CN2527062Y - Wiring structure for signal transmission line on circuit board - Google Patents
Wiring structure for signal transmission line on circuit board Download PDFInfo
- Publication number
- CN2527062Y CN2527062Y CN 01277612 CN01277612U CN2527062Y CN 2527062 Y CN2527062 Y CN 2527062Y CN 01277612 CN01277612 CN 01277612 CN 01277612 U CN01277612 U CN 01277612U CN 2527062 Y CN2527062 Y CN 2527062Y
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- Prior art keywords
- circuit board
- transmission line
- layer
- signal transmission
- wire structures
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Abstract
A wiring structure for a signal transmitting line of a circuit board is characterized in that: at least a pair of coupled bi-differential transmitting lines is wired in two adjacent layers of a plurality of different layers in the circuit board. One of the two transmitting lines is wired in a signal transmitting layer and the other line is wired in a power supply layer or a grounding layer, besides, when the space between the two adjacent layers is at a specific value, a better transmitting effect can be obtained. The layer number of the circuit board at least comprises the signal layer, the power supply layer and the grounding layer.
Description
Technical field
The wire structures of the relevant a kind of circuit board signal transmission line of the utility model, particularly in the high-frequency circuit relevant for high-frequency signal transmission wire in multilayer circuit board certain certain layer and the wire structures of certain specific range.
Background technology
In the employed printed circuit board (PCB) of radio communication of general high frequency, because institute's frequency of utilization is high, so all need strict design and arrange for the configuration of each assembly in circuit board and the design of interlock circuit wiring usually, to avoid circuit to produce high-frequency effects or other ill effect, and have influence on the electrical characteristic of entire circuit, popular personal digital assistant (Personal Digital Assistant especially at present; PDA) and the electronic product of very general mobile phone and other HF communication, transmission usefulness and the noise resisting ability for signal requires higher.
On general circuit plate or motherboard, except the wires design of general transmission signal or power supply, usually all can be to signal transmssion line (trace) special emphasis and consideration be set, because whether the design quality of transmission line is the communications characteristic of entire circuit of concerning, certainly also influence the communication quality of communication products, also be directly connected to and whether can be accepted by the consumer to this product, these characteristics for example are the transmission usefulness of circuit board and the coupling of characteristic impedance, and the antimierophonic ability of signal or the like.
See also Fig. 1, it is the wiring schematic diagram of existing circuit board transmission line.Shown in Fig. 1, one circuit board 1 is a sandwich construction, wherein the wires design of this sandwich construction is relevant with the characteristic and the circuit complexity of this integrated circuit, and the ground floor 15 in this circuit board 1 is the signal transport layer, on the signal transport layer, be provided with signal transmssion line 151 usually, 152, this signal transmssion line 151 wherein, 152 is the pair of differential signal transmssion line, and other length of arrangement wire of this two holding wire is relevant with the characteristic impedance and the correlation properties of this holding wire with width and distance W each other 1, wherein transmission line 151,152 distance is owing to the restriction of circuit board process for integrally manufacturing is maintained at about 5 Mills (mil), yet generally speaking the distance between two paired differential signal lines is the smaller the better, make transmission quality and efficient higher, ability to the elimination noise is also stronger, for example eliminate electromagnetic interference (EMI), yet, and must overcome in the prior art usually the shortcoming that can't be dwindled the distance of two transmission lines by alternate manner because the restriction of technology but can't be dwindled its distance usually.
The utility model content
Main purpose of the present utility model provides a kind of wire structures of circuit board signal transmission line, with the transmission usefulness that improves transmission line signals and reduce noise jamming, and makes two paired transmission wire spacings can reduce and reach preferable laser propagation effect.
For achieving the above object, the wire structures of circuit board signal transmission line of the present utility model, be characterized in, the two paired differential signal transmission lines of at least one pair of are routed in two adjacent layers in several different layers of this circuit board in this circuit board, wherein one of this two transmission line is routed at a signal transport layer, and another of this two transmission line then is routed in the non-signal transport layer.
Wherein the number of plies of this circuit board comprises signals layer, bus plane and ground plane at least.
For clearer connection the purpose of this utility model, characteristics and advantage, preferred embodiment of the present utility model is elaborated below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the design diagram of p-wire in the existing circuit board.
