GB2285943A - Bonding tool for electronic device - Google Patents

Bonding tool for electronic device Download PDF

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Publication number
GB2285943A
GB2285943A GB9501151A GB9501151A GB2285943A GB 2285943 A GB2285943 A GB 2285943A GB 9501151 A GB9501151 A GB 9501151A GB 9501151 A GB9501151 A GB 9501151A GB 2285943 A GB2285943 A GB 2285943A
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United Kingdom
Prior art keywords
bonding
bonding tool
gold
shank
tool
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Granted
Application number
GB9501151A
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GB2285943B (en
GB9501151D0 (en
Inventor
Lawrence E Linn
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HP Inc
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Hewlett Packard Co
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Publication of GB2285943A publication Critical patent/GB2285943A/en
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Publication of GB2285943B publication Critical patent/GB2285943B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45644—Gold (Au) as principal constituent
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/12042—LASER
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

An ultrasonic bonding tool (102) for use in tape automated bonding and wedge bonding of gold and gold plated leads, or wires to contact pads of electronic devices is fabricated of hard material such as Aluminum Oxide ceramic without electrically conductive metallic binders and has a microscopically rough contact surface (106). The Aluminum Oxide ceramic bonding tool (102) is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions, and is not readily abraded by the gold leads. The roughness pattern may be parallel lines (Fig. 2B, not shown) or circular (Figs. 3B, 3C, not shown). <IMAGE>

