KR100633864B1 - Method for manufacturing optical modulator module package - Google Patents

Abstract

A method for manufacturing a light modulation module package is provided to minimize a module package and to reduce extraneous substances and scratches during a process by controlling intervals between plural adhesive agents and reducing the number of adhesive agent applying times. An adhesive agent is applied on a surface of a substrate(220) to mount a light modulation device(230) and driver integrated circuits(240,245,250,255). The light modulation device and the driver integrated circuits are adhered to the adhesive agent. The light modulation device and the driver integrated circuits are simultaneously flip chip bonded in a pre-set temperature and pressure condition. A dam is formed to enclose a region where the light modulation device on the substrate is mounted. Epoxy resin coupling to the light modulation device is applied on the region enclosed by the dam.

Description

Method for manufacturing optical modulator module package

1A is a view coated with an adhesive for mounting a light modulator element and a driver integrated circuit according to the prior art on a substrate;

1B is a diagram showing the structure of a thin film piezoelectric light modulator element used in the present invention.

Figure 2 is an exploded perspective view of an optical modulator module package to which the present invention is applied.

3 is a schematic diagram showing a method of flip chip connecting by an anisotropic conductive film used in the present invention.

4 is a diagram showing an adhesive applied to mount a light modulator element and a driver integrated circuit according to a first preferred embodiment of the present invention on a substrate;

FIG. 5 is a view showing an adhesive applied to mount a light modulator element and a driver integrated circuit on a substrate according to a second preferred embodiment of the present invention; FIG.

FIG. 6 is a view showing an adhesive coated with a light modulator element and a driver integrated circuit according to a third preferred embodiment of the present invention mounted on a substrate; FIG.

<Explanation of symbols for the main parts of the drawings>

410: substrate

420, 430, 450, 460: area where driver integrated circuit is mounted

440: region in which the optical modulator element is mounted

470: first adhesive

480: second adhesive

The present invention relates to an optical modulator, and more particularly, to a method of manufacturing an optical modulator module package.

An optical modulator is a circuit or an apparatus that mounts a signal on light (optical modulation) in a transmitter when a free space of an optical fiber or an optical frequency band is used as a transmission medium. Optical modulators are used in the fields of optical memory, optical display, printer, optical interconnection, hologram, etc., and researches on the development of display devices using the same are being actively conducted. Such an optical modulator is related to MEMS technology, and MEMS (Micro Electro Mechanical System) is a technology for forming a three-dimensional structure on a silicon substrate using a semiconductor manufacturing technology. The fields of application of MEMS are very diverse, and examples thereof include various sensors for vehicles, inkjet printer heads, HDD magnetic heads, and portable communication devices that are rapidly progressing in miniaturization and high functionality. The MEMS element has an injured portion on the substrate so as to be mechanically operated. MEMS can be called a micro electromechanical system or device, which is one of the applications in the field of optics. Micromachining technology enables the fabrication of optical components smaller than 1mm, enabling ultra-compact optical systems. Separately manufactured semiconductor lasers can be mounted on a stand made by micromachining technology, and micro Fresnel lenses, beam splitters, and 45 ㅀ reflector mirrors can be fabricated by micromachining technology. Existing optical system constructs the system using assembling mechanism on mirror and lens on large and heavy optical bench. In addition, the size of the laser is also large. In order to obtain the performance of the optical system configured as described above, there is a problem in that the optical axis, the reflection angle, and the reflection surface must be aligned with a considerable amount of effort using a precise stage.

Currently, micro optical systems have been adopted and applied to information communication devices, information displays, and recording devices due to advantages such as fast response speed, small loss, and ease of integration and digitization. For example, micro-optical components such as micromirrors, microlenses, optical fiber holders, and the like can be applied to information storage and recording devices, large image display devices, optical communication devices, and adaptive optics.

Here, the micro-mirror is applied in various ways depending on the direction and dynamic and static motion of the vertical direction, rotation direction, sliding direction and the like. Up and down motion is applied to phase compensator or diffractometer, and tilting motion is scanner, switch, optical signal divider, optical signal attenuator, light source array, etc., and sliding direction is light shield or switch optical signal. It is applied as a dispenser.

FIG. 1A is a view showing an adhesive coated with a substrate for mounting an optical modulator device and a driver integrated circuit for manufacturing an optical modulator module package according to the prior art. Referring to FIG. 1A, a region 170 in which a substrate 110, adhesives 120, 130, 140, 150, 160 and a light modulator element are mounted is shown. Here, the substrate 110 is a substrate capable of producing a fine-pitch wiring and a bump array, and may be a glass substrate, a silicon substrate, an LTCC substrate, a multi-layer PCB, etc., as well as a printed circuit board. have.

