CN1183566C - Push-button switch - Google Patents
Push-button switch Download PDFInfo
- Publication number
- CN1183566C CN1183566C CNB011106069A CN01110606A CN1183566C CN 1183566 C CN1183566 C CN 1183566C CN B011106069 A CNB011106069 A CN B011106069A CN 01110606 A CN01110606 A CN 01110606A CN 1183566 C CN1183566 C CN 1183566C
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- Prior art keywords
- substrate
- contact
- push
- button switch
- hole
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/50—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member
- H01H13/52—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a single operating member the contact returning to its original state immediately upon removal of operating force, e.g. bell-push switch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/12—Movable parts; Contacts mounted thereon
- H01H13/14—Operating parts, e.g. push-button
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/26—Snap-action arrangements depending upon deformation of elastic members
- H01H13/36—Snap-action arrangements depending upon deformation of elastic members using flexing of blade springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H3/00—Mechanisms for operating contacts
- H01H3/02—Operating parts, i.e. for operating driving mechanism by a mechanical force external to the switch
- H01H3/12—Push-buttons
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- Push-Button Switches (AREA)
- Manufacture Of Switches (AREA)
Abstract
The present invention provided a push-button switch whose manufacturing process can be shortened without impairing mountability to a circuit board or the like. The switch comprises an insulating substrate, a fixed contact laminated and formed on a central part of the substrate, an insulator laminated and formed on the substrate, a dome-shaped metal contact which is put into a through-hole in the insulator and is placed on the substrate, through-hole electrode-faces which are respectively connected to the fixed contact and the contact pattern making contact with a metal contact, and a cover sheet which is mounted on the surface of the substrate and the metal contact and covers them. The through-hole electrode-faces are laminated and formed on the side end faces of the substrate so as to be plane in parallel with the side end faces.
Description
The present invention relates to be applicable to the push-button switch of electrical equipment that requirement is thinner etc.
Below, with Figure 10 to Figure 15 traditional push-button switch is described.
Figure 10 is the sectional view of expression conventional button switch 60, Figure 11 is the oblique view of conventional button switch, Figure 12 is the partial enlarged drawing of expression through hole 40a (40b), Figure 13 is the local oblique view of large substrates 54, Figure 14 is the local oblique view that expression armature contact 78 and cover plate 80 are installed in the state on the large substrates 54, and Figure 15 is the local oblique view that expression is separated into the state of each push-button switch.
In Figure 10, Figure 11, the 40th, the substrate by insulating material constitutes has formed circular fixed contact 46 in its surperficial central authorities, has formed the contact patterns 42 that roughly becomes C shape around it.Fixed contact 46 is quadrant cylinder shape through hole 40a, 40b and is drawn by lead-out wiring 46a, 46b, 42a, 42b respectively with the external terminal that contact patterns 42 is introduced on four jiaos that are separately positioned on substrate 40 always.
The 48th, circular metal plate is bent to dome-type armature contact, its peripheral part 48a conduction is connected contact patterns 42 and is installed on the contact patterns 42.The 50th, by the cover plate that heat stable resin constitutes, it is covered with armature contact 48 and pastes to cover and preventing on the surface of substrate 40 and in fixing armature contact 48 that solder flux etc. from entering.
In such push-button switch 60, push the part of armature contact 48 from the top, armature contact 48 counter-rotatings, its central portion contact fixed contact 46, carry out switch motion thereby connect fixed contact 46 with contact patterns 42, outside by the through hole 40a, the 40b that are connected with contact patterns 42 with fixed contact 46 respectively the switch transition signal being delivered to.
And above-mentioned push-button switch 60 assembles by following operation.
At first, as shown in figure 13, on large substrates 54, formed circuit pattern 90 corresponding to the circuit pattern that constitutes by fixed contact 46, contact patterns 42, through hole 40a, 40b and lead-out wiring 46a, the 46b of push-button switch 60 (seeing Figure 10, Figure 11), 42a, 42b crisscrossly.Figure 13 76 corresponding to the fixed contact 46,74 of push-button switch 60 corresponding to contact patterns 42,54a is corresponding to through hole 40a, 40b.
In addition, symbol 54a carries out electroplating processes and the through hole 54a that forms by the inner face to the through hole that forms with punchings such as NC plates on large substrates 54.
