CN1262159C - Electronic parts and mounting structure thereof - Google Patents
Electronic parts and mounting structure thereof Download PDFInfo
- Publication number
- CN1262159C CN1262159C CN 03155710 CN03155710A CN1262159C CN 1262159 C CN1262159 C CN 1262159C CN 03155710 CN03155710 CN 03155710 CN 03155710 A CN03155710 A CN 03155710A CN 1262159 C CN1262159 C CN 1262159C
- Authority
- CN
- China
- Prior art keywords
- tellite
- electronic unit
- contact electrode
- wiring
- inclined plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
To provide an electronic component capable of securing a sufficient mounting area for an electronic component element, and capable of coping with the formation of a fine pattern or a microvia, rigid in the mounting strength on a mother board while being highly accurate and highly dense. In the electronic component 1 constituted of the electronic component element 3 formed on the upper surface of a print substrate 2 and a plurality of terminal electrodes 8 formed on the lower surface of the same, the lower surface of the print substrate 2 is constituted of the lower surface of the print substrate 2 or a first lower surface 80, a second lower surface 60 formed at a position higher than that of the first lower surface 80 in the direction of thickness of the same, and a slope 70 connecting the first lower surface 80 and the second lower surface 60 while the terminal electrode 8 is formed by continuing conductor films 6, 7 on at least the second lower surface 60 and the slope 70. (C)2003,JPO.
Description
Technical field
The present invention relates to be installed in electronic unit on the tellite of inside of electronic equipment (no matter pocket, fixedly-mounted), particularly can be installed in electronic unit on the support substrates such as mother board.
Background technology
Electronic unit in the past such as Fig. 5 and shown in Figure 6, by tellite 51, carry the electronic unit element 53 on an interarea of this tellite 51, the seal cover 54 of overlay electronic part member 53 is formed.The multilayer wiring figure of tellite 51 for forming by stack technology method or combination technique method.
Here, be that example describes with the assembled substrate.On the tellite 51, be formed with wiring figure 55, be formed with photo-sensitive resin 51a, 51c with following lamination respectively in the above on the two sides of the sandwich layer 51b of resinous insulated substrate.On resin bed 51a, be formed with electrode 57 and wiring figure 58, and electronic unit element 53 is installed in the above, seal cover 54 is installed on electronic unit element 53.
Also have, be formed with below the tellite 51 and be used for tellite 51 is installed in contact electrode 56 on the mother board (not shown).
Also have, be formed with the groove 59 of a plurality of semi-circular shapes at its thickness direction A along the two sides of tellite 51, so that when being welded to this electronic unit on the mother board, on the side of tellite 51, forming solder filler, thereby guarantee enough installation strength.Be coated with electrode material interior week to form side electrode 52 at this groove 59.The formation zone of this side electrode 52 comprises the Zone Full from the insulated substrate 51c of foot to the insulated substrate 51a of topmost.This side electrode 52 is connected with above-mentioned contact electrode 56.
The manufacture method of this side electrode 52 is described now.When making tellite 51, under the state of a plurality of substrate (not shown)s of forming that a plurality of tellites 51 are gathered together, utilize drill bit to make the through hole of the resin bed 51a of the resin bed 51c that runs through foot and topmost at assigned position.Then, utilize the electroplating technology method on the medial surface of through hole, to form conductor.Then, a plurality of substrates are separated into single tellite 51.At this moment, side conductor is also cut apart, thereby forms the side electrode 52 that links together to topmost layer 51a from foot layer 51c.
Therefore, shown in plane graph, on the limit, two ends of the insulated substrate 51a of topmost, be formed with recessed to the inside recess 59a.The electronic unit element 53 of interarea that consequently is installed in the insulated substrate 51a of topmost must be installed in the position of avoiding recess 59a.
That is, for the electronic unit that uses tellite 51 in the past, as mentioned above, the formation zone of side electrode 52 comprises the Zone Full from the insulated substrate 51c of foot to the insulated substrate 51a of topmost along thickness direction A.Therefore, on the interarea of the insulated substrate 51a of topmost, owing to the existence of the recess of side electrode 52 reduced can actual installation electronic unit element 53 area.Consequently hinder the raising of performance of electronic components, perhaps increased the design difficulty of the distribution of the formation zone of the wiring figure 58 that forms at tellite 51 or electronic unit element 53, the problem of miniaturization occurred being difficult to realize.
Also have, as mentioned above, be formed with recess on the two sides of side electrode 52, be formed with conductor on week in its recess.But week forms the technology more complicated of conductor in recess, also the qualification rate problem can occur.
On the other hand, in order to address the above problem the electronic unit that to consider not form side electrode.But the electronic unit that will not form side electrode is by welded and installed to mother board the time, owing to can not on side electrode, form solder filler, thus reduced the installation strength of electronic unit.Particularly for being the portable electric appts of representative, owing to the drop strength that must fully guarantee under the installment state, so might not satisfy practical requirement with universal recently mobile phone.
Summary of the invention
The object of the present invention is to provide the electronic unit that can guarantee on the substrate the lift-launch area, strengthen the electronic unit of the bonding strength of substrate and mother board.Also have, the object of the present invention is to provide the electronic unit that simply to make and to adapt to high accuracy, high density designs.
Electronic unit of the present invention is characterised in that to have by order lamination wiring figure and photoresist below resin system insulated substrate buries the tellite that described wiring figure forms underground in inside, lift-launch is at this electronic unit element above tellite, and being used for of forming on below this tellite contact electrode that this tellite is connected with the support substrate of outside, have below the 1st below the above-mentioned tellite, on the thickness direction along tellite is higher than position below the 1st, form the 2nd below, connect below the above-mentioned the 1st and the inclined plane below the 2nd, by following surface irradiation laser to described tellite, the described photoresist of a burning-off part and formed described wiring figure below being exposed at the described the 2nd, and form above-mentioned contact electrode by this wiring figure that exposes and the electrically conductive film that covers above-mentioned inclined plane.
According to the present invention, tellite has below the 1st, on the thickness direction along tellite is higher than position below this, form the 2nd below, the connection tellite the 1st below and the inclined plane below the 2nd.The contact electrode that forms on tellite is by by wiring figure that the following surface irradiation laser of tellite, burning-off part photoresist are exposed and cover at least that the electrically conductive film to the inclined plane is formed below the above-mentioned the 2nd.
So, owing to below the above-mentioned the 2nd, cover and be formed with electrically conductive film to the inclined plane, can increase the area of actual contact electrode, when with electronic unit by welded and installed to support substrates such as motherboard the time, scolding tin will enter into that connection gasket plate electrode top of support substrate form to the inclined plane below the 2nd the space, can adhere to enough scolding tin on the connection gasket plate electrode, form filler.Like this, can fully guarantee the connection area of the contact electrode of electronic unit, guarantee the bonding strength of electronic unit and support substrate.Its result can be applied to pay attention to the portable electric appts of the drop strength under the installment state fully.
Also have, aspect miniaturization,, increased the area that can carry the electronic unit element, improved the electronic unit circuit elements design degree of freedom owing to can omit the side electrode of the concavity that the side at tellite in the past forms.
Also have, according to the present invention, when this electronic unit is installed on support substrate, because the solder filler that connects the two is only in that formed space forms to the inclined plane from the 2nd below, so can utilize the zone of the top region-wide conduct lift-launch electronic unit element of tellite.Like this, increase the area that carries the electronic unit element, can adapt to the high performance of electronic unit or the requirement of miniaturization.Also have, cancelled distribution limitation, improved design freedom the electronic unit element.
In addition, according to the present invention, tellite forms wiring figure on resin system insulated substrate, lamination forms photoresist in the above then.If the structure that adopts this combination technique method to form can adapt to the formation of high accuracy, highdensity Micropicture or microcell.In addition, by following surface irradiation laser to tellite, burning-off part photoresist, can expose above-mentioned wiring figure, make it, thereby can omit the technology of the electrically conductive film below the other formation the 2nd as the 2nd following electrically conductive film, simplified manufacturing technique improves qualification rate.
Also have, according to the present invention, the contact electrode can also the zone extension below tellite again from the inclined plane.According to this structure, can enlarge the contact area of scolding tin and contact electrode more, when carrying out the scolding tin installation, can further improve the scolding tin bonding strength.
In addition, the bundle spot of above-mentioned laser beam is circular or oval, and the irradiation energy density distribution is that central part is the highest, reduces gradually to circumferential part.Can simply promptly form the inclined plane thus.
Also have,, and be in the corner location of above-mentioned tellite below the above-mentioned the 2nd, just this electronic unit can be fixedly mounted on 4 positions of support substrate if above-mentioned tellite is an essentially rectangular.