Among the methods for mounting the optical modulator and driver integrated circuit on the substrate 110, a flip chip connection method is mainly used. The flip chip connection method is a method of forming protrusions such as solder balls on an electrode pattern or an internal lead of a chip, and connecting the chip to an electrode pattern formed on the substrate 110 when the chip is mounted on the substrate 110.

In this case, an adhesive for attaching the optical modulator and the driver integrated circuit to the substrate 110 is used, and a separate adhesive is currently used for each device. That is, referring to FIG. 1A, the adhesives 120, 130, 150, and 160 applied to the area where the driver integrated circuit is mounted and the adhesive 140 applied to the area 170 where the light modulator is mounted are illustrated. Here, since the size of the adhesive is different, there is a problem that a plurality of equipment for applying the adhesive should be used.

Therefore, according to the adhesive coating method according to the prior art, there is a problem that the process time is large because the number of loading and unloading during the optical modulator module package manufacturing process is large. In addition, as the number of times of applying the adhesive increases, there is a big problem that foreign substances and scratches may occur during the manufacturing process.

The present invention provides a method of manufacturing an optical modulator module package that can shorten the number of times of manufacturing process of the optical modulator module package by using one adhesive to attach the optical modulator and driver integrated circuit to the substrate.

In addition, the present invention by using a single adhesive for attaching the optical modulator and driver integrated circuit to the substrate, the optical modulator module package that can reduce the number of times to apply the adhesive to reduce the possibility of foreign substances and scratches during the manufacturing process It provides a manufacturing method.

In addition, the present invention provides an optical modulator module package manufacturing method capable of minimizing the size of the module package by attaching the optical modulator and driver integrated circuit to the substrate in one process to easily control the distance between the plurality of adhesives.

In addition, the present invention provides a method of manufacturing an optical modulator module package capable of fine pitch by attaching an optical modulator and a driver integrated circuit to a substrate in one process to easily control the distance between the plurality of adhesives.

In addition, the present invention provides a method of manufacturing an optical modulator module package that can reduce the number of times of equipment use and cost by applying an adhesive for attaching the optical modulator and driver integrated circuit to the substrate using a single equipment.

According to one aspect of the invention, the step of applying an adhesive for mounting the optical modulator element and driver integrated circuit on one surface of the substrate by one process, the step of simultaneously bonding the optical modulator element and driver integrated circuit on the adhesive, optical A method of fabricating an optical modulator module package including flip chip bonding of a modulator element and a driver integrated circuit simultaneously under conditions of a predetermined temperature and pressure can be provided.

In addition, the method of manufacturing an optical modulator module package according to the present invention further comprises the step of forming a dam surrounding an area in which the optical modulator element is mounted on the substrate, and applying an epoxy resin coupled with the optical modulator element to the area surrounded by the dam. It may include.

According to another aspect of the invention, the step of forming a circuit pattern and a metal pad on the light transmissive cover, applying an adhesive for mounting the light modulator element and driver integrated circuit on one surface of the light transmissive cover by one process, adhesive Bonding the optical modulator element and the driver integrated circuit onto the substrate; flip-bonding the optical modulator element and the driver integrated circuit simultaneously under conditions of a predetermined temperature and pressure; a light transmissive cover having the optical modulator element and the driver integrated circuit mounted thereon It can provide a method of manufacturing an optical modulator module package comprising mounting a to a substrate.

In addition, the method of manufacturing an optical modulator module package according to the present invention comprises the steps of forming a dam surrounding an area in which the optical modulator element is mounted on the light transmissive cover, and applying an epoxy resin coupled with the optical modulator element to the area surrounded by the dam. It may further include.

Here, the adhesive may be any one of an anisotropic conductive film (ACF), a nonconductive film (NCF), and a nonconductive paste (NCP).

In addition, an anisotropic conductive film (ACF) or a non-conductive film (NCF) is used as an adhesive in a region where the optical modulator element is mounted, and a non-conductive paste (NCP) or an anisotropic conductive paste (ACP) is used as an adhesive in a region where the driver integrated circuit is mounted. ) Can be used.

Here, the adhesive may include a first adhesive and a second adhesive symmetrically about the light modulator element and spaced by a predetermined interval.

