CN1267236C - 有效能量传输毛细管 - Google Patents
有效能量传输毛细管 Download PDFInfo
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- CN1267236C CN1267236C CNB018010016A CN01801001A CN1267236C CN 1267236 C CN1267236 C CN 1267236C CN B018010016 A CNB018010016 A CN B018010016A CN 01801001 A CN01801001 A CN 01801001A CN 1267236 C CN1267236 C CN 1267236C
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- soldering appliance
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- 238000005476 soldering Methods 0.000 claims description 103
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 229910052845 zircon Inorganic materials 0.000 claims description 5
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 5
- MEOSMFUUJVIIKB-UHFFFAOYSA-N [W].[C] Chemical compound [W].[C] MEOSMFUUJVIIKB-UHFFFAOYSA-N 0.000 claims description 2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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Abstract
一种用于把极细导线焊接到基板上的焊接工具。该焊接工具包括一个具有第一直径的第一圆柱部分,耦合到第一圆柱部分的一端的第二圆柱部分,该第二圆柱部分具有小于第一直径的一个第二直径;和耦合到第二圆柱部分的一端的一个锥形部分。
Description
发明领域
本发明通常涉及一种使用在导线与半导体设备焊接中的工具,并且更特别涉及一种具有有效超声波能量传输特性的焊接工具。
发明背景
现代电子设备严重依赖于在其上安装半导体芯片或集成电路(ICs)的印刷电路板。在芯片与基板之间的机械与电连接已经形成了芯片设计者的挑战。用于把IC与基板互连的三种熟知技术是:引线焊接,线带自动焊接(TAB)和倒装法。
这些方法中最常见的是引线焊接。在引线焊接中,多个压焊点位于基板上表面上的一个模型中,芯片安装在压焊点的模型的中央,并且该芯片的上表面面对基板的上表面很远。极细导线(它可以是铝或金导线)连接在芯片上表面上的接点与基板上表面上的接点之间。特别地,通过一毛细管、一个在下面将进一步描述的焊接工具,连接导线被提供并且被焊接到芯片与基板。
毛细管被用于把导线球形焊接到电子设备上,特别是球形焊接到半导体设备的压焊垫片上。这些毛细管通常由一种陶瓷材料形成,主要是氧化铝、钨化碳,红宝石,锆石坚韧氧化铝(zircon toughenedalumina)(ZTA),氧化铝坚韧锆石(alumina toughened zircon)(ATZ)和其它材料。非常薄导线,通常象大约一密耳的黄金、铜或铝线,通过毛细管中的一个轴向通路,导线的尾端形成一个小球,这个球被布置在毛细管末端之外。最初的目的是把这个球焊接到半导体设备上的一个垫片上,然后把沿着导线的进一步的一部分焊接到一个引线框架等等。在焊接循环期间,毛细管执行一个以上的功能。
在这个球形成之后,为了焊接垫片的目的,毛细管必须首先把部分在毛细管内的这个球居中。第一焊接步骤,把这个球焊接到半导体设备上的一个垫片上。当该毛细管在焊接垫片上向下轻触这个球时,这个球将被挤压并且变平。因为该焊接垫片通常是由铝制成,所以在该焊接垫片的表面上形成一个薄氧化层。为了形成一个适当焊接,最好断开该氧化表面并且暴露该铝表面。断开氧化层的一种有效方式是用导线球″擦洗″该氧化层的表面。该导线球被放置在矾土的表面上并且该毛细管根据放置在毛细管所附在其上的超声波喇叭内的压电元件的伸展与收缩而在一个线性方向上快速地移动。该飞快的移动,除了通过该焊接垫片产生热之外,还通过在导线与该焊接垫片之间传送分子而形成一个有效焊接。