Also have, the mounting structure of electronic unit has on the support substrate that connects pad for above-mentioned electronic unit is positioned in, the contact electrode of this electronic unit links together by scolding tin with the lower area of pad below the 2nd that be connected on the above-mentioned support substrate simultaneously.
Description of drawings
Fig. 1 is the stereoscopic figure of the electronic unit relevant with an embodiment of the invention.
Fig. 2 is the X-X line sectional view of the electronic unit of Fig. 1.
Fig. 3 is installed in the sectional view of the state on the support substrate 20 for the electronic unit 1 of presentation graphs 1.
Fig. 4 is the sectional view of the electronic unit relevant with other execution modes of the present invention.
Fig. 5 is the stereoscopic figure of existing electronic unit.
Fig. 6 is the X-X line sectional view of existing electronic unit.
Embodiment
Electronic unit of the present invention is described with reference to the accompanying drawings.
Fig. 1 is the stereoscopic figure of the electronic unit 1 relevant with an embodiment of the invention.Fig. 2 is the sectional view of electronic unit 1 of the present invention.Fig. 3 is installed in the sectional view of the state on the support substrate 20 such as mother board for expression electronic unit 1.
Wiring figure 9 that above-mentioned tellite 2 is a formation copper on the sandwich layer 2b of resinous insulated substrate and then folded last layer photo-sensitive resin 2a, the wiring figure 9 of formation copper and then folded last layer photo-sensitive resin 2c below sandwich layer 2b.This method is called the combination technique method.The material of this sandwich layer 2b can adopt for example to replenish in glass fibre or aromatic polyamide fibre etc. and immerse the mylar (English name: Pre-impregnated) that forms behind the epoxy resin.
Also have, the top of tellite 2 covers respectively wiring figure 12 that is formed with copper and the electrode 10 that is used to carry electronic unit element 3.Connection between the wiring figure 12 realizes by the through hole conductor that connects insulated substrate 2a or 2c.Being made as of through hole conductor at first utilize laser radiation above tellite or below the formation through hole, utilize well-known electroplating processes method in this through hole, to imbed conductor then.
Also have, above the electrode 10 that forms, be equipped with a plurality of electronic unit elements 3 on tellite 2, it carries the zone is the top roughly Zone Full of tellite 2.
Also have, tellite 2 following 5 by below the 1st 80, be in along thickness direction A be higher than the 1st below 80 position the 2nd below 60, below the connection the 1st below the 80 and the 2nd 60 inclined plane 70 formed.Like this, electrically conductive film 6,7,8a form continuously on 80 below the 2nd 60, below the inclined plane the 70, the 1st and constitute contact electrode 8.In addition, one of contact electrode 8 distolaterally also can not extend to below the 1st 80.At this moment, the electrically conductive film 6,7 that forms continuously constitutes a contact electrode 8.
Inclined plane 70 central authorities of 5 below tellite 2 are level and smooth tilts.By such formation inclined plane 70, can utilize electroplating processes etc. to form contact electrode 8 simply.In addition, also can guarantee the formation area of contact electrode 8.
Be respectively equipped with a this contact electrode 8 on 4 angles below tellite, be provided with 4 contact electrodes 8 altogether.The pad 21 that is connected with the corresponding one by one setting of contact electrode 8 on the support substrates 20 such as these contact electrodes 8 and mother board links together by scolding tin, is installed in (with reference to Fig. 3) on the support substrate 20 thereby electronic unit 2 is carried.
As mentioned above and since from tellite 2 the 2nd below 60 below inclined plane the 70, the 1st 80 coverings be formed with electrically conductive film 6,7,8a, thereby can guarantee that contact electrode 8 has bigger area.And with electronic unit 1 by welded and installed to support substrate 20 time, scolding tin 30 can enter below the top connection pad 21 and the 2nd of support substrate 20 60 and inclined plane 70 between the zone, can guarantee has bigger scolding tin bonded area.Like this, the solder filler 22 of q.s can be formed between contact electrode 8 and the support substrate 20, thereby the bond strength of electronic unit 1 and support substrate 20 can be improved.Can be applied to pay attention to the portable electric appts of the drop strength under the installment state like this, fully.
Also have, 22 of above-mentioned solder filler be lower than the 2nd below 60 or the lower zone on inclined plane 70 form, thereby can utilize the top Zone Full lift-launch electronic unit element 3 of tellite 2.Therefore, can on tellite 2, carry more electronic unit element 3.Like this, can improve the high performance of electronic unit 1, and the integrally-built miniaturization of electronic unit 1.Also have, cancelled distribution limitation, improved design freedom electronic unit element 3.
