CN1255692C - 用于组装光学器件的设备与方法 - Google Patents
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Abstract
公开了一种在光学器件上安装光学元件的方法和装置。由载体衬底制造一个安装结构。该安装结构包括限定一个阱的一个或多个壁,并且围绕多个突起。由壁限定的该阱用一种粘结材料系统、例如环氧树脂填充。光学器件降低与该环氧树脂接触,然后与该突起接触。该排出的环氧树脂通过一个或多个导管被排出,进入一个或多个储存器。多个这样的安装结构使一个光学元件与多个光学元件在单一平面能够一起对准。
Description
技术领域
本发明一般涉及光学器件及其制造,特别地涉及用于精确地控制光学器件内部的光学元件与衬底平面之间的角度关系的设备与方法。
背景技术
众所周知,滤光器使用光学器件,例如混合光学组件。用于构造光学器件,例如混合光学组件的传统组合方法,一般设计成为光学元件安装在单一结构平面上。具体地,光学器件内部的光学元件例如反射镜、滤光器、偏光器、分束镜、透镜和其它反射或透射光学元件,定位键合在衬底表面上的单一平面。重要的是使滤光器和其它光学元件沿结构平面适当地对准,以使光信号从一个光学元件到另一个光学元件不会通过不适当的传输而损失。
通常,光学装置中使用的光学元件被环氧树脂封装或以其它方式固定在衬底表面。参见图1-3,展示了具有载体衬底12的光学器件10。该光学器件10具有位于同一结构平面的光学输入点14和光学输出点40。第一光学元件18、第二光学元件28和第三光学元件34还安装在该载体衬底12上,这些元件全部在同一结构平面。光学元件18、28、34可以是任何一种反射或透射光学元件,例如透镜、反射镜、偏振镜、分光镜、滤光器或类似的光学元件。
第一光学元件18具有第一表面20(图2),第二表面22、和反射表面24。通过设计,来自输入点14的光信号沿第一信号轨迹16传输,并且从反射表面24向第二光学元件反射。该反射光信号沿第二信号轨迹26传输并且从第二光学元件28的反射表面30反射。两倍的反射光信号然后沿第三信号轨迹32传输,从第三光学元件34的反射表面36反射进入引导至输出点40的第四信号轨迹38。
实际上,如上所述,光学元件18、28、34通常通过环氧树脂42固定在载体衬底12。具体地,如图2所示,环氧树脂42淀积在载体衬底12的第一表面13上,光学元件18、28、34每个都被降低与环氧树脂42接触。然而,在待键合的光学元件降低至载体衬底12时,光学元件常常不与载体衬底12键合,以致第一表面20平行于第一表面13。如图3所示,第一光学元件18已经降低在环氧树脂42上,但是与载体衬底12的第一表面13保持成一角度。光学元件18、28、34的不适当对准导致光信号的传输超出结构平面范围外,从而妨碍光信号到达输出点40。
发明内容
本发明提供一种用于安装光学元件的安装结构。该安装结构包括具有第一表面的衬底,多个从该衬底第一表面延伸出实质上相同量的突起,所述多个突起被构成为用于接纳所述元件,所述元件被安装和粘结到所述多个突起上,和一个或更多个从该衬底第一表面延伸出的壁,该壁围绕该突起并且限定一个阱。
该发明进一步提供一种供多个半导体元件使用的载体衬底,包括:具有第一表面的衬底;和形成在所述衬底上的多个安装结构,每个安装结构包括:从所述衬底第一表面延伸的多个突起,其中,每一个安装结构的所述突起被构成为用于接纳所述元件,所述元件被安装和粘结到所述多个突起上;和从所述衬底第一表面延伸的一个或多个壁,所述壁围绕所述突起并且限定一个阱。
本发明还提供一种半导体器件,包括:具有第一表面的衬底;至少一个安装结构,所述安装结构包括:从所述衬底第一表面延伸的多个突起;和从所述衬底第一表面延伸的一个或多个壁,所述壁围绕所述突起并且限定一个阱;和至少一个光学元件,每一个元件被安装并粘结在至少两个所述突起上。
本发明进一步提供一种在半导体器件上安装一个或多个半导体元件的方法,所述半导体器件具有一个或多个安装结构,所述安装结构包括被限定一个阱的一个或多个壁环绕的多个突起,该方法包括以下工序:在所述阱中,包括在所述突起之上的位置,提供一种粘结材料系统;降低每个半导体元件使其与所述粘结材料系统接触;使每个半导体元件与至少两个突起接触;和固化所述粘结材料系统。
