CN1276698C - High polymer microcellular foam conductive gaskets and method for preparing thereof - Google Patents
High polymer microcellular foam conductive gaskets and method for preparing thereof Download PDFInfo
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- CN1276698C CN1276698C CN02828238.8A CN02828238A CN1276698C CN 1276698 C CN1276698 C CN 1276698C CN 02828238 A CN02828238 A CN 02828238A CN 1276698 C CN1276698 C CN 1276698C
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
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- Microelectronics & Electronic Packaging (AREA)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to a gasket to shield electronic apparatus from electric and electromagnetic waves and to a method for preparing the gasket, wherein the gasket is made of a conductive polymer elastic body. More particularly, an elastic body itself or an elastic body laminated with conductive fabric or metal film is punched to make holes, then a conductive material is applied thereto by dipping (filling) and coating to reduce surface resistivity and volume resistivity, and as a result, a gasket having impact and vibration absorption properties and conductivity is prepared.
Description
Technical field
The present invention relates to conductive gasket to communication apparatus shield electromagnetic interference (EMI) and/or radio frequency interference (RFI), and the method for making this liner.The manufacturing of liner of the present invention is by giving conductivity to polymer elastomer, so that liner has easy application, high conductivity, mechanics and physical strength.In addition, when utilizing low compression deformation to keep high impact absorption and vibration damping, liner of the present invention has kept foam required original hardness and pore structure uniformly in basic the application.
Background technology
When the various electronics of design, do not wish the feed line inductive interference or the radiation electrical Interference that occur from electric equipment or electronic equipment, it is the main cause that causes electronics function confusion, as weaken that it is functional, produce noise, destroy image, shorten life cycle and cause producing substandard products.As the shielding material of shield electromagnetic interference and/or radio frequency interference, use metallic plate, coat of metal fabric, electroconductive paints, conducting ring or materials similar traditionally.
As having the elastomeric conventional conductive material of polymer elastomer or polymeric sponge, perforate low-density polyurethane foam or closed-cell polyethylene foam are known.But,, impact or bump absorbent properties difference and the low (specific insulation: 10 of conductivity because their density is low
4Ω cm or bigger), so they are mainly used in packing and transportation electronics.
As being used to make the traditional elastic body that prevents the liner that clashes into or vibrate, can use highdensity polyurethane foam.The manufacturing of this polyurethane foam is by mix common poly hydroxyl compound, organic polyisocyanate compounds, cahin extension agent, catalyst, silicone foams stabilizer and air or inert gas in blender, as nitrogen, to obtain foam compositions (proportion: 0.1～1.0g/cm
3), follow the crosslinked foams composition, and by using common coating apparatus on the endless conveyor of equipment heat treated, to pour into homogeneous thickness.If desired, can the one or both sides of polyurethane foam laminated fabric or plastic film (U.S. Patent No. 3,755,212, U.S. Patent No. 3,862,879, U.S. Patent No. 4,216,177 and U.S. Patent No. 5,859,081).
In order to give conductivity, can make in the following method high density polyurethane foam.
A kind of method is, before the foaming process of polyurethane foam, as conducting pigment, is evenly dispersed in the poly hydroxyl compound with ordinary carbon black, graphite or such as the fine powder of silver, copper, nickel, aluminum metal and similar substance.But, in high density polyurethane foam, obtaining appropriate conductivity in order to use these conducting pigments, conducting pigment should form continuous passage, and the conducting pigment particle is coupled together in crosslinked polyurethane foam.That is, as the fine particle of carbon black, graphite or the metal of conducting pigment, should be very close each other, so that can transmit electronics.
For example, in order to obtain conductivity,, should add the carbon black of 15～30wt% of poly hydroxyl compound gross mass according to the particle size and the conductivity of carbon black by composite carbon black and polyurethane foam.In order to obtain higher conductivity, should add carbon black above 40wt%.But, when adding so a large amount of carbon blacks, the Dispersion of Particles difficulty, the melt viscosity of foamed compound is very high, the result, carbon black pellet is reunited each other; The viscosity that the foamed compound is so high is disturbed the appropriate conveying of material, and mixing and foaming process become extremely difficult.In addition, the proportion height of the product that obtains, physical property descends.As a result, can not use the gasket material of above-mentioned polyurethane foam as needs bump and vibration absorption.On the other hand, when using metal dust, in order to obtain stable conductivity, need more than 2～3 times of carbon black mass, this makes dispersion difficulty more, and increases proportion.Therefore, above-mentioned conducting pigment can not be applied to have the polyurethane foam (Fig. 9) of bump and vibration absorption except body phase conductivity.
