KR20010098671A - Push-Button Switch - Google Patents

Abstract

(Problem) Provided is a push button switch that can shorten a manufacturing process without impairing the mountability of a circuit board or the like.

(Solution means) Penetration of the insulating substrate 110, the fixed contact 111 laminated on the central portion on the substrate 110, the insulator 120 formed on the substrate 110 and the insulator 120 The through-hole electrode to which the dome-shaped metal contact 130 accommodated in the hole 120a and mounted on the board | substrate 110, and the contact pattern 112 which the fixed contact point 111 and the metal contact 130 contact, respectively connect, are connected, respectively. Surface 110b (110b ') and 110a (110a'), and a cover sheet 140 coated on the surface of the substrate 110 and the metal contact 130, and through-hole electrode surface 110b (110b '). ), 110a (110a ') is laminated on the side end surface of the substrate 110 so as to have a planar shape parallel to the side end surface.

Description

Pushbutton Switch {Push-Button Switch}

The present invention relates to a pushbutton switch suitable for use in electronic devices and the like requiring thinning.

Hereinafter, the conventional pushbutton switch will be described with reference to FIGS. 10 to 15.

FIG. 10 is a sectional view showing a conventional pushbutton switch 60, FIG. 11 is a perspective view of a conventional pushbutton switch 60, FIG. 12 is a partially enlarged view showing a through hole 40a (40b), FIG. 13 is a partial perspective view of the large substrate 54, FIG. 14 is a partial perspective view showing a state in which the movable contact 78 and the cover sheet 80 are attached to the large substrate 54, and FIG. 15 is an individual pushbutton switch. Partial perspective view showing the state of separation.

10 and 11, 40 is a board | substrate which consists of an insulating material, the circular fixed contact point 46 is formed in the center of the surface, and the substantially C-shaped contact pattern 42 is formed in the circumference | surroundings. The fixed contact 46 and the contact pattern 42 each have the lead wires 46a, 46b, 42a, to the external connection terminals provided at the four corners of the substrate 40, that is, through-holes 40a, 40b of the quadrant cylindrical surface shape. 42b), respectively.

48 is a movable contact obtained by bending a disc of metal in a dome shape, and is mounted on the contact pattern 42 such that its outer peripheral portion 48a is in contact with the contact pattern 42. 50 is a cover sheet made of a heat resistant resin, which is adhered to the surface of the substrate 40 so as to cover the movable contact 48 to fix the movable contact 48 and prevent intrusion of flux or the like.

In such a pushbutton switch 60, the portion of the movable contact 48 is pushed upward, the movable contact 48 is inverted, and the center portion thereof contacts the fixed contact 46, so that the fixed contact 46 The contact pattern 42 conducts a switch operation, and the switch signal is transmitted to the outside from the through holes 40a and 40b connected to the fixed contact 46 and the contact pattern 42, respectively.

The pushbutton switch 60 described above is assembled by the following process.

First, as shown in FIG. 13, on the large board | substrate 54, the fixed contact 46, the contact pattern 42, and the through hole 40a, in the pushbutton switch 60 (refer FIG. 10, FIG. 11). The pattern is formed so that the circuit pattern 90 corresponding to the circuit pattern consisting of 40b) and the drawing wirings 46a, 46b, 42a, and 42b is vertically and horizontally arranged. In Fig. 13, 76 corresponds to the fixed contact point 46 of the pushbutton switch 60, 74 corresponds to the contact pattern 42, and 54a corresponds to the through holes 40a and 40b, respectively.

Reference numeral 54a denotes a through hole 54a formed by plating on the inner surface of the through hole drilled into the large substrate 54 by an NC drilling machine or the like.

And as shown in FIG. 14, the metal movable contact 78 is mounted on the contact pattern 74 in each circuit pattern 90 of the large-size board | substrate 54, and a large size is formed on these movable contacts 78. As shown in FIG. The heat resistant cover sheet 80 is adhered to cover the entire surface of the substrate 54. Thereafter, as shown in Fig. 15, the double-dotted line portion in the figure is cut by a slicing machine or the like so as to divide the through-hole 54a into four pieces, and then divided into individual pushbutton switches to complete the pushbutton switch 60.

