CN1264480A - 制造无接触灵巧卡的方法 - Google Patents
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Abstract
本发明涉及灵巧卡,特别是能够与卡中集成的天线无接触地工作的卡,包括具有标准接触的混合卡。该制造方法包括下列步骤:通过将天线(22)封装在层内组装叠加的塑料片,该天线包括两个导电接通区(60,24,62,26);在组件顶表面中打开一个空腔,并在所述打开时露出导电接通区;用胶将电子模块(M)粘接在空腔中,该模块在其朝向空腔内部的底表面上具有与天线的导电接通区电接触的导电范围(72)。天线的导电接通区由天线被涂覆有导电粘合剂(60,62)的两个导电端部(24,26)构成。打开空腔之后将导电粘合剂涂覆在天线端部上。
Description
本发明涉及灵巧卡,特别是能够借助集成到卡中的天线无接触地工作的卡的制造。术语″无接触卡″一方面是指人们仅通过天线可与外界通信的卡,以及并且特别是通过天线或通过常规标准接触可与外界通信的混合卡。
这些卡用来执行各种操作,例如,象金融操作、电话通信、识别操作、借方操作或补充账户单元之类的操作,各种操作可通过将卡插入读取器或在一定距离内通过发送/接收终端与放置在该终端作用区内的卡之间的电磁耦合(感应原理)进行。
无接触卡最好必须具有与装有触点的常规灵巧卡的尺寸相同的标准化尺寸。很显然,这对混合卡特别重要,并且希望这些卡单独无接触地工作。
常用的标准ISO 7810定义了长85mm,宽54mm和厚0.76mm的卡。触点在卡表面上的确定位置平齐地装配在下凹处。
这些标准对制造施加了严格的限制。卡的厚度很薄尤其是主要限制,由于需要提供将天线引入到卡中,因此对无触点卡的要求比对仅设置触点的卡的要求更严格。
所提出的技术问题是天线相对于卡定位的问题,由于天线几乎占据了卡的整个表面,必须考虑为卡提供电子功能的集成电路模块(包括芯片和其触点)定位的问题,模块与天线之间连接的精确性和可靠性的问题,最后,还必须考虑机械性能的制约,可靠性和制造成本。
本发明的目的是提出一种能够解决尺寸、制造精度、机械性能和更一般地说可靠性,卡的制造成本和效率的各种制约的制造方法。
为此,根据本发明,制造灵巧卡的方法包括下列步骤:
将一个塑料片放置在另一个塑料片顶部上来组装塑料片,重叠封闭具有两个导电接通区的天线;
在组件顶面向上打开一个空腔,在该空腔打开时露出导电接通区;
将电子模块粘接在空腔中,该模块在其朝向空腔内部的底面上具有与天线的导电接通区电接触的导电表面。
天线的导电接通区最好由天线导体被导电胶覆盖的端部构成。原则上,在打开空腔之后涂覆导电胶,但也可在执行几遍轧制的两个阶段之间涂覆。
片组件最好包括一个带有到达天线端部之上的孔的片,当空腔向上打开时露出这些孔,导电胶涂覆在这些孔中。
正如将要看到的,电子模块可以是单面或双面型,在后一种情况下,将其制成双面电路,在两个面之间无接触通路而是在芯片和两个面的导体之间具有焊接的导线是有利的。无论怎样设计该模块,最好是制造空腔将外壳限定成模块的形状,以使模块的导体与卡的顶表面一样高并由此构成到灵巧卡的通路接触。
天线导体最好是印刷在绝缘片的导体,但它也可由塑料片组件中封装的螺旋线组成。
从阅读下面参考附图给出的详细描述将体现出本发明的其它特征和优点,其中:
图1至5描绘了根据本发明一个实施例的方法的连续操作;
图6描绘了两个面之间无导电通路的双面电子模块的结构;
图7至9描绘了根据本发明第二实施例的方法。
一般来说,无接触芯片卡是通过粘接(热或冷轧)其中已插入或放入天线导体的塑料片,然后在组装的片中向上打开一个空腔以便在其中为集成电路模块形成一个外壳,或完成一个已部分形成的外壳,装配该模块以使模块的两个导电区直接或更经常的是通过导电胶与天线导体的两个端部电接触制成的。
图1至5描绘了根据本发明方法的第一实施例。
开始是将几片塑料片,在此是四片10,20,30,40,通过热或冷轧将一片放置在另一片的顶部,以使它们连接在一起。如后面将看到的,可能仅使用两个或三个相互放置在顶部的塑料片。轧制操作包括在片之间出现任何粘合基片的情况下将这些片相对于另一个片压平。在轧制操作之前或之后将卡切割成标准尺寸,最好是在轧制操作之后。
叠层下面的片10构成灵巧卡的背面包层。
片20带有印刷电路天线22,即在片上涂覆和蚀刻,或丝网印刷的导体。一般将天线22在卡的外围制成几圈,以使尽可能大的电磁通量出来。天线具有两个相互略微分开的端部24和26。根据插入卡中的电子模块的导电区选择该间隔。
片30最好有两个孔34和36,每个孔位于天线的相应端部24,26上。通过这些孔在天线与集成电路模块之间形成电接触。
最后,片40构成芯片的正面包层(图1)。
轧制操作用四个片形成塑料50的薄片,薄片中封装了天线22和其端部24,26,后者在孔34,36下面(图2)。
然后将空腔52挖空,该空腔一般为将电子模块插入其中所需的形状,空腔的深度是使模块的外部接通触点与薄片的上表面一样高,模块的外部接通触点将要变成插入带有触点的读取器的卡的接通触点。一般情况下,空腔具有带有两个平底的双碗形状,一个底面54较浅,另一个底面67较深。较浅的部分到达端部24和26上面,而较深的部分整个位于端部之间。
