CN1104181C - Printed circuit board with integrated twisted pair conductor - Google Patents
Printed circuit board with integrated twisted pair conductor Download PDFInfo
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- CN1104181C CN1104181C CN97113444A CN97113444A CN1104181C CN 1104181 C CN1104181 C CN 1104181C CN 97113444 A CN97113444 A CN 97113444A CN 97113444 A CN97113444 A CN 97113444A CN 1104181 C CN1104181 C CN 1104181C
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- flaggy
- tracks
- lead
- circuit board
- printed circuit
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Abstract
The present invention relates to a multi-layer printed circuit board with an integrated twisted pair conductor. A first board layer and a second board layer are respectively provided with two segmented conductor traces and a plurality of through holes, wherein the segmented conductor traces are mutually crossed; the two segmented conductor traces of the first board layer are connected with the two segmented conductor traces of the second board layer through the through holes. The twisted pair conductor can be shielded by the method that grounding traces are additionally arranged on both sides of the conductor traces, and grounding planes are additionally arranged above and below the grounding traces. The conductor traces can also be adjusted to the traces with specific electric properties by the method that a plurality of through holes are arranged according to proper intervals to enable the turning number per unit length to achieve a specific value. The continuous conductor traces can also be adjusted by adopting a dielectric with specific thickness and by designing the conductor traces into the traces with a specific size.
Description
The present invention generally speaking relates to printed circuit board (PCB).More particularly, the present invention relates to a kind of multilayer board that comprises integrated twisted pair conductor with transmission line performance.
Recently, printed circuit board (PCB) is usually designed to and has the line conductor that signal is sent to the other end from board rear end.For example, be presented to Mullen 5,278, No. 524 patent disclosures the manufacture method of printed circuit board (PCB) of transmission line like the band coaxial cable.Transmission line has a conduction herring bone to be encircled by four constant voltage conductors.Conductor and conductive strips separate with dielectric layer.Authorize Currie 4,310, No. 811 patent disclosures the printed circuit board (PCB) of outside standby (rework) line of a kind of band.These sidings are the part of dedicated backup layer.The dedicated backup layer is made up of standby datum layer and lining traverse net, and the former is fixed on the printed circuit board (PCB), and the latter is fixed on the standby datum layer semipermanently, so that the rewiring of each element or overcome defective in the embedding signals layer.Yet, though these patent disclosures the manufacture process of printed circuit board (PCB) of band line conductor, the manufacture process of going back neither one and be the printed circuit board (PCB) of open band integrated twisted pair line.
As you know, twisted-pair wire (twisted-pair wire that holding wire and loop line strand forms together) is the straightforward procedure that reduces electromagnetic interference in the cable of two circuit that interconnect in the field of transmission line.In other words, lead twists together and can make external signal (for example noise signal) be not easy to be coupled with needed signal.In addition, everybody knows that also two glue leads are easy to eliminate the extraneous signal that transmission line is collected.For example, because holding wire and loop line interwind, wherein the extraneous signal collected of lead is also collected for another root lead.So just can be at the collection of letters end of twisted-pair feeder with the total signal (extraneous signal of promptly collecting) of difference receiver filtering two leads.In addition, everybody also knows, reduces the holding wire of twisted-pair wire and the formed loop of loop line district and can reduce magnetic coupling on the transmission line greatly.
In the past, when will be on printed circuit board (PCB) connecting two chips, always adopt outside twisted-pair wire cable with twisted-pair wire.Cable is soldered on the track lead (trace conductors) of guiding to chip particular pin to be connected on the printed circuit board (PCB).Lead track on the printed circuit board (PCB) is very thin, and spacing is minimum, thereby this operation all is no small at labour intensity and the cost paid on the time.In addition, when the cost of twisted-pair cable is added to the cost of whole system, the electric device system of the printed circuit board (PCB) of band interconnect die is housed, its cost must improve.