Description

BONDING TOOL FOR ELECTRONIC DEVICE This invention pertains generally to the field of tape automated bonding (TAB) and, more particularly, to a process and tool for forming a TAB inner lead bond.
In the manufacture of electronic devices, such as semiconductor integrated circuits (IC's), input, output, power and ground pads must be bonded or coupled to external leads.
One technique known in the technology is tape automated bonding (TAB), which is well known to persons of ordinary skill in the field of semiconductor fabrication. As shown in Figure 1, this fabrication procedure utilizes a continuous insulated tape 14 which is similar to photographic film to provide a planar substrate for chips 26 that are attached to individual sections, or frames, of the tape 14. This procedure could be done equally as well using singulated frames, rather than frames attached to tape 14. A spider-like metal (generally copper plated with gold) pattern of conductive traces 20, 21 and 22 is etched on each frame.
The traces may either "fan out", i.e. radiate from the center of the frame to the four edges, or may be four sets of parallel lines, with each set extending perpendicular from one edge of a chip 26. The chip 26 is carefully aligned over the center of the frame so that the contact pads 28 (usually aluminum) of the chip 26 are precisely located at corresponding conductive trace pads 24 in the central portion of the frame. The chip 26 is then attached to the tape automated bonding frame.
This connection of the chip pad 28 to the conductive trace pads 24 of the frame is referred to as "inner lead bonding", which is performed via ultrasonic bonding or thermosonic bonding techniques. All of these bonding techniques are accomplished by bringing a bonding tool 32 into contact with conductive trace pads 24 of a frame. Once the bonding tool 32 is in contact with a trace pad 24, ultrasonic or thermosonic bonding is then carried out for that particular chip pad 28 and conductive trace pad 24. The contact end 34 must have a microscopically patterned, rough surface so that when the tool 32 comes into contact with the gold lead 24, the tool will "grab" the lead. Accordingly, when thermosonic or ultrasonic energy is applied to the tool 32, it will grab the gold lead 24 and move it across the aluminum bonding pad 28. This ultrasonic motion causes a molecular bond to form between the gold lead 24 and the aluminum pad 28.
Bonding tool 32 is generally made of sintered titanium carbide or tungsten carbide in a electrically conductive, metallic binder - typically nickel. The carbide gives the tool 32 its hardness, while the electrically conductive metal (binder) is needed because the tool is manufactured using an electrodischarge machining process. In the manufacturing of the tool 32, a master tool is made of tool steel using standard precision machining techniques. This master tool is pressed into a soft copper blank to create an electrode, which is then used to form the contact end 34 of the tool 32 using conventional electrodischarge machining procedures.
While this process for making a bonding tool 32 is very efficient and cost effective for precision tool manufacturers, it does not create a superior tool. The contact end 34 of tools that are made by this manufacturing method is prone to quite rapid erosion in the presence of gold on the bonding leads under normal thermosonic bonding conditions. Gold from the bonding leads also tends to build up on the surface of the bonding tool. The inventor has discovered that under ultrasonic conditions, the gold in leads 24 attacks and diffuses into the metal in the bonding tool 32, causing the tool 32 to lose its shape after a relatively few bonds. This condition is very unfavourable for mass production of integrated circuits, which can have several hundred I/O pads. A typical bonding tool generally keeps its original shape for 100 or so bonds, and then has to be changed for a new tool. Tools made by the current manufacturing techniques must be changed frequently, which makes the manufacturing of integrated circuits more expensive.
Although some tool manufacturers claim to make ceramic, diamond or alloy tools that resist ablation by gold, the inventor has discovered that these tools have metallic binders that permit electrodischarge machining.
The present invention seeks to provide an improved bonding tool.
According to an aspect of the present invention, there is provided a bonding tool for ultrasonically or thermosonically fonning a bond between a gold or gold plated lead and a contact pad of an electronic device or circuit, comprising: a shank of a hard material without metallic binders, said shank including a first end and a second end; and a bonding tip of a hard material without metallic binders, said bonding tip being located at said first end of said shank, and including a microscopically rough surface.
According to another aspect of the present invention, there is provided a method of manufacturing a bonding tool, comprising the steps of (a) forming a solid shank of 99.99% sintered Aluminum Oxide ceramic, said shank including an axis with a first subportion at one end of said axis and a second subportion at an opposite end of said axis; (b) forming a tapered end portion at said first subportion, said tapered end portion including a wide end adjacent to and equal in width to said second subportion of said shank, and a narrow end opposite from said shank, said narrow end of said tapered end portion including a surface substantially perpendicular to said axis of said shank; and (c) forming said surface of said narrow end so as to have a microscopically rough pattern.
According to another aspect of the present invention, there is provided a method of manufacturing a bond between a gold or gold plated lead and a contact pad, of an electronic device by means of a bonding tool as herein specified, comprising the steps of (a) positioning said gold or gold plated lead adjacent said contact pad; (b) positioning the microscopically rough surface of said bonding tool adjacent said gold or gold plated lead, such that when a compressive force is applied to said bonding tool, said gold or gold plated lead is urged into intimate contact with said contact pad; and (c) applying ultrasonic or thermosonic pressure to said bonding tool, such that said bonding tool grabs said gold or gold plated lead and moves it across said contact pad until a molecular bond is established between said gold or gold plated lead and said contact pad.
It is possible with the invention to provide a bonding tool which can keep its shape for a significantly longer number of bonds than bonding tools of the prior art. In particular, the bonding tool may be able to maintain its shape for approximately 500,000 bonds before any deformation or degradation is noticed.
As bumpless bonding requires the tool to grab the lead and ultrasonically move the lead across the bonding pad, it is more important in bumpless bonding for the tool to maintain a rough surface on the bonding tip. Accordingly, the preferred tool can work especially well for bumpless bonding.
