CN1276563C - 能量调节器 - Google Patents

能量调节器 Download PDF

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Publication number
CN1276563C
CN1276563C CN00810937.0A CN00810937A CN1276563C CN 1276563 C CN1276563 C CN 1276563C CN 00810937 A CN00810937 A CN 00810937A CN 1276563 C CN1276563 C CN 1276563C
Authority
CN
China
Prior art keywords
common
conductive
differential
electrode
energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN00810937.0A
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English (en)
Chinese (zh)
Other versions
CN1367946A (zh
Inventor
A·A·安东尼
W·M·安东尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X2Y Attenuators LLC
Original Assignee
X2Y Attenuators LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/460,218 external-priority patent/US6331926B1/en
Application filed by X2Y Attenuators LLC filed Critical X2Y Attenuators LLC
Publication of CN1367946A publication Critical patent/CN1367946A/zh
Application granted granted Critical
Publication of CN1276563C publication Critical patent/CN1276563C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Filters And Equalizers (AREA)
  • Emergency Protection Circuit Devices (AREA)
CN00810937.0A 1999-05-28 2000-05-26 能量调节器 Expired - Fee Related CN1276563C (zh)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
US13645199P 1999-05-28 1999-05-28
US60/136451 1999-05-28
US13918299P 1999-06-15 1999-06-15
US60/139182 1999-06-15
US14698799P 1999-08-03 1999-08-03
US60/146987 1999-08-03
US16503599P 1999-11-12 1999-11-12
US60/165035 1999-11-12
US09/460,218 US6331926B1 (en) 1997-04-08 1999-12-13 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US09/460218 1999-12-13
US18010100P 2000-02-03 2000-02-03
US60/180101 2000-02-03
US18532000P 2000-02-28 2000-02-28
US60/185320 2000-02-28
US20032700P 2000-04-28 2000-04-28
US60/200327 2000-04-28
US20386300P 2000-05-12 2000-05-12
US60/203863 2000-05-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN 200510108955 Division CN1783631A (zh) 1999-05-28 2000-05-26 多功能能量调节器

Publications (2)

Publication Number Publication Date
CN1367946A CN1367946A (zh) 2002-09-04
CN1276563C true CN1276563C (zh) 2006-09-20

Family

ID=27578537

Family Applications (1)

Application Number Title Priority Date Filing Date
CN00810937.0A Expired - Fee Related CN1276563C (zh) 1999-05-28 2000-05-26 能量调节器

Country Status (8)

Country Link
EP (1) EP1188212A4 (enExample)
JP (1) JP4418613B2 (enExample)
CN (1) CN1276563C (enExample)
AU (1) AU774310B2 (enExample)
CA (1) CA2375135A1 (enExample)
IL (1) IL146760A0 (enExample)
MX (1) MXPA01012236A (enExample)
WO (1) WO2000074197A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US6018448A (en) 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US20020079116A1 (en) 2000-10-17 2002-06-27 X2Y Attenuators, Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
JP2003526195A (ja) 1998-04-07 2003-09-02 エクストゥーワイ、アテニュエイタズ、エル、エル、シー 部品キャリア
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
NO309877B1 (no) * 2000-01-24 2001-04-09 Reinertsen Kai Tommy Automatisk gearkasse
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
IL154413A0 (en) 2000-08-15 2003-09-17 X2Y Attenuators Llc An electrode arrangement for circuit energy conditioning
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
US7180718B2 (en) 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
EP1629582A2 (en) 2003-05-29 2006-03-01 X2Y Attenuators, L.L.C. Connector related structures including an energy conditioner
EP1649572A4 (en) 2003-07-21 2012-06-27 X2Y Attenuators Llc FILTER ASSEMBLY
US7356050B2 (en) 2003-12-17 2008-04-08 Siemens Aktiengesellschaft System for transmission of data on a bus
US7675729B2 (en) * 2003-12-22 2010-03-09 X2Y Attenuators, Llc Internally shielded energy conditioner
JP2008537843A (ja) 2005-03-01 2008-09-25 エックストゥーワイ アテニュエイターズ，エルエルシー 内部で重なり合った調整器
WO2006099297A2 (en) 2005-03-14 2006-09-21 X2Y Attenuators, Llc Conditioner with coplanar conductors
GB2473245A (en) 2009-09-07 2011-03-09 Steritrox Ltd An ozone generator
CN102378476A (zh) * 2010-08-26 2012-03-14 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN102790599B (zh) 2012-07-30 2015-09-09 华为技术有限公司 滤波器
KR102017491B1 (ko) * 2013-08-01 2019-09-04 삼성전자주식회사 안테나 장치 및 그를 구비하는 전자 기기
CN105263303B (zh) * 2014-07-17 2019-06-28 上海诺基亚贝尔股份有限公司 一种用于为基板屏蔽电磁辐射的装置及方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838216A (en) * 1996-09-06 1998-11-17 Sunstrand Corporation Common-mode EMI filter
US5909350A (en) * 1997-04-08 1999-06-01 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package

Also Published As

Publication number Publication date
JP4418613B2 (ja) 2010-02-17
IL146760A0 (en) 2002-07-25
CA2375135A1 (en) 2000-12-07
CN1367946A (zh) 2002-09-04
EP1188212A4 (en) 2003-07-16
MXPA01012236A (es) 2003-06-30
JP2003501992A (ja) 2003-01-14
EP1188212A1 (en) 2002-03-20
AU5297500A (en) 2000-12-18
WO2000074197A1 (en) 2000-12-07
AU774310B2 (en) 2004-06-24

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060920

Termination date: 20150526

EXPY Termination of patent right or utility model