CN1294412A - Plastic substrate with heat dissipation function for package and its making method - Google Patents
Plastic substrate with heat dissipation function for package and its making method Download PDFInfo
- Publication number
- CN1294412A CN1294412A CN99123285A CN99123285A CN1294412A CN 1294412 A CN1294412 A CN 1294412A CN 99123285 A CN99123285 A CN 99123285A CN 99123285 A CN99123285 A CN 99123285A CN 1294412 A CN1294412 A CN 1294412A
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- copper foil
- plastic substrate
- thin copper
- manufacture method
- sinking function
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Abstract
A plastic substrate with heat dissipation function for package is made up of polyimide material with copper fil layers in different thicknesses on both surface through coating or pressing phototesist on one copper foil layer, exposing, developing, electroplating or etching to form circuit, and etching on another copper foil layer to form heat radiating plates. Its advantages are saving labour and raw material.
Description
The present invention relates to a kind of encapsulation with plastic substrate and manufacture method thereof, refer to a kind of encapsulation of tool heat sinking function plastic substrate and manufacture method thereof that on plastic substrate, directly forms the metal fin of heat transmission especially.
The function of chip constantly improves along with the progress of science and technology, under the functional requirement guiding, operating frequency has more and more high trend, therefore the caloric value of chip also increases thereupon, but in order to keep the normal operation of chip, below must maintaining chip temperature to a certain degree, so the thermal diffusivity of substrate promptly becomes a considerable design focal point, in existing technology,, help chip cooling so can on chip, attach a metal fin (Heat Sink) in order to provide wafer suitable heat radiation function.
By the element decomposing schematic representation of Fig. 3 as seen, the existing chip manufacture method is at tape-BGA (BallGrid Array) .CSP (Chip Scale Package) (tape-BGA.CSP means that integrated circuit successively uses coil type sphere grid array method for packing and wafer size method for packing to encapsulate) plastic substrate (the described in this article plastic substrate of mentioning, all being the simplification title of tape-BGA.CSP plastic substrate) 90 top tie spacers (Stiffener) 92 are with laminated bond fin 94, be mode combination therebetween with gummed, with regard on the drawing its in conjunction with processing and uncomplicated, but in fact because this series products all is to adopt full-automatic mode processing and manufacturing, so combination therebetween must be undertaken by special equipment.Production firm must carry out the applying of metal fin 94 by configure dedicated equipment for this reason, causes the increase on the cost.
The schematic side view that cooperates Fig. 4 more as seen, after with plastic substrate 90 tie spacers (Stiffener) 92 bond fin 94, i.e. structure as shown in FIG., then binder layer 96 between each layer, because the desired measure of precision of this series products and all quite high in conjunction with stability, hindered the heat radiation approach of chip simultaneously for fear of binder layer 96, so selecting for use of this binder promptly must be quite careful, it is the applying processing method of the suitable automation equipment of Dan Yaoneng not, to provide suitable linking steady character, want in the operational environment of chip, to keep the permanent time and never degenerate or get loose, also want to conduct heat rapidly, and the unlikely radiating effect that has influence on chip, so this kind binder must be special and special-purpose binder, all from external import, its cost is not low for the binder that present relevant industries are adopted, also caused the high of production cost, this shows in addition improved necessity.
Main purpose of the present invention is to overcome above-mentioned defective and provides a kind of tool heat sinking function that directly forms the metal fin of heat transmission on plastic substrate to encapsulate with plastic substrate and manufacture method thereof.
Technical program of the present invention lies in providing the manufacture method of a kind of tool heat sinking function encapsulation, comprising with plastic substrate:
A. selecting the two-sided polyimides that is provided with the Copper Foil of different-thickness for use is raw material, that is it is to be respectively equipped with thick Copper Foil and thin copper foil on a plastic substrate two sides;
B. coating or press polish resistance on described raw material is developed through mask exposure again, forms circuit on the thin copper foil to electroplate or to be etched in;
C. etching forms metal frame and metal fin on thick Copper Foil;
D. on plastic substrate, etch component hole;
E. form at thin copper foil surface appropriate location and refuse weldering;
F. online road surfaces carries out nickel plating/gold.
The heat sinking function of having the as the aforementioned encapsulation manufacture method of plastic substrate, wherein, etching component hole on plastic substrate can carry out with laser, plasma or chemical mode.
The tool heat sinking function encapsulation plastic substrate that manufacture method is as the aforementioned finished, wherein, plastic substrate two sides at a polyimides is respectively equipped with thick Copper Foil and thin copper foil, on thin copper foil, be formed with circuit, on thick Copper Foil, be formed with metal frame and metal fin, on plastic substrate, be provided with component hole simultaneously.
The present invention is with brand-new design, a kind of manufacture method that need not paste metal fin is provided, and metal fin can be directly molded on structure on the plastic substrate, it economizes the special equipment of using except the applying metal fin, also need not simultaneously again for selecting binder to bother, on the other hand, because product of the present invention is to allow metal fin be directly molded on the plastic substrate, have influence on the conduction of heat so can not be subjected to the obstruction of binder layer, and can allow the processing operation more simplify, cost is lower.
