CN1255692C - Equipment and method for assembling optical device - Google Patents

Equipment and method for assembling optical device Download PDF

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Publication number
CN1255692C
CN1255692C CNB011124253A CN01112425A CN1255692C CN 1255692 C CN1255692 C CN 1255692C CN B011124253 A CNB011124253 A CN B011124253A CN 01112425 A CN01112425 A CN 01112425A CN 1255692 C CN1255692 C CN 1255692C
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CN
China
Prior art keywords
mounting structure
substrate
trap
material system
binding material
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Expired - Fee Related
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CNB011124253A
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Chinese (zh)
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CN1316657A (en
Inventor
鲍·A·M·安德森
明道加斯·F·道塔塔斯
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Nokia of America Corp
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Lucent Technologies Inc
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8314—Guiding structures outside the body
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    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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Abstract

A method and apparatus for mounting optical elements onto an optical device are described. A mounting structure is produced out of a carrier substrate. The mounting structure includes one or more walls defining a well and surrounding a plurality of protrusions. The well defined by the walls is filled with an adhesive material system, such as epoxy. An optical device is lowered into contact with the epoxy, and then into contact with the protrusions. The displaced epoxy is displaced through one or more conduits into one or more reservoirs. A plurality of such mounting structures enables one to align a plurality of optical elements together in a single plane.

