CN1564310A - Appts. for silicon anisotropic corrosion - Google Patents
Appts. for silicon anisotropic corrosion Download PDFInfo
- Publication number
- CN1564310A CN1564310A CN 200410017033 CN200410017033A CN1564310A CN 1564310 A CN1564310 A CN 1564310A CN 200410017033 CN200410017033 CN 200410017033 CN 200410017033 A CN200410017033 A CN 200410017033A CN 1564310 A CN1564310 A CN 1564310A
- Authority
- CN
- China
- Prior art keywords
- corrosion
- container cover
- container
- hole
- corrosive liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Weting (AREA)
Abstract
The equipment includes magnetic stirrer, corrosion container, metal plate heatable by resistance wire or metal plate ceramics coated, condensation reflow unit, temperature controller and pH meter. Advantages are: controllable corrosion parameters and corrosion states so as to guarantee repeatable result of eroded sample and reach fine structure of eroded sample designed.
Description
Technical field
The present invention relates to device used in the microelectromechanical systems manufacturing process, specifically be meant a kind of device that is used for silicon anisotropic etching.
Background technology
The anisotropic corrosion technique of silicon is an important content in silicon microelectromechanical systems (MEMS) manufacturing technology.Usually, can select alkali metal hydroxide for use, a kind of as corrosive liquid in organic diamine or the ammonium hydroxide three class solution carries out the microfabrication of body silicon, to realize desired fine structure.
The anisotropic wet of silicon corrosion normally at high temperature (T>80 ℃) is carried out, and has certain corrosion rate with the corrosion that guarantees silicon.The pattern on the size of corrosion rate and the surface that is corroded closely depends on the temperature of corrosive liquid, the concentration of corrosive liquid, and corrosive liquid is in the flowing velocity of silicon face, the uniformity of corrosive liquid in the corrosion process, parameter and states such as the additive in the corrosive liquid.Guarantee to obtain a controllable corrosion process, guarantee the fine structure repeatably met design requirement, use specially, can be controlled, monitor, and be beneficial to the device of operating in the corrosion process and just seem very important etching condition.
The Chinese patent 85203849 of the Liu Zhenfang that on December 3rd, 1986 authorized etc., announced a kind of corrosion device that is attached to the flat return-flow system on the corrosion container lid, the sleeve pipe that the laying temperature meter is also arranged on its corrosion container, can in corrosion process, measure the temperature of corrosive liquid, but do not have thermostatic control, and lack to the stirring of corrosive liquid with to the monitoring of corrosive liquid pH value.5,779, No. 927 United States Patent (USP)s that on July 14th, 1998 announced have been issued a kind of etcher of taking back stream and pH value monitoring, and just it is at application, gas-protection-free and agitating device with the phosphoric acid corrosion silicon nitride.
Summary of the invention
Based on the defective that above-mentioned existing device exists, the objective of the invention is to propose a kind of can be to corrosion parameter and etch state control, and be beneficial to the silicon anisotropic etching device of operating in the corrosion process.
Silicon anisotropic etching device of the present invention comprises: magnetic stirring apparatus 1, corrosion container 2, a metallic plate 3 that can wrap by the metallic plate 3 or the pottery of resistance wire 301 heating is arranged between magnetic stirring apparatus and corrosion container, and this metallic plate is used for the corrosive liquid heating.The corrosion container is made up of corrosion vessel 201 and container cover 202.
It is characterized in that: also have a condensation reflux device 4 on the container caping, the air inlet pipe 401 of condensation reflux device connects with container cover intermediate throughholes 202-1, and return duct 404 inserts in the corrosive liquid by container cover next door through hole 202-2.In the corrosion vessel sample anchor clamps 5 are arranged, measure the temperature probe 601 of corrosive liquid temperature in addition on the limit, measure the probe 702 of corrosive liquid pH value, they connect with controller 6 and pH value measuring instrument 7 by container cover periphery through hole respectively.
Advantage of the present invention is as follows:
1. because the corrosion parameter and the etch state may command of corrosion device of the present invention, the repeatability of the sample Corrosion results that guaranteed to be corroded, the sample that guaranteed to be corroded has the fine structure that meets design requirement.
2. because corrosion device of the present invention will be protected gas circuit; agitating device; the measurement supervisory control system gathers together; make this corrosion device can select alkali metal hydroxide according to need for use; organic diamine or ammonium hydroxide three class solution any as corrosive liquid, widened the scope of application of general corrosion device.
Description of drawings
Fig. 1 is the structural representation of corrosion device.
Fig. 2 is the structural representation of magnetic stirring apparatus and heating temperature control part.
Fig. 3 A is the structural representation of corrosion container, and Fig. 3 B is the vertical view of container cover.
Fig. 4 is the structural representation of condensation reflux device.
