KR100836658B1 - Optical modulator module package and Manufacturing Method thereof - Google Patents

Abstract

An optical modulator for modulating the signal by emitting light corresponding to a predetermined signal; A driver IC having a hole for emitting outgoing light emitted from the light modulator, the input terminal of the light modulator being directly connected to an output end formed on one surface to drive the light modulator; And a light transmissive cover coupled to the other side of the driver IC, the light transmissive cover for passing outgoing light exiting from the light modulator. The optical modulator module package and the manufacturing method thereof according to the present invention have an effect of minimizing the module package by directly connecting the optical modulator and the driver IC.

Optical Modulators, Boards, Driver ICs, Modules.

Description

Optical modulator module package and manufacturing method

1A is an exploded perspective view of an optical modulator module package according to the prior art.

1B is a perspective view of a diffractive optical modulator module using a piezoelectric body applicable to the present invention.

2 is an exploded perspective view of an optical modulator module package according to a first preferred embodiment of the present invention.

3A is a cross-sectional view of an optical modulator module package according to a first preferred embodiment of the present invention.

Figure 3b is a cross-sectional view of the optical modulator module package using a metal member according to a first embodiment of the present invention.

4 is a plan view of an optical modulator module package according to a first preferred embodiment of the present invention.

5 is a bottom view of an optical modulator module package according to a first preferred embodiment of the present invention.

6 is an exploded perspective view of an optical modulator module package according to a second preferred embodiment of the present invention.

7 is a cross-sectional view of an optical modulator module package according to a second preferred embodiment of the present invention.

8 is a plan view of an optical modulator module package according to a second preferred embodiment of the present invention.

9 is a bottom view of an optical modulator module package according to a second preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

210: substrate

220: driver IC

230: light modulator

240: light transmissive cover

The present invention relates to an optical modulator, and more particularly, to an optical modulator module package and a method of manufacturing the same.

In general, optical signal processing has advantages of high speed, parallel processing capability, and large-capacity information processing, unlike conventional digital information processing, which can not process a large amount of data and real time, and design a binary phase filter using spatial optical modulation theory. Research into fabrication, optical logic gates, optical amplifiers, and image processing techniques, optical devices, optical modulators, and the like has been conducted. Dual optical modulators are used in the fields of optical memory, optical display, printer, optical interconnection, and hologram, and research and development of light beam scanning apparatus using them have been in progress.

An optical modulator is a circuit or device that transmits a signal to light (optical modulation) in a transmitter when the optical medium or free space of an optical frequency band is used as a transmission medium. Optical modulators are used in the fields of optical memory, optical display, printer, optical interconnection, hologram, etc., and researches on the development of display devices using the same are being actively conducted. Such an optical modulator is related to MEMS technology, and MEMS (Micro Electro Mechanical System) is a technology for forming a three-dimensional structure on a silicon substrate using a semiconductor manufacturing technology. The fields of application of MEMS are very diverse, and examples thereof include various sensors for vehicles, inkjet printer heads, HDD magnetic heads, and portable communication devices that are rapidly progressing in miniaturization and high functionality. The MEMS element has an injured portion on the substrate so as to be mechanically operated. MEMS can be called a micro electromechanical system or device, which is one of the applications in the field of optics. Micromachining technology enables the fabrication of optical components smaller than 1mm, enabling ultra-compact optical systems. Separately manufactured semiconductor lasers can be mounted on a stand made by micromachining technology, and micro Fresnel lenses, beamsplitters, and 45 'reflecting mirrors can be fabricated and assembled by micromachining technology. Existing optical system constructs the system using assembling mechanism on mirror and lens on large and heavy optical bench. In addition, the size of the laser is also large. In order to obtain the performance of the optical system configured as described above, there is a problem in that the optical axis, the reflection angle, and the reflection surface must be aligned with a considerable amount of effort using a precise stage.

Currently, micro optical systems have been adopted and applied to information communication devices, information displays, and recording devices due to advantages such as fast response speed, small loss, and ease of integration and digitization. For example, micro-optical components such as micromirrors, microlenses, optical fiber holders, and the like can be applied to information storage and recording devices, large image display devices, optical communication devices, and adaptive optics.

Here, the micro-mirror is applied in various ways depending on the direction and dynamic and static motion of the vertical direction, rotation direction, sliding direction and the like. Up and down motion is applied to phase compensator or diffractometer, and tilting motion is scanner, switch, optical signal divider, optical signal attenuator, light source array, etc., and sliding direction is light shield or switch optical signal. It is applied as a dispenser.