Description

The apparatus and method for that is used for assembling optical device
Technical field
The present invention relates generally to optical device and manufacturing thereof, relate to especially and be used for accurately controlling the optical element of optical device inside and the apparatus and method for of the angular relationship between the substrate plane.
Background technology
As everyone knows, light filter uses optical device, for example hybrid optical assembly.Be used to construct optical device, for example the conventional combination method of hybrid optical assembly generally is designed to optical element and is installed on the single structure plane.Particularly, the optical element of optical device inside is catoptron, light filter, polarizer, beam splitter, lens and other reflection or transmission optical component for example, and positioning key is combined in the single plane on the substrate surface.Light signal light filter and other optical element suitably aimed at, so that can not lose by unsuitable transmission from an optical element to another optical element along the structural plan.
Usually, the optical element that uses in the optical devices is by epoxy encapsulation or otherwise be fixed on substrate surface.Referring to Fig. 1-3, showed optical device 10 with carrier substrates 12.This optical device 10 has optics input point 14 and the optics output point 40 that is positioned at same structural plan.First optical element 18, second optical element 28 and the 3rd optical element 34 also are installed on this carrier substrates 12, and these elements are all in same structural plan. Optical element 18,28,34 can be any reflection or transmission optical component, for example lens, catoptron, polariscope, spectroscope, light filter or similar optical element.
First optical element 18 has first surface 20 (Fig. 2), second surface 22 and reflecting surface 24.By design, along 16 transmission of first signal trajectory, and reflect to second optical element from reflecting surface 24 from the light signal of input point 14.This reflected light signal is along secondary signal track 26 transmission and from reflecting surface 30 reflections of second optical element 28.The reflected light signal of twice is then along the transmission of the 3rd signal trajectory 32, enters the 4th signal trajectory 38 that guides to output point 40 from reflecting surface 36 reflections of the 3rd optical element 34.
In fact, as mentioned above, optical element 18,28,34 is fixed on carrier substrates 12 by epoxy resin 42 usually.Particularly, as shown in Figure 2, epoxy resin 42 is deposited on the first surface 13 of carrier substrates 12, and each all is lowered optical element 18,28,34 with epoxy resin 42 and contacts.Yet, when the optical element for the treatment of bonding is reduced to carrier substrates 12, optical element usually not with carrier substrates 12 bondings so that first surface 20 is parallel to first surface 13.As shown in Figure 3, first optical element 18 has been reduced on the epoxy resin 42, and still the first surface 13 with carrier substrates 12 keeps at angle.The inappropriate aligning of optical element 18,28,34 causes the transmission of light signal to exceed outside the scope of structural plan, thereby hinders light signal to arrive output point 40.
Summary of the invention
The invention provides a kind of mounting structure that is used to install optical element.This mounting structure comprises the substrate with first surface, a plurality ofly extend the projection of same amount in fact from this substrate first surface, described a plurality of projection is constituted as and is used to admit described element, described element is mounted and is bonded on described a plurality of projection, with one or more from the extended wall of this substrate first surface, this wall is around this projection and limit a trap.
This invention further provides a kind of carrier substrates for a plurality of semiconductor elements uses, comprising: the substrate with first surface; With a plurality of mounting structures that are formed on the described substrate, each mounting structure comprises: from a plurality of projections of described substrate first surface extension, wherein, the described projection of each mounting structure is constituted as and is used to admit described element, and described element is mounted and is bonded on described a plurality of projection; With the one or more walls that extend from described substrate first surface, described wall is around described projection and limit a trap.
The present invention also provides a kind of semiconductor devices, comprising: the substrate with first surface; At least one mounting structure, described mounting structure comprises: from a plurality of projections of described substrate first surface extension; With the one or more walls that extend from described substrate first surface, described wall is around described projection and limit a trap; With at least one optical element, each element is mounted and is bonded at least two described projections.
The present invention further provides a kind of method that one or more semiconductor elements are installed on semiconductor devices, described semiconductor devices has one or more mounting structures, described mounting structure comprise one or more walls of being defined a trap around a plurality of projections, this method comprises following operation: in described trap, be included in the position on the described projection, a kind of binding material system is provided; Reducing each semiconductor element makes it contact with described binding material system; Each semiconductor element is contacted with at least two projections; With the described binding material of curing system.
The present invention further provides a kind of planar alignment method of two or more semiconductor elements of on semiconductor devices, installing, described semiconductor devices has two or more mounting structures, each mounting structure comprise one or more walls of being defined a trap around a plurality of projections, this method comprises following operation: in the described limited trap of each described mounting structure, be included in the position of described projection top, a kind of binding material system is provided; Reduce each described semiconductor element, it is contacted with described binding material system; Each described semiconductor element is contacted with at least two described projections of corresponding mounting structure; Each described semiconductor element is aimed at other semiconductor elements; And solidify described binding material system.
