CN101583250B - Method for processing through hole of printed circuit board, printed circuit board and communication equipment - Google Patents
Method for processing through hole of printed circuit board, printed circuit board and communication equipment Download PDFInfo
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- CN101583250B CN101583250B CN2008100942002A CN200810094200A CN101583250B CN 101583250 B CN101583250 B CN 101583250B CN 2008100942002 A CN2008100942002 A CN 2008100942002A CN 200810094200 A CN200810094200 A CN 200810094200A CN 101583250 B CN101583250 B CN 101583250B
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Abstract
The invention discloses a method for processing a through hole of a printed circuit board, a printed circuit board and communication equipment. The method comprises the following steps: a single layerof the printed circuit board confirmed to be drilled is singly processed so as to obtain a metallic outer-layer shielded through hole; a conductive body is arranged in an axial parallel direction in the obtained outer-layer shielded through hole, and an insulating medium is contained between the conductive body and the outer-layer shielded through hole; and the conductive body is connected with aconfirmed cable. The printed circuit board comprises at least one single-layer board, wherein the single-layer board contains the metallic outer-layer shielded through hole; an axle centre in the out er-layer shielded through hole contains the conductive body, and the insulating medium is contained between the conductive body and the outer-layer shielded through hole; the conductive body is telecommunicated with the cable; and the position of the outer-layer shielded through hole wall, corresponding to the connecting part of the cable, contains a groove, and the insulating medium is filled in the groove. The technical scheme can lead signals at all layers in the printed circuit board to be connected with each other.
Description
Technical field
The present invention relates to printed substrate and make the field, be specifically related to a kind of printed substrate method for processing through hole and printed substrate, communication equipment.
Background technology
In traditional multilayer circuit board, the signal interconnection between the different layers is to connect by the metallization via hole.So-called metallization via hole (hereinafter to be referred as via hole) is meant behind machine drilling or the laser calcination pore-forming, electroplates or adopts other modes to make the surface in hole enclose the hole that forms behind the metal.In being applied to the multilayer circuit board of high-speed interconnect, device density is all more and more higher, and via pitch is more and more littler, and it is more and more serious to cause crosstalking, and in addition, high density makes the radius-thickness ratio of multilayer circuit board increase, and causes serious impedance mismatching.For addressing these problems, coaxial via hole technology has appearred.
Coaxial via hole adopts the notion of similar coaxial cable, and internal layer signal via (hereinafter to be referred as the internal layer via hole) is surrounded by outer shielding via hole, two via hole axially parallels, and with one heart, material is a conductor, thereby has avoided crosstalking between the signal.Fill dielectric between outer shielding via hole and internal layer via hole, the coaxial configuration impedance Z satisfies relation with the dielectric constant (Er) of inside diameter D, internal layer via hole outside diameter d and the dielectric of outer shielding via hole
Therefore can by control above-mentioned Several Parameters D, d, Er controls through hole impedance Z, makes through hole impedance Z consistent with other part impedances on the signalling channel, thereby guarantee the impedance continuity of whole passage, avoid impedance mismatching.
Prior art in making with the method for the multilayer printed circuit board of coaxial via hole is:
In multilayer printed circuit board processing, each stacked pressure of printed substrate together, thereby be formed with the sandwich construction of top layer and bottom.Sandwich construction is holed such as adopting machine drilling, constitute a skin shielding via hole from the bottom to the top layer, fill dielectric in this skin shielding via hole, boring obtains the internal layer via hole again, inserts conductor in this internal layer via hole hole.Then, in the top layer of sandwich construction and bottom, cover insulating medium layer and conductive pattern layer again, and mask film covering, electroplate again, the conductor in signal lead and the internal layer via hole is coupled together, remove the mask of bottom and top layer again, obtain coaxial via structure.At last, the thin multilayer circuit board that contains several groups of coaxial via structures is forced together just obtained thick multilayer circuit board with coaxial via structure.
As shown in Figure 1, multilayer circuit board is to be forced together by two groups of thin multilayer circuit boards to form, above one group have a coaxial via hole, below one group also have a coaxial via hole, also having a coaxial via hole is the coaxial via hole that cascade formation is carried out in two groups of holes.The outer shielding of 10 expressions via hole among the figure, 11 expression internal layer via holes, the conductor in the 12 expression internal layer via holes, 13 expression signal lead, the dielectric layer of 14 expression wiring boards, 15 expression plane layers.