The size of a micromirror is about 10-1000 micrometers, and about 1-106 pieces of mirrors are produced and applied. A large image display device is small, as small as 10 to 50 µm, but requires about one million mirrors because the number of mirrors is required by the number of pixels. However, in the case of adaptive optics or optical signal splitters, the size of the mirror is somewhat larger, about a few hundred micrometers, but the number is reduced, requiring several hundreds. In the case of scanners or optical pickups, the mirrors can be as large as a few millimeters and one application is sufficient. In this way, the size and number are very different depending on the application, and the application varies depending on the motion direction and the dynamic or static motion. Of course, the manufacturing method of the micro mirror accordingly is also different. The mirror of a large image display apparatus is about tens of micrometers in size, but the response time is very fast, about tens of microseconds, and the mirror of an adaptive optical or optical signal distributor is about several hundred micrometers in size and several hundreds of micrometers. Mirrors of several millimeters in size are used for scanners, and the response time is several kilometres.

1A is an exploded perspective view of an optical modulator module package according to the prior art. Referring to FIG. 1A, the optical modulator module package 100 includes a substrate 110, a light transmissive substrate 120, a light modulator 130, driver ICs 140, 145, 150, 155, a heat dissipation plate 160, and Connector 170.

The substrate 110 is a substrate for a semiconductor package generally used. The light transmissive substrate 120 has a bottom surface attached to the substrate 110. The light modulator 130 is attached to the upper surface of the light transmissive substrate 120 to correspond to the hole formed in the substrate 110. The connector 170 electrically connects the board 110 with the external board.

The light modulator 130 emits diffracted light by modulating incident light incident through the hole of the substrate 110. The light modulator 130 is flip chip connected to the light transmissive substrate 120. The driver ICs 140, 145, 150, and 155 are flip-chip connected to the periphery of the optical modulator 130 to which the light transmissive substrate 120 is attached to supply the driving voltage to the optical modulator 130 according to a control signal input from the outside. Serves to provide.

The heat dissipation plate 160 is provided to dissipate heat generated by the optical modulator 130 and the driver ICs 140, 145, 150, and 155, and a metallic material that emits heat well is used.

The method of manufacturing the optical modulator module package 100 shown in FIG. 1A includes attaching the connector 170 to the substrate 110, the optical modulator 130 and the driver ICs 140, 145, on the light transmissive substrate 120. Attaching 150 and 155, providing a heat sink 160, laminating the light transmissive substrate 120 to the substrate 110, and performing wire bonding, the light modulator 130 and the driver IC 140. Attaching the heat radiating plate 160 to the 145, 150, and 155, and mounting the optical modulator 130 and the driver ICs 140, 145, 150, and 155 to form the optical modulator module package 100. It is done by

The optical modulator module package 100 shown in FIG. 1A has a large number of components, and therefore, a large number of components must be mounted in an appropriate space, thereby limiting the minimization of the module package. In addition, in order to mount the light modulator 130 directly on the light transmissive substrate 120, the electrical / optical characteristics are concentrated on the light transmissive substrate 120, and the manufacturing cost of the light transmissive substrate 120 for realizing this is increased. There is a problem. In addition, since the light modulator 130 is directly mounted on the light transmissive substrate 120, there is a problem in that the effect of foreign matters is increased according to a narrow distance between the light modulator 130 and the light transmissive substrate 120. In addition, during the process of directly mounting the light modulator 130 to the light transmissive substrate 120, there is a problem that the contamination by foreign matter, scratches may occur.

The present invention provides an optical modulator module package and a method of manufacturing the same that can minimize the module package by directly connecting the optical modulator and the driver IC.

In addition, the present invention provides an optical modulator module package and a method of manufacturing the same, in which electrical / optical characteristics are not implemented on the light transmissive cover by not mounting the light modulator directly on the light transmissive cover.

In addition, the present invention provides an optical modulator module package having low manufacturing cost and a method of manufacturing the same because the electrical / optical characteristics are not concentrated in the transparent cover.

In addition, the present invention provides a light modulator module package and a method of manufacturing the light modulator module package that can reduce the effect of foreign matter between the light modulator and the light transmissive cover is not mounted directly on the light transmissive cover.

In addition, the present invention provides an optical modulator module package and a method of manufacturing the optical modulator module which can reduce the problem of contamination by foreign matters generated during the process of mounting the optical modulator directly to the light transmissive substrate by not mounting the optical modulator directly to the light transmissive cover. to provide.