And as shown in FIG. 14, it was necessary to form the through hole 80a in the cover sheet 80 in the position corresponding to the through hole 54a. This is because when there is no through hole 80a, the corners 50 '(see Fig. 12) of the cover sheet 50 overhang through-holes 40a (40b) of the pushbutton switch 60 after being divided. This is to prevent the problem that the soldered part is overhanged and the soldered part cannot be seen by the naked eye when the pushbutton switch 60 is soldered by surface mounting, for example, on a circuit board of an electronic device.

However, the formation of the through holes 80a in the cover sheet 80 has a problem that the number of steps increases because the processing to the cover sheet 80 is required. In addition, since the thickness of the cover sheet 80 is about several tens of micrometers, it is difficult to make a perforation and it became a factor which further increases processing time. In addition, when adhering the cover sheet 80 shown in FIG. 14 to the large substrate 54, a step of precisely aligning the through-hole 80a with the minute through-hole 54a is required, which further increases the manufacturing process. There was a problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pushbutton switch that can solve the above problems and shorten the manufacturing process without impairing the mountability to a circuit board or the like.

1 is an exploded perspective view showing a pushbutton switch 100 of the first embodiment of the present invention.

FIG. 2 is a sectional view taken along 2-2 in FIG. 1.

3 is a plan view of a substrate 110 according to the pushbutton switch 100 of the first embodiment of the present invention.

4 is a rear view of FIG. 3.

FIG. 5 relates to the pushbutton switch 100 of the first embodiment of the present invention, which shows a state in which an insulator 220, a movable contact 130, and a cover sheet 240 are attached to a large substrate 210. As shown in FIG. Some perspective views.

FIG. 6 is a partial plan view of the large substrate 210 shown in FIG. 5.

7 is a perspective view of a substrate 310 according to a second embodiment of the present invention.

8 is a partial plan view of a large-size substrate 410 according to the second embodiment of the present invention.

9 is a perspective view of a substrate 510 according to the third embodiment of the present invention.

10 is a cross-sectional view showing a conventional pushbutton switch 60.

11 is a perspective view of a conventional pushbutton switch 60.

12 is a partially enlarged view showing the through hole 40a (40b) related to the conventional pushbutton switch 60. As shown in FIG.

13 is a partial perspective view of a large substrate 54 related to a conventional pushbutton switch 60.

Fig. 14 relates to a conventional pushbutton switch 60, which is a partial perspective view showing a state in which a movable contact 48 and a cover sheet 50 are attached to a large substrate 54.

15 is a perspective view of a conventional pushbutton switch 60, showing a state in which the individual pushbutton switches are separated.

* Description of the symbols for the main parts of the drawings *

100: pushbutton switch 110: substrate

110a, 110a ', 110b, 110b': Through hole electrode surface 111: Fixed contact

120: insulator 130: metal contact

140: cover sheet

As a first solution for solving the above problems, an insulating substrate, a fixed contact formed on the substrate, a dome-shaped movable contact mounted on the substrate and contacting the fixed contact to perform a switch operation, and the fixed An external connection terminal to which a contact and the movable contact are respectively connected, and a cover sheet coated on the surface of the substrate and the movable contact, wherein the external connection terminal is formed of a metal layer, and the metal layer is a side cross section of the substrate. The laminate is formed so as to have a planar shape parallel to the side cross section.

And, as a second solution, the metal layer is characterized in that the through-hole electrode surface.

In addition, as a third solution means, an insulator having an accommodating portion for accommodating the movable contact is formed between the substrate and the cover sheet.

And as a 4th solution means, the said board | substrate is rectangular shape and the said metal layer is formed in the predetermined position of the four corners of this board | substrate.

Embodiment of the invention

The pushbutton switch 100 which is 1st Embodiment of the pushbutton switch of this invention is demonstrated below using FIG. 1 thru | or FIG.