In research and practice process to prior art, the inventor finds that there is following problem in prior art:
The prior art scheme is the sandwich construction after obtaining earlier pressing, this sandwich construction holed obtain outer shielding via hole, in the hole, fill dielectric, obtain coaxial via structure after boring obtains the internal layer via hole and inserts conductor then, so just can not realize from one deck simultaneously respectively to the random layer outlet, promptly can't realize the random layer signal interconnection.
Summary of the invention
The technical problem that the embodiment of the invention will solve provides a kind of printed substrate method for processing through hole and printed substrate, communication equipment, can make random layer signal interconnection in the printed substrate.
The embodiment of the invention provides a kind of printed substrate method for processing through hole, comprising: the individual layer of definite printed substrate of holing is processed separately obtained metallized outer shielding via hole; Shielded the hole wall position corresponding at described skin, and removed the screen conductor and fill dielectric by offering groove with cabling wiring place; On the axially parallel direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole; Described conductive body is connected with the cabling of determining.
The embodiment of the invention provides a kind of printed substrate: comprise at least one lamina; Described lamina contains metallized outer shielding via hole; Conductive body is contained in axle center in described outer shielding via hole, contains dielectric between described conductive body and described outer shielding via hole; Described conductive body is connected with cabling telecommunications; Described skin shielded the hole wall position corresponding with cabling wiring place and contained flutedly, was filled with dielectric in the described groove.
The embodiment of the invention provides a kind of communication equipment, comprises printed substrate: described printed substrate comprises at least one lamina; Described lamina contains metallized outer shielding via hole; Conductive body is contained in axle center in described outer shielding via hole, contains dielectric between described conductive body and described outer shielding via hole; Described conductive body is connected with cabling telecommunications; The described outer shielding via hole position corresponding with cabling wiring place contains fluted, is filled with dielectric in the described groove.
Technique scheme as can be seen, the prior art scheme is that the sandwich construction after obtaining earlier pressing is holed and obtained coaxial via structure, so just can not realize from one deck simultaneously respectively to the random layer outlet, and the via hole of embodiment of the invention technical scheme is by the individual layer sectional making, process separately and obtain metallized outer shielding via hole, on the axially parallel direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole, thereby can realize making random layer signal interconnection in the printed substrate.
Description of drawings
Fig. 1 is the multilayer printed circuit board schematic diagram of the coaxial via hole of prior art band;
Fig. 2 is embodiment of the invention printed substrate method for processing through hole first pass figure;
Fig. 3 is embodiment of the invention printed substrate method for processing through hole second flow chart;
Fig. 4 is four layers of wiring board schematic diagram of the embodiment of the invention;
Fig. 5 is that a pair of ground floor copper clad plate of the embodiment of the invention is processed schematic diagram;
Fig. 6 carries out the connection procedure schematic diagram with via hole signal and cabling in the embodiment of the invention one;
Fig. 7 is that a pair of ground floor insulating medium layer of the embodiment of the invention is processed schematic diagram;
Fig. 8 is the schematic diagram after a pair of second layer copper clad plate processing of the embodiment of the invention;
Fig. 9 is that the embodiment of the invention one is carried out pressing with each layer and obtained multilayer circuit board process schematic diagram;
Figure 10 is that the embodiment of the invention one is carried out the graphics process schematic diagram at the skin of the multilayer circuit board of band via structure;
Figure 11 is the alternative steps schematic diagram that is used in the embodiment of the invention two implementing;
Figure 12 is the alternative steps schematic diagram that is used in the embodiment of the invention three implementing;
Figure 13 is the alternative steps schematic diagram that is used in the embodiment of the invention four implementing;
Figure 14 is a control gun drilling profile in the embodiment of the invention four;
Figure 15 is an embodiment of the invention printed substrate schematic diagram.
Embodiment
The embodiment of the invention provides a kind of printed substrate method for processing through hole, can make random layer signal interconnection in the printed substrate.