Fig. 2 is the first preferred embodiment schematic diagram that the utility model is applied to multilayer circuit board.
Fig. 3 is the second preferred embodiment schematic diagram that the utility model is applied to multilayer circuit board.
Fig. 4 is the 3rd preferred embodiment schematic diagram that the utility model is applied to multilayer circuit board.
Fig. 5 is the 4th preferred embodiment schematic diagram that the utility model is applied to multilayer circuit board.
Embodiment
The utility model discloses a kind of wire structures that is applied to the circuit board signal transmission line of high-frequency circuit, be for two adjacent layers that two paired differential signal transmission lines are routed in this circuit board, wherein one of this two transmission line is to be routed in signals layer, and another then is routed at a bus plane or a ground plane.
See also Fig. 2, the utility model shown in the figure is applied to first preferred embodiment of multilayer circuit board.As shown in Figure 2, multilayer circuit board 2 can be applicable in the circuit board of HF communication, can for example be the 3rd layer 23 and the 4th layers 24 wires design two bars transmission lines wherein at two adjacent layers, they become corresponding arranged, wherein being positioned at the 3rd layer 23 transmission line 231 and the 4th layer 24 transmission line 241 is to transmit a paired differential wave, its two signal in fact transmits through becoming two signals after the phase deviation for same signal, its purpose is that anti-stop signal is interfered in transport process, 241 liang of relative vertical ranges of this transmission line 231 and transmission line also must be restricted in addition, can be in the middle acquisition good result of transmission quality and usefulness.Be applied in the actual circuit at the utility model, 241 liang of relative distance W2 of this transmission line 231 and transmission line can regulate and control between 2.5～4 Mills (mil), because of consideration printed circuit board (PCB) (PCB) manufacture craft, with effect when 3 Mills (mil) for better.
In addition, in the wiring design in a multilayer circuit board, signals layer or bus plane or ground plane may have several layers respectively, its number of plies that has separately and the position in circuit board, be relevant with the relevant design of this circuit characteristic or the function that will reach, also relevant with circuit complexity and designer's ability, and in application of the present utility model, be to propose preferable signal transmssion line should design in the design of which kind of number of plies.
See also Fig. 3, it is the utility model to be shown be applied to the multilayer circuit board second preferred embodiment schematic diagram.As shown in Figure 3, this circuit board is six layers of structure (L1～L6), wherein ground floor 31, the 3rd layer 33, layer 6 36 are signal transport layer (S), the second layer 32, layer 5 35 are ground plane (GND), the 4th layer 34 is bus plane Vcc, and be to have connected up transmission line 321,331 respectively the second layer 32 and the 3rd layer 33, it is routed in the second layer 32 (ground plane) and the 3rd layer 33 (signal transport layer) respectively, is can prevent that stop signal is transmitted in to be subjected to noise jamming in the transport process to guarantee that preferable communication quality is arranged.
See also Fig. 4, it is that the schematic diagram that the utility model is applied to the 3rd preferred embodiment of multilayer circuit board is shown.As shown in Figure 4, this circuit board also is six layers of structure (L1～L6), wherein ground floor 41, the 3rd layer 43, layer 6 46 are signal transport layer (S), the second layer 42, layer 5 45 are ground plane (GND), the 4th layer 44 is bus plane (Vcc), and be to have connected up transmission line 431,441 respectively at the 3rd layer 43 and the 4th layers 44, it is routed in the 3rd layer 43 (signal transport layer) and the 4th layer 44 (bus plane) respectively, is can prevent that stop signal is transmitted in to be subjected to noise jamming in the transport process and to transmit quality and entire circuit characteristic and usefulness to guarantee signal.
See also Fig. 5, it is that the schematic diagram that the utility model is applied to multilayer circuit board the 4th preferred embodiment is shown.As shown in Figure 5, this circuit board also be six layers of structure (L1～L6), wherein ground floor 51, the 3rd layer 53, layer 6 56 are signal transport layer (S), the second layer 52, layer 5 55 are ground plane (GND), the 4th layer 54 is bus plane (Vcc).And be the transmission line 531,541 that connected up respectively at the 3rd layer 53 (signal transport layer) and the 4th layer 54 (bus plane).In addition, be the transmission line 551,561 that connected up respectively at layer 5 55 (ground plane) with layer 6 56 (signal transport layer).This design is allowed in the sandwich construction in a circuit board can distinguish the some transmission lines to differential wave of designing wiring between some different numbers of plies, though it is for example different with the number of plies in the 8-layer printed circuit board at 6-layer circuit board, but such design is to can be applicable to than in the complicated circuit, has the design of some groups of different transmission signals simultaneously.