1 is an exploded perspective view showing a pushbutton switch 100 according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along 2-2 in FIG. 1, FIG. 3 is a plan view of the substrate 110, and FIG. 4 is FIG. 3. 5 is a partial perspective view illustrating a state in which the insulator 220, the movable contact 130, and the cover sheet 240 are attached to the large substrate 210, and FIG. 6 is a large substrate 210 illustrated in FIG. 5. Is a partial plan view of the.

As shown in Figs. 1 and 2, the pushbutton switch 100 includes a rectangular plate-shaped substrate 110 made of an insulating substrate such as glass epoxy resin, and an insulator 120 laminated and adhered to the substrate 110. ), A cover sheet 140 which covers the movable contact, which is accommodated in the insulator 120 and is mounted on the substrate 110, that is, the metal contact 130 and the insulator 120 and the metal contact 130 are adhered to each other. It is mainly composed of).

Next, the structure and assembly state of each component are demonstrated.

As shown in Figs. 1 and 3, the surface of the substrate 110 is formed with a fixed circular contact 111 which is substantially circular in the center thereof, and at the right end of both edge portions facing up and down in Fig. 3, respectively. Wiring patterns 113a and 113b are formed respectively along the edges. Further, a contact pattern 112 is formed in a range around the fixed contact 111 and in a predetermined gap with the wiring patterns 113a and 113b.

On the other hand, as shown in FIG. 4, a cross wiring pattern 114 is formed on the back surface of the substrate 110 so that a thin copper film covers the surface with a large area for securing strength. Further, quadrangular solder patterns 115a, 115b, 116a, and 116b are formed at four corners of the rear surface, and solder patterns 116a and 116b are pattern-connected with the wiring pattern 114.

1, 3 and 4, through-hole electrodes 111a and 111b are formed on both edges of the fixed contact 111 to penetrate through the substrate 110 and to be connected to the wiring pattern 114 on the back surface. ) Are installed respectively.

In addition, both end portions in each side end surface in the front-rear direction (up and down direction in Fig. 3) in Fig. 1 have a metal layer, i.e., through-hole electrode faces 110a, 110b and 110a 'having a portion that becomes planar in parallel to each side end surface. And 110b ') are formed respectively. These through hole electrode surfaces 110a, 110b and 110a ', 110b' are formed with a step lower than the distance L of each side surface of the substrate 110 (see Figs. 2 and 3).

The through-hole electrode surfaces 110a and 110a 'are all connected to the contact patterns 112 on the surface, and to the solder patterns 115a and 115b on the back surfaces, respectively (Figs. 1, 3 and 4). Reference). Then, the external connection terminal is constituted by the through-hole electrode surface 110a (110a ') and the soldering pattern 115a (115b).

The through-hole electrode surfaces 110b and 110b 'are connected to the wiring patterns 113a and 113b on the surface and the soldering patterns 116a and 116b on the back surface, respectively. Then, the external connection terminal is constituted by the through hole electrode surface 110b (110b ') and the soldering pattern 116a (116b).

Subsequently, the rectangular sheet-shaped insulator 120 is made of heat resistant resin such as polyimide resin, and its outer shape is almost the same as that of the substrate 110. In addition, a through hole 120a (accommodating portion) is formed in the center portion in accordance with the shape of the metal contact 130.

2, the insulator 120 is laminated | stacked and adhere | attached on the surface of the board | substrate 110. As shown in FIG. At this time, the center portion of the fixed contact 111 and the contact pattern 112 is exposed from the through hole 120a. In the contact portion with the insulator 120 of the substrate 110, a resist 110c (see FIG. 2) is formed outside the through hole 120a and inside the outer edge of the insulator 120 in advance. It is. Thereby, since the coating part 160a, 160b of an adhesive agent is formed between the board | substrate 110 and the insulator 120 in the inside and the outer side of the resist 110c, respectively, at the time of adhesion of the insulator 120, Since pressure is hardly applied to the escape portions 160a and 160b even when the adhesive 170 is pressed against the bonding surface, the adhesive 170 is pushed outward from the outer side of the metal contact 130 and the insulator 120. There is no work. Instead of the resist 110c, an insulating layer may be formed by silk printing.

