JP2594914Y2 - Push switch - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a push switch used for a contact portion of an operation panel or a keyboard.

[0002]

2. Description of the Related Art Conventionally, a push switch used individually as a single unit is provided with an electrode 10 in an insulating resin such as PBT by insert molding as shown in FIG.
A tact plate 14 whose surface is slightly curved in a spherical shape is accommodated in the case 12, and the upper surface opening of the case 12 is covered with a polyimide sheet 16 and further covered with a metal plate 18 such as SUS. ing.

[0003]

The push switch of the prior art described above accommodates the tact plate 14 in a case 12 formed by insert molding and covers the opening with a metal plate 18 or the like. Due to the accuracy of the molding die, there is a limit to reducing the shape, which hinders the miniaturization of electronic devices. Furthermore, the shapes of the electrode 10 and the case 12 are complicated, and molding is difficult, and the adhesion between the molding resin and the electrode 10 is poor, and there is a problem in strength.

The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a push switch which has a simple structure and is formed thin.

[0005]

According to the present invention, a conductor portion is formed on an insulating substrate, a tact plate for forming a contact is placed, and a heat-resistant film is directly applied to the insulating substrate and the tact plate via an adhesive layer. This is a push switch provided with a pair of electrodes formed by semi-cylindrical through holes connected to the conductor on the end surface of the substrate, which are fixed to each other and fixed to each other. Furthermore, a conductor portion connected to the pair of electrodes is formed on the surface of the substrate, and a portion of the conductor portion that contacts the tact plate is provided with an insulating resin.

The present invention also provides a single push switch having a conductor portion formed on an insulating substrate, and a contact plate forming a contact, which is placed in contact with the conductor portion and placed thereon, and having substantially the same size as the tact plate. In this, a heat-resistant film is directly adhered to the substrate and the tact plate via an adhesive layer and fixed to each other, and a through hole is formed below a central portion of the tact plate, and connected to the through hole and one of the substrates is connected. This is a push switch in which a conductor portion connected to a pair of electrodes formed on an end surface is provided on the back surface of the substrate. further,
On the back surface of the substrate, there is provided a conductor portion connected from the through hole at the central portion to one of a pair of electrodes formed on the end surface.

[0007]

The push switch of the present invention is formed only by the thickness of the substrate, the tact plate and the heat-resistant film.
It has a simple structure and is thin and has good strength and durability.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. A conductor portion 22 is formed of copper foil in an arc shape on the surface of an insulating substrate 20 such as an epoxy copper foil-clad laminate, and the conductor portion 22 has a spherical surface. The peripheral edge of a tact plate 24 made of a metal spring plate having a curved shape and a bulged central portion is in contact with the tact plate 24. Further, a contact 26 formed of a part of the copper foil pattern is formed at the center of the substrate 20, and a conductor 28 of the copper foil extends from the contact 26 to the edge of the substrate 20. The surface of the conductor 28 is coated with an insulating resin such as a resist (not shown) so as not to short-circuit with the tact plate 24. At one edge of the substrate 20, end electrodes 30 and 32 formed by dividing a through hole provided with copper foil or conductive paint on the surface are formed, and the end electrodes 30 and 32 are respectively provided with conductors 22, 26
Are connected.

The substrate 20 on which the tact plate 24 is placed is covered with a heat-resistant film 36 such as a polyimide resin having an adhesive layer 34 of a heat-resistant adhesive. It is fixed so as to be able to come into contact with the contact 26 with the substrate 20.

According to the push switch of this embodiment,
The tact plate 24 is formed with a heat-resistant film 36 via an adhesive layer 34.
, The structure is simple, the thickness is extremely thin, and it can withstand the heat of the molten solder, so that it can be easily mounted on a circuit board. Also, the electrodes 30 and 32 can be easily formed, and the number of manufacturing steps and cost can be reduced. Further, a small tact plate having a diameter of 3φ can be used, and a chip having a chip size of 2.5 × 3 mm and a thickness of 0.3 can be used.

Next, a second embodiment of the present invention will be described with reference to FIG. The push switch of this embodiment is
A through hole 38 made of copper foil is formed in the contact 26 formed on the surface of the substrate 20, and a conductor 39 on the back side of the through hole 38 is connected to one electrode. The through hole 38 is closed by a resin 40 and is formed so that solder, dust and the like do not enter the tact plate 24. Others are formed similarly to the first embodiment.

According to this embodiment, the conductor portion connected to one of the electrodes is provided on the back surface of the substrate 20.
No resist or the like for preventing contact with the electrode is required, and the position of the electrode can be freely set. Further, by using the electrode in the peripheral portion of the through hole 38, more other electronic components can be arranged around the push switch, and the mounting density can be increased.