Layout by the one or more pairs of differential signal transmission lines described in above-mentioned several preferred embodiments, and to can design according to the needs of side circuit in the design of some level, and not because total number of plies number of the multilayer circuit board implemented and difference, the technology that proposed of 8-layer printed circuit board or more multi-layered equally also suitable the utility model of circuit board for example.Design of the present utility model is the efficient that can improve signal transmission, and can reduce the situation that signal disturbs, and can improve the disappearance that prior art can't be reduced two transmission line distances.
The above only is preferred embodiment of the present utility model, but can not be used for limiting the scope that the utility model is implemented.All equivalence of being done according to the utility model spirit changes with equivalence replaces, and all should still belong in the scope that the utility model patent contains.
Claims (10)
1. the wire structures of a circuit board signal transmission line, it is characterized in that, the two paired differential signal transmission lines of at least one pair of are routed in two adjacent layers in several different layers of this circuit board in this circuit board, wherein one of this two transmission line is routed at a signal transport layer, and another of this two transmission line then is routed in the non-signal transport layer.
2. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, described circuit board comprises signals layer, bus plane and ground plane at least.
3. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, the distance of described two adjacent layers is between 2.5～4 Mills.
4. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, the distance of described two adjacent layers is 3 Mills.
5. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, described two adjacent layers are to be signal transport layer and bus plane.
6. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, described two adjacent layers are to be signal transport layer and ground plane.
7. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, described circuit board is the circuit board for six layers.
8. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, described circuit board is the circuit board for eight layers.
9. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, described circuit board is used for the circuit of a high-frequency wireless communication.
10. the wire structures of circuit board signal transmission line as claimed in claim 1 is characterized in that, described circuit board is used for the personal digital assistant product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01277612 CN2527062Y (en) | 2001-12-21 | 2001-12-21 | Wiring structure for signal transmission line on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01277612 CN2527062Y (en) | 2001-12-21 | 2001-12-21 | Wiring structure for signal transmission line on circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2527062Y true CN2527062Y (en) | 2002-12-18 |
Family
ID=33681330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01277612 Expired - Fee Related CN2527062Y (en) | 2001-12-21 | 2001-12-21 | Wiring structure for signal transmission line on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2527062Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100438727C (en) * | 2005-06-17 | 2008-11-26 | 鸿富锦精密工业（深圳）有限公司 | Wiring structure of printed circuit board transmission line |
| CN106714475A (en) * | 2016-12-28 | 2017-05-24 | 盛科网络（苏州）有限公司 | Lamination method of six-layer PCB |
| CN108880195A (en) * | 2018-07-03 | 2018-11-23 | 中国电子科技集团公司第二十四研究所 | Multichannel voltage converter based on integrative packaging |
| CN110418494A (en) * | 2019-07-04 | 2019-11-05 | 武汉精立电子技术有限公司 | A kind of PCB construction for analog-to-digital conversion, AOI detection device |
| CN111770626A (en) * | 2020-06-30 | 2020-10-13 | 苏州浪潮智能科技有限公司 | High speed signal link |
-
2001
- 2001-12-21 CN CN 01277612 patent/CN2527062Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100438727C (en) * | 2005-06-17 | 2008-11-26 | 鸿富锦精密工业（深圳）有限公司 | Wiring structure of printed circuit board transmission line |
| CN106714475A (en) * | 2016-12-28 | 2017-05-24 | 盛科网络（苏州）有限公司 | Lamination method of six-layer PCB |
| CN108880195A (en) * | 2018-07-03 | 2018-11-23 | 中国电子科技集团公司第二十四研究所 | Multichannel voltage converter based on integrative packaging |
| CN110418494A (en) * | 2019-07-04 | 2019-11-05 | 武汉精立电子技术有限公司 | A kind of PCB construction for analog-to-digital conversion, AOI detection device |
| CN111770626A (en) * | 2020-06-30 | 2020-10-13 | 苏州浪潮智能科技有限公司 | High speed signal link |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |