CN1297690C - Appts. for silicon anisotropic corrosion - Google Patents
Appts. for silicon anisotropic corrosion Download PDFInfo
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- CN1297690C CN1297690C CNB2004100170333A CN200410017033A CN1297690C CN 1297690 C CN1297690 C CN 1297690C CN B2004100170333 A CNB2004100170333 A CN B2004100170333A CN 200410017033 A CN200410017033 A CN 200410017033A CN 1297690 C CN1297690 C CN 1297690C
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Abstract
The present invention relates to a silicon anisotropic corrosion device which comprises a magnetic stirrer, a corroding container, a metal plate, a condensing refluxing device, a temperature controlling instrument and a pH measurement instrument, wherein the metal plate is heated by resistance wires or is covered by ceram; the temperature controlling instrument controls the temperature of corroding solutions. The device structure of the present invention has the advantages that corroding parameters and corroding states can be controlled, the repeatability of corroding results of corroding samples can be ensured, and the fine structure required by sample design can be met.
Description
Technical field
The present invention relates to device used in the microelectromechanical systems manufacturing process, specifically be meant a kind of device that is used for silicon anisotropic etching.
Background technology
The anisotropic corrosion technique of silicon is an important content in silicon microelectromechanical systems (MEMS) manufacturing technology.Usually, can select alkali metal hydroxide for use, a kind of as corrosive fluid in organic diamine or the ammonium hydroxide three class solution carries out the microfabrication of body silicon, to realize desired microtexture.
The anisotropic wet of silicon corrosion normally at high temperature (T>80 ℃) is carried out, and has certain erosion rate with the corrosion that guarantees silicon.The pattern on the size of erosion rate and the surface that is corroded closely depends on the temperature of corrosive fluid, the concentration of corrosive fluid, and corrosive fluid is in the velocity of flow of silicon face, the homogeneity of corrosive fluid in the corrosion process, parameter and states such as the additive in the corrosive fluid.Guarantee to obtain a controllable corrosion process, guarantee the microtexture repeatably met design requirement, use specially, can be controlled, monitor, and be beneficial to the device of operating in the corrosion process and just seem very important etching condition.
The Chinese patent 85203849 of the Liu Zhenfang that on December 3rd, 1986 authorized etc., announced a kind of corrosion device that is attached to the flat return-flow system on the corrosion container lid, the sleeve pipe that the laying temperature meter is also arranged on its corrosion container, can in corrosion process, measure the temperature of corrosive fluid, but do not have thermostatic control, and lack to the stirring of corrosive fluid with to the monitoring of corrosive fluid pH value.5,779, No. 927 United States Patent (USP)s that on July 14th, 1998 announced have been issued a kind of etcher of taking back stream and pH value monitoring, and just it is at application, gas-protection-free and whipping appts with the phosphoric acid corrosion silicon nitride.
Summary of the invention
Based on the defective that above-mentioned existing device exists, the objective of the invention is to propose a kind of can be to corrosion parameter and etch state control, and be beneficial to the silicon anisotropic etching device of operating in the corrosion process.
Silicon anisotropic etching device of the present invention comprises: magnetic stirring apparatus 1, corrosion container 2, a metal sheet that can wrap by the metal sheet or the pottery of resistance wire 3 heating is arranged between magnetic stirring apparatus and corrosion container, and this metal sheet is used for the corrosive fluid heating.The corrosion container is made up of corrosion container body 201 and container cover 202.
It is characterized in that: also have a condensation reflux device 4 on the container caping, the inlet pipe 401 of condensation reflux device connects with container cover intermediate throughholes 202-1, and return line 404 inserts in the corrosive fluid by container cover next door through hole 202-2.In the corrosion container body sample anchor clamps 5 are arranged, measure the temperature probe 601 of corrosive fluid temperature in addition on the limit, measure the probe 702 of corrosive fluid pH value, they connect with controller 6 and pH value survey meter 7 by container cover periphery through hole respectively.
Advantage of the present invention is as follows:
1. because the corrosion parameter and the etch state may command of corrosion device of the present invention, the repeatability of the sample Corrosion results that guaranteed to be corroded, the sample that guaranteed to be corroded has the microtexture that meets design requirement.
