KR20070038398A - Mems module package using sealing cap having heat spreading function and manufacturing method thereof - Google Patents

Abstract

Lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; And a sealing cap having a heat dissipating function, the groove having a MEMS element in physical contact with the MEMS element, and having a groove accommodating the MEMS element and the driver IC, and including a sealing cap in contact with the lower substrate. MEMS module package is presented. MEMS module package using a sealing cap having a heat dissipation function according to the present invention and a method of manufacturing the same has the effect of dissipating heat generated in each device through an effective heat dissipation structure.

Board, MEMS element, heat dissipation, sealing cap

Description

MEMS module package using sealing cap having heat spreading function and Manufacturing method

1 is a cross-sectional view of a MEMS module package using a sealing cap according to the prior art.

2A is a perspective view of one type of diffractive light modulator module using a piezoelectric body applicable to a preferred embodiment of the present invention.

2B is a perspective view of another type of diffractive light modulator module using a piezoelectric body applicable to a preferred embodiment of the present invention.

2C is a plan view of a diffractive light modulator array applicable to a preferred embodiment of the present invention.

FIG. 2D is a schematic diagram in which an image is generated on a screen by a diffractive light modulator array applicable to a preferred embodiment of the present invention. FIG.

2E is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a first preferred embodiment of the present invention.

3 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a second preferred embodiment of the present invention.

4 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a third embodiment of the present invention.

5 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a fourth preferred embodiment of the present invention.

6 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a fifth exemplary embodiment of the present invention.

7 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a sixth preferred embodiment of the present invention.

8 to 10 is a view conducting a thermal conductivity analysis according to a preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

210: lower substrate

220 (1), 220 (2): first adhesive

230: sealing cap

240: MEMS element

250 (1), 250 (2): Driver IC

260 (1), 260 (2): second adhesive

270 printed circuit board

280: third adhesive

The present invention relates to a semiconductor package, and more particularly, to a MEMS module package using a sealing cap having a heat dissipation function and a manufacturing method thereof.

MEMS (Micro Electro Mechanical System) is a technology that forms three-dimensional structures on silicon substrates using semiconductor manufacturing technology. The fields of application of MEMS are very diverse, and examples thereof include various sensors for vehicles, inkjet printer heads, HDD magnetic heads, and portable communication devices that are rapidly progressing in miniaturization and high functionality. The MEMS element has an injured portion on the substrate so as to be mechanically operated. Hereinafter, the optical modulator among the MEMS structures will be described. An optical modulator is a circuit or an apparatus that mounts a signal on light (optical modulation) in a transmitter when a free space of an optical fiber or an optical frequency band is used as a transmission medium. Optical modulators are used in the fields of optical memory, optical display, printer, optical interconnection, hologram, etc., and researches on the development of display devices using the same are being actively conducted. Hereinafter, the optical modulator device among the MEMS devices will be described.

The optical modulator element is largely divided into a direct method of directly controlling the on / off of light and an indirect method using reflection and diffraction, and the indirect method may be divided into an electrostatic method and a piezoelectric method. Here, the optical modulator element comprises a plurality of regularly spaced deformable reflective ribbons having reflective surface portions and suspended above the substrate. Therefore, the light reflected from the reflective surface and the reflective ribbon is diffracted to emit light corresponding to the signal.

1 is a cross-sectional view of a MEMS module package using a sealing cap according to the prior art. Referring to FIG. 1, the lower substrate 110, the first adhesive 120 (1), and 120 (2), the sealing cap 130, the MEMS element 140, the driver IC 150 (1), and 150 (2). ), A second module 160 (1), 160 (2), a printed circuit board 170, a MEMS module package including a third adhesive 180 is shown.

The lower substrate 110 transmits incident light incident to the MEMS element 140 and reflected and diffracted light emitted from the MEMS element 140. The first adhesive (120 (1), 120 (2)), the second adhesive (160 (1), 160 (2)) and the third adhesive 180, respectively, the sealing cap 130 and the lower substrate 110, The MEMS element 140 and the driver ICs 150 (1) and 150 (2) are bonded to the lower substrate 110, the printed circuit board 170, and the sealing cap 130.