In addition, when adopting analog-and digital-electric component on the same printed circuit board (PCB), these elements always are configured to make all digital elements to be positioned at an end of circuit board, and all analog elements are positioned at the other end.This structure is used for reducing the switching of unwanted signal factor word element to greatest extent and introduces chance in the analog line.In addition, reduce the possibility of these noise signal drawing-in systems often to greatest extent with two printed circuit board (PCB)s: a printed circuit board (PCB) is for analog element usefulness, and another printed circuit board (PCB) is used for digital element.This arrangement, owing to adopt two rather than a printed circuit board (PCB), thereby improved the price of the electric component system that these printed circuit board (PCB)s are housed.
Therefore, all feel to need a kind of printed circuit board (PCB) that is electrically connected the twisted-pair wire that two electric components use that comprises for a long time in the art.
The present invention is exactly the above-mentioned requirements that will satisfy the present technique field.The invention provides a kind of twisted-pair wire system that is embedded in the multilayer board.In a most preferred embodiment, two segmentations lead track intersected with each other and a plurality of otherwise be called the plating coating ventilating hole of via hole is arranged on first and second layers of printed circuit board (PCB) of the present invention.Two segmented conductor tracks on the ground floor are connected with two segmented conductor line tracks on the second layer by via hole, form two continuous conductive traces.Twisted-pair wire can be shielded by setting up ground trace at the either side of conductor tracks and setting up ground plane at the upper and lower of conductor tracks.Conductor tracks can also make it reach the specific turnover number of per unit length to be adjusted to specific electrical characteristic by dispose a plurality of via holes by suitable spacing.Continuous lead track can also be by making dielectric layer have certain thickness and conductor tracks being designed to have specific size and further being adjusted.
Fig. 1 adopts printed circuit board (PCB) of the present invention.
Fig. 2 is a schematic diagram of the present invention.
Fig. 3 is the flow chart of the process of twisted-pair wire manufacturing.
Fig. 4 is the schematic diagram of shielding twisted-pair wire.
The present invention can be applicable in the printed circuit board (PCB) that many kinds of manufacture methods make.Illustrate two kinds of manufacture methods of printed circuit board (PCB) below.
First kind of manufacture method is called laminating.Before this two Copper Foils were crimped on the formation end heart together with being clipped between the two the glass epoxy net that both are played insulation and bonding effect.Then on one of them Copper Foil, etch specific circuit.Be laminated together to form the lamination finished product with a plurality of through the heart of the etched end then, clip the glass epoxy net of insulation between each end heart, play insulation and bonding effect.But the outer copper foil layer of the outer bottom heart is normally without etched.
Then on the select location of lamination finished product, bore many holes.These holes are the via holes that are used to provide between each copper foil layer of interconnection.Remove drilling cuttings on the laminate bored the hole with the debris removal apparatus then.Then, make in the boring and conduct electricity, and electroplate outer surface in laminate electricity plated with copper.Subsequent usefulness subtracts etch from the undesired copper of surperficial ablation.Remaining copper just remains on via hole and the selected position as track and weld zone.When printed circuit board (PCB) afterwards the stage just can go into the soldering of pins type device in the via hole when assembling various device, surface-mounted device is soldered on the weld zone.
Before the device assembly process, the outer surface in laminate applies the protectiveness photosensitive dielectrics earlier.This photosensitive dielectrics often is called the soldering protecting film, can be the Probimer52 protecting film that Ciba-Geigy company produces, or other chemicals of meeting the requirements of the dielectric of industrial usefulness or photosensitive property.Then see through the fine weldering of a protecting film irradiation protecting film, make irradiated position produce polymerization with collimated light source.Subsequent, flushing is welded protecting films through the laminate of exposure to remove all fibres without exposure.Fibre weldering protecting film like this without exposure is removed, and just can touch weld zone and the via hole that passes circuit board.Then with the dry soldering protecting film that draws with processing of the method for heating.At this moment just can print out information such as the brief introduction of waiting to be arranged on the device on the printed circuit board (PCB) with the epoxy resin method of the use of ink and water.Last procedure is to spray very thin one deck anticorrisive agent toward the outer surface of printed circuit board (PCB), for example Entek (triazole copper) anticorrisive agent of Enthone company product.Can repair the printed circuit board (PCB) operation with that and assemble and weld the outward flange of usefulness with each device.