Seeing also Fig. 2, is embodiment of the invention printed substrate method for processing through hole first pass figure, comprising:
The embodiment of the invention is each layer of processing separately in the multilayer circuit board, and said each layer is meant insulating medium layer or copper clad plate, rather than refers to independent conductor layer (as signals layer and plane layer).Copper clad plate is meant a kind of insulating medium layer that presses copper sheet at its positive and negative in advance.In the embodiment of the invention, earlier according to the design of multilayer circuit board, definite individual layer that need carry out the printed substrate of coaxial via hole processing, these individual layers are holed, for example machine drilling or laser drill are electroplated again, obtain metallized outer shielding via hole.
On step 202, the coaxial direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole;
This step can have dual mode, and mode one is: behind the skin shielding via hole that above-mentioned steps obtains, boring again behind the filling dielectric obtains the internal layer via hole in the hole, and this internal layer via hole is coaxial with outer shielding via hole, again filled conductive object in the hole of new brill.Can directly fill conductor, for example also can adopt other modes to make to enclose in the hole metal material such as copper (can by sinking realizations such as copper, plating).
Also have a kind of mode to be: on the coaxial direction in the described skin shielding via hole that obtains, directly to be pressed into the conductor of tape insulation medium, also to realize coaxial via structure.
After above-mentioned steps obtains coaxial via structure, by traditional handicraft electroplate, graphics process, the conductive body in the internal layer via hole is linked to each other with outside cabling, thereby realizes that the internal layer via hole of coaxial configuration and cabling interconnect.
Need to prove,, can draw cabling, be connected with other cablings that need be connected by increasing a dielectric layer if the conductive body of internal layer via hole is wanted outlet at this moment.
If two-layer above multilayer circuit board after step 203, also need carry out pressing with the individual layer of each processing, the outer shield opening of correspondence position carries out cascade during pressing, finally obtains the coaxial via hole of multilayer circuit board.
And then the embodiment of the invention also provides a kind of method for processing through hole.Seeing also Fig. 3, is embodiment of the invention printed substrate method for processing through hole second flow chart, comprises step:
The embodiment of the invention is each layer of processing separately in the multilayer circuit board, and said each layer is meant insulating medium layer or copper clad plate, rather than refers to independent conductor layer (as signals layer and plane layer).According to the design of multilayer circuit board, definite individual layer that need contain the printed substrate of coaxial via hole is holed these individual layers, and for example machine drilling or laser drill are electroplated again, obtains metallized outer shielding via hole.
Through after the step 301, the metal that outer shielding via hole top layer is enclosed is also referred to as the screen conductor, and the cabling of the signal of printed substrate may pass through this correspondence position, therefore can remove the screen conductor by the mode of offering groove.The degree of depth of groove can be the entire depth of outer shielding via hole, promptly whole screen conductor is run through and removes, and also can be the partial depth of outer shielding via hole, for example half, as long as it is just passable to remove partly shielding effect layer conductor.The area of groove as long as the area that the covering cabling occupies is just passable, can be at the described outer shielding via hole position occupied area corresponding with cabling wiring place more than or equal to the screen conductor.Center position as for groove, because the screen conductor that outer shielding via hole top layer forms is equivalent to a toroidal, so, the center position of groove preferably is positioned at the ring central point of this annulus, can certainly be to the skew of the lateral direction of annulus, the area that just occupies in this position of the area of groove like this greater than the screen conductor.The shape of groove can be round, also can be circular ring type etc.
Offer groove, can adopt variety of way, adopting the control gun drilling is a kind of preferably mode.So-called control gun drilling just is meant the degree of depth that needs keyhole when holing, and obtains the hole of set depth.The degree of depth and openings of sizes for this hole, signal shielding and impedance Control requirement in the time of can considering the multilayer circuit board design, such as the depth size in hole for the influence of walking line impedence, at least be greater than screen to walking the influence of line impedence, A/F can not influence under the application scenarios the control requirement of impedance and the requirement of crosstalking between the signal.With reference to noted earlier, the degree of depth in hole specifically can be the entire depth or the partial depth of outer shielding via hole, the center of circle in hole preferably is positioned at the ring central point of this annulus, the area in hole, as long as it is just passable to cover the area that cabling occupies, the area that can occupy in this position more than or equal to the screen conductor.The control gun drilling can be machine drilling or laser drill form.In addition, in the processing technology of control gun drilling, can also directly through hole be processed in the hole, also just be equivalent to the entire depth of outer shielding via hole, also just not need the degree of depth of keyhole this moment.
