JPH0545543A - Optical component fixing method - Google Patents

Optical component fixing method

Info

Publication number
JPH0545543A
JPH0545543A JP19951791A JP19951791A JPH0545543A JP H0545543 A JPH0545543 A JP H0545543A JP 19951791 A JP19951791 A JP 19951791A JP 19951791 A JP19951791 A JP 19951791A JP H0545543 A JPH0545543 A JP H0545543A
Authority
JP
Japan
Prior art keywords
optical
substrate
optical component
optical axis
optical components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19951791A
Other languages
Japanese (ja)
Inventor
Seiichi Ajiki
精一 安食
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP19951791A priority Critical patent/JPH0545543A/en
Publication of JPH0545543A publication Critical patent/JPH0545543A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable easy, high-accuracy assembly without providing any seat for positioning optical components on a substrate by aligning the optical axis of laser beam and the optical axis of the optical components with each other and fixing the bottom surfaces of the optical components with an adhesive. CONSTITUTION:Laser beam which is the parallel light beam from a semiconductor laser 4 obtained through a collimator lens 10 as an optical component is transmitted in the space on the substrate 1 to form an optical axis, on which optical components 11, 11a, 20, 12, 12a, etc., are mounted. Then the optical axis of the laser beam and the optical axes of the optical components are aligned with the coordinates of a coordinate plate where the optical axis of the laser light beam is made incident and the bottom surfaces of the respective optical components 11, 11a, 20, 12, and 12a are fixed to the surface of the substrate 1 with an adhesive. Consequently, even if the surface of the substrate 1 has an error factor such as curvature, waving, and roughness, the optical axes are accurately aligned regardless of them to accurately fix the optical components 11, 11a, 20, 12, and 12a.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光部品固定方法に関
し、特に、基板上に光部品の位置決め用の座を設けるこ
となく、レーザ光の光軸と光部品の部品光軸とを整合さ
せ、光部品の底面を接着剤を介して固定することによ
り、簡単且つ高精度な組立を達成するための新規な改良
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical component fixing method, and more particularly to aligning an optical axis of a laser beam with an optical axis of a component of an optical component without providing a seat for positioning the optical component on a substrate. The present invention relates to a new improvement for achieving a simple and highly accurate assembly by fixing the bottom surface of an optical component with an adhesive.

【0002】[0002]

【従来の技術】従来、用いられていたこの種の光ピック
アップとしては種々あるが、代表的なものとして図4に
示される周知の光ピックアップの構成を挙げることがで
きる。すなわち、図4において符号1で示されるものは
基板であり、この基板1の表面には、所定の間隔Dを有
する複数の座2が形成されている。前記各座2間には、
取付凹部3が形成されていると共に、両端に位置する各
座2の外方位置に形成された設置凹部6,7には、半導
体レーザ4、反射ミラー5が設けられている。
2. Description of the Related Art There are various optical pickups of this type that have been conventionally used, but as a representative one, there is a well-known optical pickup configuration shown in FIG. That is, what is denoted by reference numeral 1 in FIG. 4 is a substrate, and a plurality of seats 2 having a predetermined interval D are formed on the surface of the substrate 1. Between each seat 2,
The mounting recess 3 is formed, and the semiconductor laser 4 and the reflection mirror 5 are provided in the installation recesses 6 and 7 formed outside the seats 2 located at both ends.

【0003】前記各取付凹部3上には、光部品としての
コリメートレンズ10、プリズム11およびビームスプ
リッター12等が設けられており、コリメートレンズ1
0、およびプリズム11、半導体レーザ4および反射ミ
ラー5は、前記各座2によって、その取付位置および間
隔Dが決められていた。
A collimating lens 10, a prism 11 and a beam splitter 12 as optical components are provided on each of the mounting recesses 3, and the collimating lens 1 is provided.
0, the prism 11, the semiconductor laser 4, and the reflection mirror 5 have their mounting positions and intervals D determined by the seats 2.

