CN1275306A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN1275306A
CN1275306A CN98810044A CN98810044A CN1275306A CN 1275306 A CN1275306 A CN 1275306A CN 98810044 A CN98810044 A CN 98810044A CN 98810044 A CN98810044 A CN 98810044A CN 1275306 A CN1275306 A CN 1275306A
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China
Prior art keywords
circuit board
printed circuit
pcb
heating
resistor
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Granted
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CN98810044A
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CN1173610C (zh
Inventor
E·P·莫顿
A·P·J·圭弗
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Telefonaktiebolaget LM Ericsson AB
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Telefonaktiebolaget LM Ericsson AB
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

印刷电路板(1)呈多层结构,其中一层(3)形成加热层,将加到其上的热量传给装设在电路板(1)上的许多电子元件(2),从而可以使电子元件(2)维持在适当的工作温度。

Description

印刷电路板
发明的技术领域
本发明涉及印刷电路板，具体地说，涉及加热印刷电路板经选择的区域的一种方法及其有关设备。
相关技术简介
为使电子元件持续可靠工作，必须使其维持在其要求的工作温度范围内。这在远程蜂窝系或卫星电话基地台中是个特殊的问题：这类基地台可能需要在极端的气候条件下工作。在这种情况下，历来习惯上是采用工作温度范围宽的电子元件，但这类电子元件毕竟不便宜。
美国专利5,103,071公开了一种表面安装技术加热器，用来加热电路板，将表面安装式接插件端子钎焊到焊接区。接插件端子制成多个象可有选择地加以启动的加热器彼此间隔开形成一个整体的突起，加热器产生的热能沿各突起传送给钎料端，熔化可熔融的导电材料。
但这种加热器只能用来将端子钎焊到印刷电路板上，对装在印刷电路板上的电子元件在工作期间的加热不适用。
发明简介
本发明提供了加热印刷电路板上对温度敏感的电子元件的加热装置，可以将电子元件维持在所要求的工作温度范围内。
按照本发明的第一方面，本发明提供了一种多层结构的印刷电路板，其中一个结构层配备有一层加热层，将加到该层的热量传送给装在印刷电路板上的电子元件。
按照本发明的第二方面，本发明提供了一种加热装在印刷电路板上的电子元件的方法。该方法包括将热能提供给印刷电路板的一个层面上的步骤。
热量最好通过电阻性元件在印刷电路板内加热提供。
这样做的好处是，可以检测出各电子元件的温度，用检测出的温度控制各电子元件的热量供应。
附图简介
图1是本发明第一实施例的印刷电路板的示意图。
图2是本发明第二实施例的印刷电路板的示意图。
最佳实施例详介
参看图1。印刷电路(PCB)1上装着许多电子元件2。PCB1通常呈一般结构，即有一层衬底层、一层导电层、一层接地层和多层绝缘层。导电层和接地层通常是铜的，构制得使其将装在PCB1上的各电子元件2妥善连接起来。
具体地说，这些电子元件，无论是例如集成电路或是分立元件，都只有在特定温度范围(例如0℃-70℃)内才能令人满意地工作。
这种印刷电路板形成例如蜂窝系电话基地台之类的器件的一部分，而这类器件要求能在例如远低于0℃的温度的恶劣气候条件下工作。
PCB1周围装着许多例如0.25瓦的表面安装式电阻器，与加热层3接触。可以看到，加热层3作为PCB1的上层示出。PCB1上还装有温度传感器7，给受控电压源9提供温度信号。受控电压源9接表面安装式电阻器5，给这些电阻器5提供受控电压。
为加热装在PCB1上的各电子元件2从而使它们维持在工作温度范围内，由受控电压源9给各表面安装的电阻器5提供电压。这使表面安装电阻器5因电阻加热而变热，从而将热量传给PCB1的加热层3，于是热量传给装在PCB1上的各电子元件2。
温度传感器7给受控电压源9提供温度信号，以调节提供给表面安装电阻器5的电压，从而可以控制PCB1和电子元件2的温度。
表面安装的电阻器5可按任何适当的方式配置，在PCB上形成所要求的加热方式。
采用个别加热方式时，可以在整个PCB上配置多个个别加以控制的电阻器组，这样热量可按不同的要求量提供给PCB的不同区域。同样，可以配备不止一个温度传感器。
加热层3可由PCB一般的导电层或电路板一般的接地层形成，这样就可以在各板层内。
不然也可另设一层铜加热层，专供加热装在板上的电子元件。
图2是本发明第二实施例的PCB10的示意图。PCB10的上绝缘层12上配置着许多表面安装式电阻器13。板内形成有一层铜层14。电阻器13通过多个孔15与铜层14热接触。
电阻器13通接插件16和17加上电压时变热，从而使热量传给铜层14，这反过来使整个PCB10的温度上升。提供给电阻器的电压可以象图1的电路板一样根据温度传感器(图中未示出)的输出控制。

Claims (4)

1.一种印刷电路板包括多层结构，其中一个结构层形成加热层，将加到其上的热量传给装在印刷电路板上的多个电子元件；所述印刷电路板还包括：
多个表面安装式电阻器，成组配置，各电阻器安装得与所述加热层接触；
一个受控电压源，给各电阻器提供控制电压；以及
一个温度传感器，装在电路板上，给受控电压源提供表示电路板温度的信号，受控电压源工作时根据温度信号给表面安装式电阻器提供控制电压，各电阻器组由受控电压源个别控制。
2.如权利要求1所述的印刷电路板，其特征在于，包括一层衬底层、一层接地层和一层导电层，接地层和导电层由一层绝缘层彼此绝缘起来，导电层或接地层形成所述加热层。
3.参看附图描述和如附图所示的一种印刷电路板。
4.如参照附图说明的一种加热装设在印刷电路板上的电子元件的方法。
CNB988100444A 1997-10-13 1998-10-13 印刷电路板 Expired - Fee Related CN1173610C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9721706.1 1997-10-13
GB9721706A GB2330289A (en) 1997-10-13 1997-10-13 Heated printed circuit board