Need explanation to be,, then do not need this step, draw outside the outer shielding via hole with cabling if desired, then carry out this step if coaxial internal layer via hole does not need to adopt cabling to draw outside the outer shielding via hole signal.
By this step, can avoid skin the shielding via hole and the cabling short circuit that links to each other with the internal layer via hole of coaxial configuration, thereby guarantee that signal lead can link to each other with the internal layer via hole with layer, and not need to increase extra layer.
On step 303, the coaxial direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole;
This step can have dual mode, and mode one is: behind the skin shielding via hole that above-mentioned steps obtains, boring again behind the filling dielectric obtains the internal layer via hole in the hole, and this internal layer via hole is coaxial with outer shielding via hole, again filled conductive object in the hole of new brill.Can directly fill conductor, for example also can adopt other modes to make to enclose in the hole metal material such as copper (can by sinking realizations such as copper, plating).
Also have a kind of mode to be: on the coaxial direction in the described skin shielding via hole that obtains, directly to be pressed into the conductor of tape insulation medium, also to realize coaxial via structure.
After above-mentioned steps obtains coaxial via structure, by traditional handicraft electroplate, graphics process, the conductive body in the internal layer via hole is linked to each other with outside cabling, thereby realizes that the internal layer via hole of coaxial configuration and cabling interconnect.
If be doubling plate, then the individual layer of processing is a copper clad plate separately, just can obtain the coaxial via hole of wiring board after step 304.If two-layer above multilayer circuit board then also need carry out pressing with the individual layer of each processing, the outer shield opening of correspondence position carries out cascade during pressing, finally obtains the coaxial via hole of multilayer circuit board.
For conveniently better understanding embodiment of the invention method, describe in detail below in conjunction with concrete application examples.
With being made as example but being not limited to this of four layers of wiring board, introduce embodiment of the invention technical scheme in detail below.As shown in Figure 4, be four layers of wiring board schematic diagram of the embodiment of the invention.These four layers of wiring boards are made of two copper clad plates (20 expression ground floor copper clad plates among the figure, 22 expression second layer copper clad plates) and insulating medium layer (among the figure shown in 21); Comprise four conductor layers, wherein, ground floor (L1) and the 4th layer (L4) are ground plane, and the second layer (L2) and the 3rd layer (L3) are signals layers.The outer shielding of 16 expressions via hole among the figure, 17 expression internal layer via holes, conductor is filled in the inside, and the oblique line around the internal layer via hole is partly represented the dielectric that insulate, the groove that 18 expressions are offered.
Introduce embodiment one earlier:
One, the ground floor copper clad plate is processed:
Seeing also Fig. 5, is that a pair of ground floor copper clad plate of the embodiment of the invention is processed schematic diagram:
Step 501-502, this layer copper clad plate holed, electroplated, obtain first metallization via hole, be i.e. the skin of coaxial via hole shielding via hole;
The content of removing the screen conductor specifically can be referring to the description in the preceding step 302.
Need explanation to be,, then do not have this step, draw outside the shielding via hole with cabling if desired, then carry out this step if coaxial internal layer via hole does not need to draw outside the shielding via hole with cabling.
By this step, guarantee signal lead can with link to each other with the internal layer via hole in the layer screen, then do not need to increase extra layer and could realize the outlet that interconnects of coaxial via hole signal and respective layer.
Step 504-505, boring again behind the filling dielectric in skin shielding via hole;
The detailed process of this step 507 sees also Fig. 6, is in the embodiment of the invention one coaxial via hole signal and cabling to be carried out the connection procedure schematic diagram, comprising:
Two, the ground floor insulating medium layer is processed:
Seeing also Fig. 7, is that a pair of ground floor insulating medium layer of the embodiment of the invention is processed schematic diagram:
Three, second layer copper clad plate is processed:
Do not have coaxial via hole owing on the second layer copper clad plate, only need get final product by traditional multilayer circuit board processing, the situation after the processing sees also the schematic diagram after a pair of second layer copper clad plate of Fig. 8 embodiment of the invention is processed.
Four, each layer copper clad plate and insulating medium layer pressing in order:
The pressing situation sees also Fig. 9 embodiment of the invention one and each layer carried out pressing obtains multilayer circuit board process schematic diagram.