Fig. 5 is the structural representation of pH value measuring instrument.
Fig. 6 is the structural representation of sample clamp.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail:
Magnetic stirring apparatus 1 produces alternating magnetic field by the alternating current that controller provides, and stirrer 101 placed alternating magnetic field, stirrer changes with ac frequency and rotates, when stirrer is in the corrosive liquid, promptly drive corrosive liquid and rotate, corrosive liquid each several part concentration is reached unanimity.Stirrer 101 is cylinder or Spindles of being made by permanent magnetic material, and its outside is wrapped up as polyvinyl fluoride by fluoroplastics.Can satisfy at strong acid, the strong base solution environment is work down.
The heating of corrosive liquid is to be realized by the metallic plate that resistance wire 301 metal heating plates 3 or pottery wrap by the power supply that controller 6 provides, and can reach to be higher than 80 ℃ working temperature.The temperature of corrosive liquid is to be controlled by the temperature that temperature probe 601 gets by temperature control part in the controller, and temperature probe can be occasionally white appliances resistance of thermoelectricity.
Fig. 3 A has shown corrosion container 2, is made up of vessel 201 and container cover 202.Container and container cover are all selected silica glass material for use, can satisfy in strong base solution basic assurance and not be corroded.There is scale 203 side of vessel 201, is used for showing the amount of corrosion container corrosive liquid.
Fig. 3 B is the vertical view of container cover 202, and 6 through holes are arranged on the container cover, is used to connect condenser, protective gas, and temperature survey is with popping one's head in and the pH value measuring probe.Through hole 202-1 is positioned at the middle part of container cover, connects the air inlet pipe 401 of condenser, is the inlet channel of corrosive liquid steam, and through hole 202-2 is positioned at the edge of container cover, is used to insert the return duct 404 of condenser, is the passage that returns container behind the corrosive liquid vapor condensation.Through hole 202-3 and 202-4 are the import and the outlets of protective gas, are positioned at the container cover edge, and be mutually corresponding and be in the two ends of container cover diameter.Through hole 202-5 and 202-6 also are in the container cover edge, are respectively applied for to connect temperature probe 601 and pH value measuring probe 702.Each through hole all is furnished with the quartz glass stopper, uses to do the through hole sealing when not measuring.The sealing surface of contact-making surface between vessel and the container cover and through hole stopper all adopts the sealing of frosted mouth.
Fig. 4 has shown condensation reflux device 4, by 2 serpentine condensers 401 and 402, and condenser pipe connector 403, cooling water tube connector 405 and return duct 404 constitute.Serpentine condenser 401 is connected to container cover intermediate throughholes 202-1, is used for entering of corrosive liquid steam; Return duct 404 inserts in the corrosive liquid by container cover next door through hole 202-2, is used for normally returning of condensation post-etching liquid.405 is the import and export of serpentine condenser cooling water, and the cooling water pipeline of two serpentine condensers connects by rubber tube 406.
The main consideration and the emphasis point of condensation reflux device 4 designs are:
With condenser arrangement in top of closure because the existence of condensed water, can play the counterweight effect of lid, corrosive liquid steam is limited in the container in the assurance work.
2. select two straight formula serpentine condensers for use, both, be easy to buying because this type condenser pipe is a plain edition; Realized the closure in condensation loop again, and guaranteed the condensation channel long enough, enough condensation efficiencies have been arranged.
3. condenser pipe interface and probe interface all are placed on the edge of corrosion container lid, are will guarantee to put into probe post-etching container to leave enough sample angle placement spaces.
The anisotropic etch of silicon normally carries out in the alkaline solution environment.Corrosive effect closely depends on the concentration of OH ion in the corrosive liquid.So, the monitoring of solution pH value is very important.Choosing of pH value measuring instrument 7 will make it be complementary with actual working state, promptly satisfies under the high temperature and to use and the requirement of wide trend of work scope.Fig. 5 has shown plum Teller-Tuo benefit Delta 320 type pH value measuring instruments, constitutes by measuring main frame 701 and measuring probe 702.Probe 702 immerses in the corrosive liquid during measurement.Its pH value can the survey scope be 0-14, and operating temperature range is 80-120 ℃.The temperature-compensating of pH value measuring instrument 7 should have same dynamic range.
Fig. 6 has shown sample clamp 5, and material is selected quartz glass too for use, is shaped as square or circular hanging basket.Inner row has the upright arc demarcation strip 504 of polylith, is used to make the silicon chip that is corroded upright.Demarcation strip is that arc can guarantee that the silicon chip surface of putting into can not contact with hanging basket.Handle 503 makes things convenient for putting into and taking out of hanging basket.3 or 4 supporting legs 501 are arranged at the hanging basket bottom, support hanging basket and make stirrer that the working space of rotation be arranged.On the bottom of hanging basket and side and the demarcation strip, all have small through hole 502, so that the inside and outside corrosive liquid of hanging basket exchanges in the corrosion.The size of hanging basket also satisfies the sealing that it does not highly influence container lid except the diameter that satisfies it does not influence putting into of return duct position and temperature probe and pH value probe.