And, as shown in figure 14, on the contact patterns 74 of each circuit pattern 90 of large substrates 54, metal armature contact 78 has been installed, in addition, from those armature contact 78 tops, the whole surface that covers large substrates 54 is pasted and is gone up heat-resisting cover plate 80.Subsequently, as shown in figure 15, through hole 54a is divided into four parts with the double dot dash line part among the slicing machine cut-out figure, has finished push-button switch 60 thereby be partitioned into each push-button switch.
As shown in figure 14, must cover plate 80 corresponding to the position of through hole 54a on form through hole 80a.This is in order to prevent such problem, promptly under the situation that does not have through hole 80a, dangle on the through hole 40a (40b) of the push-button switch 60 after cutting apart in the bight 50 ' of cover plate 50 (seeing Figure 12), when push-button switch 60 for example and on the circuit board of soldering at electrical equipment the time by mounted on surface, soldering portion is positioned at dangles lid down, can not estimate and confirm soldering portion.
But, when on cover plate 80, having gone out through hole 80a, exist because of processing the problem that cover plate 80 increases operation.In addition, because cover plate 80 thickness are tens of microns,, also process time will be prolonged so punching is very difficult.In addition, when being attached on the large substrates 54, must accurately make through hole 80a and trickle through hole 54a position alignment to as shown in figure 14 cover plate 80, thereby, exist the problem that increases manufacturing process.
The objective of the invention is to address the above problem and provide a kind of and can shorten the push-button switch of manufacture process without detriment to being installed to installation capability on the circuit board etc.
As first technical scheme that addresses the above problem, a kind of push-button switch has been proposed, it has insulated substrate, take shape in fixed contact, contact on this substrate be contained in fixed contact on this substrate carry out the dome-shaped armature contact of switch motion, respectively connect described fixed contact and armature contact external terminal, paste at the surface of described substrate and the cover plate on the armature contact, described substrate is square, described external terminal is made of metal level, and this metal level is by be laminated into parallel with it plane formation on the side end face of this substrate.
In addition, alternative plan has proposed a kind of like this push-button switch, and wherein said metal level is the through hole electrode face.
In addition, third party's case has proposed a kind of like this push-button switch, wherein between described substrate and cover plate, and the stacked insulating trip that formed with the accommodation section that holds described armature contact.
In addition, cubic case has proposed a kind of like this push-button switch, and wherein said metal level takes shape on the assigned position of four jiaos of described substrates.
As mentioned above, the present invention proposes a kind of like this push-button switch, it has insulated substrate, fixed contact on moulding and this substrate, contact is contained in the dome-shaped armature contact that the fixed contact on this substrate is carried out switch motion, the external terminal that connects described fixed contact and armature contact respectively, paste at the surface of described substrate and the cover plate on the armature contact, described substrate is square, external terminal is made of metal level, this metal level is by be laminated into parallel with it plane formation on the side end face of this substrate, thereby, for example on the crisscross large substrates that sets a plurality of fixed contacts, a plurality of armature contacts are set, cover plate is pasted after on large substrates surface and a plurality of armature contacts, when being divided into each push-button switch ground assembling push-button switch, section can be arranged to make it close, thereby not have on the cover board to be provided with in advance yielding hole corresponding to metal level along metal level.Thus one, can cut down the operation that the hole is made a concession in processing, and owing to there is no need critically to make and be formed with the cover plate of making a concession the hole and aim at large substrates, so can shorten manufacture process.In addition, because the cover plate length of stretching out on metal level is very little, so the button welded and installed to circuit board etc. the time, is being carried out the range estimation of soldering portion easily and confirmed.
In addition, because metal level is the through hole electrode face, so, can simplify manufacture process forming under the situation of metal level under the state at large substrates.
In addition, because the stacked insulating trip that formed between described substrate and cover plate with the accommodation section that holds described armature contact, compare so directly cover plate is sticked on the lip-deep situation of dome-shaped armature contact, on cover plate can be stuck incrustly with past ground.In addition, by house movable contact in the space in the insulating trip accommodation section that cover plate covered, so when pushing armature contact so that carrying out switch motion (aftermentioned), can form the exhaust portion of part in compression, thus one, armature contact pressure exceeds design load ground can not obtain good operation sense.In addition, when the assembling push-button switch, can need not on insulating trip, to set in advance yielding hole, so can further shorten the manufacture process of push-button switch corresponding to metal level.
