JP2594914Y2 - Push switch - Google Patents
Push switchInfo
- Publication number
- JP2594914Y2 JP2594914Y2 JP1991080327U JP8032791U JP2594914Y2 JP 2594914 Y2 JP2594914 Y2 JP 2594914Y2 JP 1991080327 U JP1991080327 U JP 1991080327U JP 8032791 U JP8032791 U JP 8032791U JP 2594914 Y2 JP2594914 Y2 JP 2594914Y2
- Authority
- JP
- Japan
- Prior art keywords
- pair
- substrate
- tact plate
- electrodes
- push switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【0001】[0001]
【産業上の利用分野】この考案は、操作パネルやキーボ
ード等の接点部に用いられるプッシュスイッチに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a push switch used for a contact portion of an operation panel or a keyboard.
【0002】[0002]
【従来の技術】従来、個別に単体で用いられるプッシュ
スイッチは、図5に示すように、PBT等の絶縁樹脂中
に電極10をインサート成形により設けて、ケース12
を形成し、このケース12内に表面が球面状に僅かに湾
曲したタクト板14を収納し、ケース12の上面開口部
をポリイミドシート16により覆い、さらにSUS等の
金属板18で覆って形成されている。2. Description of the Related Art Conventionally, a push switch used individually as a single unit is provided with an electrode 10 in an insulating resin such as PBT by insert molding as shown in FIG.
A tact plate 14 whose surface is slightly curved in a spherical shape is accommodated in the case 12, and the upper surface opening of the case 12 is covered with a polyimide sheet 16 and further covered with a metal plate 18 such as SUS. ing.
【0003】[0003]
【考案が解決しようとする課題】上記従来の技術のプッ
シュスイッチは、インサート成形により形成したケース
12内にタクト板14を収納して、金属板18等で開口
部を覆っているので、強度や成形型の精度上、形状を小
さくすることには限界があり、電子機器の小型薄型化の
妨げになっていた。さらに、電極10とケース12の形
状が複雑になり成形が難しく、成形樹脂と電極10との
密着性が悪く、強度的に問題があった。The push switch of the prior art described above accommodates the tact plate 14 in a case 12 formed by insert molding and covers the opening with a metal plate 18 or the like. Due to the accuracy of the molding die, there is a limit to reducing the shape, which hinders the miniaturization of electronic devices. Furthermore, the shapes of the electrode 10 and the case 12 are complicated, and molding is difficult, and the adhesion between the molding resin and the electrode 10 is poor, and there is a problem in strength.
【0004】この考案は上記従来の技術の問題点に鑑み
てなされたもので、構造が簡単で、薄く形成されたプッ
シュスイッチを提供することを目的とする。The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a push switch which has a simple structure and is formed thin.
【0005】[0005]
【課題を解決するための手段】この考案は、絶縁基板に
導体部を形成し、接点を形成するタクト板を載置し、こ
の絶縁基板及びタクト板に粘着層を介して耐熱性フィル
ムを直接密着させ互いに固定し、上記基板の端面に上記
導体部と接続した半円筒状のスルーホールにより形成さ
れた一対の電極を設けたプッシュスイッチである。さら
に、上記基板表面に、上記一対の電極と接続する導体部
が形成され、この導体部の上記タクト板と接触する個所
は、絶縁樹脂が設けられたものである。According to the present invention, a conductor portion is formed on an insulating substrate, a tact plate for forming a contact is placed, and a heat-resistant film is directly applied to the insulating substrate and the tact plate via an adhesive layer. This is a push switch provided with a pair of electrodes formed by semi-cylindrical through holes connected to the conductor on the end surface of the substrate, which are fixed to each other and fixed to each other. Furthermore, a conductor portion connected to the pair of electrodes is formed on the surface of the substrate, and a portion of the conductor portion that contacts the tact plate is provided with an insulating resin.