The main consideration and the emphasis point of the design of sample clamp are:
1. anchor clamps should make sample fix, and the surface different corrosion containers that are corroded collide, to avoid the damage of surperficial desired micro-structural;
Anchor clamps should satisfy make corrosive liquid can be inside and outside anchor clamps fully exchange;
3. anchor clamps should not influence the rotation of stirring rotator;
4. anchor clamps are answered handled easily, are beneficial to putting into and emitting to the corrosion container.
For some anisotropic etchant, as organic diamine EDP, also need to feed protective gas, to guarantee the chemical stability of corrosive liquid.So the present invention also designs the path of protective gas.
The protection air path part is made of protective gas steel cylinder and gas pipeline.Through hole 202-3 air inlet by corrosion container lid top is discharged gas by through hole 202-4 in the corrosion container.
Claims (8)
1. device that is used for silicon anisotropic etching, comprise: magnetic stirring apparatus (1), corrosion container (2), one metallic plate (3) that can wrap by the metallic plate (3) or the pottery of resistance wire (301) heating is arranged between magnetic stirring apparatus and corrosion container, and the corrosion container is made up of corrosion vessel (201) and container cover (202);
It is characterized in that: also have a condensation reflux device (4) on the container caping, the air inlet pipe of condensation reflux device (401) connects with container cover intermediate throughholes (202-1), and return duct (404) inserts in the corrosive liquid by container cover next door through hole (202-2); In the corrosion vessel, sample anchor clamps (5) are arranged, on the limit, measure the temperature probe (601) of corrosive liquid temperature in addition, measure the probe (702) of corrosive liquid pH value, they connect with controller (6) and pH value measuring instrument (7) by container cover periphery through hole respectively.
2. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: said sample clamp (5) is shaped as square or circular hanging basket, inside have polylith be used to be corroded silicon chip upright with the fixing upright arc demarcation strip (504) in hanging basket bottom, the handle (503) of being convenient to hanging basket and putting into and take out is arranged above the hanging basket, the hanging basket bottom has the hanging basket of support to make stirrer (101) that 3 or 4 supporting legs (501) of the working space of rotation be arranged, and all has small through hole (502) on the bottom of hanging basket and side and the demarcation strip.
3. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: said condensation reflux device is by 2 serpentine condensers (401) and (402), condenser pipe connector (403), cooling water tube connector (405) and return duct (404) constitute; Serpentine condenser (401) is connected to container cover intermediate throughholes (202-1), return duct (404) inserts in the corrosive liquid by container cover next door through hole (202-2), (405-1) be the import and export of serpentine condenser cooling water, the cooling water pipeline of two serpentine condensers (405) connects by rubber tube (406)
4. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: the stirrer (101) of said magnetic stirring apparatus (1) places the corrosive liquid of corrosion container (2), and is in the hanging basket bottom.
5. a kind of device that is used for silicon anisotropic etching according to claim 4 is characterized in that: this stirrer (101) is cylinder or the Spindle of being made by permanent magnetic material, and its outside is wrapped up as polyvinyl fluoride by fluoroplastics.
6. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: said controller (6) is by the alternating source that provides for magnetic stirring apparatus (1), partly form with the temperature control of control corrosive liquid temperature for the power supply that resistance wire (301) provides, temperature control partly adopts proportion integration differentiation feedback closed loop control mode.
7. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: 6 through holes are arranged on the said container cover, through hole (202-1) is positioned at the middle part of container cover, the air inlet pipe (401) that connects condenser, through hole (202-2) is positioned at the edge of container cover, is used to insert the return duct (404) of condenser, through hole (202-3) and (202-4) be the import and the outlet of logical protective gas, be positioned at the container cover edge, mutually corresponding and be in the two ends of container cover diameter; Through hole (202-5) and (202-6) also be in the container cover edge is respectively applied for and connects temperature probe (601) and pH value measuring probe (702); Each through hole all is furnished with the quartz glass stopper, and the contact-making surface of through hole and quartz glass stopper all adopts the sealing of frosted mouth.