最好通过两个连续的铣削操作形成空腔。形成空腔后,可通过孔34和36到达天线导体的端部24和26;这表明底部54的深度至少足以贯穿片40的整个厚度并到达片30和它的孔(图3)。
然后,在每个孔34和36中最好灌注一滴导电胶60,62。由此覆盖的天线端部构成通向天线的导电区(图4)。
然后,将包含提供有灵巧卡电子功能的集成电路的电子模块M定位。该模块可以是单面印刷电路模块或双面印刷电路模块,在后一种情况下,可具有两种可能的结构,下面对此进行详细说明。图4描绘了空腔52之上的模块M。在该实例中,它是一个双面印刷电路模块的情况,该双面印刷电路模块具有其表面朝向空腔外面的顶部导体70和其表面朝向空腔里面的底部导体72。导体形成在绝缘片上并用导电通路连接顶部和底部的导体。把植入保护树脂74中的芯片安装在底面上并连接到导体72(由此到导体70)。
将已加工成其标准尺寸的模块装配在空腔52中。图5示出安装在卡中的模块。刚好设置在天线端部24,26上的模块的底面的两个导电区通过孔34和36中给出的导电胶与这两个端部电连接。
导电胶将模块固定到位,但也可设想用涂覆在空腔底部上或模块底面上的非导电胶将模块辅助固定在专供与天线端部接触的位置的外部。也可使用与胶层垂直的方向导电而与胶层平行的方向不导电的各向异质导电胶,以防止一定不能连在一起的模块的和天线的特定电部件之间短路。这种各向异质导电胶可涂覆在孔34,36中和空腔52的剩余部分而不需要任何特定的保护措施。
单面集成电路模块也很容易使用该方法。这种情况下,芯片放置在金属格栅上,其顶面构成灵巧卡的接通触点,其朝向天线端部的底面允许通过导电胶与这些端部连接。通常用绝缘片将该金属格栅覆盖在底侧上。在必须制成天线触点的部分将绝缘片钻穿,最好用该绝缘片或芯片的保护树脂保护格栅底面的其它导电部分。
在一个特别有利的不同实施例中,该模块包括一个带有集成电路芯片的双面印刷电路,但该双面电路是在两个面的导体之间没有导体通路的情况下制造的,使该双面电路更便宜。
图6详细描绘了这种没有通路的双面模块的设计。该模块包括绝缘片80,该绝缘片具有放置并在其顶面(模块放置在卡中时的外面)上蚀刻的第一导体70,和放置并在其底面上蚀刻的第二导体72。第一导体将作为灵巧卡的接通触点。第二导体的目的在于为芯片与天线提供连接。将集成电路芯片82用胶粘到底面并且一方面通过焊接的导线直接连接到底面上的导体,另一方面通过绝缘片中的开口连接到顶面上导体70的后面。
更具体地说,两条焊接的连接导线从芯片开始并在底面上的两个导体72处结束,这些导体用来连接到天线的端部。图6中仅描绘了这些导线中的一条84。其它连接导线从芯片开始并焊接到顶面上导体70的后面,以便在无接触读取器中产生到卡的通路。图6中仅描绘了这些导线中的一条86。
图1至6中描述的实施例采用四片塑料轧制。应该理解,可用可能更厚的单个片20代替片10和20,同样,可用可能更厚的单个片30代替片30和40。在后一种情况下,孔34和36与经轧制的薄片50的表面一样高;然后无论空腔的底54的深度如何,露出这些孔。
在另一个不同的实施例中,可在把顶片40用胶粘到片30之前,但在把片30用胶粘到片20之后涂覆导电胶60。在进行两遍轧制情况下,在两遍轧制之间涂覆导电胶。然后将导电胶封闭在孔34和36中并在加工空腔52时将其露出。然后,如果希望,在装配电子模块之前可对已填充导电胶的孔34和36上的胶进行测量。
在另一个不同的实施例中,图7描绘了在为空腔提供的区域中在组件的两个片之间放置一个防粘附衬底的措施,以便防止两个片在该区域中粘合和便于在打开空腔时去除该区域中的材料;两个片中的一个是用于承载天线以便空腔中的开口露出天线端部的片。更具体地说,顶片30没有孔34和36,但在空腔52上具有该防粘附衬底90,防粘附衬底防止片30粘到天线的端部。轧制后,将不粘附部分的塑料片30剥落,露出触点并部分地形成空腔52(图8)。
应指出,通过加工可获得确定的空腔形状,以便限定更深部分。然后,在用胶粘模块前可将一滴导电胶涂在天线导体的端部(图9)。
最后,特定情况下,最好可使用由螺旋线制成的天线而不是印在绝缘片上的天线。这种情况下,与片20类似对着塑料片压平螺旋天线并因此在热或冷轧制期间将其封闭在灵巧卡中。可在片30中设置如34和36之类的孔,但这不是必须的,因为在加工空腔的操作期间能使螺旋天线的端部露出。由于螺旋线比印刷导体厚并因此可能在露出导线时限制加工,该解决方案实际上是可能的。然后,在装配电子模块前,可将一滴导电胶涂在露出的导线上。
Claims (9)
1.一种制造灵巧卡的方法,包括下列步骤:
将一个塑料片放置在另一个塑料片顶部上来组装塑料片(10,20,30,40),重叠封闭具有两个导电接通区(60,24,62,26)的天线(22);
在组件顶面向上打开一个空腔(52),在该空腔打开时露出导电接通区;
将电子模块(M)粘接在空腔中,该模块在其朝向空腔内部的底面上具有与天线的导电接通区电接触的导电表面(72)。