Further specify specific structural features of the present invention and purpose below in conjunction with accompanying drawing.
Fig. 1: be that schematic flow sheet is made in preferred embodiment of the present invention.
Fig. 2: be preferred embodiment finished product schematic appearance of the present invention.
Fig. 3: the element decomposing schematic representation that is the laminated bond fin of existing plastic substrate tie spacer.
Fig. 4: the combination schematic side view that is existing plastic substrate tie spacer bond fin.
See also shown in Figure 1ly, it is to make schematic flow sheet for preferred embodiment of the present invention, wherein can see making flow process of the present invention, and it mainly comprises:
A. adopting the two-sided polyimides (Polyimide) that is provided with the Copper Foil of different-thickness is raw material, that is it is to be respectively equipped with thick Copper Foil 20 and thin copper foil 30 on a plastic substrate 10 two sides;
B. coating or press polish resistance on these raw material is developed through mask exposure again, forms circuit 32 on the thin copper foil 30 to electroplate or to be etched in;
C. on thick Copper Foil 20, form metal frame 22 (Metal Frame) and metal fin 24 (Heatsink) with identical processing mode etching;
D. on plastic substrate 10, go out component hole 12 (Devicehole) with laser, plasma (Plasma) or chemical mode etching (Etching);
E. form at thin copper foil 30 surperficial appropriate locations and refuse to weld 34 (Solder resist);
F. carry out nickel plating/gold 36 on circuit 32 surfaces.
Via above-mentioned step, promptly finished the finished product of tool heat sinking function encapsulation of the present invention with plastic substrate 10.
Cooperate the preferred embodiment finished product schematic appearance of the present invention of Fig. 2 to see, its be for a component hole 12 towards the bottom surface and have a plastic substrate 10 of metal fin 24.
Claims (3)
1 one kinds of tool heat sinking function encapsulation manufacture method of plastic substrate is characterized in that comprising:
A. selecting the two-sided polyimides that is provided with the Copper Foil of different-thickness for use is raw material, that is it is to be respectively equipped with thick Copper Foil and thin copper foil on a plastic substrate two sides;
B. coating or press polish resistance on described raw material is developed through mask exposure again, forms circuit on the thin copper foil to electroplate or to be etched in;
C. etching forms metal frame and metal fin on thick Copper Foil;
D. on plastic substrate, etch component hole;
E. form at thin copper foil surface appropriate location and refuse weldering;
F. online road surfaces carries out nickel plating/gold.
The 2 tool heat sinking function encapsulation according to claim 1 manufacture method of plastic substrate, it is characterized in that: etching component hole on plastic substrate can carry out with laser, plasma or chemical mode.
The 3 tool heat sinking function encapsulation plastic substrates of finishing with the described manufacture method of claim 1, it is characterized in that: the plastic substrate two sides at a polyimides is respectively equipped with thick Copper Foil and thin copper foil, on thin copper foil, be formed with circuit, on thick Copper Foil, be formed with metal frame and metal fin, on plastic substrate, be provided with component hole simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99123285A CN1131553C (en) | 1999-10-29 | 1999-10-29 | Plastic substrate with heat dissipation function for package and its making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99123285A CN1131553C (en) | 1999-10-29 | 1999-10-29 | Plastic substrate with heat dissipation function for package and its making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1294412A true CN1294412A (en) | 2001-05-09 |
| CN1131553C CN1131553C (en) | 2003-12-17 |
Family
ID=5282853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99123285A Expired - Fee Related CN1131553C (en) | 1999-10-29 | 1999-10-29 | Plastic substrate with heat dissipation function for package and its making method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1131553C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685781B (en) * | 2008-09-23 | 2011-04-27 | 钰桥半导体股份有限公司 | Method for manufacturing packaging substrate |
| CN102130084A (en) * | 2009-12-19 | 2011-07-20 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with a post/base heat spreader and a signal post |
| CN101908510B (en) * | 2009-06-03 | 2012-05-09 | 钰桥半导体股份有限公司 | Semiconductor device with heat-radiating and packaging structure and manufacturing method thereof |
-
1999
- 1999-10-29 CN CN99123285A patent/CN1131553C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685781B (en) * | 2008-09-23 | 2011-04-27 | 钰桥半导体股份有限公司 | Method for manufacturing packaging substrate |
| CN101908510B (en) * | 2009-06-03 | 2012-05-09 | 钰桥半导体股份有限公司 | Semiconductor device with heat-radiating and packaging structure and manufacturing method thereof |
| CN102130084A (en) * | 2009-12-19 | 2011-07-20 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with a post/base heat spreader and a signal post |
| CN102130084B (en) * | 2009-12-19 | 2013-01-16 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with a post/base heat spreader and a signal post |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1131553C (en) | 2003-12-17 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| BB1A | Publication of application | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031217 Termination date: 20171029 |