The present invention also provides an optical modulator module package capable of fine pitch by not mounting the optical modulator directly on the light transmissive cover and a method of manufacturing the same.

Technical problems other than the present invention will be easily understood through the following description.

According to an aspect of the invention, the optical modulator for modulating the signal by emitting light corresponding to the predetermined signal; A driver IC having a hole for emitting outgoing light emitted from the light modulator, the input terminal of the light modulator being directly connected to an output end formed on one surface to drive the light modulator; And a light transmissive cover coupled to the other surface of the driver IC and configured to pass outgoing light emitted from the light modulator.

Here, the output terminal of the driver IC may be formed around the hole.

According to another aspect of the invention, an optical modulator for modulating the signal by emitting light corresponding to the predetermined signal; A plurality of driver ICs having an input terminal of the optical modulator directly connected to an output terminal formed on one surface thereof to drive the optical modulator, and spaced at predetermined intervals for passing outgoing light emitted from the optical modulator; And a light transmissive cover coupled to the other surface of the driver IC and configured to pass outgoing light emitted from the light modulator.

In addition, the optical modulator module package according to the present invention is formed with a hole for accommodating the optical modulator, may further include a substrate for transmitting a predetermined signal to the input terminal of the driver IC.

Here, the substrate may be a flexible circuit board.

The optical modulator may be mounted on the driver IC using solder.

Here, the light transmissive cover may be mounted on the driver IC using epoxy or solder.

The optical modulator may be flip-chip mounted on the driver IC using any one of an anisotropic conductive film (ACF), non-conductive film (NCF), non-conductive paste (NCP), and anisotropic conductive paste (ACP). have.

In addition, the optical modulator module package according to the present invention may further include a metal member for protecting the light transmissive cover around the light transmissive cover.

Further, according to another aspect of the present invention, (a) a hole for transmitting light is formed, the input terminal of the optical modulator is directly connected to the output terminal formed on one surface on the driver IC for driving the optical modulator Mounting an optical modulator to modulate a signal by emitting light corresponding to a predetermined signal to the hole; And (b) mounting a light transmissive cover through which light emitted from the light modulator passes through the other surface of the driver IC.

Here, the output terminal of the driver IC is formed around the hole, the light modulator may be mounted on the hole.

In addition, the optical modulator module package manufacturing method according to the present invention (c) is provided with a hole for accommodating the optical modulator, mounting the driver IC on a substrate for transmitting a predetermined signal to the input terminal of the driver IC It may further comprise a step.

Here, the substrate may be a flexible circuit board.

Here, in the step (a), the optical modulator may be mounted on the driver IC using solder.

Here, in the step (b), the light transmissive cover may be mounted on the driver IC using epoxy or solder.

Here, in the step (a), the optical modulator is attached to the driver IC of any one of an anisotropic conductive film (ACF), non-conductive film (NCF), non-conductive paste (NCP) and anisotropic conductive paste (ACP). It can be flip chip mounted.

In addition, the method of manufacturing a light modulator module package according to the present invention may further comprise the step of forming a metal member for protecting the light transmissive cover in the vicinity of the light transmissive cover.

Hereinafter, a preferred embodiment of an optical modulator module package and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same components regardless of reference numerals refer to the same reference numerals. Reference numerals will be omitted and duplicate description thereof will be omitted. In addition, the light modulator applicable to the present invention will be described first before describing the preferred embodiments of the present invention in detail.

Optical modulators are largely divided into a direct method of directly controlling the on / off of light and an indirect method using reflection and diffraction, and the indirect method may be divided into an electrostatic method and a piezoelectric method. Herein, the optical modulator device may be applied to the present invention regardless of the method of driving or the product name of the manufacturing company (for example, a Grating Light Valve (GLV) device which is an optical modulator of Silicon Light Machine Co., Ltd.).

The electrostatic grating light modulator disclosed in US Pat. No. 5,311,360 includes a plurality of regularly spaced deformable reflective ribbons having reflective surface portions and suspended above a substrate. An insulating layer is deposited on the silicon substrate. Next, the deposition process of the sacrificial polysilicon film and the silicon nitride film is followed.

The nitride film is patterned from the ribbon and a portion of the polysilicon layer is etched so that the ribbon is held on the oxide spacer layer by the nitride frame. To modulate light with a single wavelength [lambda] 0, the modulator is designed such that the thickness of the ribbon and the thickness of the oxide spacers are [lambda] 0/4.