该毛细管然后在循环过程中处理导线,把该焊接导线既平滑地馈送到该毛细管之外然后又馈回到该毛细管中。该毛细管然后形成一个″缝合″焊接和一个″定位搭焊″或者″尾部″焊接。
目前,热声引线焊接是把半导体设备与它们的支持基板互相连接的精选方法。热声焊接方法部分地依靠把转换器中的超声波能量,附加一个可移动的焊接热,通过一个工具,例如毛细管或者楔形物,传送到被焊接到半导体设备或支持基板上的球或导线。
在传统毛细管(焊接工具)中,焊接用具的几何形状不被设计来修改对球/导线互连垫片界面区域的能量转换。本发明的发明人已判定强加在工具上的压力/张力波的超声波衰减的控制对焊接方法和它的性能是至关重要的。
然而,传统焊接工具设计是有缺陷的,因为传统焊接工具设计是以互连程度和丝焊器环路高度为基础的而没有考虑控制超声波衰减。同样地,传统焊接工具不是能量有效的。
图1是一种传统焊接工具的例图。如图1所示,焊接工具100具有一个圆柱主体部分102和一个锥形部分104。一个轴向通路108从焊接工具100的尾端110延伸到末端106。一个焊接导线(未示出)经过轴向通路108并且通过末端106用于最后焊接在一个基板(未示出)上。
发明内容
为了解决传统焊接工具的上述缺点,本发明涉及一种用于把极细导线焊接到基板上的能量有效焊接工具。
根据本发明,提供一种焊接工具,与超声转换器一起使用,以把细导线焊接到一个基板上,该焊接工具包括:一个具有第一直径的第一圆柱部分,该第一圆柱部分的第一端连接到该转换器;耦合到该第一圆柱部分的第二端的第二圆柱部分,该第二圆柱部分具有小于所述第一直径的第二直径;和耦合到第二圆柱部分的一端的一个锥形部分。
按照本发明的一个方面,该第二圆柱部分是一个凹槽。
按照本发明的另一方面,该第二圆柱部分是多个凹槽。
按照本发明的另外一个方面,该凹槽具有一个基本上为矩形的截面。
按照本发明的另一方面,该凹槽被一个槽缝所替换。
按照本发明的另一方面,该锥形部分与第二圆柱部分紧密邻接。
在下面将参考附图和本发明的示例性实施例阐明本发明的这些和其他方面。
附图说明
当结合附图阅读了下列详细说明之后,将最好地理解本发明。按照通常的实践经验,附图中的各个特征不是限定性的。相反地,为了清楚,各个特征的尺度可任意扩大或减小。附图中包括下列图:
图1是一个传统焊接工具的侧视图;
图2是一个相对于转换器移动响应的焊接工具的说明;
图3A-3D是根据本发明示例性实施例的一种焊接工具的各个视图;
图4是本发明实施例的一个放大的剖面图;
图5是测绘根据本发明示例性实施例的一个焊接工具的超声波能量影响的曲线图;
图6是测绘根据本发明示例性实施例的一个焊接工具的超声波能量与谐振频率影响的曲线图;
图7是测绘根据本发明示例性实施例的一个焊接工具的毛细管位移的曲线图;
图8是根据本发明第二示例性实施例的一个焊接工具的部分侧视图;
图9是根据本发明第三示例性实施例的一个焊接工具的部分侧视图;
图10A-10C是根据本发明第四示例性实施例的一种焊接工具的各个视图;和
图11是根据本发明第五示例性实施例的一个焊接工具的部分侧视图。
最佳实施方式
本发明通过改变沿着焊接工具长度方向的质量分配从而克服了传统毛细管焊接工具的缺陷。当与传统焊接工具相比时,所得到的焊接工具需要较少的超声波能量以在一个基板上形成一个焊接。
通过数学描述超声换能器驱动的工具的移动就可以实现超声焊接工具的设计。这样一个系统通过如等式(1)中示出的一种悬臂射束来表示:
在此,E是弹性系数,I是惯性力矩,m是质量分配,z是离移动支持的距离,x是垂直于射束的位移而x0描述了移动支持的移动。
图2说明了按照等式(1)的一个焊接工具的响应。如图2所示,对于焊接工具设计,悬臂射束200表示焊接工具,204为转换器202的移动Xo,以及206为焊接工具响应移动x(z,t)。由于质量和惯性矩被允许沿着射束改变,则这些参数可用来设计一个焊接工具的构成和″形状″以便产生一个期望的焊接超声波移动。
正如在上面所提及的,在常规设计中,惯性力矩I和质量分配m不被控制来用于超声波衰减的目的,而是严格地用于考虑所需的互连节距和丝焊器环路(loop)高度。在本发明的示例性实施例中,横断部分的形状和质量分配被规定来控制超声波衰减。
设计效果的一些示例:面积惯性矩I和质量分配m被给出。表1是参考图3A-3B利用一个凹槽几何形状来验证该思想的实验工作的一个总计。然而,本发明不因此被限制,而是也可使用其他几何形状。
毛细管 | 直径318(10-3英寸) | 宽316(10-3英寸) | 高314(10-3英寸) |
A1 | 16.0(0.406mm) | 17.2(0.437mm) | 165.6(4.206mm) |