本发明进一步提供一种在半导体器件上安装的两个或多个半导体元件的平面对准方法,所述半导体器件具有两个或多个安装结构,每个安装结构包括被限定一个阱的一个或多个壁环绕的多个突起,该方法包括以下工序:在每个所述安装结构的所述被限定的阱中,包括在所述突起上方的位置,提供一种粘结材料系统;降低每个所述半导体元件,使其与所述粘结材料系统接触;使每个所述半导体元件与相应的安装结构的至少两个所述突起接触;使每个所述半导体元件与其他半导体元件对准;以及固化所述粘结材料系统。
通过以下参考附图对本发明的详细说明,可以更容易地了解本发明的上述和其它优点和特征。
附图说明
图1是在载体衬底上的一个传统的光学器件的顶视图。
图2是沿图1的线II-II剖取的剖面图。
图3是展示图1的光学器件的一个光学元件的不适当对准的另一个剖面图。
图4是根据本发明的一个实施例构成的光学器件载体衬底的顶视图。
图5是沿图4的线V-V剖取的安装在载体衬底上的光学元件的剖面图。
图6是安装在图4的载体衬底上的光学元件的另一个剖面图。
图7是安装在图4的载体衬底上的光学器件的另一个剖面图。
图8是沿图4的线VIII-VIII剖取的部分剖面图。
图9是根据本发明的实施例在载体衬底上对准光学元件的工序流程图。
具体实施方式
参见图4-8,展示了一个光学器件载体衬底100。该光学器件载体衬底100具有一个第一表面102。位于第一表面102之上的是包括通常是矩形的阱108的安装结构103,该阱具有限定空间109的壁106。多个岛状突起104位于间隔109之内。优选地,每个突起104在第一表面102之上向上延伸相同的距离。在一个优选实施例中,壁106在第一表面102之上延伸的高度大于突起104的高度。一对储存器112位于阱108的相反端。每个储存器112通过具有壁116的导管114连接到阱108。
一个材料系统110放置在阱108之内,填充空间109达到至少正好在突起104最高程度之上,该材料系统最好具有这样的特性,即有效地湿润被粘附的表面,并且具有弱的粘结力(图6,8)。被足够湿润的表面可使用于粘结光学元件的粘结材料系统110的薄层粘结于突起104。粘结材料系统110的一个优选实施例是环氧树脂,或者是液体或者是粉末状的。如果是粉末状,则环氧树脂最好在例如温度或者压力变化的条件下转变成为液相。粘结材料系统110的另一实例是蜡状材料。正如与粉末状环氧树脂那样,蜡状材料最好在例如温度或者压力变化的条件下转变成为液相。
在安装光学元件例如光学元件18、28、34的过程中,导管114可使粘结材料系统110从空间109溢出进入储存器112。
安装结构103,即突起104、阱108、储存器112、和导管114,优选通过一个衬底例如半导体衬底的标准各向异性的蚀刻来形成。图4仅部分地展示了载体衬底100。因此,设计多个图4的突起104来支撑单个光学元件18、28、34。另外,在衬底12中还设置与图4所示相同或者类似的结构103,用于支撑各个光学元件18、28、34。
术语“衬底”应理解为包括能够支撑光学元件的任何材料。工业上优选的材料包括陶瓷、玻璃、硅、钢、金属合金和金刚石。
接着将参见展示了安装过程的图9和展示了结构过程的图5-8,说明安装光学元件的方法。在工序200(图9),粘结材料系统110添加到壁106之内的空间109。光学元件例如18然后在安装结构103之上降低进入空间109,如图5所示。为了清楚地展示光学元件18的降低,图5中省略了粘结材料系统110。在工序202,光学元件18进一步降低直到它接触到粘结材料系统110(图6、7、9)。一旦接触到材料系统110,则在工序204光学元件18定位接触至少两个突起104(图7、9)。然而,如上所述,包括多于两个突起104的所示安装结构103,配置成接受单个光学元件。光学元件18的体积将替换相等量的粘结材料系统110,强制使粘结材料系统110通过导管114进入储存器112。在工序206,粘结材料系统110被固化。通过适当的材料系统110的组成和适当的干燥温度,粘结材料系统110最好趋向于通过固化和冷却减少其体积,从而迫使光学元件18成为张力状态。这将保证正确的对准和提高安装的光学元件18的稳定性。
如此说明的方法可以被重复必要多的次数,以便安装全部需要的光学元件。而且,固化工序204可以延期到全部光学元件被适当地安装和对准之后,以便确保光信号通路引导到输出点40或相似的输出。