Here, the adhesive may be formed with a central hole corresponding to the region in which the light modulator element is mounted.

Here, as an adhesive, an anisotropic conductive film (ACF) or a non-conductive film (NCF) having a central hole corresponding to the region in which the optical modulator element is mounted is used as an adhesive, and the driver integrated circuit is mounted. Non-conductive paste (NCP) or anisotropic conductive paste (ACP) may be used in the region.

Hereinafter, a preferred embodiment of the optical modulator module package manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings, in the following description with reference to the accompanying drawings, the same components regardless of reference numerals denote the same reference numerals. And duplicate description thereof will be omitted. In addition, prior to describing the preferred embodiments of the present invention in detail, a method of flip chip connection by an optical modulator element, a module package structure thereof and an anisotropic conductive film will be described first.

The optical modulator element can be largely divided into an electrostatic method and a piezoelectric method, and can be applied to the present invention regardless of the driving method.

The electrostatic grating light modulator disclosed in US Pat. No. 5,311,360 includes a plurality of regularly spaced deformable reflective ribbons having reflective surface portions and suspended above the substrate. An insulating layer is deposited on the silicon substrate. Next, the deposition process of the sacrificial silicon dioxide film and the silicon nitride film is followed.

The nitride film is patterned from the ribbon and a portion of the silicon dioxide layer is etched so that the ribbon is held on the oxide spacer layer by the nitride frame. To modulate light with a single wavelength [lambda] 0, the modulator is designed such that the thickness of the ribbon and the thickness of the oxide spacers are [lambda] 0/4.

The lattice amplitude of this modulator, defined by the vertical distance d between the reflective surface on the ribbon and the reflective surface of the substrate, is the conduction of the ribbon (reflective surface of the ribbon serving as the first electrode) and the substrate (substrate serving as the second electrode). Film).

1B is a diagram showing the structure of a thin film piezoelectric optical modulator element used in the present invention. Referring to FIG. 1B, an optical modulator including a substrate 11, an insulating layer 12, a sacrificial layer 13, a ribbon structure 14, and a piezoelectric body 15 is shown.

The substrate 11 is a commonly used semiconductor substrate, and the insulating layer 12 is deposited as an etch stop layer, and an etchant for etching a material used as a sacrificial layer, where the etchant is an etching gas or an etching Solution). Here, the insulating layer 12 may be coated with a reflective layer (not shown) to reflect incident light.

The sacrificial layer 13 supports the ribbon structure 14 at both sides so as to be spaced apart from the insulating layer 12 at regular intervals, and serves to form a space at the center.

The ribbon structure 14 serves to light modulate the signal by causing diffraction and interference of incident light as described above. The shape of the ribbon structure 14 may be configured in the form of a plurality of ribbons according to the electrostatic method, or may be provided with a plurality of open holes in the center of the ribbon according to the piezoelectric method. In addition, the piezoelectric member 15 controls the ribbon structure 14 to move up and down in a piezoelectric manner.

When the wavelength of light is λ, the distance between the ribbon structure 14 and the insulating layer 12 on which the lower reflective layer is formed is equal to λ / 2 in the state where the light modulator is not deformed (no voltage is applied). Therefore, the total path difference between the light reflected from the ribbon structure 14 and the insulating layer 12 is equal to λ so that the light interferes constructively.

In addition, when an appropriate voltage is applied to the piezoelectric body 15, the distance between the ribbon structure 14 and the insulating layer 12 on which the lower reflective layer is formed is equal to λ / 4. Thus, the total path difference between the light reflected from the ribbon structure 14 and the insulating layer 12 is equal to [lambda] / 2 so that light interferes with each other. As a result of such interference, the optical modulator may load a signal on the light by adjusting the amount of incident light. The optical modulator element may be classified into a recessed type and a protrusion type according to the shape of the ribbon structure 14.

2 is an exploded perspective view of an optical modulator module package to which the present invention is applied. Referring to FIG. 2, the optical modulator module package 200 includes a substrate 210, a light transmissive substrate 220, a light modulator element 230, driver integrated circuits 240, 245, 250, and 250, and a heat dissipation plate 260. ) And a connector 270.

The bottom surface of the light transmissive substrate 220 is attached to the substrate 210. The light modulator element 230 is attached to the top surface of the light transmissive substrate 220 to correspond to the hole formed in the substrate 210.

The light modulator element 230 emits diffracted light by modulating incident light incident through the hole of the substrate 210. The optical modulator element 230 is flip chip connected on the light transmissive substrate 220. An adhesive or the like is formed around the seal to provide sealing from the external environment, and the electrical connection is maintained by the electrical wiring formed along the surface of the light transmissive substrate 220.

The driver integrated circuits 240, 245, 250, and 250 are flip-chip connected to the periphery of the optical modulator element 230 to which the light transmissive substrate 220 is attached, and the optical modulator element 230 according to a control signal input from the outside. ) To provide a driving voltage.

The heat dissipation plate 260 is provided to dissipate heat generated in the optical modulator element 230 and the driver integrated circuits 240, 245, 250, and 250, and a metal material that emits heat well is used.

The method of manufacturing the optical modulator module package 200 shown in FIG. 2 includes attaching the connector 270 to the substrate 210, the optical modulator element 230 and the driver integrated circuit 240 on the transparent substrate 220. Attaching 245, 250, 250, providing a heat sink 260, laminating the light transmissive substrate 220 to the substrate 210 and performing wire bonding, optical modulator element 230 and driver integration Attaching the heat dissipation plate 260 to the circuits 240, 245, 250, and 250 and performing molding to form the optical modulator module package 200.

In addition, although the case where the optical modulator element and the driver integrated circuit are mounted on the light transmissive substrate has been described, the present invention is not limited thereto. For example, the optical modulator element and driver integrated circuit may be mounted directly on the substrate.

It is a schematic diagram which shows the method of flip-chip connected by the anisotropic conductive film used for this invention. Referring to FIG. 3, a substrate 310, an optical modulator element 320, metal pads or bumps 330, 335, 340, 345, insulation assistant 350, and conductive particles 360 are shown.

Any adhesive that can attach the chip to the substrate can be applied to the present invention regardless of its form. For example, any one of an anisotropic conductive film (ACF), a non-conductive film (NCF), a non-conductive paste (NCP), and an anisotropic conductive paste (ACP) Or an adhesive prepared from a combination thereof may be applied to the present invention. Hereinafter, a case in which the chip is attached to the substrate based on the anisotropic conductive film (ACF) will be described.

In addition, in the case of film, a laminating process is used, and in the case of paste, a dispensing process is used. Therefore, hereinafter, it will be referred to apply when both of these bonding process is available.

The anisotropic conductive film is an anisotropic conductive film required for mounting technology for connecting an LCD panel and a driver integrated circuit for a liquid crystal display (LCD) used in a mobile phone or a computer. The anisotropic conductive film is scattered fine conductive particles (360) having a diameter of 3 ~ 15㎛ on an insulating adhesive 350 having an adhesive film thickness of 15 ~ 35 μm ( Adhesive film in the dispersed state. There are various kinds of conductive particles 360, and carbon fiber, metal (eg, Ni, Solder) and metal coated metal ball (Metal (Ni / Au) -Coated Plastic Ball) are mainly used. . Insulation Adsorption (350) Adhesive Materials include Thermoplastic (SBR: Styrene Butadiene Rubber, Pol-yvinyl Butylene), Thermosetting (Epoxy Resin, Polyurethane, Acrylic Resin), and Thermopla-stic and Thermosetting Material Materials can be used. The term 'anisotropy' here means that the conductive properties change depending on the direction. That is, according to the present invention, the anisotropic conductive film is conductive in the vertical direction in which the flip chip-connected optical modulator element and the substrate are vertically connected, but not in the horizontal direction orthogonal thereto.

The optical modulator, the module package, and the anisotropic conductive film applied to the optical modulator module package manufacturing method are described above. Hereinafter, the optical modulator module package manufacturing method according to the present invention will be described with reference to the accompanying drawings. Let's explain. Embodiments according to the present invention are largely divided into three, which will be described in turn below.

FIG. 4 is a view showing an adhesive coated with a light modulator element and a driver integrated circuit according to a first embodiment of the present invention on a substrate. Referring to FIG. 4, the substrate 410, the regions 420, 430, 450, and 460 on which the driver integrated circuits are mounted, the region 440 on which the optical modulator elements are mounted, the first adhesive 470, and the second adhesive ( 480 is shown. Only one cross section of the process of applying an adhesive in the optical modulator module package manufacturing process is shown here.

The optical modulator and driver integrated circuit are electrically connected to the substrate 410 by a flip chip connection method. In this case, an adhesive for attaching the optical modulator and driver integrated circuit to the substrate 410 is used. According to the present invention, the size and type of adhesive applied to each device is controlled to attach the optical modulator and the driver integrated circuit to the substrate 410 using one or two adhesives. That is, referring to FIG. 4, adhesives 470 and 480 applied to regions 420, 430, 450, and 460 on which driver ICs are mounted and regions 440 on which light modulators are mounted are illustrated. Since the adhesives 470 and 480 have the same size, the adhesive application process can be performed by a single machine for applying the adhesives 470 and 480. Therefore, the adhesive application process can be performed in a single process using one machine, which simplifies the process. Here, the substrate 210 may be formed of a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC) having a heat dissipation function. Here, since an adhesive application process is performed by one process, it is called the process by which an adhesive agent is apply | coated by one process.

In addition, since the adhesive application process may be performed in a single process using a single machine, the distance between the first adhesive 470 and the second adhesive 480 may be finely adjusted, thereby increasing the size of the optical modulator module package as a whole. Can be reduced. Here, the first adhesive and the second adhesive are symmetrical about the light modulator element and spaced apart by a predetermined interval.

Here, the method of manufacturing an optical modulator module package according to the present invention is the step of simultaneously applying an adhesive for mounting the optical modulator element and the drive integrated circuit on one surface of the substrate, the step of simultaneously bonding the optical modulator element and the drive integrated circuit on the adhesive And flip chip bonding the optical modulator element and the drive integrated circuit simultaneously under conditions of a predetermined temperature and pressure. Here, the light modulator element may be protected by forming a dam surrounding the region where the light modulator element is mounted on the substrate, and applying or dispensing an epoxy resin bonded to the light modulator element in the region surrounded by the dam. . Here, the term "simultaneously" may mean spontaneously in physical time or may be processed in the same process, as follows.

The method of manufacturing an optical modulator module package according to the present invention can be applied to a case in which the optical modulator element is directly mounted on the light transmissive cover. That is, according to another embodiment, a method of manufacturing an optical modulator module package according to the present invention includes forming a circuit pattern and a metal pad on a light transmissive cover, and for mounting the light modulator element and the drive integrated circuit on one surface of the light transmissive cover. Simultaneously applying an adhesive, simultaneously adhering the optical modulator element and the drive integrated circuit onto the adhesive, flip chip bonding the optical modulator element and the drive integrated circuit simultaneously at predetermined temperature and pressure conditions, the optical modulator element and The method may include mounting a light transmissive cover on which a drive integrated circuit is mounted on a substrate.

Here, an adhesive of a separate component may be used for each device. For example, an anisotropic conductive film (ACF) or non-conductive film (NCF) is used as an adhesive in a region where the optical modulator element is mounted, and a non-conductive paste (NCP) or anisotropic conductive paste (ACP) is used in the region where the drive integrated circuit is mounted. ) Can be used. In the case of using the non-conductive paste (NCP) partially, there is an advantage that does not require additional equipment because the process is performed by the dispensing method. That is, the anisotropic conductive film (ACF) or non-conductive film (NCF) is a film form, but in addition to the flip chip bonder used when bonding the chip and the IC, there must be a separate pressurization facility, but the non-conductive paste (NCP) or anisotropic conductive paste (ACP) is a dispensing material that can be applied to flip chip bonders, so no additional equipment is required and the application is simple.

FIG. 5 is a view showing an adhesive coated with a substrate for mounting an optical modulator device and a driver integrated circuit according to a second exemplary embodiment of the present invention. Referring to FIG. 5, a substrate 510, regions 520 and 540 on which driver integrated circuits are mounted, regions 530 on which an optical modulator element is mounted, a first adhesive 550, and a second adhesive 560 are illustrated. The differences from the first embodiment described above will be mainly described.

Since the present invention relates to a method for mounting an optical modulator element and a driver integrated circuit on a substrate, the number of ribbons or the number of driver integrated circuits included in the optical modulator element is obvious to those skilled in the art. Do. Referring to FIG. 5, a case is described in which the light modulator element has 480 ribbons. The number of ribbons can be configured differently depending on the development device and the required resolution. That is, in a projection TV or the like, 720 or 1080 ribbons are required, and in a small projector or the like, 480 may be required. Driver integrated circuits may be provided corresponding to the number of ribbons of the optical modulator element, where four are arranged.

FIG. 6 is a view showing an adhesive coated with a light modulator element and a driver integrated circuit according to a third exemplary embodiment of the present invention mounted on a substrate. Referring to FIG. 6, a substrate 610, regions 620, 630, 650, and 660 on which a driver integrated circuit is mounted, an adhesive 640, and an region 670 on which an optical modulator element is mounted are illustrated. The differences from the first embodiment described above will be mainly described.