A2 | 14.7(0.373mm) | 17.0(0.431mm) | 174.3(4.427mm) |
A3 | 13.7(0.348mm) | 17.8(0.452mm) | 183.3(4.656mm) |
H1 | 16.0(0.406mm) | 17.2(0.437mm) | 184.4(4.683mm) |
H2 | 16.5(0.419mm) | 17.4(0.442mm) | 151.4(3.845mm) |
H3 | 16.6(0.422mm) | 16.4(0.417mm) | 140.7(3.573m) |
W1 | 15.9(0.404mm) | 13.6(0.345mm) | 161.8(4.110mm) |
W2 | 15.9(0.404mm) | 19.3(0.490mm) | 164.6(4.181mm) |
D1 | 11.4(0.289mm) | 17.4(0.442mm) | 165.4(4.201mm) |
D2 | 8.2(0.208mm) | 16.9(0.429mm) | 165.7(4.209mm) |
H1D2 | 11.5(0.292mm) | 17.1(0.434mm) | 181.9(4.620mm) |
H2D2 | 8.2(0.208mm) | 15.6(0.419mm) | 149.8(3.805mm) |
表1
图3A是根据本发明第一示例性实施例的一个焊接工具300的侧视图。如图3A所示,焊接工具300具有一个圆柱上主体部分302和一个下主体部分304。下主体部分304包括一个圆柱部分308和从该圆柱部分306延伸到该焊接工具300的末端310的一个圆锥部分306。布置在上主体部分302和下主体部分304之间的是一个凹槽312。凹槽312以一个大约在0.1490英寸和0.1833英寸(3.785-4.656nun))之间的一段距离314位于末端310之上。该凹槽312从上主体部分302和下主体部分304中嵌入以便凹槽312具有大约在0.0083英寸和0.0155英寸(0.211-0.394mm)之间的一个直径318。凹槽312的高度316大约在0.0136英寸和0.0200英寸(0.345-0.508mm)之间。
图3B是焊接工具300的一个部分侧视图。如图3B所示,一个轴向通路320从焊接工具300的尾端322延伸到末端310。在该示例性实施例中,轴向通路320具有一个大体上连续的锥形形状,具有一个大约为14°的预确定角度326。然而,本发明不因此被限制,该轴向通路320可以仅在焊接工具300长度的一部分上具有一个大体上固定的直径或者锥形。后者可以是所期望的以便帮助导线插入在焊接工具300的上端322。这样的备用轴向通路的示例在图3C和3D中被说明。如图3C所示,轴向通路320具有沿着焊接工具300长度的一个大体上固定的直径330。在图3D中,镗孔320具有沿着焊接工具300长度一部分的一个大体上固定的直径340,并且具有与焊接工具300尾端322相邻的一个锥形342。
为了保持焊接工具300的结构完整性,必须在焊接工具300的设计期间考虑凹槽312和镗孔320之间的距离。本发明人指出此距离为″最小的墙厚度″(MWT)324。现在参见图4,示出了焊接工具300的一个放大截面,详细的MWT 324。如图4所示,凹槽312在槽缝312的内部可以具有一个半径402。这主要应归于用于形成凹槽312的设备轮廓。预期可以使用诸如锯条之类的一个刀口来形成凹槽312。凹槽312的形成不因此被限制,并且可以使用诸如板条或铸造之类的其他传统方法来形成。
再一次参见图3A,在本发明的优选实施例中距离314可以大约在0.140和0.143in(3.556-3.632mm)之间,高度316可以大约在0.0160和0.0190英寸(0.406-0.483mm)之间,直径318可以在大约0.0154和0.0160英寸(0.391-0.406)之间,并且MWT 324大于0.098in。在本发明的最优选实施例中,距离314大约为0.142英寸(3.61mm),高度316大约为0.0170英寸(0.432mm),直径318大约为0.0157英寸(0.399),并且MWT 324大约为0.0100英寸(0.254mm)。