The lattice amplitude of this modulator, defined by the vertical distance d between the reflective surface on the ribbon and the reflective surface of the substrate, is the conduction of the ribbon (reflective surface of the ribbon serving as the first electrode) and the substrate (substrate serving as the second electrode). Film).

1B is a perspective view of a diffractive light modulator module using a piezoelectric component among indirect light modulators applicable to the present invention. Referring to FIG. 1B, an optical modulator including a substrate 111, an insulating layer 112, a sacrificial layer 113, a ribbon structure 114, and a piezoelectric 115 is shown.

The substrate 111 is a commonly used semiconductor substrate, and the insulating layer 112 is deposited as an etch stop layer, and an etchant for etching a material used as a sacrificial layer, where the etchant is an etching gas or an etching solution. Solution). The insulating layer 112 may be coated with a reflective layer (not shown) to reflect incident light.

The sacrificial layer 113 supports the ribbon structure 114 at both sides so as to be spaced apart from the insulating layer 112 at regular intervals, and forms a space at the center.

The ribbon structure 114 serves to light modulate the signal by causing diffraction and interference of incident light as described above. The shape of the ribbon structure 114 may be configured in a plurality of ribbon shapes according to the electrostatic method, or may be provided with a plurality of open holes in the center of the ribbon according to the piezoelectric method. In addition, the piezoelectric member 115 controls the ribbon structure 114 to move up and down according to the piezoelectric method.

When the wavelength of the light is λ, the distance between the ribbon structure 114 and the insulating layer 112 on which the lower reflective layer is formed is equal to λ / 2 without the optical modulator unmodified (no voltage applied). Therefore, the total path difference between the light reflected from the ribbon structure 114 and the insulating layer 112 is equal to λ so that the light interferes constructively.

In addition, when an appropriate voltage is applied to the piezoelectric body 115, the distance between the ribbon structure 114 and the insulating layer 112 on which the lower reflective layer is formed is equal to λ / 4. Therefore, the total path difference between the light reflected from the ribbon structure 114 and the insulating layer 112 is equal to [lambda] / 2 so that light interferes with each other. As a result of this interference, the light modulator may load the signal on the light by adjusting the amount of incident light. The light modulator may be classified into a recessed type and a protrusion type according to the shape of the ribbon structure 114. In the present invention, the overall size can be reduced by mounting the optical modulator directly on the driver IC.

In the above description, a perspective view of an optical modulator module package and an optical modulator applied to the method of manufacturing the same is described in general. Hereinafter, a light modulator module package and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings. This will be described as a reference. Embodiments according to the present invention are largely classified into two types according to the shape of the driver IC, which will be described in order below.

2 is an exploded perspective view of an optical modulator module package according to a first embodiment of the present invention. 2, the optical modulator module package according to the present invention may include a substrate 210, a driver IC 220, an optical modulator 230, and a light transmissive cover 240.

The substrate 210 is a substrate for a semiconductor package generally used, and outputs a signal for driving the optical modulator 230 to the driver IC 220. The light modulator 230 is attached to one surface of the driver IC 220 to correspond to the hole formed in the substrate 210. The connector (not shown) serves to electrically connect the board 210 with the external board. The substrate 210 is formed with a predetermined hole capable of accommodating the optical modulator 230, and the optical modulator 230 is accommodated in the hole and connected to an output terminal of the driver IC 220. Here, the substrate 210 is a substrate capable of producing a fine-pitch wiring and a bump array, and may be a glass substrate, a silicon substrate, an LTCC substrate, a multi-layer PCB, etc., as well as a printed circuit board. have. In addition, the substrate 210 may be a flexible printed circuit board (FPC). Here, if the driver IC 220 has a structure that can be directly connected to the external substrate, it is obvious that the substrate 210 can be omitted.

The output terminal of the driver IC 220 is coupled to the input terminal of the optical modulator 230, and the input terminal of the driver IC 220 is flip chip connected to the substrate 210 around the optical modulator 230. Therefore, the driver IC 220 serves to provide a driving voltage to the optical modulator 230 according to a control signal input from the outside. Here, the driver IC 220 is formed with a hole for emitting the light emitted from the light modulator 230. These holes serve to pass incident light irradiated from the light source and diffracted light emitted from the light modulator 230. Here, the output terminal of the driver IC 220 may be formed in part or all around the hole formed in the driver IC 220.

The light modulator 230 emits diffracted light by modulating incident light incident through a hole formed in the substrate 210. The optical modulator 230 is connected on the driver IC 220. The driver IC 220 has an adhesive or the like formed around it to provide sealing from the external environment, and electrical connection is maintained by electrical wiring formed along the surface of the substrate 210.