【0006】またこの考案は、絶縁基板に導体部を形成
し、接点を形成する一つのタクト板をこの導体部に接触
させて載置しほぼ上記タクト板と同様の大きさの単体の
プッシュスイッチにおいて、この基板及びタクト板に粘
着層を介して直接耐熱性フィルムを密着させ互いに固定
し、上記タクト板の中央部下方にスルーホールを形成
し、このスルーホールに接続するとともに上記基板の一
の端面に形成された一対の電極に接続する導体部を上記
基板の裏面に設けたプッシュスイッチである。さらに、
上記基板の裏面には、上記中央部のスルーホールから上
記端面に形成された一対の電極の一方に接続した導体部
を設けたものである。The present invention also provides a single push switch having a conductor portion formed on an insulating substrate, and a contact plate forming a contact, which is placed in contact with the conductor portion and placed thereon, and having substantially the same size as the tact plate. In this, a heat-resistant film is directly adhered to the substrate and the tact plate via an adhesive layer and fixed to each other, and a through hole is formed below a central portion of the tact plate, and connected to the through hole and one of the substrates is connected. This is a push switch in which a conductor portion connected to a pair of electrodes formed on an end surface is provided on the back surface of the substrate. further,
On the back surface of the substrate, there is provided a conductor portion connected from the through hole at the central portion to one of a pair of electrodes formed on the end surface.
【0007】[0007]
【作用】この考案のプッシュスイッチは、厚さが基板と
タクト板及び耐熱性フィルムの厚み分のみで形成され、
簡単な構造で薄く強度及び耐久性が良いものである。The push switch of the present invention is formed only by the thickness of the substrate, the tact plate and the heat-resistant film.
It has a simple structure and is thin and has good strength and durability.
【0008】[0008]
【実施例】以下この考案の実施例について図面に基づい
て説明する。図1はこの考案の第一実施例を示すもの
で、エポキシ銅箔張り積層板等の絶縁基板20の表面
に、円弧状に銅箔で導体部22が形成され、この導体部
22に、球面状に湾曲し中央部が膨らんだ金属ばね板製
のタクト板24の周縁部が接する。さらに、基板20の
中央部には、銅箔パターンの一部からなる接点26が形
成され、接点26から銅箔の導体部28が、基板20の
端縁部に延出している。この導体部28の表面には、タ
クト板24とショートしないように、図示しないレジス
ト等の絶縁樹脂が被覆されている。基板20の一端縁部
には、銅箔または導電塗料が表面に設けられたスルーホ
ールを分割して形成された端面電極30,32が形成さ
れ、端面電極30,32にはそれぞれ導体部22,26
の先端部が接続している。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. A conductor portion 22 is formed of copper foil in an arc shape on the surface of an insulating substrate 20 such as an epoxy copper foil-clad laminate, and the conductor portion 22 has a spherical surface. The peripheral edge of a tact plate 24 made of a metal spring plate having a curved shape and a bulged central portion is in contact with the tact plate 24. Further, a contact 26 formed of a part of the copper foil pattern is formed at the center of the substrate 20, and a conductor 28 of the copper foil extends from the contact 26 to the edge of the substrate 20. The surface of the conductor 28 is coated with an insulating resin such as a resist (not shown) so as not to short-circuit with the tact plate 24. At one edge of the substrate 20, end electrodes 30 and 32 formed by dividing a through hole provided with copper foil or conductive paint on the surface are formed, and the end electrodes 30 and 32 are respectively provided with conductors 22, 26
Are connected.
【0009】タクト板24が載置された基板20は、耐
熱性粘着剤の粘着層34を有したポリイミド樹脂等の耐
熱性フィルム36で覆われており、タクト板24はこの
耐熱性フィルム36と基板20との間で接点26と接触
可能に固定されている。The substrate 20 on which the tact plate 24 is placed is covered with a heat-resistant film 36 such as a polyimide resin having an adhesive layer 34 of a heat-resistant adhesive. It is fixed so as to be able to come into contact with the contact 26 with the substrate 20.
【0010】この実施例のプッシュスイッチによれば、
粘着層34を介して耐熱性フィルム36でタクト板24
を覆い固定したので、構造が簡単であり、厚さが極めて
薄く、しかも、溶融はんだの熱に対しても耐え得るの
で、回路基板への実装が容易に行なうことができる。ま
た、電極30,32も簡単に形成することができ、製造
工数及びコストも削減することができる。さらに、大き
さもタクト板を3φの小型のものを使用でき、チップサ
イズも2.5×3mmで厚さが0.3のものも可能であ
る。According to the push switch of this embodiment,
The tact plate 24 is formed with a heat-resistant film 36 via an adhesive layer 34.
