CN104871278A - Dome switch and method for manufacturing same - Google Patents
Dome switch and method for manufacturing same Download PDFInfo
- Publication number
- CN104871278A CN104871278A CN201380060344.5A CN201380060344A CN104871278A CN 104871278 A CN104871278 A CN 104871278A CN 201380060344 A CN201380060344 A CN 201380060344A CN 104871278 A CN104871278 A CN 104871278A
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- China
- Prior art keywords
- mentioned
- support
- thin film
- film
- film switch
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/26—Snap-action arrangements depending upon deformation of elastic members
- H01H13/48—Snap-action arrangements depending upon deformation of elastic members using buckling of disc springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2205/00—Movable contacts
- H01H2205/016—Separate bridge contact
- H01H2205/024—Means to facilitate positioning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2223/00—Casings
- H01H2223/002—Casings sealed
Abstract
The present invention relates to a dome switch and a method for manufacturing same, and more specifically, to a dome switch and a method for manufacturing same, wherein the entire edge of the dome switch can be fixed by means of soldering when mounting on a surface of a printed circuit board, so that installation direction is not limited by soldering positions, gaps are eliminated between the dome switch and the printed circuit board so that liquid such as water is prevented from being introduced to the inside, and wherein a wrapping cover comes into contact with a residual adhesive layer remaining on the edge of a film when wrapping a dome switch product so as not to adhere to the dome switch.
Description
Technical field
The present invention relates to a kind of thin film switch and preparation method thereof, particularly relate to and a kind ofly make it carry out thin film switch of exchange work and preparation method thereof with simple structure installment printed circuit board (PCB).
Background technology
Usually, thin film switch obtains signal by the twist operation of elastic film.
This kind of thin film switch is mainly used in the enter key of handset starting key and electronic product in addition thereof, be made up of with the top be installed on printed circuit board switch contact the fixing bottom of the fixed contact of printed circuit board (PCB), and for have electric conductivity, form in elastic film.
If pressurize to the top of this kind of elastic film, its top will become spill and contact with make and break contact to become and connect (ON) state, and after decompress(ion), the top of elastic film then becomes convex again, restore to the original state and become disconnection (OFF) state.
Connection point terminal (wire) that printed circuit board (PCB) is connected with by soldering forms multiple electronic product keypad switch thin film switch structure along the periphery of thin film switch is disclosed in No. (20) 5, Korean Patent Registration publication 10-569.
But the printed circuit board (PCB) of this kind of thin film switch may produced problem be when attachment, and its thin film switch not forming the printed circuit board (PCB) of soldering forms gap, and then has the liquid such as water to flow into.
Moreover, thin film switch in the past needs through operation manufactures such as the punch process operation of connection point terminal, the insert molding operation of the connection point terminal of punch process, the bonding operations of dome part, manufacturing procedure is complicated, and the terminal of punch process is shaped in the mode of insert-molding.Therefore, the complicated integral structure of thin film switch, size is large, with the miniaturization of mobile phone etc., lighteningly to run counter to, goes wrong.
Meanwhile, when the fixed contact of printed circuit board (PCB) forms corresponding quantity with multiple connection point terminal, the front, rear, left and right of its multiple connection point terminal cannot form symmetry, and the direction being mounted on the thin film switch of printed circuit board (PCB) is limited, goes wrong.
Especially, when packaging product, the residue of the tack coat of film place position remnants causes packaging cover to stick at thin film switch, goes wrong.Thus, packaging cover is bonded on thin film switch and occurs the situations such as pickup (pick up) error, and fault like this causes the efficiency in operation to go wrong.
[prior art document]
[patent documentation]
Korean Patent power registration publication 10-569 (20) 5 ((20) 06.04.03)
Korean utility model patent power registration No. (20)-275959, publication ((20) 02.05.18)
Summary of the invention
The present invention solves the problem and creates, and the object of the invention is as follows:
The first, the thin film switch of " in the surface mount process of printed circuit board (PCB), make all peripherally to be fixed by soldering, make the installation direction corresponding to brazed portions unrestricted " and preparation method thereof.