参见图5,说明了曲线图500。在图5中,曲线图500画出了利用安装到自由焊接端上的转换器并在强加超声波的作用下得到的、沿着焊接工具300的长度方向焊接工具300的位移206(如图2所示)对凹槽312的影响。在图5中,纵坐标是用英寸表示的离转换器底部的位置而横坐标是用mm表示的焊接工具的位移。曲线图500被绘制用于各种焊接工具,其中,凹槽312的位置与几何形状不同。在图5中,由于超声波能量而以一个固定频率零位移工具移动的位置如节点502所示。在本发明中,焊接工具300中的凹槽312被放置在节点502处。发明人已经确定把凹槽312放置在节点502处以把焊接工具的效率最大化。在图5中,曲线504阐明了一个传统(参考)焊接工具的特性曲线,而曲线506-518说明了根据本发明一个示例性实施例的焊接工具的特性曲线。
在图6中,曲线图600画出了对于一个固定的工具尖头位移的超声波能量与谐振频率。在图6中,谐振点602-624被示出并被绘制为曲线626。如图6中所述,点624表示传统的参考工具并且,与根据本发明的工具(如点602-622所示)相比,表明了一个明显更高的能量需求。曲线图600说明了焊接工具300中凹槽312的布局显著降低了能量需求。
在图7中,曲线图700画出了根据本发明的焊接工具一个传统焊接工具的位移。如图7所示,一个焊接工具的位移,通过面积惯性矩的控制、凹槽的机械加工来使它的几何形状最优化,大于一个标准杆(非凹槽)焊接工具。图7的证明表示:对于引线焊接,在根据本发明使用受控制的几何形状毛细管之前(曲线702)和之后(曲线704),末端位移的曲线都大于一个标准焊接工具的曲线(曲线706)。
本发明人也已经确定该示例性焊接工具的较低能量需求结果造成较高的质量焊接。表2是说明各种焊接工具、焊接(超声波)能量、焊接力以及毁坏该焊接所需要的切断力的数据汇编。正如所清楚说明的,使用不足传统焊接工具50%能量的本示例性焊接工具却可以提供表现出众的切断阻力的焊接。
毛细管 | 切断/UA(gr/mil2) | 球径(μm) | USG(mA) | 时间(ms) | 力(gr) |
参考(传统设计) | 6.37 | 43.7 | 80 | 6 | 11 |
160W3 | 7.10 | 41.8 | 30 | 6 | 12 |
160W3-1 | 6.79 | 40.0 | 30 | 6 | 12 |
160W3-2 | 7.41 | 41.1 | 30 | 6 | 12 |
160W3-3 | 7.71 | 41.7 | 30 | 6 | 12 |
160W3-4 | 6.51 | 41.2 | 30 | 6 | 12 |
160W3-5 | 6.88 | 40.5 | 30 | 6 | 12 |
表2
表3是说明由根据本发明的焊接工具与一种传统焊接工具相比所形成的出众焊接牵引阻力的数据汇编。
毛细管 | 牵引X(gr) | 牵引Y(gr) | 平均牵引(gr) | USG(mA) | 时间(ms) | 力(gr) |
参考(传统设计) | 7.15 | 7.08 | 7.11 | 65 | 5 | 100 |
160W3 | 7.24 | 7.04 | 7.14 | 35 | 6 | 100 |
160W3-1 | 7.00 | 7.12 | 7.06 | 35 | 6 | 100 |
160W3-2 | 7.33 | 7.23 | 7.28 | 35 | 6 | 100 |
160W3-3 | 7.81 | 7.36 | 7.58 | 35 | 6 | 100 |
160W3-4 | 7.15 | 7.25 | 7.20 | 35 | 6 | 100 |
160W3-5 | 7.28 | 7.16 | 7.22 | 35 | 6 | 100 |
表3
图8是本发明第二示例性实施例的部分侧视图。在图8中,凹槽312包括一个弯曲的轮廓802。在所有其它方面中,第二示例性实施例类似于第一示例性实施例。
图9是本发明第三示例性实施例的部分侧视图。在图9中,焊接工具300的凹槽包括两个凹槽902,904。虽然在图9中示出了两个凹槽,但是本发明不因此被限制,而是可以包括两个以上的凹槽(如果期望的话)。在该示例性实施例中,每个凹槽具有一个弯曲的部分910。正如在上面讨论的,相对于第一示例性实施例,凹槽902,904的轮廓取决于用于形成该凹槽的方法并且不需要包括一个弯曲的部分。在图9中,边缘906,908可以是斜切面的或者圆形的(如果期望的话),以便消除由于凹槽902、904的形成所引起的锐边。在所有其它方面中,第三示例性实施例类似于第一示例性实施例。
图10A和10B分别是本发明第四示例性实施例的一个部分侧视图和顶视图。在图10中,槽缝1000代替了焊接工具300的凹槽312。槽缝1000的宽度1002、长度1004、深度1006以及数量是以焊接工具300的期望特性曲线为基础的。该槽缝可以基本上平行于焊接工具的纵向轴线或者可以以一个预确定角度处于焊接工具300的主体中,如图10C所示。在所有其它方面中,第四示例性实施例类似于第一示例性实施例。
