within a preset range of or a preset value of , so as to keep the temperature sensitive device in a constant temperature state and improve the performance of the temperature sensitive device.
As shown in fig. 3, the thermostat device further includes a temperature sensor 105 and a controller 112, the temperature sensor 105 is disposed in the cavity and is configured to obtain a temperature of the temperature sensitive device and output temperature signals, and the controller 112 is configured to output the cooling signal to the semiconductor cooling module according to the temperature signal, and the semiconductor cooling module responds to the cooling signal to adjust the temperature of the temperature sensitive device.
When the temperature of the temperature sensitive device obtained by the temperature sensor 105 is greater than a preset value, temperature signals are output and transmitted to the controller 112, the controller 112 outputs refrigeration signals according to the temperature signals, the semiconductor refrigeration assembly cools the temperature sensitive device according to the refrigeration signals until the temperature of the temperature sensitive device is within a preset range, when the temperature of the temperature sensitive device obtained by the temperature sensor 105 is greater than the preset value, another temperature signals are output and transmitted to the controller 112, the controller 112 outputs another refrigeration signals according to the temperature signals, the semiconductor refrigeration assembly heats the temperature sensitive device according to the refrigeration signals until the temperature of the temperature sensitive device is within the preset range, and when the temperature of the temperature sensitive device obtained by the temperature sensor 105 is equal to the preset value, the temperature sensor 105 is in a standby state or outputs a normal temperature signal, so that the controller 112 controls the semiconductor refrigeration assembly to be in a standby state.
As shown in fig. 1 to 3, the housing 101 is further formed with a high temperature cavity in which the second heat transfer member 111 is located. Through the setting of high temperature cavity, can be isolated in the high temperature cavity with the absorptive heat of second heat transfer spare, avoid the heat of second heat transfer spare to spread for other devices, make the absorptive heat of second heat transfer spare 111 all transmit away through radiator unit basically, improved constant temperature equipment's reliability.
As shown in fig. 3, a heat insulating layer 104 is disposed on the inner wall of the casing 101, the cavity blocks heat exchange with the outside of the casing 101 through the heat insulating layer 104, and the heat insulating capability of the low temperature cavity and the high temperature cavity is further improved to avoid the influence of the external environment on the temperature in the cavity, thereby avoiding the influence of the external environment on the temperature of the temperature sensitive device, improving the accuracy of the semiconductor refrigeration assembly in adjusting the temperature of the temperature sensitive device, and enabling the temperature of the temperature sensitive device to be more stable within a preset temperature range.
The heat insulation layer 104 can be a heat insulation coating, is coated on the inner surface of the shell 101, is small in thickness due to the adoption of the heat insulation coating, occupies a small cavity, can reduce the volume of the constant temperature device, and is convenient for carrying temperature sensitive devices. In addition, the heat insulation layer 104 may be a heat insulation plate made of a heat insulation material, which is attached to the inner wall of the casing 101. The present disclosure is not limited to the specific materials of the thermal barrier coating and the thermal shield.
As shown in fig. 3, the semiconductor refrigeration assembly includes a semiconductor refrigeration plate 110, a th heat transfer element 109 and a second heat transfer element 111, the th heat transfer element 109 and the second heat transfer element 111 are respectively disposed at two sides of the semiconductor refrigeration plate 110, and the second heat transfer element 111 is connected to the heat dissipation assembly, wherein the th heat transfer element 109 and the second heat transfer element 111 may be made of high thermal conductivity material, such as silicon material, aluminum material, etc., the th heat transfer element 109 and the second heat transfer element 111 may be rectangular parallelepiped shape, etc., and the disclosure does not limit the material and specific shape of the th heat transfer element 109 and the second heat transfer element 111.