The second, thin film switch of " avoid the appearance such as the gap between thin film switch and printed circuit board (PCB), have the liquid such as water to flow into prevent thin film switch inside " and preparation method thereof.
3rd, " punch process of elastic film and support and just can manufacturing by means of only the elasticity of film and the bonding of support, the simplification of this kind of manufacturing process not only can be cost-saving, also can make upper and lower to height minimum " thin film switch and preparation method thereof.
4th, the thin film switch of " avoid in the process of packing film switch product, the residue of the adhesive layer of film installation position remnants contacts with packaging cover and sticks the phenomenon at its thin film switch " and preparation method thereof.
For achieving the above object, the present invention is as the thin film switch of " being installed on the surface of the printed circuit board (PCB) of the make and break contact of the inner side being provided with fixed contact and being positioned at above-mentioned fixed contact; pack by independent packaging cover ", part and individual features thereof comprise: annular support, be provided with hollow bulb, above-mentioned support is positioned at the outside of above-mentioned fixed contact, and is fixed on above-mentioned printed circuit board (PCB); Elastic film, is positioned at above-mentioned hollow bulb, and above-mentioned elastic film is provided with the protuberance projected upwards, and is connected with above-mentioned fixed contact; And film, be positioned at the top of above-mentioned elastic film, above-mentioned film, for connecting above-mentioned support and above-mentioned elastic film, carries out airtight to above-mentioned hollow bulb, and above-mentioned elastic film is according to pressurize to above-mentioned protuberance or decompress(ion) contacts with above-mentioned make and break contact or removes and contacts.
The invention is characterized in, above-mentioned support is polygon or circle.
The invention is characterized in, above-mentioned elastic film also comprises support portion, and its underpart contacts with above-mentioned fixed contact, and what top was connected with above-mentioned protuberance additional arranges position.
The invention is characterized in, the lower surface of above-mentioned support, be positioned at same plane with above-mentioned elastic film bottom institute holding position.
The invention is characterized in that above-mentioned support is provided with the spacer portion extended to form from lateral; Above-mentioned spacer portion, makes the edge isolation of above-mentioned packaging cover and above-mentioned film on the one hand, guides the above-mentioned film being positioned at above-mentioned support on the other hand.
In the present invention, above-mentioned spacer portion is characterised in that, the lead ring upwards extended to form from the peripheral surface of above-mentioned support or multiple guide protrusion are formed.
In the present invention, the feature of above-mentioned support is, be formed to inward side to multiple guide grooves of depression in peripheral surface centered by central part, above-mentioned multiple guide protrusion upwards extends to form from the medial surface of the above-mentioned support forming above-mentioned multiple guide groove respectively.
In the present invention, the feature of above-mentioned support is, outer periphery entirety in its underpart is fixed in above-mentioned printed circuit board (PCB) by soldering.
In the present invention, the feature of the manufacture method of thin film switch is, it provides, and " support and elastic film punch process step are carry out punch process to manufacture above-mentioned support and above-mentioned elastic film to raw material; And film adhesion step is, with above-mentioned film, above-mentioned support manufactured in above-mentioned support and elastic film punch process step and above-mentioned elastic film are bondd " thin film switch manufacture method.
The present invention has following effect: the first, when being packaged in printed circuit board (PCB) surperficial, to be wholely around fixed by soldering, thus based on unrestricted in the setting direction of soldering places.
The second, whole periphery mounts printed circuit board (PCB) by soldering, thus prevents from producing gap etc. between thin film switch and printed circuit board (PCB), and then intercepts the inside that the liquid such as water flow into thin film switch.
3rd, the bonding by means of only the punch process of elastic film and support and the elastic film undertaken by film and support manufactures, and not only can simplify manufacturing process and reduce costs, but also can by the minimized height of above-below direction.
4th, " when the product of packing film switch; packaging cover contacts with the residue of the tack coat remaining in film edge and is attached to the phenomenon of thin film switch " is avoided to occur, thus not only make pickup (Pick up) when using product freely, and thus in the effect that operation can realize Efficient Operation.
Accompanying drawing explanation
As shown in Figure 1, be the stereogram of thin film switch of the present invention.