Traditionally, as EMI that only needs surface conductivity and RFI shielding material, use metallic plate, coat of metal fabric and conductive strips, wherein their manufacturing is by conducting pigment being coated on various weaving devices, nonwoven fabrics, paper, plastic film or the materials similar.But because these materials do not have body phase conductivity, they need only to be used to the situation of surface conductivity, and the result has surface conductivity and the body polymeric sponge disclosure as yet of conductivity mutually simultaneously.
Yet, have low-gravity polymeric sponge material, as soft elastic polyurethane foam, be applied to packing and transport various electronic devices or semiconductor chip and shielding window bracket or electromagnetic equipment.But, because these soft polyurethane foamed materials are non-conductive and have high resistance, in order to obtain to have the required form of conductivity, need special technology, promptly, after polyurethane foam (polymeric sponge) being cut extraly or pour into required form, then paste conduction weaving device or nonwoven fabrics that expression has binding agent; Or complicated forming technology, as with the polyurethane foam compound injection in casting mold, wherein conductive spinning product or nonwoven fabrics have been contained on the surface of casting mold.As a result, the manufacturing cost height, so these are not widely used as the gasket material of electronics, and these gasket materials need bump and vibration damping performance and EMI shielding actions (Fig. 9) fully.
In order to give the required body phase conductivity of polymeric sponge and EMI and RFI shielding properties, common conductive black, graphite, gold, silver, copper, nickel, aluminium or similar material should be compound in the polymeric sponge foamed compound.But, in this case, as mentioned above, consider technology difficulty and physical property, the quantity that compound back is produced the conducting pigment of conductivity proposes restriction.As a result, be difficult to make specific insulation less than 10
4Ω cm.Therefore, have high surface and body conductivity and low hardness and compressive deformation mutually, HI high impact absorbs and the polymeric sponge liner of bump damping, does not create as yet.
In this case, in order to address the above problem and for the polymer elasticity foam provides conductivity, the present inventor investigates and studies.
As a result, the present inventor has drawn the present invention, and has made the liner that is used for electronics, and this is by to the elastomer punching, then uses electric conducting material on surface of elastomer, and fills these holes to the wall coating of punching or with electric conducting material; Perhaps by stacked conductive spinning product or metal forming on elastomeric two sides or side, then to the elastomer punching, and to the wall coating in the hole of getting, or fill these holes with electric conducting material.Compare with above-mentioned conventional art, liner of the present invention is made by very simple technology, and does not change elastomeric original physical property.And liner of the present invention can have surface and body conductivity mutually, and keeps impact absorption and vibration simultaneously or clash into damping capacity.
Therefore, the purpose of this invention is to provide a kind of liner, it is made easily, and obtains required surface conductivity and body electric conductor mutually simultaneously, keeps the ability of impact absorption and vibration damping simultaneously, and does not sacrifice its original physical property.
Another object of the present invention provides a kind of method of making liner.
Summary of the invention
The invention provides a kind of liner of electronic equipment, this liner is made by the cutting conducting strip, and the manufacturing of conducting strip is by elastomeric sheets is punched, then on the surface of elastomeric sheets, use the conductive paint that contains electric conducting material, on the wall in the hole of getting, use conductive paint again or use the conductive paint filler opening.
And, the invention provides a kind of liner of electronic equipment, its manufacturing is by before carrying out above-mentioned punching, will be layered on the elastomeric sheets such as the electric conducting material of conductive fabric or metal film.Promptly, sheet of conductive material, for example, such as the conductive fabric of nonwoven fabric base conductive fabric, or copper, aluminium, nickel, silver or golden metal film, be layered in after the both sides or a side of elastomeric sheets, then to stacked elastomeric sheets punching, fill hole that the punching process obtains or apply hole wall with conductive paint with conductive paint, and final cutting elastomeric sheet (conducting strip), thereby liner of the present invention obtained.
The present invention can use the elastomer of any kind, is the condition of being made by the rubber-like polymer and be not limited in elastomer.For example, can use fluoropolymer resin, as polyurethane foam sheet, PVC, silicones, ethylene vinyl acetate copolymer or polythene strip, rubber is as NR, SBR, EPDM, NBR or neoprene, synthetic rubber solid sheet or sponge sheet.
The thickness of sheet can be 0.5mm～10.0mm.The thickness of sheet can be selected according to application aims.
The electric conducting material that produces conductivity can be, for example, and carbon black, graphite, gold, silver, copper, nickel or aluminium, but be not limited thereto.These electric conducting materials use with the form of fine powder, mix to form to apply lacquer, are used for the surface of coated sheet and are used to apply hole wall or fill these holes.
One of ordinary skill in the art can easily be controlled the build that is coated in the conductive coating material layer on the sheet according to application purpose.The unit representation of the build of conductive coating based on mil (mil), wherein 1mil equals 0.025mm.Preferably, the build of conductive coating be 0.1mil to 3.0mil, more preferably 0.3mil is to 1.0mil.But, in the different application different thickness can be arranged.
In the time will being layered on the elastomeric sheets such as the sheet of conductive material of conductive fabric or metal film, the thickness of conductive fabric or metal film can be 1～10mil, more preferably 2～8mil.Particularly, the thickness of conductive fabric is better in 3～4mil scope, and the thickness of metal film is better in 2～3mil scope.
The preparation of conductive fabric can by the soft fabric of polyester or nylon or on nonwoven fabrics the mixed powder of deposition or electroless copper, nickel, aluminium, silver, gold or copper/nickel or copper/silver.Can use common chemical vapour deposition technique plated metal on fabric.Also can use electroless plating method plating on fabric.And the preparation of conductive fabric can be coated with the conductive yarn of electric conducting material by weaving.
As metal film, can use golden film, silverskin, copper film, nickel film, aluminium film or graphite film.
The conductive fabric of commercial distribution has a lot, for example, and SR-W23B (PET/Ni+Cu+Ni; Ripstop; E-Song company makes), ST-W29B (PET/Ni+Cu+Ni; Taffeta; E-Song company makes), SN-W05B (PET/Ni+Cu+Ni; Nonwoven fabrics; E-Song company makes), SM-W13B (PET/Ni+Cu+Ni; E-Song company makes), SP-W22B (PET/Ni+Cu; E-Song company makes), SR-W23D (PET/Ni; E-Song company makes) or ST-W25E (PET/Cu; E-Song company makes).
As for metal film, can use the metal film of conducting resinl banding pattern, as T200 (fabric/Ripstop backing; E-Song company makes), T214 (fabric/taffeta; E-Song company makes) or T254 (nonwoven fabrics backing; E-Song company makes).And,, can use T267, T288, T286 or T291 (manufacturing of E-Song company) as metal forming adhesive tape type.
As the binding agent that conductive fabric or metal film is pasted the polymer elasticity sheet, can use the conductive adhesive of commercial distribution.One of ordinary skill in the art can be selected a kind of suitable binding agent.Preferably, elastic binder is better.
According to the application of liner, the size and the distance between the hole of sheet and punching are different.For example, for the notebook computer of large-size, use big and thick sheet, the distance between the big and hole of the size in hole is also big.But, for the portable phone of reduced size, use thin sheet, the size and the distance between the hole in hole are also little.
Preferably, to be of a size of 0.1～3.0mm better in the hole.Every 1cm
2The quantity in hole can be 1～100 on the sheet.The arrangement in hole has no particular limits, but considers that manufacturing efficient and conductivity can change.For example, point-blank after the punching, when punching on the second parallel straight line, the angle on the previous straight line between the nearest hole can be 30 °～90 °.According to the application of liner, the size in hole, quantity and arrangement are different.
With the size restrictions in hole is to make conductive coating coat with lacquer easy filler opening in the reason of 0.1mm～3.0mm.When conducting pigment (for example, conductive black, graphite, silver, copper, nickel and aluminium powder) be dispersed in when becoming conductive paint in the mixture of water-soluble or solvent of acrylic resin, epoxy resin or polyurethane resin, because the high useful load of conducting pigment, the viscosity of conductive paint uprises, therefore need the size of adjustment hole, make in the easy ostium of conductive paint of thickness.The size in hole can be according to the viscosity and the permeance property control of conductive paint.
In less electronic equipment, when the size in hole surpassed 1.0mm, the gross area in hole surpassed 25% with the ratio of the area of flexure strip, the result, and the strength reduction of flexure strip, the shock and vibration absorbability is impaired.
On the contrary, for bigger electronic equipment, when the gross area in hole is limited in less than 25% condition, the size in hole can increase to greater than 1.0mm to 3.0mm, distance between the hole also can increase to greater than 2.0mm to 5.0mm, thereby use the conductive paint filler opening to become easily, and the reduction of punching cost, and body phase conductivity increases.