2.根据权利要求1所述的制造方法,其特征在于:天线的导电接通区包括被导电胶(60,62)覆盖的两个导电端部(24,26)。
3.根据权利要求2所述的制造方法,其特征在于:在向上打开空腔后在天线的端部涂覆导电胶。
4.根据权利要求2和3之一所述的制造方法,其特征在于:片组件包括带有到达天线端部之上的孔(34,36)的片(30),当向上打开空腔时露出这些孔,和在这些孔中涂覆的导电胶(60,62)。
5.根据权利要求2所述的制造方法,其特征在于:组件包括至少一个承载导电天线(22)的片(20),在天线的端部(24,26)之上带有孔(34,36)的片(30),和顶部封闭片(40),其中首先组装前两个片(20,30),在孔中涂覆导电胶,组装第三个片(40),然后,当向上打开空腔时,露出导电胶,装配电子模块。
6.根据权利要求1至5之一所述的制造方法,其特征在于:电子模块(M)具有一个集成电路芯片(82)和一个在两个面之间无导电通路的双面印刷电路,双面电路具有具有一个绝缘片(80),在绝缘片的一面上承载用于作为灵巧卡的接通触点的第一导体(70),和在另一面上承载用于连接到天线的第二导体(72),连接导线(86)通过绝缘片的穿孔区焊接在芯片和第一导体(70)之间,另一条连接导线(84)不穿过绝缘片焊接在芯片和第二导体(72)之间。
7.根据权利要求1至6之一所述的制造方法,其特征在于:以在组件的塑料片之一(20)上印刷的导体形式制造天线。
8.根据权利要求1至6之一所述的制造方法,其特征在于:以螺旋线的形式制造天线。
9.根据权利要求1所述的制造方法,其特征在于:在为空腔提供的区域中在组件的两个片之间放置一个防粘附衬底(90),以便防止两个片在该区域中粘合和便于在向上打开空腔时去除该区域中的材料,两个片中的一个承载天线以便空腔向上的开口露出天线端部。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9707191A FR2764414B1 (fr) | 1997-06-10 | 1997-06-10 | Procede de fabrication de carte a puce sans contact |
FR97/07191 | 1997-06-10 |
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CN1264480A true CN1264480A (zh) | 2000-08-23 |
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CN98805557A Pending CN1264480A (zh) | 1997-06-10 | 1998-06-10 | 制造无接触灵巧卡的方法 |
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EP (1) | EP0988619A1 (zh) |
JP (1) | JP2002505022A (zh) |
KR (1) | KR20010013578A (zh) |
CN (1) | CN1264480A (zh) |
AU (1) | AU7925798A (zh) |
CA (1) | CA2293460A1 (zh) |
FR (1) | FR2764414B1 (zh) |
WO (1) | WO1998057298A1 (zh) |
Cited By (1)
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CN110493954A (zh) * | 2019-08-28 | 2019-11-22 | 成都傅立叶电子科技有限公司 | 一种qfn器件内埋pcb结构及其制作方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2795202B1 (fr) * | 1999-06-15 | 2001-08-31 | Gemplus Card Int | Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contact |
WO2001062517A1 (fr) * | 2000-02-22 | 2001-08-30 | Toray Engineering Company,Limited | Carte d'identification sans contact ou analogue et procede de fabrication correspondant |
GB2372012A (en) * | 2001-01-18 | 2002-08-14 | Pioneer Oriental Engineering L | Forming a high frequency contact-less smart card with an antenna coil |
FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