The adhesive 640 has a through hole corresponding to a region 670 in which the light modulator element is mounted at the center portion. In this case, the driver integrated circuit may be mounted with a liquid such as a non-conductive paste (NCP), so that one device for applying an anisotropic conductive film (ACF) or a non-conductive film (NCF) may be used. In another embodiment, the adhesive 640 may be sized to cover the entire substrate 610. That is, one adhesive 640 having a through hole corresponding to the region 670 in which the optical modulator element is mounted in the central portion is applied to the substrate 610, and the optical modulator element and the driver integrated circuit are applied to the substrate ( 610 may be flip-chip connected.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, the method of manufacturing the optical modulator module package according to the present invention has the effect of reducing the number of manufacturing time of the optical modulator module package by using one adhesive to attach the optical modulator and the driver integrated circuit to the substrate. .

In addition, the optical modulator module package manufacturing method according to the present invention uses a single adhesive to attach the optical modulator and driver integrated circuit to the substrate, thereby reducing the number of times of applying the adhesive and possibly causing foreign substances and scratches during the manufacturing process. There is an effect that can be lowered.

In addition, the optical modulator module package manufacturing method according to the present invention has the effect of minimizing the module package by attaching the optical modulator and driver integrated circuit to the substrate in one process to easily control the distance between the plurality of adhesives.

In addition, the optical modulator module package manufacturing method according to the present invention has an effect of enabling a fine pitch by attaching an optical modulator and a driver integrated circuit to a substrate in one process to easily control a gap between a plurality of adhesives.

In addition, the method of manufacturing an optical modulator module package according to the present invention has the effect of reducing the number of times of equipment use and cost by applying an adhesive for attaching the optical modulator and the driver integrated circuit to the substrate using one device. .

Although the above has been described with reference to a preferred embodiment of the present invention, those of ordinary skill in the art to the present invention without departing from the spirit and scope of the present invention and equivalents thereof described in the claims below It will be understood that various modifications and changes can be made.

Claims (9)

Applying, in one step, an adhesive for mounting the optical modulator element and the driver integrated circuit on one surface of the substrate; Bonding an optical modulator element and the driver integrated circuit on the adhesive; And And flip chip bonding the optical modulator element and the driver integrated circuit simultaneously under conditions of a predetermined temperature and pressure. The method of claim 1, Forming a dam surrounding the area where the light modulator element is mounted on the substrate; And And applying an epoxy resin to the optical modulator element in an area surrounded by the dam. Forming a circuit pattern and a metal pad on the light transmissive cover; Applying, in one step, an adhesive for mounting the optical modulator element and the driver integrated circuit on one surface of the transparent cover; Bonding an optical modulator element and the driver integrated circuit on the adhesive; Flip chip bonding the optical modulator element and the driver integrated circuit simultaneously at predetermined temperature and pressure conditions; And And mounting the light transmissive cover on which the light modulator element and the driver integrated circuit are mounted on a substrate. The method of claim 3, Forming a dam on the light transmissive cover surrounding a region in which the light modulator element is mounted; And And applying an epoxy resin to the optical modulator element in an area surrounded by the dam. The method according to claim 1 or 3, The adhesive is any one of an anisotropic conductive film (ACF), non-conductive film (NCF), non-conductive paste (NCP) and anisotropic conductive paste (ACP). The method according to claim 1 or 3, An anisotropic conductive film (ACF) or non-conductive film (NCF) is used as the adhesive in a region where the optical modulator element is mounted, and a non-conductive paste (NCP) or anisotropic conductive paste as the adhesive in a region where the driver integrated circuit is mounted. A method of manufacturing an optical modulator module package, characterized in that (ACP) is used. The method according to claim 1 or 3, And said adhesive comprises a first adhesive and a second adhesive symmetrically about said light modulator element and spaced by a predetermined interval. The method according to claim 1 or 3, Wherein the adhesive is a modulator module package manufacturing method, characterized in that the central hole corresponding to the area in which the optical modulator device is mounted. The method according to claim 1 or 3, As the adhesive, an anisotropic conductive film (ACF) or a non-conductive film (NCF) having a central hole corresponding to a region in which the optical modulator element is mounted is used in a region where the optical modulator element is mounted, and the driver integrated circuit is mounted. Non-conductive paste (NCP) or anisotropic conductive paste (ACP) is used in the region.

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