Publications (2)

Publication Number Publication Date
CN1275306A true CN1275306A (zh) 2000-11-29
CN1173610C CN1173610C (zh) 2004-10-27

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CNB988100444A Expired - Fee Related CN1173610C (zh) 1997-10-13 1998-10-13 印刷电路板

Country Status (8)

Country Link
US (1) US6262392B1 (zh)
EP (1) EP1025747B1 (zh)
CN (1) CN1173610C (zh)
AU (1) AU9450298A (zh)
DE (1) DE69803216T2 (zh)
GB (1) GB2330289A (zh)
HK (1) HK1032176A1 (zh)
WO (1) WO1999020088A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4344101B2 (ja) * 2001-02-14 2009-10-14 Ｏｋｉセミコンダクタ株式会社 配線構造部
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
US6867391B2 (en) * 2002-10-24 2005-03-15 The Boeing Company Control system for electrostatic discharge mitigation
KR20040063589A (ko) * 2003-01-08 2004-07-14 (주)정우이엔지 패턴히터를 이용한 인쇄회로기판과 이를 이용한인쇄회로기판의 온도제어 장치
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
DE102006030268B4 (de) * 2006-06-30 2008-12-18 Advanced Micro Devices Inc., Sunnyvale Verfahren zum Ausbilden einer Halbleiterstruktur, insbesondere eines FETs
US7839157B2 (en) 2007-01-18 2010-11-23 Dfr Solutions, Llc Surface mount testing system
FR2938102A1 (fr) * 2008-10-31 2010-05-07 Hager Security Module d'un systeme de surveillance et/ou d'alarme, a mesure de temperature et procede de mesure de temperature ambiante
US8445818B2 (en) 2009-05-05 2013-05-21 Sierra Wireless, Inc. PCB quick heater
JP2013243263A (ja) * 2012-05-21 2013-12-05 Internatl Business Mach Corp <Ibm> ３次元積層パッケージにおける電力供給と放熱（冷却）との両立
US8981259B2 (en) 2012-07-24 2015-03-17 Mildef Crete Inc. Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
EP2693851A1 (en) * 2012-07-30 2014-02-05 Mildef Crete Inc. Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
KR102038427B1 (ko) * 2012-09-28 2019-10-31 삼성전자 주식회사 온도별 전압 제어 방법 및 이를 지원하는 단말기
FR3034947B1 (fr) 2015-04-13 2017-04-21 Commissariat Energie Atomique Dispositif de chauffage et refroidissement par circuit imprime pour regenerer des composants electroniques soumis a des radiations
US10372182B2 (en) * 2017-01-13 2019-08-06 International Business Machines Corporation Reducing thermal cycling fatigue
US11224098B2 (en) * 2018-11-01 2022-01-11 General Electric Company Systems and methods for passive heating of temperature-sensitive electronic components
US11382178B2 (en) * 2019-06-27 2022-07-05 General Electric Company System and method for heating an electrical bus in an electrical cabinet for cold startup and condensation/frost control

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3289046A (en) * 1964-05-19 1966-11-29 Gen Electric Component chip mounted on substrate with heater pads therebetween
US3395265A (en) * 1965-07-26 1968-07-30 Teledyne Inc Temperature controlled microcircuit
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US3816702A (en) * 1972-06-26 1974-06-11 R Green Electronic isothermal device
DE2354719A1 (de) * 1973-11-02 1975-05-15 Licentia Gmbh Anordnung zur temperaturstabilisierung
DE2362567A1 (de) * 1973-12-17 1975-06-19 Crl Electronic Bauelemente Temperaturstabilisierte elektronische schaltung
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
US4481403A (en) * 1983-03-04 1984-11-06 Honeywell Inc. Temperature control of solid state circuit chips
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
US5103071A (en) * 1988-11-29 1992-04-07 Amp Incorporated Surface mount technology breakaway self regulating temperature heater
FR2646966B1 (fr) * 1989-05-10 1996-02-02 Elf Aquitaine Procede de chauffage rapide et uniforme d'un ensemble multicouche comportant au moins une couche mince a base d'un materiau macromoleculaire a conduction ionique intercalee entre deux structures a conduction electronique elevee
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.
GB9225260D0 (en) * 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
JP3224930B2 (ja) 1993-12-28 2001-11-05 株式会社東芝 半導体装置の再生方法
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits
US5574627A (en) * 1995-07-24 1996-11-12 At&T Global Information Solutions Company Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
DE19613236A1 (de) * 1996-04-02 1997-10-09 Coherent Adlas Gmbh & Co Kg Modul mit befestigter Komponente und Verfahren zum Befestigen einer Komponente
US5896259A (en) * 1997-08-05 1999-04-20 Raytheon Company Preheating device for electronic circuits

Also Published As

Publication number Publication date
CN1173610C (zh) 2004-10-27
EP1025747A1 (en) 2000-08-09
AU9450298A (en) 1999-05-03
GB2330289A (en) 1999-04-14
HK1032176A1 (en) 2001-07-06
US6262392B1 (en) 2001-07-17
GB2330289A8 (en) 2000-06-16
DE69803216T2 (de) 2002-06-27
EP1025747B1 (en) 2002-01-16
DE69803216D1 (de) 2002-02-21
GB9721706D0 (en) 1997-12-10
WO1999020088A1 (en) 1999-04-22

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