Preferably, there is provided a bonding tool that is omnidirectional (e.g., can be used to bond in any direction, regardless of the direction of the gold leads). This can be accomplished by supplying a bonding tool with a bonding tip with a raised pattern that is substantially the same from any direction. For example, the bonding tool may have a raised bonding ring.
Advantageously, the bonding tool does not contain electrically conductive metallic material, but rather is fabricated from sintered aluminum oxide ceramic (A12O3).
The present invention may also provide bonding tools for other types of bonding techniques where the bonding tool comes into contact with gold or gold plated leads, such as a gold wedge bonding tool.
An embodiment of the present invention is described below, by way of example only, with reference to the accompanying drawings, in which: Figure 1 shows a perspective view of a conventional tape automated bonding process, including a tape, its placement over an integrated circuit chip and a bonding tool; Figure 2A shows a magnified side cut-away view of a bonding tool according to a first embodiment of the present invention; Figure 2B shows a greatly magnified view of an end tip surface of a bonding tool according to the first embodiment of the present invention; Figure 2C shows a greatly magnified side cut-away view of the end tip of a bonding tool according to the first embodiment of the present invention; Figure 3A shows a magnified side cut-away view of a bonding tool according to a second embodiment of the present invention; Figure 3B shows a greatly magnified view of an end tip surface of a bonding tool according to the second embodiment of the present invention; and Figure 3C shows a greatly magnified side cut-away view of the end tip of a bonding tool according to the second embodiment of the present invention.
Reference is made now in detail to a specific embodiment of the present invention, which illustrates the best mode presently contemplated. Alternative embodiments are also briefly described as applicable. It will be understood by the skilled reader that dimensions and ranges given below are approximate and could be varied without losing the effects sought.
Referring now to Figures 2A-2C, a bonding tool 100 made substantially of sintered aluminum oxide ceramic, according to a first embodiment of the present invention, is shown. Bonding tool 100 includes a cylindrical shank body portion 102 having a diameter of approximately 1.5850 + 0.0025mm (0.0624 + 0.0001 inches and a conical end portion 104. The entire length of bonding tool 100 is approximately 11.940 + 0.127mm (0.470 + 0.005 inches). Conical end portion 104 terminates at contact end surface 106, which has a diameter of approximately 0.102 + 0.0076/-0mm (0.004 + 0.0003/-0). As shown in Figures 2B and 2C, contact end surface 106 comprises three substantially flat, inner contact regions 110 that are approximately 0.0102mm (0.0004 inches) wide and two substantially flat, outer contact regions 112 that are approximately 0.0051mm (0.0002 inches) wide. Contact regions 110 and 112 are separated by grooves 108, which are approximately 0.0152 + 0.0025mm (0.0006 + 0.0001 inches) wide and approximately 0.0076 + 0.0025 (0.0003 + 0.0001 inches) deep.
During fabrication, an Aluminum Oxide (Alumina) ceramic, cylindrical blank with a tapered end portion 104, is made by well known molding and sintering processes. The taper being at approximately a 30 included angle.
Then the cylindrical blank is ground and lapped to form the final shape and size.
The blank is then cut with a laser or diamond saw to the specified length. Next, grooves 108 are formed in contact end surface 106 using diamond saw or laser machining techniques. Also, as will be apparent to those of ordinary skill in the art, other hard materials, such as monocrystalline sapphire could be used for fabricating the bonding tool.
Referring now to Figures 3A-3C, a bonding tool 200 made substantially of sintered Aluminum Oxide ceramic, according to a second embodiment of the present invention, is shown. Bonding tool 200 includes a cylindrical shank body portion 202 having a diameter of approximately 1.5850 + 0.0025 (0.0624 + 0.0001 inches) and a conical end portion 204. The entire length of bonding tool 200 is approximately 11.940 + 0.127mm (0.470 + 0.005 inches). Conical end portion 204 terminates at contact end surface 206. As shown in Figures 3B and 3C, contact end surface 206 comprises a substantially flat contact ring 214 that has an outer diameter of approximately 0.1168mum (0.0046 inches) and an inner diameter of approximately 0. 1067mm (0.0042 inches). As shown in Figure 3C, contact ring 214 is a circular mesa structure having a height of approximately 0.0203mm (0.0008 inches) above a valley region 208, which has a diameter of approximately 0.0660mnn (0.0026 inches).
During fabrication, an Aluminum Oxide (Alumina) ceramic, cylindrical shank with a tapered end portion 204, is made by well known molding and sintering processes. The taper being at approximately a 30 included angle. The tapered end portion 204 includes sloped wall 212, which is at approximately a 45" angle from the center axis XX. Then the cylindrical blank is ground and lapped to form the final shape and size. The shank is then cut with a laser or a diamond saw to the specified length. Valley region 208 in end portion 204 is formed using an ultrasonic machining process or a grinding process.
This bonding tool is considered to be superior, because the contact end is omnidirectional. Therefore, the direction of the tool with regard to the direction of the device to be bonded is irrelevant. Accordingly, it is unnecessary to align the direction of the contact end mesa(s) to be perpendicular with the direction of the lead fingers, which would be necessary for bonding tools of the prior art and the first embodiment of the present invention. Such an alignment procedure requires all of the lead fingers in one direction to be bonded and then the bonding tool must be realigned before the lead fingers in the opposite direction (or any other direction) can be bonded.
Once a bonding tool of the above-described type is fabricated, it can be used in the same bonding machines and in the same manner that other bonding tools are used for TAB bonding -with two exceptions. First, the Alumina bonding tool has a useful bonding life span of more than 500,000 bonds, in contrast with the useful life span of conventional bonding tools of just a few hundred bonds. Second, the bonding tool of the second embodiment of the present invention does not require the precise alignment with the lead fingers of the device to be bonded that bonding tools of the prior art require. It will be readily evident to one of ordinary skill in the art that the dimensions of the bonding tools will necessarily change with the intended use and the bonding machine to be used.
The bonding tools described do not have to be Aluminum Oxide ceramic, but can be any hard material, such as ruby or sapphire, so long as the binder material used is not nickel or any other material that is readily abraded by gold.
The tools may also be adapted for use in wedge bonding with gold wire, where similar bonding tool wear problems exist.
The disclosures in United States patent application no. 08/188,282, from which this application claims priority, and in the abstract accompanying this application are incorporated herein by reference.