Currently, the cap using the sealing cap 130 to reduce the failure rate and improve the reliability and workability generated during sealing of the micro mirror array module (Micro Mirror Array Module) such as the MEMS device 140 according to the prior art The method of cap sealing is used. That is, by sealing using the sealing cap 130 to reduce the penetration of moisture to improve the performance of the device. However, due to the structure that seals the portion to generate heat may cause a problem that the heat release becomes difficult. This difficulty in heat dissipation may cause a direct or indirect operation failure in driving the optical modulator. Therefore, a heat dissipation structure is required to solve this problem.

The present invention provides a MEMS module package using a sealing cap having a heat dissipation function capable of dissipating heat generated in each device through an effective heat dissipation structure, and a method of manufacturing the same.

The present invention also provides a MEMS module package using a sealing cap having a heat dissipation function capable of dissipating heat generated by using a sealing cap connected to each device, and a manufacturing method thereof.

In addition, the present invention provides a MEMS module package using a sealing cap having a heat dissipation function capable of effectively dissipating heat generated in the device by variously forming a heat dissipation structure combined with the sealing cap, and a manufacturing method thereof.

In addition, the present invention by placing a thermally conductive material between the sealing cap and each element, to facilitate the processing of the sealing cap, if necessary, the MEMS using a sealing cap having a heat release function that can freely adjust the internal structure of the sealing cap It provides a module package and a method of manufacturing the same.

In addition, the present invention provides a MEMS module package using a sealing cap having a heat dissipation function having a structure capable of dissipating heat generated in each device through a sealing cap and a heat sink, and a manufacturing method thereof.

Technical problems other than the present invention will be easily understood through the following description.

According to an aspect of the invention, the lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; And a sealing cap having a heat dissipating function, the groove having a MEMS element in physical contact with the MEMS element, and having a groove accommodating the MEMS element and the driver IC, and including a sealing cap in contact with the lower substrate. You can provide MEMS module packages.

In addition, the sealing cap according to the present invention may further include a protrusion for the driver IC in physical contact with the driver IC.

According to another aspect of the invention, the lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap contacting the lower substrate; And it may be provided in the groove formed in the sealing cap, it is possible to provide a MEMS module package using a sealing cap having a heat dissipation function comprising a thermally conductive material for the MEMS device for physically contacting the MEMS device and the sealing cap. .

In addition, the MEMS module package according to the present invention may further include a thermally conductive material for the driver IC accommodated in the groove formed in the sealing cap and in physical contact with the driver IC.

Here, the thermally conductive material for the MEMS device or the thermally conductive material for the driver IC may be a thermally conductive paste or a thermally conductive pad.

Here, the lower substrate may be formed of a transparent material.

In addition, the MEMS module package according to the present invention may further include a printed circuit board positioned on the sealing cap and transmitting an electrical signal to the driver IC.

In addition, the MEMS module package according to the present invention may further include a printed circuit board positioned under the lower substrate and transmitting an electrical signal to the driver IC.

Here, the material of the sealing cap may be a metal.

The MEMS module package according to the present invention may further include a heat dissipation plate accommodated in a hole formed in the printed circuit board and capable of conducting heat from the sealing cap.

Here, the material of the heat dissipation plate may be a metal.

In addition, the MEMS module package according to the present invention is located on the printed circuit board, and further comprises a heat dissipation plate capable of heat conduction from the sealing cap, wherein the heat dissipation plate and the sealing cap is formed on the printed circuit board It can be connected by the above heat path.

Here, the heat path formed on the printed circuit board may be a metal.

Here, the MEMS device may be an optical modulator that reflects and diffracts light modulated according to the driving signal received from the driver IC.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the MEMS module package and its manufacturing method using a sealing cap having a heat dissipation function according to the present invention will be described in detail with reference to the accompanying drawings, reference numerals Regardless, the same components are given the same reference numerals and redundant description thereof will be omitted. Hereinafter, a description will be given of a diffractive optical modulator device among MEMS devices. In addition, an embodiment of the present invention may be generally applied to a MEMS package for transmitting a signal to or receiving a signal from the outside, and among the MEMS packages applied to the present invention before describing preferred embodiments of the present invention in detail. The optical modulator will be described first.