For being the little liner that very small-sized electronic equipment prepares, the hole dimension of 0.3mm is too big for this application, and the size in hole can be reduced to less than 0.3mm and arrive 0.1mm, and the distance between the hole can be reduced to less than 0.5mm to 0.3mm.In this case, in order to fill and apply the so little hole of diameter 0.3mm～0.1mm effectively, do not destroy under the restriction of conductivity in dilution, can water or solvent reduce the viscosity of conductive paint.As shown in Figure 4, suck technology by compulsory vacuum, the conductive paint of above-mentioned dilution is filled very little hole or the coating hole wall of size of diameter 0.1mm～0.3mm forcibly.
In order flexure strip to be die-cut into required size and shape as liner, and the total area ratio of retaining hole is constant, preferably punches on angle is the parallel lines of 45 ° (Fig. 1 c) or 60 ° (Fig. 1 b).
Only otherwise destroy the function of flexure strip, can use in any method that applies on the flexure strip or in the hole and filled conductive coats with lacquer.Preferably, above-mentioned conveyer belt coat system with pressure roll can be recommended more.
For example, in the conveyer belt coat system, after making complete the hole of uniform-dimension and pitch of holes and fixed angle arranged, utilize the conductive paint that is fit to apply the high-density foam sheet for preparing by cast equably, filler opening or apply hole wall wherein is mixed with the fine powder (Fig. 3 and 4) of carbon black, graphite, silver, copper, nickel or aluminium in the conductive paint.Identical operation can be applied to conductive fabric or the stacked sheet of metal film.
Because liner of the present invention is by applying on the shock and vibration absorbing sheet and/or the manufacturing of filled conductive lacquer; and can be contained in addition the narrow and compact space of very little electronic equipment in; liner of the present invention can provide multiple function; for example be used to protect the impact absorption and the vibration damping of electronic equipment; and can shield instrument internal and the outside EMI/RMI that occurs, the function of electronic equipment is at utmost brought into play.
In the present invention, the method for manufacturing sheet is unrestricted.Sheet can be made by the commonsense method of making the foam of polymers resin.The method of punching is also unrestricted.One of ordinary skill in the art can be made sheet and with the sheet punching, be applied in the liner.
Description of drawings
Fig. 1 a is the plane graph with the high density polyurethane foam sheet shock and vibration absorbent properties, the present invention's punching;
Fig. 1 b represents on the parallel lines punching of 60 ° of angles between the hole;
Fig. 1 c represents on the parallel lines punching of 45 ° of angles between the hole;
Fig. 2 is the end view with the high density polyurethane foam sheet shock and vibration absorbent properties, the present invention's punching;
Fig. 3 is the process schematic diagram of application on the high density polyurethane foam sheet of punching, filler opening, drying and crosslinked conductive paint;
Fig. 4 is on the high density polyurethane foam sheet of punching, by using backer roll and vacuum suction apparatus to use conductive paint and using the conductive paint filler opening, and the process schematic diagram of dry and crosslinked conductive paint, wherein carefully be equipped with on the foam piece and be of a size of 0.3mm or littler hole;
Fig. 5 is the high density polyurethane foam sheet that the present invention has the shock and vibration absorbent properties, and it is by punching, and then application, filler opening, drying and crosslinked conductive paint are made;
Fig. 6 is the liner of electronics, and this is to obtain by die-cut high density polyurethane foam sheet with shock and vibration absorbent properties, and foam piece is by punching, and then application, filler opening, drying and crosslinked conductive paint are made;
Fig. 7 a is the liner that obtains by die-cut high density polyurethane foam sheet, and foam piece is to be layered in the polyurethane foam sheet both sides by the polyester textile that will deposit copper/nickel mixing, punching, and then application, filler opening, drying and crosslinked conductive paint are made;
Fig. 7 b is the cutaway view of liner among Fig. 7 a;
Fig. 8 a is the liner that obtains by die-cut high density polyurethane foam sheet, and foam piece is to be layered in polyurethane foam sheet one side by the polyester textile that will deposit copper/nickel mixing, punching, and then application, filler opening, drying and crosslinked conductive paint are made;
Fig. 8 b is the cutaway view of liner among Fig. 8 a;
Fig. 9 is a traditional EMI/RFI shielding foam, wherein conductive fabric is sticked on the whole surface of polyurethane foam conductivity is provided.
Embodiment
Below with reference to embodiment the present invention is described more specifically.