Here, the optical modulator 230 and the driver IC 220 may be bonded by epoxy or solder, and the driver IC 220 may also be bonded by epoxy or solder to the substrate 210. In addition, the optical modulator 230 includes an anisotropic conductive film (ACF), a non-conductive film (NCF), a non-conductive paste (NCP), and an anisotropic conductive paste (ACP). ) May be mounted to the driver IC 220 by an adhesive made of any one or a combination thereof.

The light transmissive cover 240 is coupled to the other surface of the driver IC 220 and serves to pass outgoing light emitted from the light modulator 230. Therefore, the transparent cover 240 is formed of a transparent material, for example, the transparent cover 240 may be formed of glass.

3A is a cross-sectional view of a light modulator module package according to a first preferred embodiment of the present invention, and FIG. 3B shows a structure for protecting and supporting the light transmissive cover 240 using a metal member. 3A and 3B, the optical modulator module package according to the present invention may include a substrate 210, a driver IC 220, an optical modulator 230, and a light transmissive cover 240. 260 may be formed to protect the light transmissive cover 240.

Referring to FIG. 3A, the optical modulator 230 is flip chip mounted on the driver IC 220 using solder or the like, and is molded in the driver IC 220 by using a molding member such as an epoxy resin. The light transmissive cover 240 may be mounted on the driver IC 220 using epoxy or solder.

Referring to FIG. 3B, a metal member 260 is shown that supports and protects the light transmissive lid 240. Here, the metal member 260 may be applied to the present invention as long as the light entering and exiting the light modulator 230 may pass through the light transmitting cover 240.

4 is a plan view from above of the optical modulator module package according to the first preferred embodiment of the present invention, and FIG. 5 is a bottom view of the optical modulator module package according to the first preferred embodiment of the present invention.

Referring to FIG. 4, the light modulator 230 is accommodated in a hole formed in the substrate 210. Therefore, the hole formed in the substrate 210 may be applied to the present invention as long as it has a shape capable of receiving the light modulator 230.

Referring to FIG. 5, the optical modulator 230 accommodated in a hole formed in the substrate 210 is directly mounted on the driver IC 220 in which another hole is formed. In another aspect of the driver IC 220, a light transmissive lid 240 is mounted.

6 is an exploded perspective view of an optical modulator module package according to a second embodiment of the present invention. Referring to FIG. 6, an optical modulator module package according to the present invention may include a substrate 610, driver ICs 620 and 630, an optical modulator 640, and a light transmissive cover 650. Hereinafter, the differences from the above-described first embodiment will be mainly described.

The number of output terminals of the driver ICs 620 and 630 is formed to match the number of input terminals formed in the optical modulator 640. In general, since the number of driver ICs 620 and 630 corresponding to one optical modulator 640 is plural, in the second embodiment, the optical modulator 640 is directly mounted on the plurality of driver ICs 620 and 630. Present the structure. Here, the case where the number of driver ICs 620 and 630 is 2 is presented, but the present invention is not limited to this number.

The plurality of driver ICs 620 and 630 are spaced at predetermined intervals for passing outgoing light emitted from the light modulator 640. Here, the predetermined interval is sufficient to allow the light emitted by the light modulator 640 to pass through. Therefore, the optical modulator 640 is directly flip-chip mounted to an output terminal of the plurality of driver ICs 620 and 630, and an input terminal of the driver ICs 620 and 630 is disposed on the substrate 610 around the optical modulator 640. Flip chip is connected. Therefore, the driver IC 220 serves to provide a driving voltage to the optical modulator 230 according to a control signal input from the outside.

7 is a cross-sectional view of an optical modulator module package according to a second preferred embodiment of the present invention. Referring to FIG. 7, a substrate 610, driver ICs 620 and 630, an optical modulator 640 and a light transmissive lid 650 are shown, and compared to FIG. 3A, a plurality of driver ICs 620 and 630. The configuration includes different.

8 is a plan view from above of the optical modulator module package according to the second preferred embodiment of the present invention, and FIG. 9 is a bottom view of the optical modulator module package according to the second preferred embodiment of the present invention. 8 is a plan view of the first embodiment.

Referring to FIG. 9, the optical modulator 640 accommodated in the hole formed in the substrate 610 is directly mounted on the output terminals of the driver ICs 620 and 630 spaced apart from each other by a predetermined interval. In another aspect of the driver ICs 620 and 630, a light transmissive lid 650 is mounted.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, the optical modulator module package and the manufacturing method thereof according to the present invention have an effect of minimizing the module package by directly connecting the optical modulator and the driver IC.