As shown in Figure 2, be the longitudinal cross-section stereogram of thin film switch of the present invention.
As shown in Figure 3, be the using state figure of the longitudinal cross-section of thin film switch of the present invention.
As shown in Figures 4 and 5, in thin film switch of the present invention, the using state figure of the stereogram of another example of support and the state after packing by packaging cover.
As shown in Figure 6, be thin film switch of the present invention, the longitudinal sectional view of encapsulated space.
As shown in Figures 7 and 8, be vertical view and the stereogram of another example of spacer portion shown in thin film switch of the present invention.
As shown in Figure 9, be the flow chart of the manufacture method of thin film switch of the present invention.
Embodiment
As follows, with reference to the accompanying drawings, the preferred embodiments of the present invention are described in detail:
Known referring to figs. 1 through Fig. 3, the present invention is the surface of the printed circuit board (PCB) 100 of the make and break contact 120 being packaged in the inner side being provided with fixed contact 110 and being positioned at above-mentioned fixed contact 110, and the thin film switch packed is carried out by independent packaging cover 200, above-mentioned thin film switch 1 comprises: annular support 10, be positioned at the outside of above-mentioned fixed contact 110, above-mentioned support 10 is formed with hollow bulb 11, and is fixed on above-mentioned printed circuit board (PCB) 100; Elastic film 20, is positioned at above-mentioned hollow bulb 11, and above-mentioned elastic film 20 is provided with the protuberance 21 projected upwards, and is connected with above-mentioned fixed contact 110; And film 30, be positioned at the top of above-mentioned elastic film 20, above-mentioned film 30 is for airtight above-mentioned hollow bulb 11.
Above-mentioned printed circuit board (PCB) 100 can be gross morphology, and is formed with multiple above-mentioned fixed contact 110 and above-mentioned make and break contact 120 in the nature of things.
In addition, above-mentioned thin film switch 1 can connect above-mentioned fixed contact 110 and above-mentioned make and break contact 120 by manual operation, by this connection, transmission of electric signals etc. can be made to be in and connect ON state.
Above-mentioned support 10 is in the tabular comprising above-mentioned hollow bulb 11, in the same plane with the lower edge of above-mentioned elastic film 20 below above-mentioned support 10.
Above-mentioned support 10 is formed by electric conductor, although above-mentioned support 10 can in the polygonal annular state comprising the corner, hexagonal etc. that are formed with hollow bulb 11 to the inside, more preferably, in the circular rings form comprising oval form.
Above-mentioned thin film switch 1 not only can maintain the form of above-mentioned elastic film 20 by above-mentioned support 10, and, block the external impact etc. can transmitted to above-mentioned elastic film 20, and reduce the reason broken down.
Above-mentioned fixed contact 110 is in the form identical with above-mentioned support 10, if above-mentioned support 10 is in polygonal ring or circular rings form, then above-mentioned fixed contact 110 also can be understood in polygonal ring or circular rings form.
Above-mentioned make and break contact 120 can in the form corresponding with above-mentioned fixed contact 110, and above-mentioned make and break contact 120 is configured at the inside of above-mentioned fixed contact 110 with the state separated with fixed contact 110.Such as, if above-mentioned fixed contact 110 is in polygonal annular state, then above-mentioned make and break contact 120 can be polygon form, if the rounded annular state of above-mentioned fixed contact 110, then above-mentioned make and break contact 120 can rounded form.
Above-mentioned support 10 is positioned at above-mentioned printed circuit board (PCB) 100, and the outer periphery of above-mentioned support 10 is carried out soldering with above-mentioned printed circuit board (PCB) 100 by independent other surface encapsulation devices SMD etc.Wherein, can have can carry out the support contact 130 of soldering with above-mentioned support 10 at the above-mentioned printed circuit board (PCB) 100 being provided with above-mentioned support 10.
That is, the outer periphery of above-mentioned support 10 overall fixed by soldering be arranged at above-mentioned printed circuit board (PCB) 100, and to block between inner side and outer side.