Five, make figure by traditional handicraft processing at the multilayer circuit board top layer:
In the finishing operation of wiring board processing, make figure by conventional process flow at the multilayer circuit board top layer, thereby finish last whole multilayer circuit board processing, situation after machining as shown in figure 10, being the embodiment of the invention one carries out the graphics process schematic diagram at the skin with the multilayer circuit board of coaxial via structure.
Can find, the technical scheme that example one provides, by the individual layer sectional making, process separately and obtain metallized outer shielding via hole, on the axially parallel direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole, thereby can realize making random layer signal interconnection in the printed substrate, remove the screen conductor and fill dielectric by the mode of offering groove in addition, can not need to increase extra layer like this and realize coaxial via hole signal and respective layer interconnection outlet, also just can realize the coaxial via interconnection of double sided board, can also reduce the multilayer circuit board number of plies.
Below introduce the embodiment of the invention two, embodiment two technical schemes and embodiment one are basic identical, and the main distinction is after machining outer shielding via hole, can be by being pressed into the conductor of tape insulation medium, thus obtain coaxial via structure.Coaxial via hole for control gun drilling situation is arranged can recharge dielectric behind the conductor that is pressed into the tape insulation medium.
Seeing also Figure 11, is the alternative steps schematic diagram that is used in the embodiment of the invention two implementing.
Obtain outer shielding via hole when the individual layer copper clad plate being holed, electroplating, and after adopting the control gun drilling to remove partly shielding effect layer conductor on skin shielding via hole and the cabling lap position, directly be pressed into the conductor of tape insulation medium to skin shielding via hole, so do not need not hole again as in skin shielding via hole, filling dielectric among the embodiment one, and in the hole of new brill the filled conductive object.
The technical scheme of embodiment two also can reach embodiment one described beneficial effect, and adopts the mode of the conductor that is pressed into the tape insulation medium, and enforcement can be simpler.
Below introduce the embodiment of the invention three, embodiment three technical schemes and embodiment one are basic identical, the main distinction is after the skin shielding via hole of filling dielectric is holed again, not in the hole of new brill, to fill conductor, but, play the effect of conductor equally by depositing one deck chemical copper at new hole wall of holing or electroplating and enclose layer of metal.For copper clad plate, after finishing the boring of internal layer via hole, do not electroplate at once, but re-plating after finishing graphic making, it will be hollow obtaining the internal layer via hole like this, rather than solid.For insulating medium layer, the internal layer via hole of coaxial via hole also can adopt this mode to process.Seeing also Figure 12, is the alternative steps schematic diagram that is used in the embodiment of the invention three implementing.
The technical scheme of embodiment three also can reach embodiment one described beneficial effect, and provides by depositing one deck chemical copper at new hole wall of holing or electroplating and enclose layer of metal to realize filling the another kind of mode of conductor.
Below introducing the embodiment of the invention four, see also Figure 13, is the alternative steps schematic diagram that is used in the embodiment of the invention four implementing.Figure 14 is a control gun drilling profile in the embodiment of the invention four.
The main distinction of embodiment four and above-mentioned three embodiment is in the processing technology of control gun drilling, through hole is processed in the hole, this moment, shield effectiveness was less better, but because the remainder of internal layer via hole links to each other with last lower plane, still can play the effect of control group and shielding, so adopt this mode just to reduce difficulty of processing, thereby can improve working (machining) efficiency.Above-mentioned three embodiment can adopt this mode.
Need to prove that embodiment of the invention technical scheme is to illustrate with the situation that contains a conductor in the internal layer via hole, be equally applicable to the multilayer circuit board interconnection with a plurality of inner wire structures of containing of shielding, its principle is the same.
Foregoing describes embodiment of the invention printed substrate method for processing through hole in detail, and corresponding, the embodiment of the invention provides a kind of printed substrate.
Seeing also Figure 15, is embodiment of the invention printed substrate schematic diagram.
As described in Figure 15, printed substrate comprises: the individual layer 151,152,153 of printed substrate.
Individual layer the 151, the 153rd, copper clad plate, individual layer 152 is insulating medium layers.Wherein, individual layer 151 and 152 is the individual layers that determine to need boring, and individual layer 153 is not need the individual layer of holing, and processes by traditional handicraft.