Next, the metal contact 130 is formed by bending a metal plate in a dome shape. The metal contact 130 is accommodated in the through hole 120a of the insulator 120 and is mounted on the contact pattern 112 so that the outer periphery is in contact with the contact pattern 112 of the substrate 110. .

Subsequently, the rectangular sheet-like cover sheet 140 is formed of a heat resistant resin such as polyimide resin, and its appearance is almost the same as that of the insulator 120. The cover sheet 140 is adhered to cover the surfaces of the metal contact 130 and the insulator 120, thereby preventing the metal contact 130 from being separated from the substrate 110, and at the same time, the substrate 110. This prevents intrusion of flux into the surface.

Since the cover sheet 140 is adhered to cover the insulator 120 containing the metal contact 130, when the cover sheet 140 adheres directly to the surface from the top of the dome-shaped movable contact to the outer periphery as in the prior art, In comparison, there is no curling or the like of the cover sheet 140, and thus it can be easily adhered. Then, the metal contact 130 is accommodated in the space in the through hole 120a of the insulator 120 covered with the cover sheet 140, so that the metal contact 130 is pressed when pressed for the switch operation (to be described later). Since the place of air escape of a part can be formed, a favorable operation feeling can be obtained without raising the pressing force of the metal contact 130 more than a design value.

In addition, on the back surface of the substrate 110, a spacer 150 (see FIG. 2) made of the same material as that of the insulator 120 so as to cover the entire wiring pattern 114 (see FIG. 4) is formed of the insulator 120. It adhere | attaches with the adhesive agent same as the adhesive agent used for adhesion | attachment, and prevents intrusion of the flux, dust, etc. from the through-hole electrodes 111a and 111b.

When the insulator 120 and the cover sheet 140 are fixed to the substrate 110, pressure is applied in a heated state to cure the adhesive layer. In this case, the substrate ( 110) and the substrate after curing and cooling at a point where the coefficient of linear expansion of each material of the insulator 120 is different (glass epoxy resin; 250 to 300 ppm / ° C, polyimide resin; 25 to 28 ppm / ° C) Warpage occurred at 110, resulting in unstable contact of the switch contact portion, or poor connection due to floating during soldering of the solder patterns 115a, 115b, 116a, and 116b to circuit boards such as electronic devices. .

Therefore, in this embodiment, since the said spacer 150 which consists of the same material as the said insulator 120 is formed also in the back surface side of the said board | substrate 110, the bending of the said board | substrate 110 can be prevented. have.

In addition, the spacer 150 is formed so that the occupancy on the substrate 110 is substantially equal to each other in correspondence with the insulator 120, and the spacer 150 is formed at an end of the substrate 110. The portions other than the formed soldering patterns 115a, 115b, 116a, and 116b are formed to be thicker than the thicknesses of these soldering patterns.

Therefore, since the insulator 120 and the spacer 150 are substantially symmetrical on the front and back sides of the substrate 110, the warpage of the substrate 110 can be prevented more reliably. do.

The pushbutton switch 100 assembled in this way is a land portion of a circuit board, in which soldering patterns 115a, 115b, 116a, and 116b (see FIGS. 2 and 4) formed on the back surface of the substrate 110 are not shown. Are mounted so as to face each other and are soldered. At this time, the solder is connected to return to the through-hole electrode surfaces 110a, 110a ', 110b, 110b' of the substrate 110, so that the solder can be firmly connected to the circuit board.

At this time, a gap is formed between the soldering patterns 115a, 115b, 116a, and 116b and the land portion by the spacers 150 (see FIG. 2) provided on the lower surface of the substrate 110. The solder flows into this part, and the floating of the support surface of the pushbutton switch 100 can be prevented.

As shown in FIG. 2, the insulator 120 and the cover sheet 140 are provided by the distance L on the upper side of the through-hole electrode surfaces 110a, 110a ′, 110b and 110b ′. Since L) is minute, this part does not impair visual confirmation of the solder soldered to each through hole electrode surface.

As shown in FIG. 1, through-hole electrode surfaces 110a, 110a ', 110b, and 110b' are arranged at four corners of the substrate 110, so that the contact pattern 112 is formed at the fixed contact 111 of the center portion. It can be formed to have an even pattern width around, and the space on a board | substrate can be used efficiently in a pattern design.