Thus, above-mentioned thin film switch 1 not only can with freely the fixing based on the setting direction of soldering places is carried out without restriction of above-mentioned fixed contact 110, and, the inside that the liquid such as water flow in above-mentioned thin film switch 1 can also be intercepted, and prevent the fault etc. that occurs because liquid flows into.
More preferably, above-mentioned elastic film 20 is formed by metal, and pressurize or decompress(ion) according to above-mentioned protuberance 21, upwards state hollow bulb 11 by reversion action and introduce and draw from above-mentioned hollow bulb 11, thus contact with above-mentioned make and break contact 120 or remove and contact.
More preferably, the rounded form of above-mentioned elastic film 20, but be not limited thereto, can in the variform that can realize reversion action according to pressurization and decompress(ion).
Above-mentioned elastic film 20 is formed at above-mentioned protuberance 21, and has the support portion 22 contacted with above-mentioned fixed contact 110.
More preferably, above-mentioned support portion 22 diametrically from bottom more to the form that above-mentioned protuberance 21 more diminishes, thus there is gentle slope, and come to be formed integrally with above-mentioned protuberance 21 by punch process.
In above-mentioned thin film switch 1, not only above-mentioned protuberance 21 is positioned at the position higher than the surface of above-mentioned support 10 by above-mentioned support portion 22, thus easily carries out the operation of above-mentioned protuberance 21.
In addition, in above-mentioned thin film switch 1, can pressurize according to above-mentioned protuberance 21, crimp and press above-mentioned support portion 22, and carry out the contact with above-mentioned fixed contact 110 smoothly.
Above-mentioned elastic film 20 by being attached to the above-mentioned film 30 on top, the state that the bottom maintaining above-mentioned support portion 22 contacts with above-mentioned fixed contact 110.
Above-mentioned film 30 is formed by insulator, the tack coat 34 of coating bonding material etc. is formed in the bottom surfaces of above-mentioned film 30, above-mentioned film 30 is bonded in above-mentioned support 10 and above-mentioned elastic film 20 is fixedly installed on above-mentioned support 10 by above-mentioned elastic film 20, on the other hand, intercept the liquid such as water and flow in above-mentioned hollow bulb 11.
For this reason, above-mentioned film 30 comprises: the first film 31, and outside is attached to above-mentioned support 10, and the inner side of above-mentioned the first film 31 extends to form to direction, above-mentioned support portion 22 and forms level; 3rd film 33, is attached to above-mentioned protuberance 21 and forms curved surface; And second film 32, be attached to above-mentioned support portion 22, the bottom of above-mentioned second film 32 is connected with above-mentioned the first film 31, and the top of above-mentioned second film 32 is connected with the 3rd film 33, and more from lower to upper part, the width of above-mentioned second film 32 is narrower.
The outside of above-mentioned the first film 31 is attached to above-mentioned support 10, and on the other hand, the inner side of above-mentioned the first film 31 is positioned at above-mentioned support 10 and above-mentioned support portion 22) between, and block the space be formed between above-mentioned support 10 and above-mentioned support portion 22.
In addition, the space of the sky of above-mentioned the first film 31 between above-mentioned support 10 and above-mentioned support portion 22, when pressurizeing to above-mentioned protuberance 21, together move with above-mentioned elastic film 20, thus the reversion action of above-mentioned elastic film 20 can be made easily to carry out.
Above-mentioned second film 32 in the shape corresponding with the shape of above-mentioned support portion 22, and mildly connects above-mentioned the first film 31 and above-mentioned 3rd film 33.
Above-mentioned 3rd film 33 is attached to the above-mentioned protuberance 21 forming above-mentioned elastic film 20, thus makes above-mentioned elastic film 20 maintain the state being stably fixed on above-mentioned support 10.
Above-mentioned film 30, after making in the mode making above-mentioned the first film 31, above-mentioned second film 32 and above-mentioned 3rd film 33 be in the state of the same face, is attached to above-mentioned support 10 and above-mentioned elastic film 20, and in the form shown in Fig. 1 to Fig. 3.Or above-mentioned film 30 is before being attached to above-mentioned support 10 and above-mentioned elastic film 20, and above-mentioned the first film 31, above-mentioned second film 32 and above-mentioned 3rd film 33 can be the form shown in Fig. 1 to Fig. 3.