For the individual layer 151 and 152 of printed substrate, contain metallized outer shielding via hole, described outer shielding via hole is that described individual layer is processed acquisition separately; Conductive body is contained in axle center in described outer shielding via hole, contains dielectric between described conductive body and described outer shielding via hole; Described conductive body is connected with the cabling telecommunications of determining, described skin shielded the hole wall position corresponding with cabling wiring place and contains flutedly, and described groove is filled with dielectric.
The metal that outer shielding via hole top layer is enclosed is also referred to as the screen conductor, and the cabling of the signal of printed substrate may pass through this correspondence position, therefore can remove the screen conductor by the mode of offering groove.The degree of depth of groove can be the entire depth of outer shielding via hole, promptly whole screen conductor is run through and removes, and also can be the partial depth of outer shielding via hole, for example half, as long as it is just passable to remove partly shielding effect layer conductor.The area of groove as long as the area that the covering cabling occupies is just passable, can be at the described outer shielding via hole position occupied area corresponding with cabling wiring place more than or equal to the screen conductor.Center position as for groove, because the screen conductor that outer shielding via hole top layer forms is equivalent to a toroidal, so, the center position of groove preferably is positioned at the ring central point of this annulus, can certainly be to the skew of the lateral direction of annulus, the area that just occupies in this position of the area of groove like this greater than the screen conductor.The shape of groove can be round, also can be circular ring type etc.Offer groove, can adopt variety of way, adopting the control gun drilling is a kind of preferably mode.
During with individual layer 151,152,153 pressings, individual layer 151 and 152 correspondence positions each have the cascade of an outer shielding via hole, obtain the coaxial via hole after the pressing.
Boring is contained in the individual layer 151 of described printed substrate and 152 the skin shielding via hole position corresponding with cabling wiring place, and described boring is filled with dielectric.Described boring is the hole or the through hole of the set depth that adopts the control gun drilling and obtain.
Comprise the internal layer via hole of isolating in the described outer shielding via hole by dielectric, the conductive body that contains on the coaxial direction in described outer shielding via hole, be the conductor of filling in the described internal layer via hole, or appended conductive layer on the hole wall of described internal layer via hole.
The individual layer of described printed substrate is insulating medium layer or copper clad plate.
The embodiment of the invention also provides a kind of communication equipment, comprises printed substrate.Described printed substrate comprises at least one lamina; Described lamina contains metallized outer shielding via hole; Conductive body is contained in axle center in described outer shielding via hole, contains dielectric between described conductive body and described outer shielding via hole; Described conductive body is connected with cabling telecommunications; Described skin shielded the hole wall position corresponding with cabling wiring place and contained flutedly, was filled with dielectric in the described groove.Concrete structure such as Figure 15 of printed substrate describe.
In sum, the prior art scheme is that the sandwich construction after obtaining earlier pressing is holed and obtained coaxial via structure, so just can not realize from one deck simultaneously respectively to the random layer outlet, and the via hole of embodiment of the invention technical scheme is by the individual layer sectional making, process separately and obtain metallized outer shielding via hole, on the axially parallel direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole, thereby can realize making random layer signal interconnection in the printed substrate.
Further, embodiment of the invention technical scheme is to shield the hole wall position corresponding with cabling wiring place at described skin, remove the screen conductor and fill dielectric by the mode of offering groove, extra layer be can not need to increase like this and coaxial via hole signal and respective layer interconnection outlet realized, also just can realize the coaxial via interconnection of double sided board, can also reduce the multilayer circuit board number of plies.
More than a kind of printed substrate method for processing through hole that the embodiment of the invention provided and printed substrate, communication equipment are described in detail, for one of ordinary skill in the art, thought according to the embodiment of the invention, part in specific embodiments and applications all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (16)
1. a printed substrate method for processing through hole is characterized in that, comprising:
The individual layer of definite printed substrate of holing is processed the metallized outer shielding via hole of acquisition separately;
Shielded the hole wall position corresponding at described skin, and removed the screen conductor and fill dielectric by offering groove with cabling wiring place;
On the axially parallel direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole;
Described conductive body is connected with the cabling of determining.
2. printed substrate method for processing through hole according to claim 1 is characterized in that:
With at least two individual layer pressings that obtain by above-mentioned processing, the cascade of the skin of described two individual layer correspondence positions shielding via hole.
