CN1258306C

CN1258306C - Through hole processing and structure for HF circuit board

Info

Publication number: CN1258306C
Application number: CN 01104695
Authority: CN
Inventors: 郑裕强
Original assignee: Mitac International Corp
Current assignee: Mitac International Corp
Priority date: 2001-02-20
Filing date: 2001-02-20
Publication date: 2006-05-31
Anticipated expiration: 2021-02-20
Also published as: CN1371239A

Abstract

The present invention relates to through hole processing of a high frequency circuit panel, and the structure of the high frequency circuit panel. The high frequency circuit panel is provided with two signal layers and a ground plane. The processing method of the present invention comprises the following steps: a) a first copper foil layer is arranged at the inner circumference of a through hole, and the first copper foil layer is connected to the ground plane; b) an insulating layer is laid at the inner circumference of the first copper foil layer in step a to separate the first copper foil layer from the two signal layers; c) a second copper foil layer is laid at the inner circumference of the insulating layer in step b, and the second copper foil layer is connected with the two signal layers. Thereby, the impedance consistency and the avoidance of electromagnetic waves are realized by that the first copper foil layer is connected with the ground plane and the second copper foil is separated from the two signal layers by the isolating layer.

Description

The perforation of HF circuit board is handled and structure

Technical field

The perforation that the present invention relates to a kind of HF circuit board is handled and structure, particularly relates to a kind of perforation processing and structure thereof that reaches the impedance consistency and avoid Electromagnetic Interference.

Background technology

General HF link is usually to avoid wearing the consistency (Tracecharacteristic impedance) that layer comes the impedance of inhibit signal, but often because consider all factors of Electromagnetic Compatibility or other cablings (layout), thereby circuit trace must be passed through perforation (Via) to other layers, therefore, this perforation (Via) tends to cause the discontinuous of signal impedance and influences signal quality or cause harmful effects such as electromagnetic wave (EMI) radiation.

Please refer to shown in Figure 1, its perforation for existing a kind of HF circuit board is handled, this panel 1 has

binary signal layer

11,12 and one ground plane 13, and has a perforation 14, its perforation inner peripheral plating at panel 1 is provided with

copper foil layer

15,15 of this copper foil layers be connected with ground plane 13 and with

binary signal layer

11,12 connect, therefore,

binary signal layer

11,12 can produce impedance Z 0 to ground plane 13, and this impedance Z 0 equates, but copper foil layer 15 can produce impedance to cabling, and the impedance that copper foil layer 15 is produced is not equal to Z0, therefore cause the inconsistency of impedance, in addition, because of

signals layer

11,12 can generate electromagnetic waves, and separate at copper foil layer 15 no ground planes, therefore, the signals layer that electromagnetic wave can have influence on whole front panel 1 to outdiffusion is subjected to electromagnetic interference, and produce bad signal, this kind situation is all perplexing the personage of electronics industry always, therefore, can propose a kind ofly to avoid panel to be subjected to electromagnetic interference and reach the panel processing method of signals layer to the impedance unanimity that ground plane and copper foil layer produced, be the problem that needs creation at present.

Summary of the invention

The object of the present invention is to provide a kind of perforation of HF circuit board to handle and structure, it is respectively equipped with copper foil layer on the different section of perforation, makes this HF circuit board can reach the consistency of impedance and reaches the effect of avoiding Electromagnetic Interference.

The object of the present invention is achieved like this, promptly provide a kind of perforation of HF circuit board to handle, this panel includes a binary signal layer and a ground plane, and it comprises the following steps: that a. lays one first copper foil layer at the perforation inner peripheral, and this first copper foil layer is connected with ground plane; B. lay an insulating barrier at the first copper foil layer inner edge of step a, to separate first copper foil layer and binary signal layer; C. lay one second copper foil layer at the insulating barrier inner peripheral of step b, this second copper foil layer is connected with above-mentioned binary signal layer; Thus, make first copper foil layer that is connected with ground plane respectively and second copper foil layer are insulated layer and separate, and reach the consistency of impedance, and make signals layer be grounded layer to encase and avoided electromagnetic interference.

The present invention also provides a kind of structure that adopts HF link perforation that above-mentioned perforation processing method makes to handle, and it has a ground plane and binary signal layer, and this perforation comprises: one first copper foil layer is connected with above-mentioned ground plane; An insulating barrier to be located at the inner peripheral of this first copper foil layer with separating first above-mentioned copper foil layer and above-mentioned binary signal layer; One second copper foil layer is located at the inner peripheral of above-mentioned insulating barrier and is formed a perforation, and this second copper foil layer is connected with above-mentioned binary signal layer; Thus, make first copper foil layer that is connected with ground plane respectively and second copper foil layer are insulated layer and separate, and reach the consistency of impedance, and make signals layer be grounded layer to encase and avoided electromagnetic interference.

Main feature of the present invention is, this HF circuit board is spread the copper foil layer that is connected with ground plane at the perforation periphery in regular turn, lay an insulating barrier at the copper foil layer periphery and spread the copper foil layer that is connected with signals layer in this insulating barrier periphery again, separate and reach the consistency of impedance so that this each copper foil layer is insulated layer, and can reach signals layer simultaneously and be grounded layer and encase and avoided Electromagnetic Interference.