【0004】[0004]

【発明が解決しようとする課題】従来の光ピックアップ
は、以上のように構成されていたため、次のような課題
が存在していた。すなわち、各光部品が基板上にあらか
じめ形成された座をガイドとして所定位置に設けられて
いるため、各光部品を各所定位置以外に固定することが
できず、そのため、各光部品の部品光軸にバラツキがあ
った場合部品光軸を合わせつつ組立ることは極めて困難
なことであった。
Since the conventional optical pickup is constructed as described above, there are the following problems. That is, since each optical component is provided at a predetermined position with a seat formed in advance on the substrate as a guide, each optical component cannot be fixed at a position other than each predetermined position. If the axes are not uniform, it is extremely difficult to assemble the parts while aligning the optical axes.

【0005】本発明は、以上のような課題を解決するた
めになされたもので、特に、基板上に光部品の位置決め
用の座を設けることなく、レーザ光の光軸と光部品の部
品光軸とを整合させ、光部品の底面を接着剤を介して固
定することにより、簡単且つ高精度な組立を達成できる
ようにした光部品固定方法を提供することを目的とす
る。
The present invention has been made to solve the above problems, and in particular, the optical axis of the laser beam and the component light of the optical component can be provided without providing a seat for positioning the optical component on the substrate. An object of the present invention is to provide an optical component fixing method capable of achieving a simple and highly accurate assembly by aligning the shaft and fixing the bottom surface of the optical component with an adhesive.

【0006】[0006]

【課題を解決するための手段】本発明による光部品固定
方法は、基板上に光部品を設け、表面実装を施すように
した光部品固定方法において、前記光部品の底面と前記
基板の表面間を接着剤を介して固定する方法である。
An optical component fixing method according to the present invention is an optical component fixing method in which an optical component is provided on a substrate and surface mounting is performed, wherein a bottom surface of the optical component and a surface of the substrate are provided. Is a method of fixing with an adhesive.

【0007】さらに詳細には、前記基板上の空間に走る
レーザ光を光軸とし、この光軸に合わせて前記光部品を
固定する方法である。
More specifically, it is a method in which a laser beam traveling in the space on the substrate is used as an optical axis, and the optical component is fixed along the optical axis.

【0008】さらに詳細には、前記光部品は複数よりな
る方法である。
More specifically, the optical component is a method including a plurality of optical components.

【0009】さらに詳細には、前記光部品の部品光軸と
前記レーザ光の光軸の整合を座標板を用いて行う方法で
ある。
More specifically, the optical axis of the optical component and the optical axis of the laser light are aligned using a coordinate plate.

【0010】さらに詳細には、前記光部品は光ピックア
ップを構成するようにした方法である。
More specifically, the optical component is a method for configuring an optical pickup.

【0011】[0011]

【作用】本発明による光部品固定方法においては、光部
品であるコリメートレンズを介して得られた半導体レー
ザからの平行光線であるレーザ光を基板上の空間に走ら
せて光軸を形成させ、この光軸上に光部品を搭載し、光
軸が当たっている座標板の座標に、光軸と部品光軸が整
合するようにして、各部品の底面を接着剤を介して基板
の表面に固定することにより、基板の表面に、曲がり、
うねり、あらさ等の誤差要因があったとしても、これら
に無関係に正確な光軸整合をとって正確な固定を達成す
ることができる。
In the optical component fixing method according to the present invention, the laser light, which is a parallel light beam from the semiconductor laser obtained through the collimating lens which is an optical component, is made to run in the space on the substrate to form the optical axis, Optical components are mounted on the optical axis, and the optical axis and the optical axis of the component are aligned with the coordinates of the coordinate plate on which the optical axis hits, and the bottom surface of each component is fixed to the surface of the substrate with an adhesive. By doing so, bending on the surface of the substrate,
Even if there are error factors such as undulations and roughness, accurate optical axis alignment can be achieved irrespective of these and accurate fixing can be achieved.