8. according to a kind of device that is used for silicon anisotropic etching of claim 1, it is characterized in that: the vessel (201) of said corrosion container (2) and the contact-making surface between the container cover (202) all adopt the sealing of frosted mouth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100170333A CN1297690C (en) | 2004-03-18 | 2004-03-18 | Appts. for silicon anisotropic corrosion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100170333A CN1297690C (en) | 2004-03-18 | 2004-03-18 | Appts. for silicon anisotropic corrosion |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1564310A true CN1564310A (en) | 2005-01-12 |
CN1297690C CN1297690C (en) | 2007-01-31 |
Family
ID=34478737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100170333A Expired - Fee Related CN1297690C (en) | 2004-03-18 | 2004-03-18 | Appts. for silicon anisotropic corrosion |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1297690C (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102879248A (en) * | 2012-10-15 | 2013-01-16 | 上海锅炉厂有限公司 | Device for inspecting macrostructure of steel billet by using heat etching method |
CN103762160A (en) * | 2014-01-28 | 2014-04-30 | 北京华力创通科技股份有限公司 | Deep silicon etching method and device |
CN109437085A (en) * | 2018-10-25 | 2019-03-08 | 西南交通大学 | A kind of not damaged friction induction nanoprocessing method |
CN111379009A (en) * | 2020-04-30 | 2020-07-07 | 中国电子科技集团公司第五十五研究所 | Thin film lithium niobate optical waveguide chip polishing device and polishing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85203849U (en) * | 1985-09-17 | 1986-05-21 | 航天工业部七七一研究所 | Wet chemical corrosion device |
US5914052A (en) * | 1997-08-21 | 1999-06-22 | Micron Technology, Inc. | Wet etch method and apparatus |
JP3509555B2 (en) * | 1998-05-29 | 2004-03-22 | 三菱住友シリコン株式会社 | Anisotropic etching equipment |
KR100292953B1 (en) * | 1998-06-23 | 2001-11-30 | 윤종용 | Etching apparatus for manufacturing semiconductor device and etching method using same |
-
2004
- 2004-03-18 CN CNB2004100170333A patent/CN1297690C/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102879248A (en) * | 2012-10-15 | 2013-01-16 | 上海锅炉厂有限公司 | Device for inspecting macrostructure of steel billet by using heat etching method |
CN103762160A (en) * | 2014-01-28 | 2014-04-30 | 北京华力创通科技股份有限公司 | Deep silicon etching method and device |
CN103762160B (en) * | 2014-01-28 | 2017-05-10 | 北京华力创通科技股份有限公司 | Deep silicon etching method |
CN109437085A (en) * | 2018-10-25 | 2019-03-08 | 西南交通大学 | A kind of not damaged friction induction nanoprocessing method |
CN111379009A (en) * | 2020-04-30 | 2020-07-07 | 中国电子科技集团公司第五十五研究所 | Thin film lithium niobate optical waveguide chip polishing device and polishing method thereof |
CN111379009B (en) * | 2020-04-30 | 2022-04-29 | 中国电子科技集团公司第五十五研究所 | Polishing method of thin-film lithium niobate optical waveguide chip polishing device |
Also Published As
Publication number | Publication date |
---|---|
CN1297690C (en) | 2007-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101175612B (en) | Apparatus for servicing a plasma processing system with a robot | |
KR100892809B1 (en) | Substrate treatment apparatus and substrate treatment method | |
CN100405536C (en) | Substrate processing system | |
WO2015100793A1 (en) | Dry etcher and etching method therefor | |
CN1297690C (en) | Appts. for silicon anisotropic corrosion | |
JPH0817790A (en) | Method and apparatus for internal monitoring of noncontact real-time device of chamical etching process | |
CN101308082A (en) | Experimental device for static state high-temperature naphthenic acid erosion | |
CN109817539A (en) | Wafer measuring thickness device and wafer thickness measuring system | |
JP2012038968A (en) | Spin coating method | |
KR102485046B1 (en) | Gas sensor probe for measuring dissolved gas of transformer | |
TWI297904B (en) | ||
CN104681465B (en) | Integrated system, integrated system operating method and membrane processing method | |
CN113218857A (en) | Electrochemical analysis device and method for electronic product electrochemical migration micro-area | |
CN212568398U (en) | Metal anticorrosion coating environmental test device | |
JP7004221B2 (en) | Silicon wafer etching method, etching equipment and impurity analysis method | |
CN216348486U (en) | Novel split type coating thickness gauge probe | |
CN214346324U (en) | Dosing unit is used in production of circulating water corrosion inhibitor | |
CN212391324U (en) | Constant temperature heating sample digestion device | |
CN104733276B (en) | Window blocking device of etching machine | |
CN108426978A (en) | Wafer local processing method | |
CN111336792B (en) | Cavity for drying micro water drops | |
CN205785004U (en) | Tool for detected gas distribution plate | |
CN207408308U (en) | A kind of digestion instrument and solid power fuel heavy metal detection system | |
KR20230062136A (en) | Apparatus for processing substrate | |
CN117629984A (en) | Water quality detection device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070131 Termination date: 20100318 |