Optical modulators are largely divided into a direct method of directly controlling the on / off of light and an indirect method using reflection and diffraction, and the indirect method may be divided into an electrostatic method and a piezoelectric method. Herein, the optical modulator is applicable to the present invention regardless of the manner in which the optical modulator is driven.

The electrostatically driven grating light modulator disclosed in US Pat. No. 5,311,360 includes a plurality of regularly spaced deformable reflective ribbons having reflective surface portions and suspended above the substrate.

First, an insulating layer is deposited on a silicon substrate, followed by a deposition process of a sacrificial silicon dioxide film and a silicon nitride film. The silicon nitride film is patterned with a ribbon and a portion of the silicon dioxide layer is etched so that the ribbon is held on the oxide spacer layer by the nitride frame. To modulate light with a single wavelength [lambda] 0, the modulator is designed such that the thickness of the ribbon and the thickness of the oxide spacers are [lambda] 0/4.

The lattice amplitude of this modulator, defined by the vertical distance d between the reflective surface on the ribbon and the reflective surface of the substrate, is the conduction of the ribbon (reflective surface of the ribbon serving as the first electrode) and the substrate (substrate serving as the second electrode). Film).

Figure 2a is a perspective view of one type of diffractive light modulator module using a piezoelectric of the indirect light modulator applicable to the present invention, Figure 2b is another type of diffractive light modulator module using a piezoelectric applicable to a preferred embodiment of the present invention Perspective view. 2A and 2B, an optical modulator including a substrate 215, an insulating layer 225, a sacrificial layer 235, a ribbon structure 245, and a piezoelectric body 255 is shown.

The substrate 215 is a commonly used semiconductor substrate, and the insulating layer 225 is deposited as an etch stop layer, and an etchant for etching a material used as a sacrificial layer, where the etchant is an etching gas or an etching Solution). The reflective layers 225 (a) and 225 (b) may be formed on the insulating layer 225 to reflect incident light.

The sacrificial layer 235 supports the ribbon structure 245 on both sides so that the ribbon structure can be spaced apart from the insulating layer 225 at regular intervals, and forms a space at the center.

The ribbon structure 245 serves to light modulate the signal by causing diffraction and interference of incident light as described above. The shape of the ribbon structure 245 may be configured in a plurality of ribbon shapes according to the electrostatic method as described above, or may be provided with a plurality of open holes in the center of the ribbon according to the piezoelectric method. In addition, the piezoelectric member 255 controls the ribbon structure 245 to move up and down according to the degree of contraction or expansion of up and down or left and right caused by the voltage difference between the upper and lower electrodes. Here, the reflective layers 225 (a) and 225 (b) are formed to correspond to the holes 245 (b) and 245 (d) formed in the ribbon structure 245.

For example, when the wavelength of light is λ, no voltage is applied or a predetermined voltage is applied to the upper reflective layers 245 (a) and 245 (c) and the lower reflective layer 225 (a) formed on the ribbon structure. ), The interval between the insulating layers 225 on which 225 (b) is formed is equal to nλ / 2 (n is a natural number). Therefore, in the case of the 0th order diffracted light (reflected light), the total path difference between the light reflected from the upper reflective layers 245 (a) and 245 (c) formed on the ribbon structure and the light reflected from the insulating layer 225 is equal to nλ, which is reinforced. By interfering, the diffracted light has maximum brightness. Here, in the case of + 1st and -1st diffraction light, the brightness of light has a minimum value due to destructive interference.

In addition, when a proper voltage different from the applied voltage is applied to the piezoelectric material 255, the upper reflective layers 245 (a) and 245 (c) and the lower reflective layers 225 (a) and 225 (b) formed on the ribbon structure. The distance between the insulating layers 225, which is formed, is equal to (2n + 1) λ / 4 (n is a natural number). Therefore, in the case of zero-order diffracted light (reflected light), the total path difference between the upper reflective layers 245 (a) and 245 (c) formed in the ribbon structure and the light reflected from the insulating layer 225 is (2n + 1) λ / 2. As shown in FIG. 8, the diffracted light has minimum luminance due to destructive interference. Here, in the case of + 1st and -1st diffraction light, the brightness of light has a maximum value due to constructive interference. As a result of this interference, the light modulator can adjust the amount of reflected or diffracted light to carry the signal on the light.