图11是本发明第五示例性实施例的侧视图。在图11中,锥形部分308直接与凹槽312相邻。在所有其它方面中,第五示例性实施例类似于第一示例性实施例。
虽然参考示例性实施例已经描述了本发明,但是它不限制为此。附加的权利要求应该被解释来包括本发明的其它变型和实施例,这可以由本领域技术人员做出而没有偏离本发明的实际精神和范围。
Claims (30)
1.一种焊接工具,与超声转换器一起使用,以把细导线焊接到一个基板上,该焊接工具包括:
一个具有第一直径的第一圆柱部分,该第一圆柱部分的第一端连接到该转换器;
耦合到该第一圆柱部分的第二端的第二圆柱部分,该第二圆柱部分具有小于所述第一直径的第二直径;和
耦合到第二圆柱部分的一端的一个锥形部分。
2.如权利要求1所述的焊接工具,其中,该锥形部分在它的第一尾端处具有第三直径,该第三直径基本上等于所述第一圆柱部分的第一直径。
3.如权利要求1所述的焊接工具,还包括:一个轴向通路,沿着该焊接工具的纵向轴线从该焊接工具的第一尾端延伸到该焊接工具的第二尾端。
4.如权利要求3所述的焊接工具,其中,该轴向通路在所述第一圆柱部分的第一端处具有第一直径而在锥形部分的末端具有第二直径,该第一直径大于该第二直径。
5.如权利要求1所述的焊接工具,其中,该焊接工具是由由氧化铝、钨化碳、红宝石、陶瓷和锆石组成的群组中的至少一个而形成。
6.一种用于把极细导线焊接到一个基板上的焊接工具,该焊接工具包括:
一个具有第一直径的第一圆柱部分;
耦合到第一圆柱部分的一端的一个锥形部分;和
一个布置在第一圆柱部分和锥形部分之间的圆周状凹槽。
7.如权利要求6所述的焊接工具,其中,该凹槽被布置在焊接工具的一个节点处。
8.如权利要求6所述的焊接工具,其中,在离锥形部分的一端的一个预确定距离处布置该凹槽。
9.如权利要求8所述的焊接工具,其中,该距离介于3.556mm与4.656mm之间。
10.如权利要求8所述的焊接工具,其中,该距离介于3.556mm与3.632mm之间。
11.如权利要求6所述的焊接工具,其中,该凹槽具有一个预确定宽度。
12.如权利要求11所述的焊接工具,其中,该宽度介于0.345mm与0.508mm之间。
13.如权利要求11所述的焊接工具,其中,该宽度介于0.406mm与0.483mm之间。
14.如权利要求6所述的焊接工具,其中,该凹槽具有小于所述圆柱部分的第一直径的一个预确定直径。
15.如权利要求14所述的焊接工具,其中,该直径介于0.208mm与0.396mm之间。
16.如权利要求14所述的焊接工具,其中,该直径介于0.39mm与0.406mm之间。
17.一种与超声转换器一起使用的毛细管焊接工具,包括:
第一圆柱部分,具有第一直径、第一端和第二端,其中该第一圆柱部分的第一端连接到该转换器;
耦合到该第一圆柱部分的第二端的第二圆柱部分,该第二圆柱部分具有小于第一直径的第二直径;
锥形部分,具有耦合到第二圆柱部分的一端的第一端和第二端,该锥形部分的第一端具有基本上等于第一圆柱部分的第一直径的第三直径,而该第二端具有小于该第三直径的第四直径;和
轴向通路,从第一圆柱部分的第一端延伸到该锥形部分的第二端。
18.如权利要求17所述的毛细管焊接工具,其中,该轴向通路具有一个圆锥的形状。
19.如权利要求17所述的毛细管焊接工具,其中,该轴向通路具有一个基本上固定的直径。
20.如权利要求19所述的毛细管焊接工具,其中,该轴向通路具有布置在第一圆柱部分的第一端处的一个锥形。
21.一种用于把极细导线焊接到一个基板上的焊接工具,该焊接工具包括:
一个具有第一直径的第一圆柱部分;
耦合到第一圆柱部分的一端的一个锥形部分;和
一个布置在第一圆柱部分和锥形部分之间的一个圆周孔口。
22.如权利要求21所述的焊接工具,其中,该孔口是至少一个凹槽。
23.如权利要求22所述的焊接工具,其中,该凹槽具有一个基本上为矩形的截面。
24.如权利要求23所述的焊接工具,其中,该凹槽具有沿着截面的至少一部分的一个半径。
25.如权利要求21所述的焊接工具,其中,该孔口是多个凹槽。
26.如权利要求21所述的焊接工具,其中,该孔口是一个槽缝。
27.一种用于将细线焊接到基板上的焊接工具,该焊接工具包括:
具有第一直径的第一圆柱部分;
耦合到第一圆柱部分的一端的锥形部分;和
沿着该焊接工具的圆周、布置在第一圆柱部分和锥形部分之间的多个槽缝。
28.如权利要求26所述的焊接工具,其中,该槽缝具有基本上平行于该焊接工具的纵向轴线的一个纵向轴线。
29.一种用于将细线焊接到基板上的焊接工具,该焊接工具包括:
具有第一直径的第一圆柱部分;
耦合到第一圆柱部分的一端的锥形部分;和
设置在第一圆周部分与锥形部分之间的一个槽缝,