本发明提供一种有效地对准光学装置的光学元件的装置和方法,以便保证光信号有适当的通路。同时已经结合列举的此时已知的实施例详细地说明了本发明,应该轻易地可知本发明并不限于这样公开的实施例。而且,本发明可以改进结合许多种以上未说明的变化、改变、替换或等同设置,但是这些与本发明的精髓和范围是相称的。例如,在此已经说明了光学元件的安装,但是应该知道本安装结构103可适用于需要平面对准的任何半导体结构。而且,虽然壁106展示为通常的矩形状态,但是也可以采用任何适当的形状。因此,本发明不限于上述介绍,仅由附加的权利要求的范围限定。
Claims (44)
1.一种用于安装半导体元件的安装结构,包括:
具有第一表面的衬底;
从所述衬底第一表面延伸的多个突起,所述多个突起被构成为用于接纳所述元件,所述元件被安装和粘结到所述多个突起上;以及
从所述衬底第一表面延伸的一个或多个壁,围绕所述突起并且限定一个阱。
2.根据权利要求1的安装结构,其中,所述的阱适合于包含粘结材料系统。
3.根据权利要求2的安装结构,还包括至少一个储存器,所述储存器设置在所述衬底中并且与所述阱连接,接受来自所述阱的所述粘结材料系统。
4.根据权利要求3的安装结构,包括两个所述储存器。
5.根据权利要求4的安装结构,还包括一对导管,每个所述导管使至少一个所述储存器与所述阱连接。
6.根据权利要求1的安装结构,其中,所述元件包括光学元件。
7.根据权利要求1的安装结构,其中,所述壁延伸到所述衬底第一表面上方的一个高于所述突起的高度。
8.根据权利要求1的安装结构,其中,所述多个突起从所述衬底第一表面延伸实质上相等的量。
9.根据权利要求1的安装结构,其中,安装结构适合于安装光学元件。
10.根据权利要求5的安装结构,其中,所述壁由所述衬底形成。
11.根据权利要求10的安装结构,其中,通过所述衬底的各向异性蚀刻形成所述壁。
12.根据权利要求11的安装结构,其中,所述突起由所述衬底形成。
13.根据权利要求12的安装结构,其中,通过所述衬底的各向异性蚀刻形成所述突起。
14.根据权利要求13的安装结构,其中,所述储存器由所述衬底形成。
15.根据权利要求14的安装结构,其中,通过所述衬底的各向异性蚀刻形成所述储存器。
16.根据权利要求15的安装结构,其中,所述导管由所述衬底形成。
17.根据权利要求16的安装结构,其中,通过所述衬底的各向异性蚀刻形成所述导管。
18.一种供多个半导体元件使用的载体衬底,包括:
具有第一表面的衬底;和
形成在所述衬底上的多个安装结构,每个安装结构包括:
从所述衬底第一表面延伸的多个突起,其中,每一个安装结构的所述突起被构成为用于接纳所述元件,所述元件被安装和粘结到所述多个突起上;和
从所述衬底第一表面延伸的一个或多个壁,所述壁围绕所述突起并且限定一个阱。
19.根据权利要求18的载体衬底,其中,所述阱适合于包含一种粘结材料系统。
20.根据权利要求19的载体衬底,还包括至少一个设置在所述衬底中的储存器,与每个所述阱连接用于接受所述粘结材料系统。
21.根据权利要求20的载体衬底,包括用于每个所述安装结构的两个所述储存器。
22.根据权利要求21的载体衬底,对于每个所述安装结构还包括一对导管,每个所述导管使至少一个所述储存器与每个所述阱连接。
23.根据权利要求19的载体衬底,其中,用于所述元件包括光学元件。
24.根据权利要求19的载体衬底,其中,所述壁延伸到所述衬底第一表面上方的一个高于所述突起的高度。
25.根据权利要求19的载体衬底,其中,所述多个突起从所述衬底第一表面延伸实质上相等的量。
26.一种半导体器件,包括:
具有第一表面的衬底;
至少一个安装结构,所述安装结构包括:
从所述衬底第一表面延伸的多个突起;和
从所述衬底第一表面延伸的一个或多个壁,所述壁围绕所述突起并且限定一个阱;和
至少一个光学元件,每一个元件被安装并粘结在至少两个所述突起上。
27.根据权利要求26的半导体器件,包括多个光学元件,每个所述光学元件安装在各个所述安装结构的至少两个突起上,以使每个所述光学元件被彼此平面对准。
28.根据权利要求27的光学器件,其中,所述壁延伸到高于所述突起的高度。
29.根据权利要求26的半导体器件,其中,所述多个突起从所述衬底第一表面延伸实质上相等的量。
30.根据权利要求28的半导体器件,其中,所述阱适合用于包含一种粘结材料系统。
31.根据权利要求30的半导体器件,其中,所述粘结材料系统是环氧树脂。
32.根据权利要求31的半导体器件,其中,每个所述光学元件由所述环氧树脂安装和粘结在所述突起上。