In the above, the case in which the distance between the ribbon structure 245 and the insulating layer 225 on which the lower reflective layers 225 (a) and 225 (b) are formed is nλ / 2 or (2n + 1) λ / 4 has been described. Naturally, various embodiments that can be driven at intervals that can adjust the intensity interfered by the diffraction and reflection of incident light can be applied to the present invention.

Hereinafter, the optical modulator of the type shown in FIG. 2A will be described.

Referring to FIG. 2C, the optical modulator includes a first pixel (pixel # 1), a second pixel (pixel # 2),. And m micromirrors 100-1, 100-2,..., 100-m that are responsible for the m-th pixel (pixel #m). The optical modulator is responsible for the image information of the one-dimensional image of the vertical scanning line or the horizontal scanning line (assuming that the vertical scanning line or the horizontal scanning line is composed of m pixels), and each micromirror 100-1, 100-2. , ..., 100-m) is in charge of any one of m pixels constituting the vertical scan line or the horizontal scan line. Thus, the reflected and diffracted light in each micro mirror is then projected on the screen as a two dimensional image by the light scanning device. For example, in the case of VGA 640 * 480 resolution, 640 modulations are performed on one side of an optical scanning device (not shown) for 480 vertical pixels, thereby generating one frame of one screen per side of the optical scanning device. The optical scanning device may be a polygon mirror, a rotating bar, a galvano mirror, or the like.

Hereinafter, the principle of light modulation will be described based on the first pixel (pixel # 1), but the same may be applied to other pixels.

In this embodiment, it is assumed that there are two holes 245 (b) -1 formed in the ribbon structure 245. Three upper reflective layers 245 (a) -1 are formed on the ribbon structure 245 due to the two holes 245 (b) -1. Two lower reflective layers are formed in the insulating layer 225 corresponding to the two holes 245 (b) -1. In addition, another lower reflective layer is formed on the insulating layer 225 corresponding to a portion of the gap between the first pixel (pixel # 1) and the second pixel (pixel # 2). Accordingly, the number of upper reflective layers 245 (a) -1 and lower reflective layers per pixel is the same, and the luminance of modulated light is obtained using zero-order diffracted light or first-order diffracted light as described above with reference to FIG. 2A. It is possible to adjust.

Referring to FIG. 2D, there is shown a schematic diagram in which an image is generated on a screen by a diffractive light modulator array applicable to a preferred embodiment of the present invention.

Light reflected and diffracted by the m micromirrors 100-1, 100-2,..., 100-m arranged vertically is reflected by the optical scanning device, and is generated by scanning horizontally on the screen 275. 285-1, 285-2, 285-3, 285-4, ..., 285- (k-3), 285- (k-2), 285- (k-1), 285-k) are shown. When rotated once in the optical scanning device, one image frame may be projected. Here, the scanning direction is shown in a left to right direction (arrow direction), but it is obvious that the image may be scanned in another direction (for example, the reverse direction).

The present invention relates to a method for packaging an optical modulator element as described above, wherein a projection or thermally conductive material is made or combined in a sealing cap to dissipate heat generated in each element (optical modulator element, driver IC). It has a structure that directly connects to the device that generates heat. That is, in the case of the existing simply sealed structure, heat is not emitted directly to the outside, but heat generation is large, but in the case of the structure using the direct contact method, the heat generated from the device is transferred directly to the sealing cap, which is excellent in heat dissipation of each device. There is. According to the heat generating device, one or more protrusions of the sealing cap may be formed, and one or more thermally conductive materials may be formed. In addition, the sealing cap may release heat generated in each element through a heat radiating plate provided separately.

The optical modulator has been described in the general drawings as described above, hereinafter with reference to the accompanying drawings, a MEMS module package and a manufacturing method using a sealing cap having a heat dissipation function according to the present invention will be described with reference to specific embodiments Let's do it. Embodiments according to the present invention are divided into six categories, which will be described in turn below.

2 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a first embodiment of the present invention. Referring to FIG. 2, the lower substrate 210, the first adhesive 220 (1), 220 (2), the sealing cap 230, the MEMS element 240, the driver IC 250 (1), and 250 (2). )), The second adhesive (260 (1), 260 (2)), the printed circuit board 270, the third adhesive 280 and the MEMS module package including a protrusion (a) formed in the sealing cap 230 Shown.