Specifically, when the semiconductor chilling plate 110 is switched on, the surface of the semiconductor chilling plate 110 connected with the th heat transfer element 109 is a low temperature surface, heat of the temperature sensitive device is transferred to the second heat transfer element 111 through heat conduction of the th heat transfer element 109, the second heat transfer element 111 outputs heat through cooling of the heat dissipation assembly, and therefore the purpose of reducing the temperature of the temperature sensitive device is achieved, and when the semiconductor chilling plate 110 is switched on reversely, the surface of the semiconductor chilling plate 110 connected with the th heat transfer element 109 is a high temperature surface, heat is transferred to the temperature sensitive device through the th heat transfer element 109, so that the temperature of the temperature sensitive device is increased, and therefore the temperature of the high temperature sensitive device is within a preset range.
As shown in fig. 1, the heat dissipation assembly includes a heat exchange pipeline and a heat sink 114, the heat exchange pipeline includes a water flow pipeline 113 and a water pump, the second heat transfer element 111 is closely attached to the water flow pipeline 113 for conducting heat, an end of the water flow pipeline 113 is connected to an inlet of the heat sink 114, and another end of the water flow pipeline 113 is connected to an outlet of the heat sink 114 to form a loop, wherein the water pump is used for driving the heat exchange liquid in the water flow pipeline to circularly flow between the second heat transfer element 111 and the heat sink 114 for transferring heat.
In another embodiment, the second heat transfer element 111 includes a hollow flow channel therein, and the size, length and position of the hollow flow channel in the second heat transfer element 111 may be designed by those skilled in the art according to actual requirements, it should be understood that the longer the length, the larger the cross section and the more distributed the positions of the heat exchange flow channel, the more necessary the heat exchange capacity between the heat exchange liquid in the heat exchange flow channel and the second heat transfer element 111 will be enhanced, and the application does not limit this.
The radiator 114 is used for cooling the high-temperature heat-exchange liquid from the water flow pipeline loop, the high-temperature heat-exchange liquid flows into the heat dissipation flow channel of the radiator 114, and the high-temperature heat-exchange fluid in the heat dissipation flow channel dissipates heat through the surface of the radiator 114, so as to reduce the temperature of the heat-exchange fluid. Specifically, the heat sink 114 may be a heat dissipating fin, which has a large surface area and a strong heat exchanging capability with the external environment, and can accelerate the cooling effect of the high-temperature heat exchanging liquid.
The heat exchange liquid can be water, the water is used as the liquid exchange liquid, the heat exchange capacity is strong, the cost is low, the maintenance of the heat exchange assembly is convenient, and the liquid exchange liquid is not limited by the liquid exchange liquid.
As shown in fig. 3, the heat dissipating assembly further includes a fan 115. The fan 115 is disposed opposite to the heat sink 114 for increasing the air flow speed on the surface of the heat sink 114, thereby increasing the heat exchange capability of the heat sink 114 with the external environment.
Specifically, the water flow pipe 113 is a flexible pipe, which may be a plastic hose or a metal hose. The flexible heat exchange pipeline is connected with the second heat transfer element 111, so that the connection between the radiator 114 and the second heat transfer element 111 is flexible, and the arrangement of the heat exchange pipeline and the radiator 114 is convenient.
As shown in FIG. 3, the temperature sensitive device comprises a PCB 108, a silicon photomultiplier array 107 and a crystal array 106. the silicon photomultiplier array 107 is disposed on the PCB 108, the crystal array 106 is disposed on the side of the silicon photomultiplier array 107 away from the PCB 108, and the th heat transfer element 109 abuts the PCB 108.
The substrate material of the PCB 108 is a heat conducting material, preferably, the substrate material is a heat conducting material with good heat conductivity, for example, the PCB 108 is an aluminum substrate, which has good heat conductivity, and can conduct the heat of the silicon photomultiplier array 107 to the substrate at a uniform speed, thereby preventing the silicon photomultiplier array 107 from generating heat accumulation.
As shown in fig. 3, the thermostatic device further includes a drying chamber 102, the drying chamber 102 is disposed in the low-temperature cavity, and a drying agent 103 is disposed in the drying chamber 102. The drying agent 103 dehydrates the air in the cavity at low temperature, so that the moisture is prevented from being condensed on the PCB 108 at low temperature, and the reliability of the constant temperature device is improved. The specific position of the drying chamber 102 in the cavity can be set by those skilled in the art as required, and the disclosure is not limited thereto, and any solution that can achieve the same technical effect falls within the scope of the disclosure.