3. printed substrate method for processing through hole according to claim 1 and 2 is characterized in that:
Describedly remove the screen conductor and be specially by offering groove:
Adopt the control gun drilling to remove partly shielding effect layer conductor, perhaps, be drilled to through hole and remove the screen conductor.
4. printed substrate method for processing through hole according to claim 1 and 2 is characterized in that:
On the coaxial direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole and be specially:
Fill dielectric in the described skin shielding via hole that obtains after, boring obtains the internal layer via hole, fills conductor in described internal layer via hole, perhaps, and with conductive layer on the pore lining of described internal layer via hole.
5. printed substrate method for processing through hole according to claim 4 is characterized in that:
Described conductive layer on the pore lining of described internal layer via hole is obtained by heavy copper or plating.
6. printed substrate method for processing through hole according to claim 1 and 2 is characterized in that:
On the coaxial direction in the described skin shielding via hole that obtains, insert conductive body, contain dielectric between described conductive body and described outer shielding via hole and be specially:
On the coaxial direction in the described skin shielding via hole that obtains, directly be pressed into the conductor of tape insulation medium.
7. printed substrate method for processing through hole according to claim 2 is characterized in that:
The individual layer of described printed substrate is insulating medium layer or copper clad plate.
8. printed substrate is characterized in that:
Comprise at least one lamina;
Described lamina contains metallized outer shielding via hole; Conductive body is contained in axle center in described outer shielding via hole, contains dielectric between described conductive body and described outer shielding via hole; Described conductive body is connected with cabling telecommunications;
Described skin shielded the hole wall position corresponding with cabling wiring place and contained flutedly, was filled with dielectric in the described groove.
9. printed substrate according to claim 8 is characterized in that:
The lamina of described printed substrate is more than two, the skin shielding via hole cascade of adjacent monolayer plate correspondence position.
10. it is characterized in that according to Claim 8 or 9 described printed substrates:
Comprise the internal layer via hole of isolating in the described outer shielding via hole by dielectric, the conductive body that contains on the coaxial direction in described outer shielding via hole is the conductor of filling in the described internal layer via hole, or appended conductive layer on the hole wall of described internal layer via hole.
11. according to Claim 8 or 9 described printed substrates, it is characterized in that:
The area of described groove shields the via hole position occupied area corresponding with cabling wiring place more than or equal to the screen conductor at described skin.
12. according to Claim 8 or 9 described printed substrates, it is characterized in that:
Being shaped as of described groove is round.
13. printed substrate according to claim 9 is characterized in that:
The lamina of described printed substrate is insulating medium layer or copper clad plate.
14. a communication equipment comprises printed substrate, it is characterized in that:
Described printed substrate comprises at least one lamina;
Described lamina contains metallized outer shielding via hole; Conductive body is contained in axle center in described outer shielding via hole, contains dielectric between described conductive body and described outer shielding via hole; Described conductive body is connected with cabling telecommunications;
Described skin shielded the hole wall position corresponding with cabling wiring place and contained flutedly, was filled with dielectric in the described groove.
15. communication equipment according to claim 14 is characterized in that:
The lamina of described printed substrate is more than two, the skin shielding via hole cascade of adjacent monolayer plate correspondence position.
16., it is characterized in that according to claim 14 or 15 described communication equipments:
The area of described printed substrate further groove shields the via hole position occupied area corresponding with cabling wiring place more than or equal to the screen conductor at described skin.
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| CN2008100942002A CN101583250B (en) | 2008-05-15 | 2008-05-15 | Method for processing through hole of printed circuit board, printed circuit board and communication equipment |
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| CN2008100942002A CN101583250B (en) | 2008-05-15 | 2008-05-15 | Method for processing through hole of printed circuit board, printed circuit board and communication equipment |
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| CN101583250B true CN101583250B (en) | 2011-04-13 |
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|---|---|---|---|---|
| CN103094245B (en) * | 2011-11-01 | 2017-03-01 | 旺宏电子股份有限公司 | IC apparatus and the method setting up electric conductor in this IC apparatus |
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| CN111642085B (en) * | 2020-06-19 | 2021-08-31 | 苏州浪潮智能科技有限公司 | Printed circuit board manufacturing method, system, equipment and computer storage medium |
| CN115209617A (en) * | 2022-07-20 | 2022-10-18 | 维沃移动通信有限公司 | Circuit board structure and manufacturing method thereof, camera module and electronic equipment |
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