In addition, because described metal level takes shape on the assigned position of four jiaos of described substrates, so can guarantee rather spacious space in substrate center portion, the result more effectively utilizes this space during pattern that can be in the designs fix contact etc.
Fig. 1 is the exploded perspective view of the push-button switch 100 of expression first embodiment of the invention.
Fig. 2 is the sectional view along the 2-2 line of Fig. 1.
Fig. 3 is the plane graph of substrate 110 of the push-button switch 100 of first embodiment of the invention.
Fig. 4 is the internal view of Fig. 3.
Fig. 5 is the local oblique view of the state on the large substrates 210 that insulating trip 220 and armature contact 130 and cover plate 240 are installed in of the push-button switch 100 of expression first embodiment of the invention.
Fig. 6 is the partial plan layout of large substrates 210 shown in Figure 5.
Fig. 7 is the oblique view of the substrate 310 of second embodiment of the invention.
Fig. 8 is the partial plan layout of the large substrates 410 of second embodiment of the invention.
Fig. 9 is the oblique view of the substrate 510 of third embodiment of the invention.
Figure 10 is the sectional view of expression conventional button switch 60.
Figure 11 is the oblique view of conventional button switch 60.
Figure 12 is the partial enlarged drawing of the through hole 40a (40b) of conventional button switch 60.
Figure 13 is the local oblique view of the large substrates 54 of conventional button switch 60.
Figure 14 is the local oblique view of the state on the large substrates 54 that armature contact 48 and cover plate 50 are installed in of expression conventional button switch 60.
Figure 15 is the local oblique view of the state that is separated into each push-button switch of expression conventional button switch 60.
Below, illustrate it is the push-button switch 100 of push-button switch first embodiment of the present invention with Fig. 1 to Fig. 6.
As depicted in figs. 1 and 2, the square substrate 110 that mainly constitutes of push-button switch 100 by insulating material such as glass-epoxies, stacked to be fitted in insulating trip 120 on the substrate 110, to be received within the armature contact that is installed on the insulating trip 120 on the substrate 110 be hard contact 130, the cover plate 140 that pastes hard contact 130 and insulating trip 120 constitutes.
Below, the structure and the assembled state of each parts are described.
On the surface of substrate 110, formed roughly conglobate fixed contact 111 in central authorities as shown in figures 1 and 3.In addition, along on the right-hand member of the relative two edges of Fig. 3 above-below direction, wiring pattern 113a, 113b have been formed along each edge respectively.In addition, have in the scope of specified gap at around the fixed contact 111 and relatively wiring pattern 113a, 113b and formed contact patterns 112.
On the other hand, as shown in Figure 4, on the inner face of substrate 110, formed and be used to guarantee that the Copper Foil large tracts of land of intensity covers the cross wiring pattern 114 of its inner face.In addition, on four jiaos of inner face, formed square soldering pattern 115a, 115b, 116a, 116b respectively, wherein soldering pattern 116a, 116b link to each other with wiring pattern 114 patterns.
In addition, as Fig. 1, Fig. 3, shown in Figure 4, on the two edges of fixed contact 111, be provided with respectively and run through that substrate 110 links to each other with the wiring pattern 114 of inner face and the through hole electrode 111a, the 111b that form.
In addition, on the two ends of each side end face of the fore-and-aft direction (above-below direction among Fig. 3) of Fig. 1, having formed the metal level that has the plane part parallel with each side end face respectively is through hole electrode face 110a, 110b and 110a ', 110b '.These through hole electrode faces 110a, 110b and 110a ', 110b ' form by a cascaded surface than more lower slightly L in each side end face of substrate 110 (seeing Fig. 2, Fig. 3) is set.
And through hole electrode face 110a, 110a ' are connected with the contact patterns 112 on surface, their also link to each other with soldering pattern 115a, the 115b of inner face respectively (seeing Fig. 1, Fig. 3, Fig. 4).Thereby, constituted external terminal by through hole electrode face 110a (110a ') and soldering map interlinking case 115a (115b).
In addition, through hole electrode face 110b, 110b ' link to each other with wiring pattern 113a, the 113b on surface and soldering pattern 116a, the 116b of inner face respectively.Thereby, constituted external terminal by through hole electrode face 110b (110b ') and soldering pattern 116a (116b).
Then, make square insulating trip 120 with heat stable resins such as polyimide resins, the profile of insulating trip is substantially equal to the profile of substrate 110, has formed the through hole 120a (accommodation section) with the form fit of hard contact 130 in the central in the portion.