Description of drawings

Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:

Fig. 1 is the cutaway view that the perforation of existing HF circuit board is handled;

Fig. 2 is the top view that preferred embodiment perforation of the present invention is handled;

The cutaway view that Fig. 3 handles for preferred embodiment perforation of the present invention.

Concrete implementation content

At first please refer to Fig. 2 and shown in Figure 3, the present invention deals with at the perforation 21 of the HF circuit board 2 with

binary signal layer

22,23 and a ground plane 24, and its processing comprises the following steps:

A. run through being provided with perforation 21 at HF circuit board 2, and plate first copper foil layer 211 that is connected with this ground plane 24 at the inner peripheral of perforation 21.

B. at step a. after perforation 21 peripheries plate one first copper foil layer 211, the inner peripheral of this first copper foil layer 211 still leaves a perforation space, utilize this perforation space to spread an insulating barrier 212 in the inner peripheral of this first copper foil layer 211 in regular turn again, and after this first copper foil layer 211 is spread an insulating barrier 212, equally still leave a perforation space.

C. behind step b. again the inner peripheral in this insulating barrier 212 plate one second copper foil layer 213, and plate second copper foil layer 213 at the inner peripheral of insulating barrier 212,213 perforations 214 that are connected and form a confession cabling with

binary signal layer

22,23 of this second copper foil layer have promptly been finished the processing of the perforation of HF circuit board in step c.

Therefore, the perforation 21 of this HF circuit board 2 has then comprised first copper foil layer 211 that is connected with this ground plane 24 after handling according to above-mentioned steps, one insulating barrier 212 and of being located at first copper foil layer, 211 inner peripherals is located at the inner peripheral and the binary signal layer 22 of

insulating barrier

212,23 second copper foil layers 213 that connect, handle according to this, can reach and binary signal layer 22 by first copper foil layer 211 that insulating barrier 212 will be connected with

ground plane

24,23 second copper foil layers 213 that connect separate (please refer to Fig. 3), because, binary signal layer 22, so 23 for the aspect of cabling signal transmission it must not have its impedance of Electromagnetic Interference also must be consistent, therefore, consistency aspect from impedance, wherein 22 pairs of ground planes of a signals layer 24 can produce another signals layer 23 of a resistance value Z0 and also can produce an impedance Z 0 to ground plane 24, other first copper foil layer 211 is connected with ground plane 24, institute thinks ground connection, therefore 213 pairs first copper foil layers of second copper foil layer 211 produce an impedance Z 0, so, can reach the consistency of impedance.

On the other hand from Electromagnetic Interference, because first copper foil layer 211 that is connected with ground plane 24 reaches and binary signal layer 22, there is insulating barrier 212 to separate in the middle of 23 second copper foil layers 213 that connect, and make

binary signal layer

22,23 are grounded layer 24 encases, therefore cabling is through the 214 back signals binary signal layer 22 again of boring a hole, first copper foil layer 211 that the electromagnetic wave that is produced during 23 transmission then is connected with ground plane 24 encases, just this electromagnetic wave is grounded layer and 24 encases, thereby can avoid electromagnetic wave to continue to outdiffusion, avoided Electromagnetic Interference to signals

layer

22,23 signal transmission is avoided Electromagnetic Interference binary signal layer 22 and HF link cabling panel can be reached, 23 signal transmission.

Therefore, be connected with ground plane 24 by first copper foil layer 211, and separate first copper foil layer and second copper foil layer that is connected with

binary signal layer

22,23 can solve the inconsistent problem of HF circuit board impedance in the past by insulating barrier, also solved simultaneously the problem that HF circuit board Electromagnetic Interference

binary signal layer

22,23 signal transmit, made HF circuit board can reach the consistency of impedance and exempted Electromagnetic Interference.

Above-described only is preferred embodiment of the present invention, and all equalizations of doing by claim of the present invention change and modify, and all should belong to the covering scope of patent of the present invention.

Claims

1. the perforation of a HF circuit board is handled, and this panel includes a binary signal layer and a ground plane, and it comprises the following steps:

A. lay one first copper foil layer at the perforation inner peripheral, this first copper foil layer is connected with ground plane;

B. lay an insulating barrier at the first copper foil layer inner edge of step a, to separate first copper foil layer and binary signal layer;

C. lay one second copper foil layer at the insulating barrier inner peripheral of step b, this second copper foil layer is connected with above-mentioned binary signal layer;

Thus, make first copper foil layer that is connected with ground plane respectively and second copper foil layer are insulated layer and separate, and reach the consistency of impedance, and make signals layer be grounded layer to encase and avoided electromagnetic interference.

2. structure that the HF link perforation that adopts perforation processing method as claimed in claim 1 to make is handled, it has a ground plane and binary signal layer, and this perforation comprises:

One first copper foil layer is connected with above-mentioned ground plane;

An insulating barrier to be located at the inner peripheral of this first copper foil layer with separating first above-mentioned copper foil layer and above-mentioned binary signal layer;

One second copper foil layer is located at the inner peripheral of above-mentioned insulating barrier and is formed a perforation, and this second copper foil layer is connected with above-mentioned binary signal layer;