2. because corrosion device of the present invention will be protected gas circuit; whipping appts; the measurement supervisory system gathers together; make this corrosion device can select alkali metal hydroxide according to need for use; organic diamine or ammonium hydroxide three class solution any as corrosive fluid, widened the scope of application of general corrosion device.
Description of drawings
Fig. 1 is the structural representation of corrosion device.
Fig. 2 is the structural representation of magnetic stirring apparatus and heating temperature control part.
Fig. 3 A is the structural representation of corrosion container, and Fig. 3 B is the vertical view of container cover.
Fig. 4 is the structural representation of condensation reflux device.
Fig. 5 is the structural representation of pH value survey meter.
Fig. 6 is the structural representation of sample clamp.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail:
Controller 6 is by the alternating source that provides for magnetic stirring apparatus 1, for the power supply that resistance wire 3 provides is partly formed with the temperature control of control corrosive fluid temperature.Temperature control partly adopts XMT-C type " proportion integration differentiation (PID) " feedback closed loop control mode.
Magnetic stirring apparatus 1 produces alternating magnetic field by the alternating-current that controller provides, and stirrer 101 placed alternating magnetic field, stirrer changes with ac frequency and rotates, when stirrer is in the corrosive fluid, promptly drive corrosive fluid and rotate, corrosive fluid each several part concentration is reached unanimity.Stirrer 101 is right cylinder or Spindles of being made by permanent magnet material, and its outside is wrapped up by fluorinated ethylene propylene.Can satisfy at strong acid, the strong base solution environment is work down.
The heating of corrosive fluid is to be realized by the metal sheet that resistance wire 3 metal heating plates or pottery wrap by the power supply that controller 6 provides, and can reach to be higher than 80 ℃ working temperature.The temperature of corrosive fluid is to be controlled by the temperature that temperature probe 601 gets by temperature control part in the controller, and temperature probe can be occasionally white appliances resistance of thermoelectricity.
Fig. 3 A has shown corrosion container 2, is made up of container body 201 and container cover 202.Container and container cover are all selected silica glass material for use, can satisfy in strong base solution basic assurance and not be corroded.There is scale 203 side of container body 201, is used for showing the amount of corrosion container corrosive fluid.
Fig. 3 B is the vertical view of container cover 202, and 6 through holes are arranged on the container cover, is used to connect condenser, shielding gas, and temperature survey is with popping one's head in and the pH value measuring sonde.Intermediate throughholes 202-1 is positioned at the middle part of container cover, connecting the inlet pipe 401 of condenser, is the induction trunk of corrosive fluid steam, and next door through hole 202-2 is positioned at the edge of container cover, being used to insert the return line 404 of condenser, is the passage that returns container behind the corrosive fluid vapor condensation.Third through-hole 202-3 and fourth hole 202-4 are the import and the outlets of shielding gas, are positioned at the container cover edge, and be mutually corresponding and be in the two ends of container cover diameter.Fifth hole 202-5 and the 6th through hole 202-6 also are in the container cover edge, are respectively applied for to connect temperature probe 601 and pH value measuring sonde 702.Each through hole all is furnished with the silica glass stopper, uses to do the through hole sealing when not measuring.The trim of contact surface between container body and the container cover and through hole stopper all adopts the sealing of frosted mouth.
Fig. 4 has shown condensation reflux device 4, by first serpentine condenser 402 and second serpentine condenser 407, and prolong connecting joint 403, water coolant pipe connecting 405 and return line 404 constitute.Inlet pipe 401 is connected to container cover intermediate throughholes 202-1, is used for entering of corrosive fluid steam; Return line 404 inserts in the corrosive fluid by container cover next door through hole 202-2, is used for normally returning of condensation post-etching liquid.405 is the import and export of serpentine condenser water coolant, and the water coolant pipe connecting of two serpentine condensers connects by rubber hose 406.