Claims (15)

1. A bonding tool for ultrasonically or thermosonically forming a bond between a gold or gold plated lead and a contact pad of an electronic device or circuit, comprising a shank of a hard material without metallic binders, said shank including a first end and a second end; and a bonding tip of a hard material without metallic binders, said bonding tip being located at said first end of said shank, and including a microscopically rough surface.
2. A bonding tool according to claim 1, wherein said shank and/or tip is of Aluminum Oxide ceramic.
3. A bonding tool according to claim 2, wherein said bonding tip is formed of 99.99% sintered Aluminum Oxide ceramic.
4. A bonding tool according to any preceding claim, wherein said microscopically rough surface of said bonding tip comprises an omnidirectional, raised pattern.
5. A bonding tool according to claim 4, wherein said microscopically rough surface of said bonding tip comprises a raised ring smaller in size than a contact pad to be bonded by the tool.
6. A bonding tool according to any one of claims 1 to 3, wherein said microscopically rough surface of said bonding tip comprises a plurality of raised fingers running across said surface.
7. A method of manufacturing a bonding tool, comprising the steps of (a) forming a solid shank of 99.99% sintered Aluminum Oxide ceramic, said shank including an axis with a first subportion at one end of said axis and a second subportion at an opposite end of said axis; (b) forming a tapered end portion at said first subportion, said tapered end portion including a wide end adjacent to and equal in width to said second subportion of said shank, and a narrow end opposite from said shank, said narrow end of said tapered end portion including a surface substantially perpendicular to said axis of said shank; and (c) forming said surface of said narrow end so as to have a microscopically rough pattern.
8. A method according to claim 7, wherein said solid shank is formed so as to be cylindrical.
9. A method according to claim 7 or 8, wherein said tapered end portion is formed so as to be conical.
10. A method according to claim 7,8 or 9, wherein said predetermined pattern is formed in said surface of said narrow end by a laser.
11. A method according to claim 7,8 or 9, wherein said predetermined pattern is formed in said surface of said narrow end with a diamond saw.
12. A method according to claim 7,8 or 9, wherein said predetermined pattern is formed in said surface of said narrow end by ultrasonic machining.
13. A method according to any one of claims 7 to 12, wherein said pattern includes a circular depression.
14. A method of manufacturing a bond between a gold or gold plated lead and a contact pad of an electronic device by means of a bonding tool according to any one of claims 1 to 6, or - a bonding tool manufactured by a method according to any one of claims 7 to 13, comprising the steps of: (a) positioning said gold or gold plated lead adjacent said contact pad; (b) positioning the microscopically rough surface of said bonding tool adjacent said gold or gold plated lead, such that when a compressive force is applied to said bonding tool, said gold or gold plated lead is urged into intimate contact with said contact pad; and (c) applying ultrasonic or thermosonic pressure to said bonding tool, such that said bonding tool grabs said gold or gold plated lead and moves it across said contact pad until a molecular bond is established between said gold or gold plated lead and said contact pad.
15. A bonding tool substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
GB9501151A 1994-01-28 1995-01-20 Bonding tool for electronic device Expired - Fee Related GB2285943B (en)

Applications Claiming Priority (1)

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US18828294A 1994-01-28 1994-01-28

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GB2285943A true GB2285943A (en) 1995-08-02
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GB2305001A (en) * 1995-08-30 1997-03-26 Hewlett Packard Co Tool for tape automated bonding
EP1302272A1 (en) * 2001-10-10 2003-04-16 Ford Global Technologies, Inc. An ultrasonic welding tip and apparatus with this tip
US6612479B2 (en) 2001-10-10 2003-09-02 Ford Global Technologies, Llc Apparatus and method for joining layers of materials
US6691909B2 (en) 2001-10-10 2004-02-17 Ford Global Technologies, Llc Sonotrode for ultrasonic welding apparatus
WO2009014494A1 (en) * 2007-07-24 2009-01-29 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps
US7597231B2 (en) 2006-04-10 2009-10-06 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps

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CN111822842A (en) * 2020-07-14 2020-10-27 中车株洲电机有限公司 Ultrasonic welding method
CN114309920A (en) * 2021-12-23 2022-04-12 潮州三环（集团）股份有限公司 Ceramic cleaver and preparation method thereof

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US5816472A (en) * 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
GB2305001A (en) * 1995-08-30 1997-03-26 Hewlett Packard Co Tool for tape automated bonding
EP1302272A1 (en) * 2001-10-10 2003-04-16 Ford Global Technologies, Inc. An ultrasonic welding tip and apparatus with this tip
US6612479B2 (en) 2001-10-10 2003-09-02 Ford Global Technologies, Llc Apparatus and method for joining layers of materials
US6691909B2 (en) 2001-10-10 2004-02-17 Ford Global Technologies, Llc Sonotrode for ultrasonic welding apparatus
US7597231B2 (en) 2006-04-10 2009-10-06 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps
WO2009014494A1 (en) * 2007-07-24 2009-01-29 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps

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Publication number Publication date
JPH07263496A (en) 1995-10-13
GB2285943B (en) 1996-09-11
GB9501151D0 (en) 1995-03-08

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