More preferably, the outer periphery of above-mentioned film 30 is in the form identical with the outer periphery of above-mentioned support 10, and the external diameter of above-mentioned film 30 is less than the external diameter of above-mentioned support 10.This is to block when carrying out soldering work to the outer periphery of above-mentioned support 10, the barrier factors that outside because of above-mentioned film 30 is more outstanding than above-mentioned support 10 and likely occur, thus soldering work can be made easily to carry out, on the other hand, the fault etc. likely occurred because lead is attached to above-mentioned film 30 grade is prevented.
As shown in Figures 4 and 5, for another example of thin film switch medium-height trestle of the present invention stereogram and the using state figure of the state of packing by packaging cover is shown, as shown in Figure 6, for the longitudinal sectional view of encapsulated space in the present invention, as shown in Figures 7 and 8, be vertical view and the stereogram of another example of spacer portion in the present invention.
Known with reference to Fig. 4 to Fig. 8, the spacer portion 12 upwards extended to form can be provided with at the outer peripheral face of above-mentioned support 10.
In above-mentioned thin film switch 1, when packing the product, under the state of multiple horizontal, longitudinal arrangement, pack by above-mentioned packaging cover 200, when deployed, from packaged above-mentioned packaging cover 200, pick up (Pick up) above-mentioned thin film switch 1 to use.
When packing the product of above-mentioned thin film switch 1, above-mentioned spacer portion 13 prevents the residue 35 of the above-mentioned tack coat 34 at the edge because remaining in above-mentioned film 30 and makes above-mentioned packaging cover 200 be attached to above-mentioned thin film switch 1.
In other words, as shown in Figure 5, above-mentioned spacer portion 13 separates in the mode preventing the edge formed by above-mentioned film 30 and contact with above-mentioned packaging cover 200, thus prevents the above-mentioned residue 35 at the edge because remaining in above-mentioned film 30 and make above-mentioned packaging cover 200 be attached to above-mentioned thin film switch 1.
More preferably, the lead ring 13 that above-mentioned spacer portion 12 upwards can be extended to form by the outer peripheral face from above-mentioned support 10 is formed, and lead ring 13 forms by the lateral of above-mentioned support 10 bending or bending, and forms one with support 10.
In above-mentioned thin film switch 1, above-mentioned lead ring 13 extends to form from the lateral of above-mentioned support 10, thus can guide in the mode that above-mentioned film 30 can be made stably to place to the inner side of above-mentioned lead ring 13.This can be understood to that thus above-mentioned film 30 does not depart to the outside of lead ring 14, and can be positioned over assigned position because above-mentioned lead ring 13 projects upwards formation along the surrounding of above-mentioned support 10.
In addition, in above-mentioned thin film switch 1, when packing the product, above-mentioned lead ring 13 upwards supports above-mentioned packaging cover 200 from the edge of above-mentioned film 30, thus can separate in the mode preventing packaging cover 200 and the side edge formed by above-mentioned film 30 from touching.Thus, above-mentioned thin film switch 1 can prevent above-mentioned packaging cover 200 from contacting with the residue 35 at the edge remaining in above-mentioned film 30.
As shown in Figure 6, above-mentioned lead ring 13 can carry out circular arc process by lower outside and form encapsulated space 40 between above-mentioned printed circuit board (PCB) 100.Wherein, the lower outside of above-mentioned lead ring 13 can be understood to that the outer peripheral face of lead ring 13 contacts with the bottom surfaces of above-mentioned support 10 and the corner formed, and is understood to that corner is carried out circular arc process and forms above-mentioned encapsulated space 40.
Its reason is, for when the above-mentioned thin film switch 1 of the surface encapsulation of above-mentioned printed circuit board (PCB) 100, the applicable area of soldering is increased.
Namely, because in above-mentioned thin film switch 1, formed the lower periphery of above-mentioned lead ring 13 overall fixed by soldering be arranged at above-mentioned printed circuit board (PCB) 100, make it increase to make the applicable area of soldering by above-mentioned encapsulated space 40, and expect that the rigidity of soldering is strengthened.