The lower substrate 210 transmits incident light incident to the MEMS element 240 and reflected and diffracted light emitted from the MEMS element 240. Therefore, the lower substrate 210 may be formed of a transparent material, for example, glass, or a predetermined hole may be formed in a portion where the MEMS element 240 is mounted to transmit incident light, reflection, and diffracted light. . The first adhesives 220 (1), 220 (2), the second adhesives 260 (1), 260 (2), and the third adhesive 280 are sealed caps 230 and lower substrates 210, respectively. The MEMS device 240 and the driver ICs 250 (1) and 250 (2) are bonded to the lower substrate 210, the printed circuit board 270, and the sealing cap 230.

The sealing cap 230 has a protrusion that is in physical contact with the MEMS element 240 (herein referred to as a protrusion for the MEMS element to distinguish it from the protrusion that couples to the driver ICs 250 (1) and 250 (2)). In addition, a groove is formed to accommodate the MEMS element 240 and the driver ICs 250 (1) and 250 (2), and contacts the lower substrate 210. Here, the material of the sealing cap 230 may be a metal, for example, may be Invar, Covar, silver, copper, and the like.

The second adhesives 260 (1) and 260 (2) may be an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). In addition, the second adhesives 260 (1) and 260 (2) are adhesives for sealing portions where the sealing cap 230 and the lower substrate 210 are bonded to each other. For example, a molding resin such as an epoxy resin may be used. Can be.

The printed circuit board 270 transmits an electrical signal capable of driving the MEMS element 240 to the driver ICs 250 (1) and 250 (2). Here, the printed circuit board 270 may be stacked below the upper or lower substrate 210 of the sealing cap 230. When the printed circuit board 270 is positioned below the lower substrate 210, a predetermined hole is formed in a portion where the MEMS element 240 is mounted to transmit incident light, reflected light, and diffracted light. Can be.

Here, since the protrusion (a) formed in the sealing cap 230 is formed in physical contact with the MEMS element 240, it is possible to transfer the heat generated in the MEMS element 240 to the outside.

The MEMS module package is manufactured through the following steps. That is, the MEMS device 240 is mounted on the lower substrate 210, and driver ICs 250 (1) and 250 (2) driving the MEMS device 240 are disposed around the MEMS device 240. After mounting on the 210, the thermal conductive material for the MEMS device 240 is formed on the MEMS device 240. After contacting the thermally conductive material for the MEMS device 240, the step of adhering a sealing cap formed with a predetermined groove on the lower substrate 210 to accommodate the MEMS device 240 and the driver IC in the groove, A MEMS module package is manufactured using a sealing cap with a release function.

3 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a second embodiment of the present invention. Referring to FIG. 3, the lower substrate 310, the first adhesive 320 (1), and 320 (2), the sealing cap 330, the MEMS element 340, the driver IC 350 (1), and 350 (2) ), A second adhesive (360 (1), 360 (2)), a printed circuit board 370, a third adhesive 380 and the protrusions (a, b, c) formed in the sealing cap 330 A MEMS module package is shown. Hereinafter, the differences from the above-described first embodiment will be mainly described.

The protrusions a, b, and c formed in the sealing cap 330 are in physical contact with each of the MEMS element 340 and the driver ICs 350 (1) and 350 (2). Here, the protrusions b and c formed in the sealing cap 330 are called protrusions for the driver ICs 350 (1) and 350 (2). Therefore, the heat generated by the MEMS element 240 and the driver ICs 350 (1) and 350 (2) may be transferred to the outside.

4 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a third embodiment of the present invention. Referring to FIG. 4, the lower substrate 410, the first adhesive 420 (1), and the 420 (2), the sealing cap 430, the MEMS element 440, the driver IC 450 (1), and 450 (2). ), A second adhesive 460 (1), 460 (2)), a printed circuit board 470, a third adhesive 480, and a MEMS module package including a thermally conductive material 435 is shown. Hereinafter, the differences from the above-described first embodiment will be mainly described.