, The structure is simple, the thickness is extremely thin, and it can withstand the heat of the molten solder, so that it can be easily mounted on a circuit board. Also, the electrodes 30 and 32 can be easily formed, and the number of manufacturing steps and cost can be reduced. Further, a small tact plate having a diameter of 3φ can be used, and a chip having a chip size of 2.5 × 3 mm and a thickness of 0.3 can be used.
【0011】次にこの考案の第二実施例について図2を
基にして説明する。この実施例のプッシュスイッチは、
基板20の表面に形成された接点26に、銅箔によるス
ルーホール38が形成され、このスルーホール38の裏
面側の導体部39が一方の電極に接続しているものであ
る。スルーホール38は樹脂40によって塞がれ、はん
だやほこり等がタクト板24の方に侵入しないように形
成されている。その他は第一実施例と同様に形成されて
いる。Next, a second embodiment of the present invention will be described with reference to FIG. The push switch of this embodiment is
A through hole 38 made of copper foil is formed in the contact 26 formed on the surface of the substrate 20, and a conductor 39 on the back side of the through hole 38 is connected to one electrode. The through hole 38 is closed by a resin 40 and is formed so that solder, dust and the like do not enter the tact plate 24. Others are formed similarly to the first embodiment.
【0012】この実施例によれば、電極の一方に接続し
た導体部を基板20の裏面に設けるので、タクト板24
との接触を防止するためのレジスト等が不要であり、電
極の位置も自由に取ることができる。さらに、スルーホ
ール38の周辺部を電極にすることにより、このプッシ
ュスイッチの周囲に他の電子部品をより多く配置するこ
とができ、実装密度を上げることができる。According to this embodiment, the conductor portion connected to one of the electrodes is provided on the back surface of the substrate 20.
No resist or the like for preventing contact with the electrode is required, and the position of the electrode can be freely set. Further, by using the electrode in the peripheral portion of the through hole 38, more other electronic components can be arranged around the push switch, and the mounting density can be increased.
【0013】次にこの考案の第三実施例について図3,
図4を基にして説明する。この実施例のプッシュスイッ
チは、図2のプッシュスイッチと同様の構成で、スルー
ホール42が銀塗料等の導電塗料により形成されてい
る。そして、銅箔による接点44が、スルーホール42
の周囲に形成され、タクト板46の中央部には、透孔4
8が形成されている。透孔48は、スルーホール42の
導電塗料には接触せず、銅箔の接点44に透孔48の周
縁部が接触するように形成されている。このスルーホー
ル42は、内部で塞がれ、防塵効果を有するものでなけ
ればならない。その他の構成は、上述の第二実施例と同
様である。Next, a third embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. The push switch of this embodiment has a configuration similar to that of the push switch of FIG. 2, and the through hole 42 is formed of a conductive paint such as a silver paint. Then, the contact 44 made of copper foil is connected to the through hole 42.
Are formed around the center of the tact plate 46, and the through holes 4
8 are formed. The through hole 48 is formed such that the peripheral edge of the through hole 48 does not contact the conductive paint of the through hole 42 but contacts the copper foil contact point 44. The through hole 42 must be closed inside and have a dustproof effect. Other configurations are the same as those of the above-described second embodiment.
【0014】この実施例によれば、スルーホール42の
形成が容易であり、タクト板46が導電塗料には接触せ
ず銅箔の接点44に接触するので耐久性も高い。さら
に、タクト板46の透孔48の周縁部が銅箔接点44に
接触するので、接触部が広く動作が安定なものになる。According to this embodiment, it is easy to form the through-hole 42, and the tact plate 46 does not come into contact with the conductive paint but comes into contact with the copper foil contact point 44, so that the durability is high. Further, since the periphery of the through hole 48 of the tact plate 46 contacts the copper foil contact 44, the contact portion is wide and the operation is stable.
【0015】尚、この考案は、単体のプッシュスイッチ
において、基板にタクト板を載置し、粘着層を介して耐
熱性フィルムで上記タクト板及び基板を覆ったものであ
れば良く、上記実施例以外に、電極構造やタクト板の形
状は、適宜選択できるものである。また、粘着層は、耐
熱性があれば良く、その材質や厚さも適宜設定しうるも
のである。The present invention may be applied to any single push switch as long as the tact plate is placed on the substrate and the tact plate and the substrate are covered with a heat-resistant film via an adhesive layer. Besides, the electrode structure and the shape of the tact plate can be appropriately selected. The adhesive layer only needs to have heat resistance, and its material and thickness can be appropriately set.