33.根据权利要求31的半导体器件,还包括至少一个设置在所述衬底中的储存器,并与每个所述阱连接。
34.根据权利要求33的半导体器件,对于每个所述安装结构包括两个所述储存器。
35.根据权利要求34的半导体器件,对于每个所述安装结构还包括一对导管,每个所述导管使至少一个所述储存器与每一个所述阱连接。
36.一种在半导体器件上安装一个或多个半导体元件的方法,所述半导体器件具有一个或多个安装结构,所述安装结构包括被限定一个阱的一个或多个壁环绕的多个突起,该方法包括以下工序:
在所述阱中,包括在所述突起之上的位置,提供一种粘结材料系统;
降低每个半导体元件使其与所述粘结材料系统接触;
使每个半导体元件与至少两个突起接触;和
固化所述粘结材料系统。
37.根据权利要求36的方法,其中,所述粘结材料系统添加到在所述突起上面延伸的程度。
38.根据权利要求36的方法,其中,所述粘结材料系统的固化使半导体元件处于张力状态。
39.根据权利要求36的方法,其中,所述半导体元件包括一种光学元件。
40.一种在半导体器件上安装的两个或多个半导体元件的平面对准方法,所述半导体器件具有两个或多个安装结构,每个安装结构包括被限定一个阱的一个或多个壁环绕的多个突起,该方法包括以下工序:
在每个所述安装结构的所述被限定的阱中,包括在所述突起上方的位置,提供一种粘结材料系统;
降低每个所述半导体元件,使其与所述粘结材料系统接触;
使每个所述半导体元件与相应的安装结构的至少两个所述突起接触;
使每个所述半导体元件与其他半导体元件对准;以及
固化所述粘结材料系统。
41.根据权利要求40的方法,其中,所述粘结材料系统添加到在突起上面延伸的程度。
42.根据权利要求40的方法,其中,所述粘结材料系统的固化使每个所述半导体元件处于张力状态。
43.根据权利要求40的方法,其中,所述半导体元件包括光学元件。
44.根据权利要求43的方法,其中,所述半导体器件包括一种光学器件。
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US20040161220A1 (en) * | 2002-09-09 | 2004-08-19 | Adc Telecommunications, Inc. | Method for face-mounting optical components and devices using same |
US20040169926A1 (en) * | 2002-09-10 | 2004-09-02 | Adc Telecommunications, Inc. | Module assembly for fiber optic isolator |
US6805786B2 (en) | 2002-09-24 | 2004-10-19 | Northrop Grumman Corporation | Precious alloyed metal solder plating process |
US6998721B2 (en) | 2002-11-08 | 2006-02-14 | Stmicroelectronics, Inc. | Stacking and encapsulation of multiple interconnected integrated circuits |
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CN101382696B (zh) * | 2007-09-07 | 2010-08-25 | 群康科技(深圳)有限公司 | 光学膜片自动组装系统和光学膜片自动组装方法 |
JP2010008901A (ja) * | 2008-06-30 | 2010-01-14 | Fujitsu Ltd | 光学部品の接着面構造 |
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US5905750A (en) | 1996-10-15 | 1999-05-18 | Motorola, Inc. | Semiconductor laser package and method of fabrication |
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