Next, the operation of the pushbutton switch 100 will be described. First, the center portion of the metal contact 130 covered by the cover sheet 140 shown in FIGS. 1 and 2 is pushed upward, and the metal contact 130 is operated. Is reversed so that the central portion is in contact with the stationary contact 111, so that the stationary contact 111 and the contact pattern 112 are conducted to perform a switch operation. The switch signal is transmitted to the outside from an external connection terminal having through hole electrode surfaces 110b (110b ') and 110a (110b) connected to the fixed contact 111 and the contact pattern 112, respectively.

The pushbutton switch 100 described above is assembled by the following process.

First, as shown in FIG. 5, the surface of the large substrate 210 corresponds to a circuit pattern made of the fixed contact 111, the contact pattern 112, and the like in the pushbutton switch 100 (see FIG. 1). The circuit pattern 300 to be formed is patterned so as to be arranged vertically and horizontally. In addition, a circuit pattern (not shown) corresponding to a circuit pattern composed of the wiring pattern 114 and the soldering patterns 115a, 115b, 116a, and 116b in FIG. 4 is provided on the rear surface of the large substrate 210. It is formed to pair with the pattern 300.

In FIG. 5, 211 corresponds to the fixed contact 111 of the pushbutton switch 100, and 212 corresponds to the contact pattern 112. In addition, on the large substrate 210, circuit patterns adjacent to each other so as to correspond to respective positions of the through-hole electrode surfaces 110a, 110a ', 110b, and 110b' of the pushbutton switch 100 shown in FIG. An elongated through-hole electrode 210a having a straight portion is formed along the outer periphery of 300 (see FIGS. 5 and 6).

The through-hole electrode 210a is formed by a plating process or the like on a large substrate 210 by an NC drilling machine or the like on the inner surface of a through hole drilled into an elongated hole shape having a straight portion 210b. It is simply formed by.

5, the insulator 220 which has the through-hole 220a formed corresponding to each circuit pattern 300 is adhere | attached on the large board | substrate 210. As shown in FIG. And the insulator 220 is previously positioned so that each through-hole 220a of the insulator 220 may be arrange | positioned in the center part of the contact pattern 212 in each circuit pattern 300. FIG.

Thereafter, the metal contact 130 is received in each through hole 220a of the insulator 220, mounted on the substrate 210, and the entire surface of the insulator 220 in which these metal contacts 130 are accommodated. The heat resistant cover sheet 240 is adhered to cover it. Thereafter, as shown in FIG. 6, the portion of the width H between the double-dotted lines in the drawing is cut by a slicing machine or the like so as to divide the through-hole electrode 210a into four segments, and the respective pushbutton switches are divided into individual pushbutton switches. Complete the switch 100.

And since the width | variety H shown in FIG. 6 can be set arbitrarily by changing the width of the through-hole electrode 210a, for example, the width | variety H can be set comparatively wide and cutting | disconnection by a press or a cutter is possible. have.

In the process of dividing into individual pushbutton switches, each through hole electrode 210a is divided into four, and each through hole electrode surface is formed through the through hole electrode surfaces 110a, 110a ', 110b, 110b of the pushbutton switch 100. ') Will be assigned to either. As described above, these through hole electrode surfaces are configured to have a planar shape parallel to a predetermined side end surface of the substrate 110 (see FIGS. 1 and 3), so that the through substrates are divided when the large substrate 210 is divided. Since it is possible to cut close to the inner wall surface of the through hole electrode 210a corresponding to the hole electrode surfaces 110a, 110a ', 110b and 110b', the through hole surface 110a, 110a ', 110b and 110b' is provided. The insulator 120 and the cover sheet 140 can be made small (see FIG. 2), so that when the pushbutton switch 100 is soldered to the circuit board, the solder soldered to these through hole electrode surfaces is easily seen. Can be.