When the nuclear detection equipment comprises a temperature sensitive device with a silicon photomultiplier array, the constant temperature device can be adopted to control the temperature of the silicon photomultiplier array, so that the silicon photomultiplier array can stably work in a low-temperature environment. Because the semiconductor component is adopted to control the temperature of the silicon photomultiplier array, the volume of the constant temperature device can be reduced, and the nuclear detection equipment can be conveniently carried.
This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the -like principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains and as may be applied to the essential features hereinbefore set forth, the description and examples are to be considered as illustrative only, the true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1, thermostat for temperature sensitive devices, comprising:
the temperature sensor comprises a shell, a temperature sensor and a temperature sensor, wherein an sealed cavity is formed in the shell, and a temperature sensor is arranged in the cavity;
the semiconductor refrigeration assembly is arranged on the boundary of the cavity, is connected with the temperature sensitive device and is used for adjusting the temperature of the temperature sensitive device so as to enable the temperature value of the temperature sensitive device to be within a preset range;
and the heat dissipation assembly is connected with the semiconductor refrigeration assembly and is used for absorbing heat energy generated by the semiconductor refrigeration assembly.
2. The thermostat device of claim 1, further comprising:
the temperature sensor is arranged in the cavity and used for acquiring the temperature of the temperature sensitive device and outputting temperature signals;
and the controller is used for outputting a refrigeration signal to the semiconductor refrigeration assembly according to the temperature signal, and the semiconductor refrigeration assembly responds to the refrigeration signal to adjust the temperature of the temperature sensitive device.
3. The thermostat device according to claim 1, wherein an insulating layer is provided on an inner wall of the housing.
4. The thermostat device of claim 1, wherein the semiconductor refrigeration assembly comprises:
a semiconductor refrigeration sheet;
heat transfer element and second heat transfer element respectively arranged at two sides of the semiconductor refrigeration piece, the second heat transfer element is connected with the heat dissipation component.
5. The thermostat device of claim 4, wherein the heat sink assembly comprises:
the heat exchange pipeline comprises a water pump and a water flow pipeline, the water flow pipeline partially passes through the second heat transfer piece and is tightly attached to the second heat transfer piece, and heat exchange liquid absorbs heat from the second heat transfer piece when passing through the pipeline attached to the second heat transfer piece;
the radiator comprises a heat dissipation flow channel, wherein the end of the water flow pipeline is connected with the inlet of the heat dissipation flow channel, and the other end of the water flow pipeline is connected with the outlet of the heat dissipation flow channel.
6. The thermostat device of claim 5, wherein the heat sink assembly further comprises:
and the fan is arranged opposite to the radiator and used for increasing the air flow speed on the surface of the radiator.
7. A thermostat according to claim 5, wherein the water flow line is a flexible line.
8. A thermostat arrangement according to claim 1, characterized in that the temperature-sensitive means comprise:
a PCB board;
the silicon photomultiplier array is arranged on the PCB;
and the crystal array is arranged on the side of the silicon photomultiplier array far away from the PCB.
9. The thermostat device of claim 8, wherein the substrate material of the PCB board is a thermally conductive material.
10. The thermostat device of claim 1, further comprising:
and the drying bin is arranged in the cavity and is internally provided with a drying agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920484317.5U CN210005703U (en) | 2019-04-10 | 2019-04-10 | Constant temperature device of temperature sensitive devices |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920484317.5U CN210005703U (en) | 2019-04-10 | 2019-04-10 | Constant temperature device of temperature sensitive devices |
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| CN210005703U true CN210005703U (en) | 2020-01-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115454163A (en) * | 2022-09-05 | 2022-12-09 | 深圳市威湃创新科技有限公司 | Constant temperature control method and constant temperature device thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115454163A (en) * | 2022-09-05 | 2022-12-09 | 深圳市威湃创新科技有限公司 | Constant temperature control method and constant temperature device thereof |
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