As shown in Figure 2, on the stacked surface that is fitted in substrate 110 of insulating trip 120.At this moment, exposed the central portion of fixed contact 111 by through hole 120a with contact patterns 112.On insulating trip 120 parts of contact substrate 110, formed resistance 110c (see figure 2) in the outside of through hole 120a and in insulating trip 120 outer peripheral inboards in advance.Thus one, between the substrate 110 and insulating trip 120 in the inboard of resistance 110c and the outside, bonding agent discharge portion 160a, 160b have been formed respectively, thereby when pasting insulating trip 120, even bonding agent 170 pressurized on stickup face, pressure is applied on bonding agent discharge portion 160a, the 160b hardly, so can not see bonding agent 170 in hard contact 130 sides and the insulating trip 120 outer peripheral outsides.Can replace resistance 110 to form insulating barrier by silk screen printing.
Then, hard contact 130 is by bending to circular metal plate dome-shaped formation.And the through hole 120a contact patterns 112 interior and its outer peripheral edges connection substrate 110 that hard contact 130 is received within insulating trip 120 is set on the contact patterns 112.
Then, heat stable resins such as square cover plate 140 usefulness polyimides constitute, and its profile and insulating trip 120 are much the same.And cover plate 140 covers the surface of hard contact 130 and insulating trip 120 and is sticked, and when preventing that hard contact 130 breaks away from substrates 110, it has prevented that solder flux etc. from adhering on substrate 110 surfaces.
Because cover plate 140 is covered with the insulating trip 120 that puts hard contact 130 and is sticked, so compare with being attached to direct lip-deep situation from dome-shaped armature contact to the neighboring in the past, cover plate 140 can incrust be stuck up.In addition, put hard contact 130 by the space content in the through hole 120a of the insulating trip 120 that is covered by cover plate 140, when pushing hard contact 130 so that carrying out switch motion (aftermentioned), the exhaust portion of part in compression can be formed, good operation sense can be do not obtained so the pressure of hard contact 130 exceeds design load.
And, on the inner face of substrate 110, the complete tegmentum of wiring pattern 114 (see figure 4)s residence is used when the pasting insulating trip 120 identical bonding agent of the intact sample of used bonding agent to paste to go up by pad 150 (see figure 2)s that constitute with insulating trip 120 identical materials, has prevented that solder flux and dust etc. from entering by through hole electrode 111a, 111b.
And, under situation about insulating trip 120 and cover plate 140 being cemented on the substrate 110, for making the adhesive linkage sclerosis, under heated condition, exert pressure, in this case, because substrate 110 and the coefficient of linear expansion of the material of insulating trip 120 are different (glass-epoxy: 250ppm/ ℃～300ppm/ ℃ in the normal state, pi: 25ppm/ ℃～28ppm/ ℃), so after the sclerosis cooling, on described substrate 110, produced warpage, it is unstable that the contact of switch contact portion becomes, and taken place by with soldering pattern 115a, 115b, 116a, the unsteady bad connection that causes that the 116b soldering produces to the circuit board of electrical equipment etc. the time.Therefore, in the present embodiment, owing on the inner face side of substrate 110, also formed by the pad 150 that constitutes with above-mentioned insulating trip 120 identical materials, so can prevent the warpage of substrate 110.
In addition, to be made into its construction rate on substrate 110 corresponding to insulating trip 120 roughly the same for pad 150.In addition, on the part of removing beyond the soldering pattern 115a that takes shape on substrate 110 ends, 115b, 116a, the 116b, insulation spacer 150 thickness are made into the thickness greater than the soldering pattern.
Therefore, on the face side and inner face side of substrate 110,, therefore, can further prevent the warpage of substrate 110 reliably because insulating trip 120 is roughly symmetrical with pad 150.
The push-button switch 100 that assembles is so so installed by soldering, and the soldering pattern 115a, 115b, 116a, the 116b (seeing Fig. 2, Fig. 4) that promptly take shape in substrate 110 inner faces face with each other and be arranged on the unshowned board edge.At this moment, under the state on bending connection and substrate 110 through hole electrode face 110a, 110a ', 110b, the 110b ', solder sections can be connected on the circuit board securely.
At this moment,, between each soldering pattern 115a, 115b, 116a, 116b and described edge part, formed the gap, thereby scolding tin flows into this part seat surface that also can prevent push-button switch 100 come-up by being arranged on pad 150 (see figure 2)s under the substrate 110.