The main consideration and the emphasis point of condensation reflux device 4 designs are:
With condenser arrangement in top of closure because the existence of water of condensation, can play the counterweight effect of lid, corrosive fluid steam is limited in the container in the assurance work.
2. select two straight formula serpentine condensers for use, both, be easy to buying because this type prolong is a coventional type; Realized the closure in condensation loop again, and guaranteed the condensation channel sufficiently long, enough condensation efficiencies have been arranged.
3. prolong interface and probe interface all are placed on the edge of corrosion container lid, are will guarantee to put into probe post-etching container to leave enough sample angle placement spaces.
The anisotropic etch of silicon normally carries out in the basic solution environment.Corrosive effect closely depends on OH ionic concentration in the corrosive fluid.So, the monitoring of solution pH value is very important.Choosing of pH value survey meter 7 will make it be complementary with actual working state, promptly satisfies under the high temperature and to use and the requirement of wide trend of work scope.Fig. 5 has shown plum Teller-Tuo benefit Delta 320 type pH value survey meters, constitutes by measuring main frame 701 and measuring sonde 702.Probe 702 immerses in the corrosive fluid during measurement.Its pH value can the survey scope be 0-14, and operating temperature range is 80-120 ℃.The temperature compensation of pH value survey meter 7 should have same dynamicrange.
Fig. 6 has shown sample clamp 5, and material is selected silica glass too for use, is shaped as square or circular hanging basket.Inner row has the axial arc division plate 504 of polylith, is used to make the silicon chip that is corroded upright.Division plate is that arc can guarantee that the silicon chip surface of putting into can not contact with hanging basket.Handle 503 makes things convenient for putting into and taking out of hanging basket.3 or 4 supporting legs 501 are arranged at the hanging basket bottom, support hanging basket and make the stirrer 101 of magnetic stirring apparatus 1 that the working space of rotation be arranged.On the bottom of hanging basket and side and the division plate, all have small through hole 502, so that the inside and outside corrosive fluid of hanging basket exchanges in the corrosion.The size of hanging basket also satisfies the sealing that it does not highly influence container lid except the diameter that satisfies it does not influence putting into of return line position and temperature probe and pH value probe.
The main consideration and the emphasis point of the design of sample clamp are:
1. anchor clamps should make sample fix, and the surface different corrosion containers that are corroded collide, to avoid the damage of surperficial desired microstructure;
Anchor clamps should satisfy make corrosive fluid can be inside and outside anchor clamps fully exchange;
3. anchor clamps should not influence the rotation of stirring rotator;
4. anchor clamps are answered handled easily, are beneficial to putting into and emitting to the corrosion container.
For some anisotropic etchant, as organic diamine EDP, also need to feed shielding gas, to guarantee the chemical stability of corrosive fluid.So the present invention also designs the path of shielding gas.
The protection air path part is made of shielding gas steel cylinder and gas pipeline.Through hole 202-3 air inlet by corrosion container lid top is discharged gas by through hole 202-4 in the corrosion container.
Claims (7)
1. device that is used for silicon anisotropic etching, comprise: magnetic stirring apparatus (1), corrosion container (2), one metal sheet that can wrap by the metal sheet or the pottery of resistance wire (3) heating is arranged between magnetic stirring apparatus and corrosion container, and the corrosion container is made up of corrosion container body (201) and container cover (202);
It is characterized in that: also have a condensation reflux device (4) on the container caping, the inlet pipe of condensation reflux device (401) connects with container cover intermediate throughholes (202-1), and return line (404) inserts in the corrosive fluid by container cover next door through hole (202-2); In the corrosion container body, sample anchor clamps (5) are arranged, on the limit, measure the temperature probe (601) of corrosive fluid temperature in addition, measure the probe (702) of corrosive fluid pH value, they connect with controller (6) and pH value survey meter (7) by container cover periphery through hole respectively.
2. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: said sample clamp (5) is shaped as square or circular hanging basket, there are polylith and the hanging basket bottom upright arc division plate of fixed (504) in inside, be used to make the silicon chip that is corroded upright, the handle (503) of being convenient to hanging basket and putting into and take out is arranged above the hanging basket, the hanging basket bottom has the hanging basket of support to make the stirrer (101) of magnetic stirring apparatus (1) that 3 or 4 supporting legs (501) of the working space of rotation be arranged, and all has small through hole (502) on the bottom of hanging basket and side and the division plate.
3. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: said condensation reflux device is by inlet pipe (401), first serpentine condenser (402) and second serpentine condenser (407), prolong connecting joint (403), water coolant pipe connecting (405) and return line (404) constitute; The water coolant pipe connecting (405) of two serpentine condensers connects by rubber hose (406).
4. a kind of device that is used for silicon anisotropic etching according to claim 2 is characterized in that: this stirrer (101) is right cylinder or the Spindle of being made by permanent magnet material, and its outside is wrapped up by fluorinated ethylene propylene.
5. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: said controller (6) is by the alternating source that provides for magnetic stirring apparatus (1), partly form with the temperature control of control corrosive fluid temperature for the power supply that resistance wire (301) provides, temperature control partly adopts XMT-C type proportion integration differentiation feedback closed loop control mode.
6. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: 6 through holes are arranged on the said container cover, they are intermediate throughholes (202-1), next door through hole (202-2), third through-hole (202-3), fourth hole (202-4), fifth hole (202-5) and the 6th through hole (202-6); Third through-hole and fourth hole are the import and the outlets of shielding gas, are positioned at the container cover edge, and be mutually corresponding and be in the two ends of container cover diameter; Fifth hole and the 6th through hole also are in the container cover edge, are respectively applied for connection temperature probe (601) and each through hole of pH value measuring sonde (702) and all are furnished with the silica glass stopper, and the contact surface of through hole and silica glass stopper all adopts the sealing of frosted mouth.
7. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: the container body (201) of said corrosion container (2) and the contact surface between the container cover (202) all adopt the sealing of frosted mouth.
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CNB2004100170333A CN1297690C (en) | 2004-03-18 | 2004-03-18 | Appts. for silicon anisotropic corrosion |
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CNB2004100170333A CN1297690C (en) | 2004-03-18 | 2004-03-18 | Appts. for silicon anisotropic corrosion |
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CN1297690C true CN1297690C (en) | 2007-01-31 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102879248A (en) * | 2012-10-15 | 2013-01-16 | 上海锅炉厂有限公司 | Device for inspecting macrostructure of steel billet by using heat etching method |
CN103762160B (en) * | 2014-01-28 | 2017-05-10 | 北京华力创通科技股份有限公司 | Deep silicon etching method |
CN109437085A (en) * | 2018-10-25 | 2019-03-08 | 西南交通大学 | A kind of not damaged friction induction nanoprocessing method |
CN111379009B (en) * | 2020-04-30 | 2022-04-29 | 中国电子科技集团公司第五十五研究所 | Polishing method of thin-film lithium niobate optical waveguide chip polishing device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85203849U (en) * | 1985-09-17 | 1986-05-21 | 航天工业部七七一研究所 | Wet chemical corrosion device |
JPH11345799A (en) * | 1998-05-29 | 1999-12-14 | Mitsubishi Materials Silicon Corp | Anisotropy etching device |
US6245191B1 (en) * | 1997-08-21 | 2001-06-12 | Micron Technology, Inc. | Wet etch apparatus |
US6398904B1 (en) * | 1998-06-23 | 2002-06-04 | Samsung Electronics Co., Ltd. | Wet etching system for manufacturing semiconductor devices |
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- 2004-03-18 CN CNB2004100170333A patent/CN1297690C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85203849U (en) * | 1985-09-17 | 1986-05-21 | 航天工业部七七一研究所 | Wet chemical corrosion device |
US6245191B1 (en) * | 1997-08-21 | 2001-06-12 | Micron Technology, Inc. | Wet etch apparatus |
JPH11345799A (en) * | 1998-05-29 | 1999-12-14 | Mitsubishi Materials Silicon Corp | Anisotropy etching device |
US6398904B1 (en) * | 1998-06-23 | 2002-06-04 | Samsung Electronics Co., Ltd. | Wet etching system for manufacturing semiconductor devices |
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