Next, a third embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. The push switch of this embodiment has a configuration similar to that of the push switch of FIG. 2, and the through hole 42 is formed of a conductive paint such as a silver paint. Then, the contact 44 made of copper foil is connected to the through hole 42.
Are formed around the center of the tact plate 46, and the through holes 4
8 are formed. The through hole 48 is formed such that the peripheral edge of the through hole 48 does not contact the conductive paint of the through hole 42 but contacts the copper foil contact point 44. The through hole 42 must be closed inside and have a dustproof effect. Other configurations are the same as those of the above-described second embodiment.

According to this embodiment, it is easy to form the through-hole 42, and the tact plate 46 does not come into contact with the conductive paint but comes into contact with the copper foil contact point 44, so that the durability is high. Further, since the periphery of the through hole 48 of the tact plate 46 contacts the copper foil contact 44, the contact portion is wide and the operation is stable.

The present invention may be applied to any single push switch as long as the tact plate is placed on the substrate and the tact plate and the substrate are covered with a heat-resistant film via an adhesive layer. Besides, the electrode structure and the shape of the tact plate can be appropriately selected. The adhesive layer only needs to have heat resistance, and its material and thickness can be appropriately set.

[0016]

[Effect of the Invention] The push switch of the present invention has a tact plate mounted on a substrate, covered with a heat-resistant film having an adhesive layer, and fixed to the tact plate, so that the structure is simple as a single push switch. The overall thickness is extremely thin, which greatly contributes to the thinning of electronic devices. Moreover, since the heat-resistant film is adhered by the heat-resistant adhesive layer, the heat-resistant film can withstand the heat of the molten solder. Further, the structure is simple, the reliability is high, and the strength is strong.
In addition, the substrate can be arbitrarily selected according to the purpose without depending on the type of the substrate.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a push switch according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a push switch according to a second embodiment of the present invention.

FIG. 3 is a perspective view of a substrate of a push switch according to a third embodiment of the present invention.

FIG. 4 is a front view of a tact plate of the push switch according to the third embodiment.

FIG. 5 is a longitudinal sectional view of a conventional push switch.

[Explanation of symbols]

 Reference Signs List 20 substrate 22, 28 conductor 24, 46 tact plate 30, 32 electrode 34 adhesive layer 36 heat-resistant film

Continuation of the front page (72) Inventor Yozo Ohara 3158 Shimookubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd. (56) References (JP, A) JP-A-63-202810 (JP, A) JP-A-3-84525 (JP, U) JP-A-57-136134 (JP, U) JP-A-59-91636 (JP, U) Kaisho 61-53832 (JP, U)

Claims (4)

(57) [Scope of request for utility model registration] 1. A insulating substrate to form a pair of conductor portions, substantially the tact plate and similar sized single push a single tact plate was placed in contact with one of the conductor portion forming the contact In the switch, a heat-resistant film is directly adhered to the substrate and the tact plate via an adhesive layer and fixed to each other, and a pair of electrodes formed by through holes connected to the conductors are provided on one end surface of the substrate. This
The conductors are connected to a pair of electrodes, respectively, and the tact plate is
Is opposed to the other of the pair of conductors in an insulated state and is pressed.
A push switch characterized by being provided so that it can be contacted more . 2. The substrate is formed in a rectangular shape, and a pair of conductors connected to the pair of electrodes is formed on a surface thereof, and the other conductor of the pair of conductors is
2. The push switch according to claim 1, wherein a portion where the peripheral portion of the tact plate is placed is covered with an insulating resin. 3. A pair of conductor portions are formed on an insulating substrate, and one tact plate forming a contact is placed in contact with one of the conductor portions and placed, and a single tact plate having substantially the same size as the tact plate is placed. in the push switch, the substrate and the tact plate via the adhesive layer fixed to one another is adhered directly heat-resistant film, forming a through hole in the substrate of the central portion below the tact plate, the surrounding of the through hole Inside tact plate
Provide a contact that can be contacted at the center, and attach it to one end face of the substrate
A pair of electrodes is formed, and one of the pair of electrodes is
And the other of the pair of conductors is connected to the base
Provided on the back of the plate and connected to the other of the pair of electrodes
A push switch connected to the above through hole . 4. The substrate is formed in a rectangular shape, and its surface is
One of the pair of conductors is formed on the back of the substrate.
From the through hole at the center to the end face of the board
The push switch according to claim 3, further comprising a conductor connected to one of the formed pair of electrodes .