Or as shown in Figures 7 and 8, above-mentioned spacer portion 13 can be made up of the multiple guide protrusions 14 extended to form from the lateral of support 10 centered by the central part of above-mentioned support 10.
More preferably, above-mentioned multiple guide protrusion 14 bends from the lateral of above-mentioned support 10 or bends and form one with support 10, also can carry out circular arc process by lower outside and form encapsulated space 40 between above-mentioned printed circuit board (PCB) 100.
As shown in Figure 7, above-mentioned multiple guide protrusion 14 can be formed from the outer peripheral face of above-mentioned support 10 is outstanding laterally, or can be positioned at the outer peripheral face inside than support 10.
Such as, as shown in Figure 8, above-mentioned support 10 is formed with the multiple guide grooves 15 caved in the inside centered by central part at outer peripheral face, and above-mentioned multiple guide protrusion 15 can upwards bend from the inner peripheral surface forming above-mentioned multiple guide groove 15 respectively or bend.
Wherein, above-mentioned multiple guide groove 15 can be understood to make the easily upwards bending or bending of above-mentioned multiple guide protrusion 14, on the other hand, when when the above-mentioned thin film switch 1 of the surface encapsulation of above-mentioned printed circuit board (PCB) 100, the applicable area of soldering can be made to increase.
In the thin film switch 1 formed in the above-described manner, when packing the product, prevent the edge of above-mentioned film 30 from contacting with above-mentioned packaging cover 200 by above-mentioned spacer portion 12.
Thus, above-mentioned thin film switch 1 can prevent when packing the product of above-mentioned thin film switch 1, is attached to the phenomenon of product because above-mentioned packaging cover 200 contacts with the residue 35 of above-mentioned tack coat 34 at the edge remaining in above-mentioned film 30.
Fig. 9 is the flow chart of the manufacture method that thin film switch of the present invention is shown.
With reference to Fig. 9, the manufacture method of thin film switch of the present invention comprises: support and elastic film punch process step (S1), carries out punch process to manufacture above-mentioned support 10 and above-mentioned elastic film 20 to raw material; And dome adhesion step (S2), with above-mentioned film 30, above-mentioned support 10 manufactured in above-mentioned support and elastic film punch process step (S1) and above-mentioned elastic film 20 are bondd.
Wherein, more preferably, material is understood to the metallic plates such as metal.
Thus, as shown in Figure 9, above-mentioned thin film switch 1 can manufacture by means of only support and elastic film punch process step (S1) and dome adhesion step (S2), thus the productivity ratio of the simplification based on manufacturing process can be improved, and reduce cost, in above-mentioned support and elastic film punch process step (S1), punch process is carried out to manufacture above-mentioned support 10 and above-mentioned elastic film 20 to metal etc., in above-mentioned dome adhesion step (S2), with above-mentioned film 30, above-mentioned support 10 manufactured in above-mentioned support and elastic film punch process step (S1) and above-mentioned elastic film 20 are bondd.
In addition, above-mentioned thin film switch 1 is only provided with above-mentioned support 10 between above-mentioned printed circuit board (PCB) 100 and above-mentioned elastic film 20, and above-mentioned support 10 manufactures slim by punch process, thus entirety can manufacture ultrathin type.
Furtherly, even if above-mentioned thin film switch 1 is packaged with multiple at above-mentioned printed circuit board (PCB) 100, because above-mentioned film 30 is individually attached to each thin film switch 1, thus easily maintenance and replacing.
Referring to figs. 1 through Fig. 9, process thin film switch of the present invention being arranged to printed circuit board (PCB) is described in detail, and in above-mentioned thin film switch 1, above-mentioned elastic film 20 is positioned at the above-mentioned hollow bulb 11 being formed in above-mentioned support 10.
If above-mentioned elastic film 20 is positioned at above-mentioned hollow bulb 11, then adhere to above-mentioned film 30 on the top of above-mentioned elastic film 20, thus stably arrange when not departing from from above-mentioned support 10.Wherein, the binding sequence of above-mentioned support 10, above-mentioned elastic film 20 and above-mentioned film 30 is not limited to aforesaid way, can combine with the order of other forms.