By below with reference to the accompanying drawing detailed description of the invention, can more easily understand above-mentioned and other advantage and feature of the present invention.
Description of drawings
Fig. 1 is the top view of a traditional optical device on carrier substrates.
Fig. 2 is that the line II-II along Fig. 1 cuts open the sectional view of getting.
Fig. 3 is another sectional view of inappropriate aligning of an optical element of the optical device of exploded view 1.
Fig. 4 is the top view of the optic carrier substrate that constitutes according to one embodiment of present invention.
Fig. 5 is that the line V-V along Fig. 4 cuts open the sectional view of getting that is installed in the optical element on the carrier substrates.
Fig. 6 is mounted in another sectional view of the optical element on the carrier substrates of Fig. 4.
Fig. 7 is mounted in another sectional view of the optical device on the carrier substrates of Fig. 4.
Fig. 8 is that the line VIII-VIII along Fig. 4 cuts open the fragmentary cross-sectional view of getting.
Fig. 9 is the process flow chart according to embodiments of the invention align optical components on carrier substrates.
Embodiment
Referring to Fig. 4-8, showed an optic carrier substrate 100.This optic carrier substrate 100 has a first surface 102.Being positioned on the first surface 102 is to comprise the normally mounting structure 103 of the trap 108 of rectangle, and this trap has the wall 106 of restriceted envelope 109.A plurality of island-projections 104 are positioned at interval within 109.Preferably, each projection 104 extends upward identical distance on first surface 102.In a preferred embodiment, the height that extends on first surface 102 of wall 106 is greater than the height of projection 104.A pair of reservoir 112 is positioned at the end opposite of trap 108.Each reservoir 112 is connected to trap 108 by the conduit 114 with wall 116.
A material system 110 is placed within the trap 108, and packing space 109 reaches at least just in time on projection 104 tops, and this material system preferably has such characteristic, the promptly moistening effectively surface that is adhered to, and have weak cohesive force (Fig. 6,8).The thin layer that can be used in the binding material system 110 of bonding optical element by enough moistening surface is bonded in projection 104.A preferred embodiment of binding material system 110 is an epoxy resin, or liquid or pulverous.If Powdered, then epoxy resin is preferably under the condition that temperature for example or pressure changes and is transformed into liquid phase.Another example of binding material system 110 is a wax-like materials.As with powder epoxy resin, wax-like materials is preferably under the condition that temperature for example or pressure changes and is transformed into liquid phase.
Optical element is being installed for example in the process of optical element 18,28,34, conduit 114 can make binding material system 110 109 overflow and enter reservoir 112 from the space.
Mounting structure 103, i.e. projection 104, trap 108, reservoir 112 and conduit 114, preferably by a substrate for example the anisotropic etching of standard of Semiconductor substrate form.Fig. 4 has only partly showed carrier substrates 100.Therefore, the projection 104 that designs a plurality of Fig. 4 supports single optical element 18,28,34.In addition, same as shown in Figure 4 or similar structure 103 is set also in substrate 12, is used to support each optical element 18,28,34.
Term " substrate " be understood to include can supporting optical component any material.Industrial preferable material comprises pottery, glass, silicon, steel, metal alloy and adamas.
Then will and show Fig. 5-8 of configuration process, the method that optical element is installed be described referring to the Fig. 9 that has showed installation process.At operation 200 (Fig. 9), binding material system 110 adds the space 109 within the wall 106 to.Optical element for example 18 reduces on mounting structure 103 then and enters space 109, as shown in Figure 5.For the clearly reduction of display optics element 18, omitted binding material system 110 among Fig. 5.In operation 202, optical element 18 further reduction touches binding material system 110 (Fig. 6,7,9) up to it.In case touch material system 110, then in operation 204 optical elements 18 location contact at least two projections 104 (Fig. 7,9).Yet, as mentioned above, comprise more than mounting structure 103 shown in two projections 104, be configured to accept single optical element.The volume of optical element 18 will be replaced the binding material system 110 of equal quantities, force to make binding material system 110 enter reservoir 112 by conduit 114.In operation 206, binding material system 110 is cured.By the composition of suitable material system 110 and suitable baking temperature, binding material system 110 preferably trends towards reducing its volume by curing and cooling, thereby forces optical element 18 to become tension state.The stability that this will guarantee correct aligning and improve the optical element of installing 18.
So the method for explanation can be repeated necessary many number of times, so as to install all need optical element.And curing process 204 can put off until after whole optical elements are suitably installed and aim at, and is directed to output point 40 or similar output so that guarantee photo-signal channel.
The invention provides a kind of apparatus and method of optical element of the device of alignment optical effectively, suitable path is arranged so that guarantee light signal.Simultaneously in conjunction with this moment of enumerating known embodiment understand the present invention in detail, should be easily as can be known the present invention be not limited to disclosed like this embodiment.And the present invention can improve in conjunction with unaccounted variation, change more than many kinds, replace or be equal to setting, but these match with marrow of the present invention and scope.For example, the installation of optical element has been described, but has will be appreciated that this mounting structure 103 is applicable to any semiconductor structure that needs planar alignment at this.And, though wall 106 is shown as common rectangle state, also can adopt any suitable shape.Therefore, the invention is not restricted to above-mentioned introduction, only the scope by additional claim limits.