In addition, as above-mentioned electronic unit element 3, can be integrated circuit, chip capacitor or chip-shaped resistance, chip-shaped coil etc.These electronic unit elements 3 are positioned on the assigned position above the tellite, connect material and tellite 2 realization electrical bond and mechanical bond by conductivity such as scolding tin.
On the other hand, above-mentioned seal cover 4 is made for metals such as Kovar alloies, in the present embodiment, is installed on the tellite 2, and covers the whole electronic unit elements 3 that set above of tellite 2.Sealing lid 4 can mask outside electromagnetic noise.Prevent that like this noise from invading the distribution in electronic unit element 3 or the tellite 2 etc.Seal cover 4 is made the regulation shape by methods such as well-known sheet metal processing or deep-draw processing.Above the electronic unit element 3a of about central configuration of gained seal cover 4 on tellite, by adhesivess such as scolding tin or epoxy resin 14 secure bond on tellite 2.
This seal cover 4 also can keep the electric potential floating state when being used for electronic unit 1.But in order to ensure above-mentioned sealing function, seal cover 4 preferably remains on earthing potential by electronic unit element 3 or tellite 2.
After above-mentioned electronic unit 1 was positioned on the assigned position of support substrate 20, the thicker scolding tin 22 that forms by 60 lower area below the 2nd made contact electrode 8 combine with being connected pad 21, thereby makes electronic unit 1 lift-launch on support substrate 20.
The manufacture method of above-mentioned electronic unit 1 then, is described.
At first, for a plurality of substrates that tellite 2 is arranged in length and breadth, from the relevant position irradiating laser light beam in 4 bights of photosensitive resin layer 2c one side direction tellite 2.As LASER Light Source, can adopt excimer laser, carbon dioxide laser, YAG laser etc.For example, when using carbon dioxide laser, adopt the carbon dioxide that produces the infrared wavelength vibration as amplifying medium, its output is set at 0.4W～9.0W.And the bundle spot of laser beam is circular or oval, and the irradiation energy density distribution is that center of circle portion is the highest, reduces gradually to circumferential part.By this laser radiation, the photosensitive resin layer 2c of burning-off illuminated portion central part.Its result exposes the wiring figure 9 of the top copper of sandwich layer 2b, and this exposes face becomes electrically conductive film 6.Simultaneously, be formed with interarea orthogonal directions on the relevant position of the hot spot periphery of laser beam, the inclined plane 70 of the photosensitive resin layer 2c of 5 degree～20 degree that for example only tilt with respect to sandwich layer 2b.
Then, on inclined plane 70, form electrically conductive film 7, below tellite 2, form the electrically conductive film 8a that links to each other with electrically conductive film 7 on 5 by electroplating processes.Form contact electrode 8 like this.
Then, covering is formed for carrying the electrode 10 and the wiring figure 12 of electronic unit element on tellite 2, utilizes technical methods such as flint glass or scolding tin counter-current that electronic unit element 3 is installed.Then, connection seal cover 4 on electronic unit element 3.Then, utilize methods such as setting-out from a plurality of tellites, to cut apart and obtain single electronic unit 1.
Also have, the invention is not restricted to above-mentioned execution mode, can not leave want to carry out in the point range various changes and improvement of the present invention.
For example, in the above-mentioned execution mode, the 2nd following 60 is positioned at the place, 4 angles below the tellite, and its inboard is provided with inclined plane the 70, the 1st following 80.Also can change into as shown in Figure 4 the place, 4 angles below tellite at first be provided with the 1st below 80 ', the inclined plane 70 ' of side configuration within it, the 2nd following 60 ' then.At this moment, cross over below the 1st 80 ' continuously, 60 ' form contact electrode 8 ' below the inclined plane 70 ' and the 2nd.When on support substrate, carrying this electronic unit, can be the 2nd below 60 ' below the thicker scolding tin of zone formation, guarantee enough bonded areas and soldering tin amount simultaneously.Like this, electronic unit 1 can firmly be installed lift-launch on support substrate.
In addition, in the above-mentioned execution mode, if the peripheral part of seal cover 4 is crooked downwards, 4 coverings of the also sealed lid in the side of the side of electronic unit element 3 or tellite 2, the electric wave shielding action that can improve seal cover 4 effectively.
Claims (5)
1. electronic unit is characterized in that:
Have by order lamination wiring figure below resin system insulated substrate and photoresist come to bury tellite that described wiring figure forms underground in inside, carry this above tellite the electronic unit element and below this tellite on form be used for contact electrode that this tellite is connected with the support substrate of outside
Have below the described tellite below the 1st, on the thickness direction along tellite is higher than position the 1st below, form the 2nd below, below the connection the described the 1st and inclined plane below the 2nd,
By the following surface irradiation laser of described tellite, the described photoresist of a burning-off part are exposed formed described wiring figure below the described the 2nd, and form described contact electrode by this wiring figure that exposes and the electrically conductive film that covers described inclined plane.
2. electronic unit according to claim 1 is characterized in that:
Described contact electrode is zone extension below described substrate again from described inclined plane.
3. electronic unit according to claim 1 is characterized in that:
The bundle spot of described laser beam is circular or oval, and the irradiation energy density distribution is that central part is the highest, reduces gradually to circumferential part.
4. electronic unit according to claim 1 is characterized in that:
Described tellite is an essentially rectangular, and is in the corner location of described tellite below the described the 2nd.
5. the mounting structure of an electronic unit is characterized in that:
Be the described electronic unit of claim 1 to be positioned in have on the support substrate that connects pad, simultaneously on the contact electrode of this electronic unit and the described support substrate be connected pad the 2nd below under regionally link together by scolding tin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002252152A JP2003174258A (en) | 2001-09-28 | 2002-08-29 | Electronic component and mounting structure thereof |
| JP2002252152 | 2002-08-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1487780A CN1487780A (en) | 2004-04-07 |
| CN1262159C true CN1262159C (en) | 2006-06-28 |
Family
ID=34179479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03155710 Expired - Fee Related CN1262159C (en) | 2002-08-29 | 2003-08-29 | Electronic parts and mounting structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1262159C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018157690A1 (en) * | 2017-03-01 | 2018-09-07 | 广东欧珀移动通信有限公司 | Cover plate component, display screen component, and electronic device |
| CN110741428B (en) * | 2018-02-28 | 2021-12-21 | 京瓷株式会社 | Display device, glass substrate, and method for manufacturing glass substrate |
-
2003
- 2003-08-29 CN CN 03155710 patent/CN1262159C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1487780A (en) | 2004-04-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1057659C (en) | Multilayered metallic printed board and molded module | |
| CN1284230C (en) | High frequency module and its producing method | |
| US6882544B2 (en) | Printed circuit board, method for producing same and semiconductor device | |
| JP4650244B2 (en) | Circuit module and manufacturing method thereof | |
| CN1198486C (en) | Printed-wiring board with cavity for mounting electronic component and manufacture thereof | |
| US20060118931A1 (en) | Assembly structure and method for embedded passive device | |
| EP1450400A1 (en) | Module part | |
| AU714028B2 (en) | Semiconductor device mounting method and multi-chip module produced by the same | |
| CN1604320A (en) | Semiconductor device containing stacked semiconductor chips and manufacturing method thereof | |
| CN1653878A (en) | Electromagnetically shielded circuit device and shielding method therefor | |
| CN1398149A (en) | Printed circuit board with radiating element, its mfg. method and device contg. it | |
| US6909183B2 (en) | Substrate for an electric component and method for the production thereof | |
| CN1342041A (en) | Electronic device of sealed electronic element and manufacturing method and printed wiring board | |
| US20220264748A1 (en) | Electronic component module and method for manufacturing electronic component module | |
| CN1555576A (en) | Thin electronic label and method for making same | |
| CN110993777B (en) | Display driving board, preparation method thereof and display device | |
| US20060154533A1 (en) | Printed-circuit board and circuit unit incorporating the circuit board | |
| CN1262159C (en) | Electronic parts and mounting structure thereof | |
| JP2022168758A (en) | Flexible wiring board, module, and electronic apparatus | |
| CN1243461A (en) | Method for making a sonoprobe | |
| CN1183566C (en) | Push-button switch | |
| CN1177902A (en) | Circuit board assembly and heat conducting device thereof | |
| CN1538801A (en) | Electronic line unit with assembling structure of high-reliability welding | |
| JPS63114299A (en) | Printed wiring board | |
| KR102605794B1 (en) | Wiring circuit board, and imaging device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060628 Termination date: 20130829 |