The another kind of more novel method of printed circuit board (PCB) of making is called surperficial stratiform wiring method.This method is the heart at the bottom of the copper foil around the first etching insulating epoxy glass web, the specific circuit of formation on one of them copper surface.Then on the copper of etching, apply the photosensitive dielectrics that resembles Probimer52 and so on.So photosensitive dielectrics is flushing after exposure, to remove unexposed dielectric.Unexposed part is through being commonly used to be provided with the via hole towards lower floor's copper wire.Then will do coarsely through the dielectric surface of exposure so that copper is adhered to thereon.The operation of this surface coarsening can be used float stone cream mechanical friction dielectric surface, and makes dielectric surface swelling with solvent, and both combine and carry out.Then toward electroplating other layer of copper layer through the dielectric surface of alligatoring, exposure with in the via hole of the circuit layer below leading to, subsequent etching on this copper layer forms second line layer and leads to the via hole of lower floor.This road add the operation of photosensitive dielectrics and copper can repeated several times to form multilayer line.
At this moment can on printed circuit board (PCB), hole and lead to other via holes of lower line with formation.Again with surface coarsening, and copper facing is so that form conductive vias and electroplate outer surface in the hole that gets out.Then with subtracting undesired copper on the etch ablation surface.Remaining copper just remains on via hole and the selected position as track and weld zone.Then apply the protectiveness photosensitive dielectrics toward the outer surface of laminate as mentioned above, expose again and wash, so that can touch the weld zone of entire circuit plate and pass the via hole of circuit board.At this moment usually with the circuit board that method is dry and processing draws of heating, print out the information that resembles brief introduction of waiting to be attached to each device on the printed circuit board (PCB) and so on epoxy resin prepared Chinese ink again.Subsequent outer surface toward printed circuit board (PCB) is spilt the anticorrisive agent that very thin one deck resembles Entek and so on.
Consult Fig. 1, there is shown and use printed circuit board (PCB) 10 of the present invention.Printed circuit board (PCB) can have many flaggies, shown in flaggy among the figure 12.Printed circuit board (PCB) 10 can be equipped with integrated chip 22 and 24, interconnects with twisted-pair wire 26.Chip 22 can be a preamplifier, and for the low level audible sounds of amplifying from microphone 34, chip 24 can be D/A and A/D converter (DAC/ADC).Twisted-pair wire 26 can be laid in any different flaggies of printed circuit board (PCB) or top layer place.Chip 24 can connect I/ O circuit 28, and 28 in circuit is connected with outside acoustic apparatus 20 again.Can adorn graph data subsystem 30 on the printed circuit board (PCB) 10 and have the CPU (CPU) 32 of integrated system memory.
As can see from Figure 1, can be amplified by preamplifier 24, can be sent to outside acoustic apparatus 20 by twisted-pair wire 26 from the analog signal of preamplifier from the audible sounds of microphone 34.Analog signal through amplifying also can convert digital signal to by DAC/ADC22, and the digital signal record that sends CPU32 to is in system storage.Otherwise, also can convert analog signal to from the pre-recorded digital signal of system storage by DAC/ADC22, send chip 24 to through twisted-pair wire 26 again.Should be noted that in the case, chip 24 can be the amplifier that is connected with loud speaker again.May contain some undesired signal that twisted-pair wire is collected from graph data subsystem 30 or CPU32 in the analog signal.Therefore, can be at an one or both ends of the twisted-pair wire undesired signal of difference receiver 27 filterings.
Fig. 2 is the schematic diagram of twisted-pair wire of the present invention.Twisted-pair wire 26 is made up of track lead 52 and 54. Track lead 52 and 54 starting point can be in dielectric the same sides or homonymy not.In most preferred embodiment of the present invention, track lead 52 and 54 starting point are in the same side of dielectric 60. Track lead 52 and 54 is replacing from the dielectric layer 56 of dielectric 60 and is being applied to dielectric layer 58.In other words, when track lead 52 is during on dielectric upper strata 56, track lead 54 is in lower floor 58.Two track leads 52 and 54 pass via hole 62 cablings from a dielectric dielectric layer to another dielectric layer.Two track leads also intersected with each other so that reach stranded effect.Though the track lead of seeing among figure alternate configurations between two adjacent courses, self-evident these tracks also can be between the flaggy of any number of multilayer circuit board alternate configurations.