FR2826154B1 (fr) * | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
KR100407451B1 (ko) * | 2002-03-04 | 2003-11-28 | 주식회사 티오디 | 알에프 발급기를 갖는 카드 발급기 |
DE10337645B4 (de) * | 2003-08-16 | 2005-12-29 | Mühlbauer Ag | Verfahren und Vorrichtung zur Herstellung von Chipkarten |
KR101006873B1 (ko) * | 2008-05-02 | 2011-01-12 | 유인종 | 집적회로 칩 및 안테나 코일을 보드에 인레이하고 이를라미네이팅하는 방법 |
JP2008269648A (ja) * | 2008-07-28 | 2008-11-06 | Dainippon Printing Co Ltd | 接触型非接触型共用icカード |
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FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
AT1470U1 (de) * | 1995-08-01 | 1997-05-26 | Austria Card | Laminierte karte und verfahren zu ihrer herstellung |
FR2752077B1 (fr) * | 1996-08-02 | 1998-09-18 | Solaic Sa | Carte a circuit integre a connexion mixte et module a circuit integre correspondant |
AU3944597A (en) * | 1996-08-02 | 1998-02-25 | Solaic | Integrated circuit card with two connection modes |
-
1997
- 1997-06-10 FR FR9707191A patent/FR2764414B1/fr not_active Expired - Fee Related
-
1998
- 1998-06-10 WO PCT/FR1998/001192 patent/WO1998057298A1/fr not_active Application Discontinuation
- 1998-06-10 KR KR19997011585A patent/KR20010013578A/ko not_active Application Discontinuation
- 1998-06-10 CN CN98805557A patent/CN1264480A/zh active Pending
- 1998-06-10 CA CA002293460A patent/CA2293460A1/fr not_active Abandoned
- 1998-06-10 AU AU79257/98A patent/AU7925798A/en not_active Abandoned
- 1998-06-10 JP JP50177999A patent/JP2002505022A/ja active Pending
- 1998-06-10 EP EP98929541A patent/EP0988619A1/fr not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110493954A (zh) * | 2019-08-28 | 2019-11-22 | 成都傅立叶电子科技有限公司 | 一种qfn器件内埋pcb结构及其制作方法 |
CN110493954B (zh) * | 2019-08-28 | 2024-03-22 | 成都傅立叶电子科技有限公司 | 一种qfn器件内埋pcb结构及其制作方法 |
Also Published As
Publication number | Publication date |
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JP2002505022A (ja) | 2002-02-12 |
AU7925798A (en) | 1998-12-30 |
FR2764414A1 (fr) | 1998-12-11 |
FR2764414B1 (fr) | 1999-08-06 |
KR20010013578A (ko) | 2001-02-26 |
WO1998057298A1 (fr) | 1998-12-17 |
EP0988619A1 (fr) | 2000-03-29 |
CA2293460A1 (fr) | 1998-12-17 |
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