Therefore, at the time of assembling shown in Fig. 5, the insulator 220 and the cover sheet 240 do not need to form the escape hole corresponding to the through hole electrode 210a, thereby reducing the number of steps for the escape hole processing. Can be. In addition, since the step of precisely aligning the cover sheet 240 with the through hole 210a of the large-sized substrate 210 is also unnecessary, the effect of further reducing the manufacturing process can be obtained.

As described above, according to the present embodiment, the manufacturing process can be shortened without impairing the mountability on the circuit board or the like.

Next, 2nd Embodiment of this invention is described using FIG. 7, FIG. The same code | symbol or name is attached | subjected to the site | part of the function similar to 1st Embodiment.

7 is a perspective view of a substrate 310 according to a second embodiment of the present invention, and FIG. 8 is a partial plan view of the large substrate 410.

In this embodiment, the shape of the through-hole electrode surfaces 110a, 110a ', 110b, 110b' in the substrate 110 of the first embodiment is changed.

In the figure, 310 is a substrate, 312 is a contact pattern, 313a and 313b are wiring patterns, and 310a, 310a ', 310b and 310b' are through-hole electrode faces, and these through-hole electrode faces 310a, 310a ', 310b and 310b' are shown. Are each formed in a planar shape parallel to these side cross sections at both side cross sections of respective corner portions of the substrate 310. These through hole electrode surfaces 310a, 310a ', 310b and 310b' are formed with a step lower than the side cross-sections of the substrate 310 by a micro distance.

And like the first embodiment, the through hole electrode surfaces 310a and 310a 'are connected to the contact pattern 312, and the through hole electrode surfaces 310b and 310b' are fixed through the through hole electrodes 111a and 111b. It is connected to the contact point 111.

The pushbutton switch using the substrate 310 is assembled by the same process as in the first embodiment. In the step of the large substrate 410 as shown in FIG. 8, the through-hole electrode surfaces 310a and 310a 'of FIG. The cross-shaped through-hole electrode 410a having the straight portion 410b is formed along the outer periphery of the corner portion of the circuit pattern 400 adjacent to each other so as to correspond to the respective positions of (310b, 310b ').

Thus, the through hole electrode 410a is divided into four when the width H portion is cut in the drawing, and the through hole electrode surfaces 310a, 310b, 310a ', and 310b' shown in FIG. This is to be formed.

By doing in this way, not only the same effect as the first embodiment can be obtained but also the through-hole electrode surfaces 310a, 310b, 310a 'when soldering the pushbutton switch using the substrate 310 of the present embodiment to the circuit board. Since 310b ') is formed at both end surfaces of each corner, it is connected to a land portion (not shown) in the state where the solder has entered to surround each corner, so that the effect of being able to connect the circuit board more firmly can be obtained. have.

Next, 3rd Embodiment of this invention is described using FIG.

9 is a perspective view of a substrate 510 according to the third embodiment of the present invention. The same code | symbol or name is attached | subjected to the site | part which has a function similar to 2nd Embodiment.

In the figure, 510 is a substrate, 512 is a contact pattern, 513a and 513b are wiring patterns, and 510a, 510a ', 510b and 510b' are through-hole electrode faces, and these through-hole electrode faces 510a, 510a ', 510b and 510b' Are each formed in a planar shape parallel to each side cross section at the central portion of each cross section of the substrate 510. These through hole electrode surfaces 510a, 510b, 510a ', and 510b' are formed with a step lower than each side end surface of the substrate 510 by a small distance.

The through hole electrode surfaces 510a and 510a 'are connected to the contact pattern 512, and the through hole electrode surfaces 510b and 510b' are connected to the fixed contact 111 through the through hole electrodes 111a and 111b. It is.

The pushbutton switch using the substrate 510 is assembled by the same process as in the first and second embodiments, and in the step of the large substrate (not shown), the through-hole electrode surfaces 510a, 510a ', 510b, 510b' To form a long hole-shaped through-hole electrode having a straight portion along each of the outer periphery of the circuit patterns adjacent to each other so as to correspond to the respective positions of (see FIG. 9). Doing.

In the first and second embodiments, through-hole electrode surfaces 110a (310a), 110b (310b), 110a '(310a'), 110b '(310b') are disposed at the corners of the substrate 110 (310). However, the present invention is not limited thereto, and through-hole electrode surfaces 510a, 510b, 510a ', and 510b' may be formed in the center of each side end surface of the substrate 510 as in the present embodiment. It is possible to provide a pushbutton switch having a high degree of freedom that can be changed to be mounted in accordance with the layout of the land portion of the circuit board.

And in the board | substrate 110 (310,510) in 1st-3rd embodiment, it has the fixed contact 111 and through-hole electrode surface 110b (310b, 510b), 110b '(310b', 510b '). Although the external connection terminals were connected to each other by the through hole electrodes 111a and 111b formed through the substrates 110 (310 and 510), the present invention is not limited thereto. For example, the conventional pushbutton switch 60 shown in FIG. Likewise, the present invention can be applied to a pushbutton switch of a type in which the fixed contact and the external connection terminal are pattern-connected on the upper surface of the substrate.

As described above, according to the present invention, an insulating substrate, a fixed contact formed on the substrate, a dome-shaped movable contact mounted on the substrate and contacting the fixed contact to perform a switch operation, and the fixed contact and An external connection terminal to which the movable contacts are respectively connected, a cover sheet coated on the surface of the substrate and the movable contact, and the external connection terminal is formed of a metal layer, and the metal layer is formed on a side end surface of the substrate. By forming a stack so as to have a planar shape parallel to the side cross section, for example, a plurality of movable contacts are arranged on a large substrate in which a plurality of fixed contacts are arranged vertically and horizontally, and a cover sheet is coated on the surface of the large substrate and the plurality of movable contacts Later, when assembling the pushbutton switch by dividing it into individual pushbutton switches, the cut surface is installed to approach the metal layer. Since it is possible to form a cover hole in advance, the cover sheet corresponding to the metal layer can be formed. As a result, the number of steps for the escape hole processing can be reduced, and the step of precisely aligning the cover sheet with the escape hole to a large substrate is unnecessary, so that the manufacturing process can be shortened. Can be. In addition, since the length of the cover sheet coming out of the metal layer can be made small, the soldering part can be easily seen when the pushbutton switch is mounted on a circuit board or the like and soldered.

And since the metal layer is a through-hole electrode surface, the metal layer can be formed in the state of a large substrate, and the effect which can simplify a manufacturing process can be acquired.

In addition, since an insulator having a receiving portion accommodating the movable contact is formed between the substrate and the cover sheet, the cover sheet is curled, as compared with the case where the cover sheet is directly adhered to the surface of the dome-shaped movable contact as in the related art. It can be easily adhered because it is not present. Since the movable contact is accommodated in the space of the insulator of the insulator covered with the cover sheet, the movable contact can be formed when the movable contact is pressed for the switch operation. A good feeling of operation can be obtained without increasing the force beyond the design value. Further, when assembling the pushbutton switch, it is possible to have a structure in which the insulator does not need to form the escape hole corresponding to the metal layer in advance, so that the manufacturing process of the pushbutton switch can be further shortened.

Since the substrate is rectangular in shape and the metal layer is formed at predetermined positions at four corners of the substrate, a relatively large space can be ensured in the center portion of the substrate, so that the space can be efficiently used in pattern design such as a fixed contact. The effect can be obtained.

Claims (4)

An insulating substrate, a fixed contact formed on the substrate, a dome-shaped movable contact mounted on the substrate and contacting the fixed contact to perform a switch operation, and an external connection terminal to which the fixed contact and the movable contact are respectively connected. And a cover sheet coated on the surface of the substrate and the movable contact, wherein the external connection terminal is formed of a metal layer, and the metal layer is laminated on the side end surface of the substrate so as to have a planar shape parallel to the side end surface. Pushbutton switch, characterized in that formed. The pushbutton switch of claim 1, wherein the metal layer is a through hole electrode surface. The pushbutton switch according to claim 1 or 2, wherein an insulator having a receiving portion accommodating the movable contact is formed between the substrate and the cover sheet. The pushbutton switch according to claim 1, wherein the substrate is rectangular in shape, and the metal layer is formed at predetermined positions of four corners of the substrate.