Per inch turnover number that adopts in the size of track lead, the twisted-pair wire and the spacing between each layer all can be controlled to obtain different electrical characteristic (for example frequency response characteristic).Should be noted that the turnover number of per inch can obtain (being that each via hole can dispose with big spacing or with little spacing each other) by the spacing that changes between each via hole.
Fig. 3 is a process flow diagram of making twisted-pair wire 26.For illustrating, adopted above-mentioned first method.What say here in addition, is the manufacturing situation of two layer printed circuit boards.In operation 300, dielectric layer is pressed in the both sides of Copper Foil.Said above that this was by two Copper Foil thin slices are made compressed together the reaching of insulating epoxy glass web (or dielectric of any other type) that copper sheet is insulated from each other and be bonded together together with being clipped between two thin slices.Then, on the position that the laminate finished product is selected, bore many holes in operation 310.These holes are used to provide the interconnection vias hole between dielectric upper strata and the lower floor.At this moment can remove drilling cuttings on the drilled laminate with the debris removal instrument.In operation 320,, make the hole that gets out have conductivity and electro-coppering surface so copper is electroplated onto on the laminate.In operation 330.The copper surface etching is become the specific circuit of twisted-pair wire.
As shown in Figure 4, twisted-pair wire also can be shielded.For example, in above-mentioned operation 330, also the etching again of copper surface can be formed ground trace 70 in the twisted-pair feeder both sides.In addition, also can add ground plane 72 in dielectric the upper and lower.Come with dielectric isolation between ground plane 72 and the twisted-pair wire layer.
Though be specifically to show and illustrate of the present invention above with regard to most preferred embodiment of the present invention.But the technology people in present technique field know, can make amendment aspect form and the details to the foregoing description under the prerequisite that does not break away from spirit of the present invention and scope.
Claims (17)
1. a printed circuit board (PCB) has first flaggy and second flaggy, it is characterized in that comprising:
The lead track of at least two segmentations on first flaggy and second flaggy, intersected with each other;
A plurality of via holes at least two segmented conductor line tracks of first flaggy and at least two segmentation tracks of second flaggy are coupled together, form two continuous lead tracks;
At first ground plane on first flaggy and second ground plane under second flaggy;
A continuous ground track at the either side of described two continuous lead tracks is used to shield described lead track.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that, described a plurality of via holes by the predetermined spacing configuration, make two lead tracks be the first predetermined electrical characteristic each other.
3. printed circuit board (PCB) as claimed in claim 2 is characterized in that, makes two lead tracks further be the second predetermined electrical characteristic with the dielectric of specific thicknesses.
4. printed circuit board (PCB) as claimed in claim 3 is characterized in that, thereby described two lead tracks are got specific size and further are the 3rd predetermined electrical characteristic.
5. printed circuit board (PCB) as claimed in claim 4 is characterized in that, separates with dielectric respectively between described first and second ground planes and first flaggy and second flaggy.
6. a multilayer board supplies the installing and the first and second electronic component usefulness that interconnect, and it is characterized in that it comprises:
The installing device is used for installing first and second electronic components;
Interconnection device, for the interconnection first and second electronic component usefulness, described interconnection device comprises:
The lead track of at least two segmentations on first flaggy and second flaggy is intersected with each other;
A plurality of via holes at least two segmented conductor line tracks on first flaggy and at least two segmentation tracks on second flaggy are coupled together, form two continuous lead tracks;
At first ground plane on first flaggy and second ground plane under second flaggy;
A continuous ground track at the either side of described two continuous lead tracks is used to shield described lead track.
7. multilayer board as claimed in claim 6 is characterized in that, described a plurality of via holes make two lead tracks be the first predetermined electrical characteristic by the preset space length configuration each other.
8. multilayer board as claimed in claim 7, its feature will make two lead tracks further be the second predetermined electrical characteristic with the dielectric of specific thicknesses.
9. printed circuit board (PCB) as claimed in claim 8 is characterized in that, thereby two lead tracks are got specific size and further are the 3rd predetermined electrical characteristic.