As the polymer elastomer sheet, can adopt the various general polymeric sponge elastomer that uses traditionally.But, in the present invention, adopt the high density polyurethane foam of mechanical foaming, it is to foam in super mixer under air or the condition that exists such as the inert gas of nitrogen, then cast and form unlimited band shape on endless conveyor.Particularly, the manufacturing of high density polyurethane foam, preferably in super mixer, mix poly hydroxyl compound, organic polyisocyanate compounds, cahin extension agent, catalyst, silicone foams stabilizer and air or such as the inert gas of nitrogen, then be poured into desired thickness on endless conveyor, final heat treatment forms crosslinked.
[making the method for liner]
Method 1
The polymer elastomer that will have the common preparation of shock and vibration absorbent properties punches equably, and conductive paint is applied to the whole upper and lower surface of elastomeric sheets and is applied in the hole, thereby the surface of coated sheet and coating or filling (or dipping) hole, so that obtain required surface and body conductivity mutually according to the conductive paint of using, the elastomeric sheets of above-mentioned coating is dry and crosslinked the most at last, is used as the conductive gasket that electronics has the shock and vibration absorbent properties.
Method 2
The manufacturing of electronic equipment liner also can then obtain uniform hole with stacked elastomeric sheets punching by sheet of conductive material being layered in the both sides of elastomeric sheets.From the teeth outwards or use conductive paint (dipping or apply) in the hole that obtains by above-mentioned punching, carry out drying and crosslinked at last.In said process, sheet of conductive material comprises conductive fabric, and described conductive fabric obtains by deposition or electroless copper on nonwoven fabrics or similar material, aluminium, nickel, silver, gold, copper/nickel mixture or copper/silver-colored mixture.In addition, also can use the conductive fabric that scribbles the conductive yarn manufacturing of conductive coating material by weaving, and copper, aluminium, nickel, silver or golden metal film can be used as sheet of conductive material.In this liner, by selecting sheet of conductive material or conductive paint, control surface conductivity and the body size of conductivity mutually easily.
Method 3
Except sheet of conductive material, as conductive fabric or copper, aluminium, nickel, silver or golden metal film, only be layered in elastomeric sheets one side, the method is identical with method 2.
In these situations, according to sheet of conductive material and the applied conductive paint selected, control surface conductivity and the body size of conductivity mutually easily.
Traditionally, conducting pigment directly mixes with foaming ingredient, and therefore, the physical property of electrically conductive elastic polymer descends, and the quantity of used conducting pigment is restricted, and the result cannot obtain less than 10
4The specific insulation of Ω cm.But, in the present invention, according to used sheet of conductive material and conductive coating lacquer, control surface conductivity and body conductivity mutually easily.For example, when carbon black or graphite during, can obtain specific insulation 10 as the conducting pigment of conductive coating lacquer
3Ω cm, and when using silver or nickel powder, can obtain 10
-5Ω cm.Therefore, liner of the present invention satisfies the demand that makes electronics shielding EMI/RMI.
Describe embodiments of the invention in detail below with reference to accompanying drawing.
＜embodiment 1 〉
Fig. 1 is illustrated in the hole that is equipped with diameter 0.5mm on the high density polyurethane foam sheet as polymer elastomer of the present invention (below be called foam piece).By using hank punch press that traditionally the metallic plate punching is used and the drift with diameter 0.5mm hole, and by having the die stamping foam piece that hole angle on parallel lines is 60 ° and spacing 1.5mm, the hole of getting is shown in 1b.
The plane graph of the punching foam piece that obtains as shown in Figure 1a.
The thickness of foam piece is 1.0mm.
Above-mentioned punching foam piece is die-cut into the liner of electronic equipment, and liner has the performance that absorbs shock and vibration and shielding EMI/RFI (electromagnetic interference/radio frequency interference), and has every kind and use required shape.In order to keep uniform specific insulation, the angle in hole is set at 60 ° on the parallel lines, shown in Fig. 1 (Fig. 1 b).
Fig. 2 is the cross sectional side view of punching foam.
By selecting the punch density and the spacing in conductive coating material, the thickness that is coated in the dried film on the foam piece, hole dimension and hole, control surface conductivity and body conductivity mutually easily.
Fig. 3 is the process schematic diagram of expression application, filler opening, drying and crosslinked conductive paint.Above-mentioned punching foam piece twists on the conveying device (100), and Kemco International Associates, Inc., (West Lake, Ohio) the Black Conductron 103 of Zhi Zaoing
TMAs the conductive coating lacquer, wherein conducting pigment is a conductive black.As shown in Figure 3, by bilateral (upper and lower) immersion system (102) that is placed in the container (103) the conductive coating lacquer is applied on the foam piece, then, with the foam piece of backer roll (104,105) compression coating, such design is by controlling the conductive paint that two gaps between the roller apply uniform thickness, make the thickness of foam piece be reduced to half of original thickness, this means, the pressure of control backer roll, the thickness that makes foam piece becomes 0.5mm after the compression from original 1.0mm.One side scribbles the foam piece of conductive paint through the crosslinked tunnel (106) of the heating drum wind apparatus under 100 ℃～150 ℃ temperature is housed, and finally twists on the coiler device (107).
One side coating and crosslinked foam piece reversing also are transformed into conveying device (100) once more, and carry out above-mentioned steps once more, on a side opposite on the sheet, carry out coating with coated side.Like this, conductive coating is formed uniformly the both sides in foam piece, gets the hole and is also filled equably.As a result, obtain having the polyurethane foam sheet of uniform body phase and surface conductivity, and the original physical property of not losing foam.
The dried film thickness of conductive coating on foam piece (enamelled coating) is 0.3mil (1mil equals 0.025mm), and specific insulation and surface resistivity all are 10
3The Ω size.In order to contrast, when the thickness of conductive coating after the drying increased to 2mil, the specific insulation of the foam piece of liner was reduced to 35 Ω cm, surface resistivity be reduced to 40 Ω/square.
Japanese Iwatsu Electric Co., " VOAC86AMultimeter " of Ltd are used in the measurement of above-mentioned resistivity.
Fig. 5 represents the high density polyurethane foam liner that the present invention obtains by die-cut high density polyurethane foam sheet, and foam piece has the performance that absorbs shock and vibration, and its manufacturing is by punching then application, filler opening, drying and crosslinked conductive paint.As shown in Figure 5, the conductive coating rete be formed on the upper and lower side (301,302) of liner and the sidewall (303) in the hole of getting on, particularly, the hole is filled by the conductive coating lacquer.This liner has low permanent compression set simultaneously, outstanding shock and vibration absorbent properties, outstanding body phase conductivity and surface conductivity.Above-mentioned liner can preferably need high accuracy and functional as these electronics of LCD protective lining in electronics or the communication apparatus or communication apparatus; as portable phone, PDA, notebook computer or similar equipment, thereby strengthen their functional and durability.
＜embodiment 2 〉
Except adopting sheet thick be 0.5mm, and the aperture is 0.3mm, and pitch of holes is beyond the 1.5mm, the operation that employing and embodiment 1 are identical, and the application of conductive paint is as shown in Figure 4.
The method of Fig. 4 is used to make the liner of little electronics or communication apparatus.When the diameter in the hole of being beaten is little during to 0.1mm～0.3mm, be difficult to fill the hole of getting with the conductive coating lacquer by method shown in Figure 8 among the embodiment 1, therefore, recommend to use method shown in Figure 4.As shown in Figure 4, when the foam piece of conveying device (200) roll extrusion is passed through coating roller (201), conductive coating lacquer (CP) is applied on the foam piece by knife coater (202).Above-mentioned coating clarification sheet is by pressure roll (203,205) compression, simultaneously through being contained in the vacuum suction apparatus (204 of backer roll below, 206), make conductive paint force to apply and be filled in the hole, pass through drying and crosslinked tunnel (207) that the hot-air air-blast device is housed then, wherein the hot-air air-blast device is operated in 100 ℃～150 ℃, then is wrapped on the wind (208).
Following processes is identical with embodiment 1.
In this embodiment, use Conductive Compounds, Inc the Londonderry, " C-100 that NH 03053 makes
TM" (conductive carbon based) coat with lacquer as conductive coating.The build of conductive coating enamelled coating on foam piece is 1mil after drying.Specific insulation and surface resistivity are all less than the size of 75 Ω.
＜embodiment 3 〉
Angle on parallel lines between the hole is 45 ° (Fig. 1 c), adopts the operation identical with embodiment 1.
The build of conductive coating enamelled coating is 0.5mil, and the specific insulation of liner foam piece and surface resistivity are all less than 10
2The size of Ω.
＜embodiment 4 〉
Except adopting Conductive Compound, Inc. a kind of water-based polyurethane coating " CCI-120 that make, that contain conductive black
TM" " as beyond the conductive paint, adopt the operation identical with embodiment 1.
The build of conductive coating enamelled coating is 0.3mil, and the specific insulation of liner foam piece and surface resistivity are all less than 10
4The size of Ω.