Claims (44)

1. mounting structure that is used to install semiconductor element comprises:
Substrate with first surface;
From a plurality of projections that described substrate first surface extends, described a plurality of projections are constituted as and are used to admit described element, and described element is mounted and is bonded on described a plurality of projection; And
From one or more walls that described substrate first surface extends, center on described projection and limit a trap.
2. according to the mounting structure of claim 1, wherein, described trap is suitable for comprising the binding material system.
3. according to the mounting structure of claim 2, also comprise at least one reservoir, described reservoir is arranged in the described substrate and with described trap and is connected, and accepts the described binding material system from described trap.
4. according to the mounting structure of claim 3, comprise two described reservoirs.
5. according to the mounting structure of claim 4, also comprise a pair of conduit, each described conduit makes at least one described reservoir be connected with described trap.
6. according to the mounting structure of claim 1, wherein, described element comprises optical element.
7. according to the mounting structure of claim 1, wherein, described wall extends to a height that is higher than described projection of described substrate first surface top.
8. according to the mounting structure of claim 1, wherein, described a plurality of projections are extended the amount that equates in fact from described substrate first surface.
9. according to the mounting structure of claim 1, wherein, mounting structure is suitable for installing optical element.
10. according to the mounting structure of claim 5, wherein, described wall is formed by described substrate.
11. according to the mounting structure of claim 10, wherein, the anisotropic etching by described substrate forms described wall.
12. according to the mounting structure of claim 11, wherein, described projection is formed by described substrate.
13. according to the mounting structure of claim 12, wherein, the anisotropic etching by described substrate forms described projection.
14. according to the mounting structure of claim 13, wherein, described reservoir is formed by described substrate.
15. according to the mounting structure of claim 14, wherein, the anisotropic etching by described substrate forms described reservoir.
16. according to the mounting structure of claim 15, wherein, described conduit is formed by described substrate.
17. according to the mounting structure of claim 16, wherein, the anisotropic etching by described substrate forms described conduit.
18. the carrier substrates for a plurality of semiconductor elements uses comprises:
Substrate with first surface; With
Be formed on a plurality of mounting structures on the described substrate, each mounting structure comprises:
From a plurality of projections that described substrate first surface extends, wherein, the described projection of each mounting structure is constituted as and is used to admit described element, and described element is mounted and is bonded on described a plurality of projection; With
From one or more walls that described substrate first surface extends, described wall is around described projection and limit a trap.
19. according to the carrier substrates of claim 18, wherein, described trap is suitable for comprising a kind of binding material system.
20. according to the carrier substrates of claim 19, comprise that also at least one is arranged on the reservoir in the described substrate, be connected with each described trap and be used to accept described binding material system.
21., comprise two described reservoirs that are used for each described mounting structure according to the carrier substrates of claim 20.
22. according to the carrier substrates of claim 21, also comprise a pair of conduit for each described mounting structure, each described conduit makes at least one described reservoir be connected with each described trap.
23., wherein, be used for described element and comprise optical element according to the carrier substrates of claim 19.
24. according to the carrier substrates of claim 19, wherein, described wall extends to a height that is higher than described projection of described substrate first surface top.
25. according to the carrier substrates of claim 19, wherein, described a plurality of projections are extended the amount that equates in fact from described substrate first surface.
26. a semiconductor devices comprises:
Substrate with first surface;
At least one mounting structure, described mounting structure comprises:
A plurality of projections from described substrate first surface extension; With
From one or more walls that described substrate first surface extends, described wall is around described projection and limit a trap; With
At least one optical element, each element are mounted and are bonded at least two described projections.
27. according to the semiconductor devices of claim 26, comprise a plurality of optical elements, each described optical element is installed on two projections of each described mounting structure at least, so that each described optical element is by planar alignment each other.
28. according to the optical device of claim 27, wherein, described wall extends to the height that is higher than described projection.
29. according to the semiconductor devices of claim 26, wherein, described a plurality of projections are extended the amount that equates in fact from described substrate first surface.
30. according to the semiconductor devices of claim 28, wherein, described trap is suitable for comprising a kind of binding material system.
31. according to the semiconductor devices of claim 30, wherein, described binding material system is an epoxy resin.
32. according to the semiconductor devices of claim 31, wherein, each described optical element is installed and is bonded on the described projection by described epoxy resin.
33. according to the semiconductor devices of claim 31, comprise that also at least one is arranged on the reservoir in the described substrate, and be connected with each described trap.
34., comprise two described reservoirs for each described mounting structure according to the semiconductor devices of claim 33.
35. according to the semiconductor devices of claim 34, also comprise a pair of conduit for each described mounting structure, each described conduit makes at least one described reservoir be connected with each described trap.
36. method that one or more semiconductor elements are installed on semiconductor devices, described semiconductor devices has one or more mounting structures, described mounting structure comprise one or more walls of being defined a trap around a plurality of projections, this method comprises following operation:
In described trap, be included in the position on the described projection, a kind of binding material system is provided;
Reducing each semiconductor element makes it contact with described binding material system;
Each semiconductor element is contacted with at least two projections; With
Solidify described binding material system.
37. according to the method for claim 36, wherein, described binding material system adds the degree of extending on described projection.
38. according to the method for claim 36, wherein, the curing of described binding material system makes semiconductor element be in tension state.
39. according to the method for claim 36, wherein, described semiconductor element comprises a kind of optical element.
40. the planar alignment method of two or more semiconductor elements of on semiconductor devices, installing, described semiconductor devices has two or more mounting structures, each mounting structure comprise one or more walls of being defined a trap around a plurality of projections, this method comprises following operation:
In the described limited trap of each described mounting structure, be included in the position of described projection top, a kind of binding material system is provided;
Reduce each described semiconductor element, it is contacted with described binding material system;
Each described semiconductor element is contacted with at least two described projections of corresponding mounting structure;
Each described semiconductor element is aimed at other semiconductor elements; And
Solidify described binding material system.
41. according to the method for claim 40, wherein, described binding material system adds the degree of extending on projection.
42. according to the method for claim 40, wherein, the curing of described binding material system makes each described semiconductor element be in tension state.
43. according to the method for claim 40, wherein, described semiconductor element comprises optical element.
44. according to the method for claim 43, wherein, described semiconductor devices comprises a kind of optical device.
CNB011124253A 2000-04-04 2001-04-03 Equipment and method for assembling optical device Expired - Fee Related CN1255692C (en)

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