As shown in Figure 2, though upside at through hole electrode face 110a, 110a ', 110b, 110b ', insulating trip 120 and cover plate 140 extrude with distance L, but because this distance L is very little, do not estimate the scolding tin of confirming to be soldered on each through hole electrode face so this part does not hinder.
In addition, as shown in Figure 1, because through hole electrode face 110a, 110a ', 110b, 110b ' are arranged on four jiaos of substrate 110, so can form uniform pattern width ground formation contact patterns 112 around central portion fixed contact 111.
The action of push-button switch 100 then, is described.At first, push the central portion of the hard contact 130 that Fig. 1, cover plate 140 shown in Figure 2 covered from the top, by hard contact 130 counter-rotatings and its central portion contact fixed contact 111, fixed contact 111 is connected with contact patterns 112 and is carried out switch motion.And the switch transition signal is passed to the outside by the external terminal that has respectively the through hole electrode face 110b that links to each other with contact patterns 112 with fixed contact 111 (110b ') and 110a (110a ').
Above-mentioned push-button switch 100 assembles by following operation.
At first, as shown in Figure 5, on the surface of large substrates 210, form circuit pattern 300 corresponding to the circuit pattern that constitutes by the fixed contact 111 of push-button switch 100 (see figure 1)s, contact patterns 112 etc. crisscrossly.And, on the inner face of large substrates 210, formed circuit pattern (not shown) in couples corresponding to the circuit pattern that constitutes by the wiring pattern among Fig. 4 114, soldering pattern 115a, 116a, 115b, 116b with each circuit board 300.
Fig. 5 211 corresponding to the fixed contact 111,212 of push-button switch 100 corresponding to contact patterns 112.In addition, on large substrates 210, formed the long hole shape through hole electrode 210a (seeing Fig. 5, Fig. 6) that has line part along the peripheral part of circuit pattern adjacent one another are 300 corresponding to the position separately of the through hole electrode face 110a of push-button switch shown in Figure 1 100,110a ', 110b, 110b '.
Through hole electrode 210a forms by so known molding mode is simple, promptly the inner face that utilizes punch process such as NC plate to go out to have the slotted hole shape through hole of line part 210b on large substrates 210 is carried out electroplating processes etc.
Subsequently, as shown in Figure 5, the insulating trip 220 that will have the through hole 220a that forms corresponding to each circuit board 300 sticks on the large substrates 210.Insulating trip 220 is like this location, promptly in advance each through hole 220a of insulating trip 220 is arranged on the central portion of contact patterns 212 of each circuit pattern 300.
Subsequently, hard contact 130 is housed in each through hole 220a of insulating trip 220 and is installed on the substrate 210.In addition, so paste heat-resisting cover plate 240, promptly cover the surface of the insulating trip 220 that puts those hard contacts 130 fully.Subsequently, as shown in Figure 6, through hole electrode 210a is divided into four parts and utilize cut-outs such as slicing machine to have that part of of the folded width H of double dot dash line among the figure, has finished push-button switch 100 thereby be partitioned into each push-button switch.
In addition, by width H shown in Figure 6 can be configured to arbitrary value by the width that changes through hole electrode 210a, so under the situation that for example width H sets greatlyyer, also can utilize bicker or cutter to cut off.
In being divided into the process of each push-button switch, each through hole electrode 210a is divided into four parts, and each through hole electrode face is that through hole electrode face 110a, 110a ', the 110b according to push-button switch 100, any one electrode surface of 110b ' are divided.And, these through hole electrodes are looked like the above ground and are become parallel with the regulation side end face of substrate 110 and planely (see Fig. 1, Fig. 3), so when cutting apart large substrates 210, can be near being equivalent to through hole electrode face 110a, 110a ', 110b, the internal face of the through hole electrode 210a of 110b ' cuts off, thereby at through hole electrode face 110a, 110a ', 110b, insulating trip 120 that 110b ' go up to extrude and cover plate 140 can very little (see figure 2)s, push-button switch 100 solderings to circuit board the time, are being carried out the range estimation that scolding tin is soldered on these through hole electrode faces is confirmed easily.
Thereby, when assembling shown in Figure 5, on insulating trip 220 and cover plate 240, there is no need to form yielding hole corresponding to through hole electrode 210a, make a concession the hole manufacturing procedure so can cancel.In addition, owing to also there is no need to make cover plate 240 accurately to aim at the through hole electrode 210a of large substrates 210, the result can further shorten manufacture process.