＜embodiment 5 〉
Angle on parallel lines between the hole is 45 ° (Fig. 1 c), adopts the operation identical with embodiment 2.
The build of conductive coating enamelled coating is 0.5mil, and the specific insulation of liner foam piece and surface resistivity are all less than the size of 700 Ω.
＜embodiment 6 〉
Except adopting Kemco International Associates, that Inc. makes, as to use electric conductive oxidation iron/graphite C CI-120 " G972A
TM" as beyond the conductive paint, adopt the operation identical with embodiment 1.
The build of conductive coating enamelled coating is 1mil (0.025mm), and the specific insulation of liner foam piece and surface resistivity are all less than the size of 350 Ω.
＜embodiment 7 〉
With surface resistivity 0.06Conductive fabrics having surface resistivity of 0.06 Ω/square conductive fabric be layered in and have the shock and vibration absorbent properties and thickness is the polyurethane foam sheet both sides of 0.5mm, the diameter of punching is 0.3mm, spacing 1.5mm, the angle on the parallel lines between the hole are 60 °.
In this embodiment, as conductive fabric, conductive polyester fabric " the ST-W29B " (PET/Ni+Cu+Ni of the yarn weaving of copper/nickel/copper will be deposited; E-Song company makes), use and be layered on the polyurethane foam.The thickness of conductive fabric is 3mil, and quality is 80g/m
2
As conductive coating lacquer, will mainly contain copper and by Spraylat Corporation, Mt.Vernon, " Series 599-Y1325 " that NY makes is applied on the punching polyurethane foam of above-mentioned stacked conductive fabric, as shown in Figure 4, is used for coating and filling.Use, coated with conductive lacquer and with the method for conductive paint filler opening, identical with embodiment 2.
The resistivity on the surface of this embodiment be 0.06 Ω/square, specific insulation is 0.05 Ω cm.
＜embodiment 8 〉
Except conductive fabric is layered in high density polyurethane foam one side, adopt the operation identical with embodiment 7.
The thickness of conductive coating is 1mil, and the specific insulation of liner foam piece is 0.04 Ω cm, surface resistivity be 0.05 Ω/square.
＜embodiment 9 〉
That Spraylot Corporation makes except adopting, as to use the copper that is coated with silver " Series599-B3730M " as the conductive coating lacquer, adopts the operation identical with embodiment 7.
The build of conductive coating of the sheet of punching is 1mil, and the specific insulation of liner foam piece is 0.03 Ω cm, surface resistivity be 0.04 Ω/square.
Industrial usability
Liner of the present invention can be used simple device fabrication, and has outstanding physical and mechanical properties, Such as outstanding shock and vibration absorbent properties, therefore, be applied to make high-quality electronics or communication apparatus.
Claims (7)
1. method of making the electronic equipment liner, described liner have surface conductivity and body conductivity mutually simultaneously, and described method comprises the steps:
Make the polymer elastomer sheet;
Sheet of conductive material is layered in the one or both sides of elastomeric sheets;
With described punching to form the hole;
On described, use the conductive coating lacquer, with described face coat and filler opening or with the hole wall coating, so that form conductive layer; And
The sheet that has conductive layer above the cutting.
2. the method for manufacturing electronic equipment liner as claimed in claim 1, wherein the polymer elasticity sheet is polyurethane foam, PVC, silicones, ethylene-vinyl acetate copolymer, polyethylene, NR, SBR, EPDM, NBR, neoprene rubber sheet or sponge sheet.
3. the method for manufacturing electronic equipment liner as claimed in claim 1, wherein the conductive coating lacquer contains at least a material of selecting from following group: carbon powder, graphite powder, bronze, silver powder, copper powder, nickel powder and aluminium powder.
4. the method for manufacturing electronic equipment liner as claimed in claim 1, wherein the angle between the hole is 45 ° or 60 ° on the parallel lines.
5. the method for manufacturing electronic equipment liner according to any one of claims 1 to 4, described sheet of conductive material is conductive fabric or metal film.
6. the method for manufacturing electronic equipment liner as claimed in claim 5, wherein the manufacturing of conductive fabric is to obtain conductivity by deposition or electroless copper on polyester, nylon or nonwoven fabrics, nickel, aluminium, silver, gold, copper/nickel mixture or copper/silver-colored mixture.