10. multilayer board as claimed in claim 9 is characterized in that, comes with dielectric isolation between described first and second ground planes and first flaggy and second flaggy.
11. multilayer board as claimed in claim 10 is characterized in that, it comprises that also a difference receiver is coupled on the two lead tracks and is coupled on first electronic component, so that the noise signal that filtering two lead tracks are collected.
12. a method of making the twisted-pair wire in the multilayer board is characterized in that it comprises following operation:
Make at least two segmented conductor line track cross on printed circuit board (PCB) first and second flaggies;
At least two segmented conductor line tracks on first flaggy and at least two segmented conductor line tracks on second flaggy are coupled together by a plurality of via holes, form two continuous lead tracks;
On first flaggy, add first ground plane, under second flaggy, add second ground plane;
Either side at described two continuous lead tracks adds a continuous ground trace, is used to shield described lead track.
13. method as claimed in claim 12 is characterized in that, it also comprises such operation: make a plurality of via holes each other by the preset space length configuration, make described two lead tracks be the first predetermined electrical characteristic.
14. method as claimed in claim 13 is characterized in that, it comprises that the dielectric with specific thicknesses makes described two lead tracks further be the operation of the second predetermined electrical characteristic.
15. method as claimed in claim 14 is characterized in that, thereby it also comprises two lead tracks are designed to have the operation that specific size further is the 3rd predetermined electrical characteristic.
16. method as claimed in claim 15 is characterized in that, it also comprises the operation that comes with dielectric isolation respectively between described first and second ground planes and first flaggy and second flaggy.
17. method as claimed in claim 16 is characterized in that, the end that it also is included in the lead track adds the operation of difference receiver with the filtering noise signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97113444A CN1104181C (en) | 1997-05-21 | 1997-05-21 | Printed circuit board with integrated twisted pair conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97113444A CN1104181C (en) | 1997-05-21 | 1997-05-21 | Printed circuit board with integrated twisted pair conductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1200010A CN1200010A (en) | 1998-11-25 |
| CN1104181C true CN1104181C (en) | 2003-03-26 |
Family
ID=5172678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97113444A Expired - Fee Related CN1104181C (en) | 1997-05-21 | 1997-05-21 | Printed circuit board with integrated twisted pair conductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1104181C (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101583250B (en) * | 2008-05-15 | 2011-04-13 | 华为技术有限公司 | Method for processing through hole of printed circuit board, printed circuit board and communication equipment |
| US7812426B2 (en) * | 2008-05-30 | 2010-10-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | TSV-enabled twisted pair |
| JP5083460B2 (en) * | 2009-03-30 | 2012-11-28 | 富士通株式会社 | Differential path replacement parts, printed circuit boards, and electronic devices |
| CN103702507B (en) * | 2012-09-27 | 2016-12-07 | 国基电子（上海）有限公司 | transmission line system |
| US9101046B2 (en) * | 2013-01-29 | 2015-08-04 | Mediguide Ltd. | Shielded twisted pair of conductors using conductive ink |
| JP6399602B2 (en) | 2015-03-23 | 2018-10-03 | 三菱重工サーマルシステムズ株式会社 | Circuit board for power conversion and electric compressor |
| JP6516357B2 (en) * | 2015-04-20 | 2019-05-22 | 三菱重工サーマルシステムズ株式会社 | Circuit board for electric power conversion and electric compressor |
| US9799319B1 (en) * | 2016-05-24 | 2017-10-24 | Bose Corporation | Reducing radio frequency susceptibility in headsets |
| JP2018160492A (en) * | 2017-03-22 | 2018-10-11 | 日立金属株式会社 | Multilayer wiring board and differential transmission module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5397862A (en) * | 1993-08-31 | 1995-03-14 | Motorola, Inc. | Horizontally twisted-pair planar conductor line structure |
-
1997
- 1997-05-21 CN CN97113444A patent/CN1104181C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5397862A (en) * | 1993-08-31 | 1995-03-14 | Motorola, Inc. | Horizontally twisted-pair planar conductor line structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1200010A (en) | 1998-11-25 |
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