So, according to present embodiment, can shorten manufacture process without detriment to the installation capability ground that is installed to circuit board etc.
Then, with Fig. 7, Fig. 8 second embodiment of the invention is described.Have with the parts of the first embodiment identical functions and represent with prosign or title.
Fig. 7 is the oblique view of the substrate 310 of second embodiment of the invention, and Fig. 8 is the partial plan layout of large substrates 410.
In the present embodiment, the shape of the through hole electrode face 110a of the substrate 110 of first embodiment, 110a ', 110b, 110b ' has been changed.
In these figure, the 310th, substrate, the 312nd, contact patterns, 313a, 313b are wiring patterns, 310a, 310a ', 310b, 310b ' they are the through hole electrode faces.These through hole electrode faces 310a, 310a ', 310b, 310b ' are the plane formation that becomes parallel with described side end face on the both sides end face in substrate 310 each bight respectively.These through hole electrode faces 310a, 310b, 310a ', 310b ' form by being provided with than the lower cascaded surface in substrate 310 each side end face.
And the same with first embodiment, through hole electrode face 310a, 310a ' link to each other with contact patterns 312, and through hole electrode face 310b, 310b ' link to each other with fixed contact 111 by through hole electrode 111a, 111b.
Though utilize the push-button switch of aforesaid substrate 310 by the process assembling the same with first embodiment, but as shown in Figure 8, in the stage of large substrates 410, by corresponding in each position that becomes through hole electrode face 310a, 310a ', 310b, 310b ' of Fig. 7, formed the cross through hole electrode 410a that has line part 410b along the periphery in the bight of circuit board adjacent one another are 400.
Thus one, in cut-out figure have the part of width H the time, through hole electrode 410a is divided into four parts, on each push-button switch, has formed through hole electrode face 310a, 310b, 310a ', 310b ' shown in Figure 7.
Under the situation of design like this, not only obtained the effect the same with first embodiment, and when a push-button switch soldering of the substrate 310 of use present embodiment is to circuit board, because through hole electrode face 310a, 310b, 310a ', 310b ' take shape on the both sides end face at each angle, so scolding tin is linking to each other with unillustrated edge part, thereby obtained to be connected more firmly the effect on the circuit board under the state that changes at each angle.
Then, utilize Fig. 9 that the third embodiment of the present invention is described.
Fig. 9 is the oblique view of the substrate 510 of third embodiment of the invention.Have with the parts of first, second embodiment identical functions and represent with same-sign or title.
In the figure, the 510th, substrate, the 512nd, contact patterns, 513a, 513b are wiring patterns, 510a, 510a ', 510b, 510b ' they are the through hole electrode faces.These through hole electrode faces 510a, 510a ', 510b, 510b ' are made into parallel with side end face separately plane respectively on each end face central portion of substrate 510.These through hole electrode faces 510a, 510b, 510a ', 510b ' form by being provided with than the more lower slightly cascaded surface in substrate 510 each side end face.
And through hole electrode face 510a, 510a ' link to each other with contact patterns 512, and through hole electrode face 510b, 510b ' link to each other with fixed contact 111 by through hole electrode 111a, 111b.
Though utilize the push-button switch of aforesaid substrate 510 by the process assembling the same with first and second embodiment, but (not shown) in the stage of large substrates, by corresponding to each position that becomes through hole electrode face 510a, 510a ', 510b, 510b ' (with reference to Fig. 9), the central portion in relative each neighboring of circuit board adjacent one another are has formed the long hole shape through hole electrode that has line part along described neighboring.
Though in first, second embodiment, and through hole electrode face 110a (310a), 110b (310b), 110a ' (310a '), 110b ' (310b ') be arranged on the angle of substrate 110 (310), the present invention is not limited to this.According to this present embodiment, through hole electrode face 510a, 510b, 510a ', 510b ' can take shape on the central portion of substrate 510 each side end face, change the high push-button switch of the degree of freedom thereby can provide, the luggage that is configured into of the board edge portion when it can be matched with design is joined.
In addition, though substrate 110 (310 at first, second, third embodiment, 510) in, be connected and fixed contact 111 and have the external terminal of through hole electrode face 110b (310b, 510b), 110b ' (310b ', 510b ') by through hole electrode 111a, 111b through substrate 110 (310,510), but the present invention is not limited to this, conventional button switch 60 for example shown in Figure 11, the present invention also can be applicable to the sort of push-button switch that is connected and fixed contact and external terminal on substrate top surface by figure.