其中该槽缝具有基本上与该焊接工具的纵向轴线偏移一个预确定角度的一个纵向轴线。
30.一种用于把极细导线焊接到一个基板上的焊接工具,该焊接工具包括:
具有第一直径的第一圆柱部分,该第一圆柱部分的第一端连接到一个转换器;
耦合到第一圆柱部分的一端的第二圆柱部分,该第二圆柱部分具有小于第一直径的一个第二直径;
具有第一直径的第三圆柱部分,该第三圆柱部分连接到第二圆柱部分的一端;和
耦合到第三圆柱部分的一端的一个锥形部分。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/561,304 | 2000-04-28 | ||
US09/561,304 US6321969B1 (en) | 2000-04-28 | 2000-04-28 | Efficient energy transfer capillary |
Publications (2)
Publication Number | Publication Date |
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CN1366479A CN1366479A (zh) | 2002-08-28 |
CN1267236C true CN1267236C (zh) | 2006-08-02 |
Family
ID=24241415
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Application Number | Title | Priority Date | Filing Date |
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CNB018010016A Expired - Lifetime CN1267236C (zh) | 2000-04-28 | 2001-04-27 | 有效能量传输毛细管 |
Country Status (11)
Country | Link |
---|---|
US (1) | US6321969B1 (zh) |
EP (1) | EP1189722B1 (zh) |
JP (1) | JP3598290B2 (zh) |
KR (1) | KR100792124B1 (zh) |
CN (1) | CN1267236C (zh) |
AT (1) | ATE333334T1 (zh) |
DE (1) | DE60121520T2 (zh) |
HK (1) | HK1046661B (zh) |
MY (1) | MY129362A (zh) |
TW (1) | TW486767B (zh) |
WO (1) | WO2001083152A1 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6523733B2 (en) * | 2000-04-28 | 2003-02-25 | Kulicke & Soffa Investments Inc. | Controlled attenuation capillary |
US7083757B2 (en) * | 2001-02-28 | 2006-08-01 | Billiet Romain L | Method of making semiconductor bonding tools |
JP3742332B2 (ja) * | 2001-11-12 | 2006-02-01 | 株式会社新川 | ワイヤボンデイング装置 |
US20040024843A1 (en) * | 2002-07-31 | 2004-02-05 | Smith Christopher T. | Method for provisioning distributed web applications |
US20040211814A1 (en) * | 2003-04-23 | 2004-10-28 | Jackson Hsieh | Wire bonding capillary for an image sensor |
US7261230B2 (en) * | 2003-08-29 | 2007-08-28 | Freescale Semiconductor, Inc. | Wirebonding insulated wire and capillary therefor |
US7249702B2 (en) | 2003-12-04 | 2007-07-31 | Kulicke And Soffa Industries, Inc. | Multi-part capillary |
US7320425B2 (en) * | 2004-05-12 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | Low-profile capillary for wire bonding |
KR100718889B1 (ko) * | 2005-11-28 | 2007-05-16 | 이정구 | 투스텝 하이 보틀넥을 갖는 와이어 본딩 캐필러리 |
US7597231B2 (en) * | 2006-04-10 | 2009-10-06 | Small Precision Tools Inc. | Wire bonding capillary tool having multiple outer steps |
JP5376413B1 (ja) * | 2013-01-25 | 2013-12-25 | Toto株式会社 | ボンディングキャピラリ |
US9931709B2 (en) * | 2016-01-26 | 2018-04-03 | Orthodyne Electronics Corporation | Wedge bonding tools, wedge bonding systems, and related methods |
JP6270256B1 (ja) * | 2016-11-28 | 2018-01-31 | Toto株式会社 | ボンディングキャピラリ |
CN107275243B (zh) * | 2017-06-06 | 2020-11-13 | 潮州三环(集团)股份有限公司 | 焊接劈刀及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3894671A (en) * | 1971-01-06 | 1975-07-15 | Kulicke & Soffa Ind Inc | Semiconductor wire bonder |
US3917148A (en) * | 1973-10-19 | 1975-11-04 | Technical Devices Inc | Welding tip |
US4020543A (en) * | 1975-06-26 | 1977-05-03 | Sola Basic Industries, Inc. | Two-piece capillary tip bonding tool |
JPS5345172A (en) * | 1976-10-05 | 1978-04-22 | Mitsubishi Electric Corp | Cleaning method of capillary |
US4315128A (en) * | 1978-04-07 | 1982-02-09 | Kulicke And Soffa Industries Inc. | Electrically heated bonding tool for the manufacture of semiconductor devices |
US4513190A (en) * | 1983-01-03 | 1985-04-23 | Small Precision Tools, Inc. | Protection of semiconductor wire bonding capillary from spark erosion |
JP2527399B2 (ja) * | 1992-09-29 | 1996-08-21 | 完テクノソニックス株式会社 | ワイヤ―・ボンダ―・システム |
US5485949A (en) * | 1993-04-30 | 1996-01-23 | Matsushita Electric Industrial Co., Ltd. | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
US5558270A (en) * | 1995-01-06 | 1996-09-24 | Kulicke And Soffa Investments, Inc | Fine pitch capillary/wedge bonding tool |
US5890643A (en) * | 1996-11-15 | 1999-04-06 | Kulicke And Soffa Investments, Inc. | Low mass ultrasonic bonding tool |