In the thin film switch 1 formed in the above-described manner, when being packaged in above-mentioned printed circuit board (PCB) 100, above-mentioned support 10 contacts with above-mentioned fixed contact 110, under the state being positioned at the bottom of above-mentioned elastic film 20 at above-mentioned make and break contact 120, outer periphery due to above-mentioned support 10 is integral braze-welded in above-mentioned fixed contact 110, and thus the liquid such as anti-sealing flows in inside from outside.
In addition, in above-mentioned thin film switch 1, if pressurize downwards to above-mentioned protuberance 21, then by institute's applied pressure, above-mentioned protuberance 21 is introduced above-mentioned hollow bulb 11 and contacts with above-mentioned make and break contact 120, and is in connection (ON) state.
In contrast, in above-mentioned elastic film 20, if carry out decompress(ion) to above-mentioned protuberance 21, then above-mentioned protuberance 21 restores to the original state, and separates with above-mentioned make and break contact 120, thus is in disconnection (OFF) state.
Thus, above-mentioned thin film switch 1 obtains switching signal by the reversion action of above-mentioned elastic film 20.
In addition, above-mentioned thin film switch 1 can when packaging product, by above-mentioned spacer portion 12, prevent the edge of above-mentioned film 30 from contacting with above-mentioned packaging cover 200, and prevent the residue 35 of the above-mentioned tack coat 34 at the edge because remaining in above-mentioned film 30 from contacting with above-mentioned packaging cover 200 and being attached to the phenomenon of product.
The embodiment only belonged to for implementing thin film switch of the present invention and manufacture method thereof is more than described; the present invention is not limited to above-described embodiment; in the claimed scope of invention as following ask, as long as general technical staff of the technical field of the invention all has technical spirit of the present invention till just can carrying out the scope of numerous variations enforcement when not departing from main idea of the present invention.
The explanation of Reference numeral
1: thin film switch 10: support
11: hollow bulb 12: spacer portion
13: lead ring 14: guide protrusion
15: guide groove 20: elastic film
21: protuberance 22: support portion
30: film 34: tack coat
35: residue 40: encapsulated space
100: printed circuit board (PCB) 110: fixed contact
120: make and break contact 130: contact portion
200: packaging cover
Claims (9)
1. a thin film switch, be packaged in the surface of the printed circuit board (PCB) of the make and break contact of the inner side being provided with fixed contact and being positioned at above-mentioned fixed contact, above-mentioned thin film switch is packed by independent packaging cover, and the feature of above-mentioned thin film switch is, comprising:
Annular support, is provided with hollow bulb, and above-mentioned support is positioned at the outside of above-mentioned fixed contact, and is fixed on above-mentioned printed circuit board (PCB);
Elastic film, is positioned at above-mentioned hollow bulb, and above-mentioned elastic film is provided with the protuberance projected upwards, and is connected with above-mentioned fixed contact; And
Film, is positioned at the top of above-mentioned elastic film, and above-mentioned film, for connecting above-mentioned support and above-mentioned elastic film, carries out airtight to above-mentioned hollow bulb,
Above-mentioned elastic film is according to pressurize to above-mentioned protuberance or decompress(ion) contacts with above-mentioned make and break contact or removes and contacts.
2. thin film switch according to claim 1, is characterized in that, above-mentioned support is polygon or circle.
3. thin film switch according to claim 1, is characterized in that, above-mentioned elastic film also comprises support portion, and the bottom of above-mentioned support portion contacts with above-mentioned fixed contact, and the top of above-mentioned support portion is connected with above-mentioned protuberance.
4. thin film switch according to claim 1, is characterized in that, the bottom surfaces of above-mentioned support and the lower edge of above-mentioned elastic film in the same plane.
5. thin film switch according to claim 1, is characterized in that, above-mentioned support is provided with the spacer portion extended to form from lateral,
Above-mentioned spacer portion is for making the spaced from edges of above-mentioned packaging cover and above-mentioned film to prevent above-mentioned bag
Capping contacts with above-mentioned film, and guides the above-mentioned film being positioned over above-mentioned support.