Claims (4)
1. push-button switch, it is characterized in that, it has insulated substrate, take shape in fixed contact on this substrate, be contained on this substrate contact with the said fixing contact and carry out the dome-shaped armature contact of switch motion, respectively be connected described fixed contact and armature contact external terminal, paste at the surface of described substrate and the cover plate on the armature contact, described substrate is square, described external terminal is made of metal level, and this metal level is by be laminated into parallel with it plane formation on the side end face of this substrate.
2. push-button switch as claimed in claim 1 is characterized in that, described metal level is the through hole electrode face.
3. push-button switch as claimed in claim 1 or 2 is characterized in that, the stacked insulating trip with the accommodation section that holds described armature contact that formed between described substrate and cover plate.
4. push-button switch as claimed in claim 1 is characterized in that, described metal level takes shape on the assigned position of four jiaos of described substrates.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP122380/2000 | 2000-04-18 | ||
| JP2000122380A JP2001307582A (en) | 2000-04-18 | 2000-04-18 | Push-button switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1318853A CN1318853A (en) | 2001-10-24 |
| CN1183566C true CN1183566C (en) | 2005-01-05 |
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ID=18632863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011106069A Expired - Fee Related CN1183566C (en) | 2000-04-18 | 2001-04-11 | Push-button switch |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2001307582A (en) |
| KR (1) | KR100420016B1 (en) |
| CN (1) | CN1183566C (en) |
| TW (1) | TW512375B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030054651A (en) * | 2001-12-26 | 2003-07-02 | 명성정보통신 주식회사 | Pcb-integrated smt switch and its manufacturing method |
| JP2011198474A (en) * | 2010-03-17 | 2011-10-06 | Hosiden Corp | Movable contact tape, and key switch using this movable contact tape |
| KR101296835B1 (en) * | 2012-02-22 | 2013-08-14 | (주)세윤 | Printed circuit board dome switch and, method of manufacturing printed circuit board dome switch |
| CN104871278A (en) * | 2012-11-19 | 2015-08-26 | 波肯斯有限公司 | Dome switch and method for manufacturing same |
| CN104903986A (en) * | 2012-11-19 | 2015-09-09 | 波肯斯有限公司 | Dome switch and method for manufacturing same |
| KR101400622B1 (en) * | 2013-05-09 | 2014-05-29 | 주식회사 포콘스 | Dome switch |
| KR101361222B1 (en) * | 2012-11-19 | 2014-02-11 | 주식회사 포콘스 | Dome swithc and manufacturing method |
| CN104282467A (en) * | 2014-09-22 | 2015-01-14 | 三日科学技术（天津）有限公司 | Touch switch electronic component |
| CN104282452A (en) * | 2014-09-22 | 2015-01-14 | 三日科学技术（天津）有限公司 | Touch switch on circuit board |
| KR101854318B1 (en) * | 2017-01-06 | 2018-05-03 | 조인셋 주식회사 | Elastic thermal dissipation terminal |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3266913B2 (en) * | 1991-04-12 | 2002-03-18 | ミツミ電機株式会社 | Push switch |
| JPH04315717A (en) * | 1991-04-12 | 1992-11-06 | Mitsumi Electric Co Ltd | Push switch |
| JP2594914Y2 (en) * | 1991-09-06 | 1999-05-24 | 北陸電気工業株式会社 | Push switch |
| JP2598611Y2 (en) * | 1998-08-21 | 1999-08-16 | 北陸電気工業株式会社 | Push switch |
-
2000
- 2000-04-18 JP JP2000122380A patent/JP2001307582A/en not_active Withdrawn
-
2001
- 2001-03-26 TW TW090107095A patent/TW512375B/en not_active IP Right Cessation
- 2001-04-11 CN CNB011106069A patent/CN1183566C/en not_active Expired - Fee Related
- 2001-04-17 KR KR10-2001-0020506A patent/KR100420016B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW512375B (en) | 2002-12-01 |
| JP2001307582A (en) | 2001-11-02 |
| KR100420016B1 (en) | 2004-02-25 |
| KR20010098671A (en) | 2001-11-08 |
| CN1318853A (en) | 2001-10-24 |
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