【0012】[0012]

【実施例】以下、図面と共に本発明による光部品固定方
法の好適な実施例について詳細に説明する。尚、従来例
と同一又は同等部分については同一符号を用いて説明す
る。図1、図2及び図3は、本発明による光部品固定方
法を示すもので、図1は組立後の光ピックアップを示す
断面図、図2は図1の平面図、図3は組立時の状態を示
す構成図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the optical component fixing method according to the present invention will be described in detail below with reference to the drawings. The same or equivalent parts as those of the conventional example will be described using the same reference numerals. 1, 2, and 3 show an optical component fixing method according to the present invention. FIG. 1 is a sectional view showing an optical pickup after assembly, FIG. 2 is a plan view of FIG. 1, and FIG. It is a block diagram which shows a state.

【0013】図1において符号1で示されるものは、例
えば、厚さが約0.5mmの燐青銅からなる基板であ
り、この基板1の表面1aは平坦に形成されている。
1 is a substrate made of phosphor bronze having a thickness of about 0.5 mm, for example, and the surface 1a of the substrate 1 is formed flat.

【0014】前記基板1の1端1b側には、半導体レー
ザ4が所定位置に設けられており、この基板1の端1b
側から他端1c側に向けて複数の光部品を構成するコリ
メートレンズ10、プリズム11、第1ビームスプリッ
ター11a、フィルタ20、第2、第3ビームスプリッ
ター12,12a、第1集光レンズ22、第4ビームス
プリッター23および第2集光レンズ22aが、前記半
導体レーザ4のレーザ光9の光軸に沿って設けられ、各
光部品の底面11aA,20A,12A,12aA,2
2A(図1に示す光部品)と前記表面1a間は接着剤1
00を介して固定されている。
A semiconductor laser 4 is provided at a predetermined position on the one end 1b side of the substrate 1, and the end 1b of the substrate 1 is provided.
From one side toward the other end 1c side, a collimator lens 10, a prism 11, a first beam splitter 11a, a filter 20, second and third beam splitters 12, 12a, a first condenser lens 22, The fourth beam splitter 23 and the second condenser lens 22a are provided along the optical axis of the laser beam 9 of the semiconductor laser 4, and the bottom surfaces 11aA, 20A, 12A, 12aA, 2 of the respective optical components are provided.
2A (optical component shown in FIG. 1) and the surface 1a between the adhesive 1
It is fixed through 00.

【0015】この接着剤100の厚さは約数ミクロンで
あるため、直接接続されている構成であると共に、図1
で示されるように、各光部品全体が封止樹脂40によっ
て覆われ表面実装がなされている。
Since the thickness of the adhesive 100 is about several microns, the adhesive 100 has a structure of direct connection, and FIG.
As shown by, the entire optical component is covered with the sealing resin 40 and surface-mounted.

【0016】さらに前記第1ビームスプリッター11a
に隣接して反射ミラー60が設けられ、この反射ミラー
60の上方には対物レンズ80が設けられている。ま
た、前記基板1の端面における前記集光レンズ22,2
2aの対向位置には、第1、第2受光器70,71が設
けられている。
Further, the first beam splitter 11a
A reflection mirror 60 is provided adjacent to the reflection mirror 60, and an objective lens 80 is provided above the reflection mirror 60. In addition, the condenser lenses 22 and 2 on the end surface of the substrate 1
First and second light receivers 70 and 71 are provided at the opposite positions of 2a.

【0017】従って、半導体レーザ4から発射したコリ
メートレンズ10を介して平行光線に変換されたレーザ
光9は、前記各光部品であるプリズム11、ビームスプ
リッター11a等を経て反射ミラー60および対物レン
ズ80から光ディスク(図示せず)に入射し、この光デ
ィスクからの反射光は、各光部品11a,20,12,
23,22a,12a,22などを経て受光器70,7
1に受光されることにより、図1および図2の構造は光
ピックアップを構成している。
Therefore, the laser beam 9 emitted from the semiconductor laser 4 and converted into a parallel light beam through the collimating lens 10 passes through the prism 11, the beam splitter 11a and the like, which are the respective optical components, and the reflection mirror 60 and the objective lens 80. From the optical disc 11a, 20, 12,
23, 22a, 12a, 22 and the like, then the photodetectors 70, 7
When the light is received at 1, the structure shown in FIGS. 1 and 2 constitutes an optical pickup.

【0018】次に、前述の図1および図2で示した光ピ
ックアップを組立てる場合について説明する。まず、図
3で示すように、半導体レーザ4とコリメートレンズ1
0を基板1の表面1aの所定位置に接着剤100を介し
て設置した後、基板1の表面1a上で半導体レーザ4の
平行光線を得るように、半導体レーザ4と第2コリメー
トレンズ10を調整する。しかも、このコリメートレン
ズ10で得た平行光線であるレーザ光9の光軸を基板1
上の空間に走らせた状態で、図3で示す座標板50を基
板1の他端1cの前方位置におき、このレーザ光9の光
軸が座標板50の所定の座標50aに一致するように設
定する。
Next, a case of assembling the optical pickup shown in FIGS. 1 and 2 will be described. First, as shown in FIG. 3, the semiconductor laser 4 and the collimating lens 1
0 is placed on the surface 1a of the substrate 1 at a predetermined position via the adhesive 100, and then the semiconductor laser 4 and the second collimating lens 10 are adjusted so that parallel rays of the semiconductor laser 4 are obtained on the surface 1a of the substrate 1. To do. Moreover, the optical axis of the laser beam 9 which is a parallel light beam obtained by the collimator lens 10 is set to the substrate 1
The coordinate plate 50 shown in FIG. 3 is placed in front of the other end 1c of the substrate 1 while running in the upper space so that the optical axis of the laser beam 9 coincides with a predetermined coordinate 50a of the coordinate plate 50. Set.

【0019】前述の方法を繰り返すことにより、各光部
品11,11a,20,12,22等を基板1上に次々
に搭載し、その都度、各光部品11〜22等を貫通した
部品光軸とレーザ光9の光軸とが整合するように調整し
た後、接着剤100で基板1に固定する。従って、各光
部品の底面のみに接着剤100を設け、光が通過する側
面方向には接着剤を必要とすることなく、座標板50の
座標50a上に、前記光軸と部品光軸を完全に整合させ
ることができ、簡単で高精度の組立を行うことができ
る。尚、前述の実施例では、光ピックアップの場合につ
いて述べたが、光ピックアップに限ることなく、他の光
部品応用製品に適用することも可能である。
By repeating the above-described method, the optical components 11, 11a, 20, 12, 22 and the like are mounted on the substrate 1 one after another, and each time the optical axis of the component 11 to 22 and the like penetrates the optical component. After adjusting so that the optical axis of the laser beam 9 and the optical axis of the laser beam 9 are aligned, the substrate 100 is fixed with an adhesive 100. Therefore, the adhesive 100 is provided only on the bottom surface of each optical component, and the optical axis and the component optical axis are perfectly aligned on the coordinates 50a of the coordinate plate 50 without the need for an adhesive in the side direction through which light passes. Therefore, the assembly can be performed easily and with high precision. In the above-mentioned embodiment, the case of the optical pickup has been described, but the present invention is not limited to the optical pickup and can be applied to other optical component application products.

【0020】[0020]

【発明の効果】本発明による光部品固定方法は、以上の
ように構成されているため、次のような効果を得ること
ができる。すなわち、半導体レーザのレーザ光の光軸と
各光部品の部品光軸とを整合しつつ、光部品の底面を接
着剤を介して基板に取付け光部品を組立てているため、
従来のように、基板の表面に座等の位置決め手段を設け
る必要がなく、組立が容易となると共に、基板表面の性
状とは無関係に高精度な光軸整合を得ることができ、同
時に、全体形状の小形化を達成することができる。
Since the optical component fixing method according to the present invention is constructed as described above, the following effects can be obtained. That is, while aligning the optical axis of the laser light of the semiconductor laser and the component optical axis of each optical component, the bottom of the optical component is attached to the substrate via the adhesive to assemble the optical component,
Unlike conventional methods, it is not necessary to provide a positioning means such as a seat on the surface of the substrate, assembly is easy, and highly accurate optical axis alignment can be obtained regardless of the properties of the substrate surface. Miniaturization of the shape can be achieved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による光部品固定方法を示すもので、組
立後の光ピックアップを示す要部の断面図である。
FIG. 1 is a sectional view of an essential part showing an optical pickup after assembly, showing a method for fixing an optical component according to the present invention.