【0016】[0016]
【考案の効果】この考案のプッシュスイッチは、基板に
タクト板を載せ、接着層を有した耐熱性フィルムで覆
い、タクト板の固定を行なったので、単体のプッシュス
イッチとして構造が簡単であり、全体の厚さが極めて薄
く、電子機器の薄型化に大きく寄与する。しかも、耐熱
性の粘着層で耐熱性フィルムを接着しているので、溶融
はんだの熱にも耐え得るものであり、実装作業の自由度
が高く効率的に行なうことができる。さらに、構造が簡
単であり、信頼性も高く、強度的にも強いものである。
また、基板の種類を選ばず、用途にあわせて任意に基板
を選択できるものである。[Effect of the Invention] The push switch of the present invention has a tact plate mounted on a substrate, covered with a heat-resistant film having an adhesive layer, and fixed to the tact plate, so that the structure is simple as a single push switch. The overall thickness is extremely thin, which greatly contributes to the thinning of electronic devices. Moreover, since the heat-resistant film is adhered by the heat-resistant adhesive layer, the heat-resistant film can withstand the heat of the molten solder. Further, the structure is simple, the reliability is high, and the strength is strong.
In addition, the substrate can be arbitrarily selected according to the purpose without depending on the type of the substrate.
【図1】この考案の第一実施例のプッシュスイッチの分
解斜視図である。FIG. 1 is an exploded perspective view of a push switch according to a first embodiment of the present invention.
【図2】この考案の第二実施例のプッシュスイッチの縦
断面図である。FIG. 2 is a longitudinal sectional view of a push switch according to a second embodiment of the present invention.
【図3】この考案の第三実施例のプッシュスイッチの基
板の斜視図である。FIG. 3 is a perspective view of a substrate of a push switch according to a third embodiment of the present invention.
【図4】この第三実施例のプッシュスイッチのタクト板
の正面図である。FIG. 4 is a front view of a tact plate of the push switch according to the third embodiment.
【図5】従来の技術のプッシュスイッチの縦断面図であ
る。FIG. 5 is a longitudinal sectional view of a conventional push switch.
20 基板 22,28 導体部 24,46 タクト板 30,32 電極 34 粘着層 36 耐熱性フィルム Reference Signs List 20 substrate 22, 28 conductor 24, 46 tact plate 30, 32 electrode 34 adhesive layer 36 heat-resistant film
フロントページの続き (72)考案者 小原 陽三 富山県上新川郡大沢野町下大久保3158番 地 北陸電気工業株式会社内 (56)参考文献 特開 昭61−179019(JP,A) 特開 昭61−82625(JP,A) 特開 昭63−202810(JP,A) 実開 平3−84525(JP,U) 実開 昭57−136134(JP,U) 実開 昭59−91636(JP,U) 実開 昭61−53832(JP,U)Continuation of the front page (72) Inventor Yozo Ohara 3158 Shimookubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd. (56) References (JP, A) JP-A-63-202810 (JP, A) JP-A-3-84525 (JP, U) JP-A-57-136134 (JP, U) JP-A-59-91636 (JP, U) Kaisho 61-53832 (JP, U)
Claims (4)
を形成する一つのタクト板をこの導体部の一方に接触さ
せて載置したほぼ上記タクト板と同様の大きさの単体の
プッシュスイッチにおいて、この基板及びタクト板に粘
着層を介して直接耐熱性フィルムを密着させ互いに固定
し、上記基板の一つの端面に上記導体部と各々接続した
スルーホールにより形成された一対の電極を設け、この
一対の電極に上記導体部が各々接続し、上記タクト板
は、上記一対の導体部の他方と絶縁状態で対向し押圧に
より接触可能に設けられていることを特徴とするプッシ
ュスイッチ。1. A insulating substrate to form a pair of conductor portions, substantially the tact plate and similar sized single push a single tact plate was placed in contact with one of the conductor portion forming the contact In the switch, a heat-resistant film is directly adhered to the substrate and the tact plate via an adhesive layer and fixed to each other, and a pair of electrodes formed by through holes connected to the conductors are provided on one end surface of the substrate. This
The conductors are connected to a pair of electrodes, respectively, and the tact plate is
Is opposed to the other of the pair of conductors in an insulated state and is pressed.