6. thin film switch according to claim 1, is characterized in that, the lead ring that above-mentioned spacer portion is upwards extended to form by the outer peripheral face from above-mentioned support or multiple guide protrusion are formed.
7. thin film switch according to claim 6, is characterized in that, above-mentioned support is formed to inward side to multiple guide grooves of depression at outer peripheral face centered by central part,
Above-mentioned multiple guide protrusion respectively from formed above-mentioned multiple guide groove above-mentioned support medial surface to
On extend to form.
8. thin film switch according to claim 1, is characterized in that, around the lower outside of above-mentioned support, entirety is fixed in above-mentioned printed circuit board (PCB) by soldering.
9. a manufacture method for thin film switch, it is for the manufacture of the thin film switch according to any one of claim 1 to 8, and the feature of the manufacture method of above-mentioned thin film switch is, comprising:
Support and elastic film punch process step, carry out punch process to manufacture above-mentioned support and above-mentioned elastic film to raw material; And
Film adhesion step, bonds to above-mentioned support manufactured in above-mentioned support and elastic film punch process step and above-mentioned elastic film with above-mentioned film.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0131167 | 2012-11-19 | ||
| KR1020120131167A KR101361306B1 (en) | 2012-11-19 | 2012-11-19 | Dome switch and manufacturing method |
| KR1020130052438A KR101400622B1 (en) | 2013-05-09 | 2013-05-09 | Dome switch |
| KR10-2013-0052438 | 2013-05-09 | ||
| PCT/KR2013/007651 WO2014077496A1 (en) | 2012-11-19 | 2013-08-27 | Dome switch and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104871278A true CN104871278A (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380060344.5A Pending CN104871278A (en) | 2012-11-19 | 2013-08-27 | Dome switch and method for manufacturing same |
Country Status (2)
| Country | Link |
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| CN (1) | CN104871278A (en) |
| WO (1) | WO2014077496A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110825162B (en) * | 2018-08-14 | 2022-07-01 | 致伸科技股份有限公司 | Surface-mounted switch, touch pad module with surface-mounted switch and electronic computer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1318853A (en) * | 2000-04-18 | 2001-10-24 | 阿尔卑斯电气株式会社 | Push-button switch |
| KR20050106773A (en) * | 2004-05-06 | 2005-11-11 | 주식회사 디스텍 | Doom swich sturcture for electronic equipment key pad |
| CN200986874Y (en) * | 2006-11-21 | 2007-12-05 | 富士康(昆山)电脑接插件有限公司 | Push-button switch |
| KR20080018449A (en) * | 2006-08-24 | 2008-02-28 | 이수호 | Printed circuit board tact switch |
| JP2008269829A (en) * | 2007-04-17 | 2008-11-06 | Matsushita Electric Ind Co Ltd | Push switch |
| KR20110021210A (en) * | 2009-08-25 | 2011-03-04 | 주식회사 포콘스 | Dome switch and manufacturing method thereof |
-
2013
- 2013-08-27 CN CN201380060344.5A patent/CN104871278A/en active Pending
- 2013-08-27 WO PCT/KR2013/007651 patent/WO2014077496A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1318853A (en) * | 2000-04-18 | 2001-10-24 | 阿尔卑斯电气株式会社 | Push-button switch |
| KR20050106773A (en) * | 2004-05-06 | 2005-11-11 | 주식회사 디스텍 | Doom swich sturcture for electronic equipment key pad |
| KR20080018449A (en) * | 2006-08-24 | 2008-02-28 | 이수호 | Printed circuit board tact switch |
| CN200986874Y (en) * | 2006-11-21 | 2007-12-05 | 富士康(昆山)电脑接插件有限公司 | Push-button switch |
| JP2008269829A (en) * | 2007-04-17 | 2008-11-06 | Matsushita Electric Ind Co Ltd | Push switch |
| KR20110021210A (en) * | 2009-08-25 | 2011-03-04 | 주식회사 포콘스 | Dome switch and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014077496A1 (en) | 2014-05-22 |
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