【図2】図1の平面図である。FIG. 2 is a plan view of FIG.

【図3】固定状態を示す構成図である。FIG. 3 is a configuration diagram showing a fixed state.

【図4】従来の光ピックアップを示す断面図である。FIG. 4 is a sectional view showing a conventional optical pickup.

【符号の説明】[Explanation of symbols]

1 基板 9 レーザ光 10 光部品 11a 〃 12 〃 12a 〃 20 〃 50 座標板 100 接着剤 1 substrate 9 laser light 10 optical component 11a 〃 12 〃 12a 〃 20 〃 50 coordinate plate 100 adhesive

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 基板(1)上に光部品(11a,20,12,12a・・・)
を設け、表面実装を施すようにした光部品固定方法にお
いて、前記光部品(11a,20,12,12a・・・)の底面(11aA,20A,
12A,12aA・・・)と前記基板(1)の表面(1a)間を接着剤(100)
を介して固定することを特徴とする光部品固定方法。
1. An optical component (11a, 20, 12, 12a ...) On a substrate (1).
In the optical component fixing method for providing surface mounting, the bottom surface of the optical component (11a, 20, 12, 12a ...) (11aA, 20A,
12A, 12aA ...) and the surface (1a) of the substrate (1) between the adhesive (100)
A method for fixing an optical component, characterized in that the optical component is fixed through the.
【請求項2】 前記基板(1)上の空間に走るレーザ光(9)
を光軸とし、この光軸に合わせて前記光部品(11a,20,1
2,12a・・・)を固定することを特徴とする請求項1記載の
光部品固定方法。
2. A laser beam (9) running in a space above the substrate (1)
As an optical axis, and the optical component (11a, 20, 1
2, 12a ...) is fixed, The optical component fixing method according to claim 1, wherein
【請求項3】 前記光部品(11a,20,12,12a・・・)は複数よ
りなることを特徴とする請求項1又は2記載の光部品固
定方法。
3. The optical component fixing method according to claim 1, wherein the optical components (11a, 20, 12, 12a ...) Are composed of a plurality of components.
【請求項4】 前記光部品(11a,20,12,12a・・・)の部品光
軸と前記レーザ光(9)の光軸の整合を座標板(50)を用い
て行うことを特徴とする請求項2又は3記載の光部品固
定方法。
4. The coordinate plate (50) is used to align the optical axes of the optical components (11a, 20, 12, 12a ...) With the optical axes of the laser light (9). The optical component fixing method according to claim 2 or 3.
【請求項5】 前記光部品(11a,20,12,12a・・・)は光ピッ
クアップを構成することを特徴とする請求項1ないし3
の何れかに記載の光部品組立方法。
5. The optical component (11a, 20,12,12a ...) constitutes an optical pickup.
An optical component assembling method according to any one of 1.
JP19951791A 1991-08-08 1991-08-08 Optical component fixing method Pending JPH0545543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19951791A JPH0545543A (en) 1991-08-08 1991-08-08 Optical component fixing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19951791A JPH0545543A (en) 1991-08-08 1991-08-08 Optical component fixing method

Publications (1)

Publication Number Publication Date
JPH0545543A true JPH0545543A (en) 1993-02-23

Family

ID=16409144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19951791A Pending JPH0545543A (en) 1991-08-08 1991-08-08 Optical component fixing method

Country Status (1)

Country Link
JP (1) JPH0545543A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1143519A2 (en) * 2000-04-04 2001-10-10 Lucent Technologies Inc. Apparatus and method for assembling optical devices
JP2001320158A (en) * 2000-05-11 2001-11-16 Sharp Corp Method of mounting leadless parts to flexible board, and method of manufacturing optical pickup device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1143519A2 (en) * 2000-04-04 2001-10-10 Lucent Technologies Inc. Apparatus and method for assembling optical devices
EP1143519A3 (en) * 2000-04-04 2007-05-02 Lucent Technologies Inc. Apparatus and method for assembling optical devices
JP2001320158A (en) * 2000-05-11 2001-11-16 Sharp Corp Method of mounting leadless parts to flexible board, and method of manufacturing optical pickup device

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