In addition, the optical modulator module package and the method of manufacturing the same according to the present invention do not directly mount the optical modulator to the light transmissive cover, so that the electrical / optical characteristics are not realized in the light transmissive cover.

In addition, the optical modulator module package and the method of manufacturing the same according to the present invention have an effect that the manufacturing cost is low because the electrical / optical characteristics are not concentrated in the transparent cover.

In addition, the optical modulator module package and the method of manufacturing the same according to the present invention have an effect of reducing the effect of foreign matter between the optical modulator and the light transmissive cover because the light modulator is not directly mounted on the light transmissive cover.

In addition, the optical modulator module package and the method of manufacturing the same according to the present invention can reduce the problem of contamination by foreign matter generated during the process of mounting the optical modulator directly on the light transmissive substrate because the optical modulator is not directly mounted on the light transmissive cover. It has an effect.

In addition, the optical modulator module package and the manufacturing method thereof according to the present invention has the effect that fine pitch is possible because the optical modulator is not directly mounted on the light transmitting cover.

Although the above has been described with reference to a preferred embodiment of the present invention, those of ordinary skill in the art to the present invention without departing from the spirit and scope of the present invention and equivalents thereof described in the claims below It will be understood that various modifications and changes can be made.

Claims (17)

An optical modulator for modulating the signal by emitting light corresponding to a predetermined signal; A driver IC having a hole for emitting outgoing light emitted from the light modulator, the input terminal of the light modulator being directly connected to an output end formed on one surface to drive the light modulator; And And a light transmissive cover coupled to the other surface of the driver IC and configured to pass outgoing light emitted from the light modulator. The method of claim 1, And an output terminal of the driver IC is formed around the hole. An optical modulator for modulating the signal by emitting light corresponding to a predetermined signal; A plurality of driver ICs having an input terminal of the optical modulator directly connected to an output terminal formed on one surface thereof to drive the optical modulator, and spaced at predetermined intervals for passing outgoing light emitted from the optical modulator; And And a light transmissive cover coupled to the other surface of the driver IC and configured to pass outgoing light emitted from the light modulator. The method according to claim 1 or 3, And a hole for accommodating the optical modulator, the substrate further comprising a substrate for transmitting a predetermined signal to an input terminal of the driver IC. The method of claim 4, wherein The substrate is an optical modulator module package, characterized in that the flexible circuit board. The method according to claim 1 or 3, And the optical modulator is mounted on the driver IC using solder. The method according to claim 1 or 3, And the light transmissive cover is mounted on the driver IC using epoxy or solder. The method according to claim 1 or 3, The optical modulator is flip-chip mounted to the driver IC using any one of an anisotropic conductive film (ACF), non-conductive film (NCF), non-conductive paste (NCP) and anisotropic conductive paste (ACP). Optical modulator module package. The method according to claim 1 or 3, And a metal member for protecting the light transmissive cover around the light transmissive cover. (a) A hole through which light is transmitted is formed, and an input terminal of the optical modulator is directly connected to an output terminal formed on one surface, so that light corresponding to a predetermined signal is transmitted to the hole on a driver IC for driving the optical modulator. Mounting an optical modulator to modulate the signal by exiting; And and (b) mounting a light transmissive cover on the other side of the driver IC to pass outgoing light emitted from the light modulator. The method of claim 10, The output terminal of the driver IC is formed around the hole, the optical modulator module package manufacturing method, characterized in that mounted on top of the hole. The method of claim 10, (c) a hole for accommodating the optical modulator, the optical modulator module package further comprising the step of mounting the driver IC on a substrate for transmitting a predetermined signal to an input terminal of the driver IC; Manufacturing method. The method of claim 10, And the substrate is a flexible circuit board. The method of claim 10, wherein in step (a), And the optical modulator is mounted on the driver IC using solder. The method of claim 10, wherein in step (b), And the light transmissive cover is mounted on the driver IC using epoxy or solder. The method of claim 10, wherein in step (a), The optical modulator is flip-chip mounted to the driver IC using any one of an anisotropic conductive film (ACF), non-conductive film (NCF), non-conductive paste (NCP) and anisotropic conductive paste (ACP). Optical modulator module package manufacturing method. The method of claim 10, (d) forming a metal member for protecting the light transmissive cover around the light transmissive cover.

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