A push switch characterized by being provided so that it can be contacted more .
に、上記一対の電極と接続する一対の導体部が形成さ
れ、この一対の導体部のうちの上記他方の導体部は、上
記タクト板の周縁部が載置される個所が絶縁樹脂で被覆
された請求項1記載のプッシュスイッチ。2. The substrate is formed in a rectangular shape, and a pair of conductors connected to the pair of electrodes is formed on a surface thereof, and the other conductor of the pair of conductors is
2. The push switch according to claim 1, wherein a portion where the peripheral portion of the tact plate is placed is covered with an insulating resin.
を形成する一つのタクト板をこの導体部の一方に接触さ
せて載置し、ほぼ上記タクト板と同様の大きさの単体の
プッシュスイッチにおいて、この基板及びタクト板に粘
着層を介して直接耐熱性フィルムを密着させ互いに固定
し、上記タクト板の中央部下方の上記基板にスルーホー
ルを形成し、このスルーホールの周囲に上記タクト板中
央部が接触可能な接点を設け、上記基板の一つの端面に
一対の電極を形成し、上記一対の電極の一方を上記一方
の導体部に接続し、上記一対の導体部の他方を、上記基
板の裏面に設けて上記一対の電極の他方と接続するとと
もに、上記スルーホールと接続したプッシュスイッチ。3. A pair of conductor portions are formed on an insulating substrate, and one tact plate forming a contact is placed in contact with one of the conductor portions and placed, and a single tact plate having substantially the same size as the tact plate is placed. in the push switch, the substrate and the tact plate via the adhesive layer fixed to one another is adhered directly heat-resistant film, forming a through hole in the substrate of the central portion below the tact plate, the surrounding of the through hole Inside tact plate
Provide a contact that can be contacted at the center, and attach it to one end face of the substrate
A pair of electrodes is formed, and one of the pair of electrodes is
And the other of the pair of conductors is connected to the base
Provided on the back of the plate and connected to the other of the pair of electrodes
A push switch connected to the above through hole .
には上記一対の導体部の一方が形成され、上記基板の裏
面に、上記中央部のスルーホールから上記基板の端面に
形成された一対の電極の一方に接続した導体部を設けた
請求項3記載のプッシュスイッチ。4. The substrate is formed in a rectangular shape, and its surface is
One of the pair of conductors is formed on the back of the substrate.
From the through hole at the center to the end face of the board
The push switch according to claim 3, further comprising a conductor connected to one of the formed pair of electrodes .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1991080327U JP2594914Y2 (en) | 1991-09-06 | 1991-09-06 | Push switch |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1991080327U JP2594914Y2 (en) | 1991-09-06 | 1991-09-06 | Push switch |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0523367U JPH0523367U (en) | 1993-03-26 |
JP2594914Y2 true JP2594914Y2 (en) | 1999-05-24 |
Family
ID=13715166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1991080327U Expired - Lifetime JP2594914Y2 (en) | 1991-09-06 | 1991-09-06 | Push switch |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2594914Y2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0825258B2 (en) * | 1993-02-12 | 1996-03-13 | バンドー化学株式会社 | Matte sheet with a marbled design |
JPH08306261A (en) * | 1995-04-28 | 1996-11-22 | Shichizun Denshi:Kk | Surface mount intermittent operation switch and its manufacture |
JP2001307582A (en) * | 2000-04-18 | 2001-11-02 | Alps Electric Co Ltd | Push-button switch |
JP2008293983A (en) * | 2008-06-13 | 2008-12-04 | Nitto Denko Corp | Adhesive tape for tact switch, and tact switch |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5622728U (en) * | 1979-07-28 | 1981-02-28 | ||
JPS5826133U (en) * | 1981-08-15 | 1983-02-19 | オムロン株式会社 | switch |
JPS6182625A (en) * | 1984-09-29 | 1986-04-26 | 松下電器産業株式会社 | Push type switch |
JPS63202810A (en) * | 1987-02-18 | 1988-08-22 | ミツミ電機株式会社 | Switch |
JP3084525U (en) * | 2001-08-30 | 2002-03-29 | 田鶴子 佐々木 | Scissors with universal scoop |
-
1991
- 1991-09-06 JP JP1991080327U patent/JP2594914Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0523367U (en) | 1993-03-26 |
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