7. the method for manufacturing electronic equipment liner as claimed in claim 5, wherein conductive fabric is those fabrics that are formed by weaving by the yarn that is coated with electric conducting material above using.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0008695A KR100478830B1 (en) | 2002-02-19 | 2002-02-19 | Conductive high polymer microcellular foam gaskets and method for preparing thereof |
| KR20028695 | 2002-02-19 | ||
| KR10-2002-0051836A KR100477019B1 (en) | 2002-08-30 | 2002-08-30 | High polymer microcellular foam conductive gaskets and method for preparing thereof |
| KR200251836 | 2002-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1620845A CN1620845A (en) | 2005-05-25 |
| CN1276698C true CN1276698C (en) | 2006-09-20 |
Family
ID=27759799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02828238.8A Expired - Lifetime CN1276698C (en) | 2002-02-19 | 2002-09-17 | High polymer microcellular foam conductive gaskets and method for preparing thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN1276698C (en) |
| AU (1) | AU2002328450A1 (en) |
| WO (1) | WO2003071846A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8389113B2 (en) | 2002-09-17 | 2013-03-05 | Ppg Industries Ohio, Inc. | Substrates and articles of manufacture coated with a waterborne 2K coating composition |
| US7778676B2 (en) * | 2004-09-10 | 2010-08-17 | Nokia Corporation | ESD protection for LCD panels and the like |
| US20060141234A1 (en) * | 2004-12-23 | 2006-06-29 | Rearick Brian K | Coated compressible substrates |
| CN100577715C (en) * | 2006-04-05 | 2010-01-06 | 中国科学院金属研究所 | Electromagnetic shielding macromolecule composite material |
| US9548144B2 (en) * | 2012-11-16 | 2017-01-17 | Tyco Electronics Corporation | Isolation system for an electronic device |
| CN103108534A (en) * | 2012-12-10 | 2013-05-15 | 大连圣锋胶粘制品有限公司 | Shielding case and preparation method thereof |
| CN103666301B (en) * | 2013-04-23 | 2015-08-19 | 隆扬电子（昆山）有限公司 | A kind of Highly-conductive elastomer and production method thereof |
| CN103666302B (en) * | 2013-04-23 | 2015-06-24 | 隆扬电子（昆山）有限公司 | Production method of high conductivity rubber elastomer |
| JP6190216B2 (en) * | 2013-08-30 | 2017-08-30 | 三菱航空機株式会社 | Aircraft windows and opening closure members |
| US9357683B2 (en) * | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
| CN106317847B (en) * | 2015-06-30 | 2020-03-31 | 3M创新有限公司 | Conductive foam, conductive foam body and preparation method and application thereof |
| CN105400129B (en) * | 2015-10-30 | 2017-09-22 | 三峡大学 | A kind of filled conductive composites and preparation method thereof |
| CN105566676A (en) * | 2015-12-30 | 2016-05-11 | 南通万德科技有限公司 | Highly conductive elastomer based on chemical plating and preparation method thereof |
| US9953683B1 (en) | 2017-04-11 | 2018-04-24 | Microsoft Technology Licensing, Llc | Die-cut gasket manufacturing |
| CN111417295A (en) * | 2020-03-06 | 2020-07-14 | 南昌欧菲生物识别技术有限公司 | Conductive foam, ultrasonic fingerprint module, display screen assembly and electronic equipment |
| CN115500067B (en) * | 2022-09-02 | 2023-08-29 | 苏州申赛新材料有限公司 | Electromagnetic shielding composite material with low-reflection magneto-electric dual-functional gradient structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401911A (en) * | 1992-04-03 | 1995-03-28 | International Business Machines Corporation | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same |
| US5882459A (en) * | 1996-11-08 | 1999-03-16 | W. L. Gore & Associates, Inc. | Method for aligning and laminating substrates to stiffeners in electrical circuits |
| US5766979A (en) * | 1996-11-08 | 1998-06-16 | W. L. Gore & Associates, Inc. | Wafer level contact sheet and method of assembly |
| WO1999041963A1 (en) * | 1998-02-17 | 1999-08-19 | Parker-Hannifin Corporation | Emi shielded vent panel and method |
-
2002
- 2002-09-06 AU AU2002328450A patent/AU2002328450A1/en not_active Abandoned
- 2002-09-17 CN CN02828238.8A patent/CN1276698C/en not_active Expired - Lifetime
- 2002-09-17 WO PCT/KR2002/001689 patent/WO2003071846A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1620845A (en) | 2005-05-25 |
| WO2003071846A1 (en) | 2003-08-28 |
| AU2002328450A1 (en) | 2003-09-09 |
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