US6006977A (en) * | 1996-12-19 | 1999-12-28 | Texas Instruments Incorporated | Wire bonding capillary alignment display system |
US6112972A (en) * | 1996-12-19 | 2000-09-05 | Texas Instruments Incorporated | Wire bonding with capillary realignment |
KR19980064247A (ko) * | 1996-12-19 | 1998-10-07 | 윌리엄비.켐플러 | 와이어 본딩 캐필러리의 연속 자동 회전 |
US6073827A (en) * | 1998-08-27 | 2000-06-13 | Kulicke & Soffa Investments, Inc. | Wire bonding capillary with a conical surface |
-
2000
- 2000-04-28 US US09/561,304 patent/US6321969B1/en not_active Expired - Lifetime
-
2001
- 2001-04-11 MY MYPI20011727A patent/MY129362A/en unknown
- 2001-04-25 TW TW090109907A patent/TW486767B/zh not_active IP Right Cessation
- 2001-04-27 EP EP01928947A patent/EP1189722B1/en not_active Expired - Lifetime
- 2001-04-27 KR KR1020017016517A patent/KR100792124B1/ko active IP Right Grant
- 2001-04-27 AT AT01928947T patent/ATE333334T1/de not_active IP Right Cessation
- 2001-04-27 WO PCT/US2001/013635 patent/WO2001083152A1/en active IP Right Grant
- 2001-04-27 DE DE60121520T patent/DE60121520T2/de not_active Expired - Fee Related
- 2001-04-27 JP JP2001580019A patent/JP3598290B2/ja not_active Expired - Lifetime
- 2001-04-27 CN CNB018010016A patent/CN1267236C/zh not_active Expired - Lifetime
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2002
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Also Published As
Publication number | Publication date |
---|---|
MY129362A (en) | 2007-03-30 |
DE60121520D1 (de) | 2006-08-31 |
DE60121520T2 (de) | 2007-03-01 |
JP3598290B2 (ja) | 2004-12-08 |
HK1046661B (zh) | 2007-04-13 |
KR100792124B1 (ko) | 2008-01-04 |
WO2001083152A1 (en) | 2001-11-08 |
EP1189722A1 (en) | 2002-03-27 |
US6321969B1 (en) | 2001-11-27 |
EP1189722B1 (en) | 2006-07-19 |
HK1046661A1 (en) | 2003-01-24 |
KR20020022073A (ko) | 2002-03-23 |
JP2003531729A (ja) | 2003-10-28 |
TW486767B (en) | 2002-05-11 |
ATE333334T1 (de) | 2006-08-15 |
CN1366479A (zh) | 2002-08-28 |
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