The thermally conductive material 435 is in physical contact with the MEMS element 440 and the sealing cap 430. Therefore, the thermally conductive material 435 for the MEMS element 440 transfers the heat generated from the MEMS element 440 to the sealing cap 430, and the sealing cap 430 may release the heat to the outside. Here, the thermally conductive material 435 may be a thermally conductive paste or a thermally conductive pad. Such a thermally conductive paste or thermally conductive pad can be applied to the present invention as long as the thermally conductive material is excellent.

The MEMS module package is manufactured through the following steps. That is, the MEMS element 440 is mounted on the lower substrate 410, and the driver ICs 450 (1) and 450 (2) driving the MEMS element 440 are disposed around the MEMS element 440. 410. Thereafter, a thermal conductive material for the MEMS element 440 is formed on the MEMS element 440. Thereafter, the lower substrate (1) contacts the thermally conductive material for the MEMS element 440, and accommodates the MEMS element 440 and the driver ICs 450 (1) and 450 (2) in the groove. 410) through the step of bonding on to manufacture a MEMS module package using a sealing cap having a heat release function.

5 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a fourth embodiment of the present invention. Referring to FIG. 5, the lower substrate 510, the first adhesive 520 (1), and 520 (2), the sealing cap 530, the MEMS element 540, the driver IC 550 (1), and 550 (2). )), A second module 560 (1), 560 (2), a printed circuit board 570, a third adhesive 580 and a MEMS module package including a thermally conductive material (533, 535, 537) is shown do. Hereinafter, the differences from the above-described third embodiment will be mainly described.

Thermally conductive materials 533, 535, and 537 allow both MEMS device 540 and driver ICs 550 (1, 550 (2) to make physical contact with the sealing cap 530. Accordingly, the thermally conductive material 535 for the MEMS element 540 and the thermally conductive materials 533 and 537 for the driver ICs 550 (1) and 550 (2) may be used for the MEMS element 540 and the driver IC 550 (1). , 550 (2) transfers the heat generated by the sealing cap 530, and the sealing cap 530 may release this heat to the outside.

6 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a fifth embodiment of the present invention. Referring to FIG. 6, a lower substrate 610, a first adhesive 620 (1, 620 (2)), a sealing cap 630, a MEMS element 640, a driver IC 650 (1), and 650 (2). ), A second adhesive 660 (1), 660 (2), a printed circuit board 670, a third adhesive 680, and a heat dissipation plate 690 are shown. Hereinafter, the difference from the above-described first embodiment will be described mainly.

The heat radiating plate 690 is accommodated in a hole formed in the printed circuit board 670 and is in physical contact with the sealing cap 630. Therefore, the heat dissipation plate 690 serves to discharge the heat transferred from the sealing cap 630 to the outside.

7 is a cross-sectional view of a MEMS module package using a sealing cap having a heat dissipation function according to a sixth exemplary embodiment of the present invention. Referring to FIG. 7, the lower substrate 710, the first adhesive 720 (1), and 720 (2), the sealing cap 730, the MEMS element 740, the driver IC 750 (1), and 750 (2). ), A second adhesive 760 (1), a 760 (2), a printed circuit board 770, a third adhesive 780, a heat dissipation plate 790, and a heat path 793, 795, 797. A MEMS module package is shown. Hereinafter, the differences from the above-described fifth embodiment will be mainly described.

The heat dissipation plate 790 is accommodated in a hole formed in the printed circuit board 770 and is in physical contact with the sealing cap 730. Therefore, the heat dissipation plate 790 serves to discharge the heat transferred from the sealing cap 730 to the outside. The heat paths 793, 795, 797 receive heat from the sealing cap 730 and transfer the heat to the heat sink 690. The material of the heat paths 793, 795, and 797 may be a metal, for example, Invar, Covar, silver, copper, or the like.

8 to 10 is a view of the thermal conduction analysis according to a preferred embodiment of the present invention. 8 is a heat conduction analysis according to the prior art, FIG. 9 is a heat conduction analysis according to the first embodiment, and FIG. 10 is a heat conduction analysis according to the third embodiment.

9 or 10, it can be seen that heat decreased by about 75.7% and 76.5%, respectively, than in the case shown in FIG. 8. That is, when comparing the magnitude of the relative temperature, the temperature of the MEMS module package according to the prior art is 111 ℃, whereas the temperature of the MEMS module package according to the first embodiment is 82.5 ℃, the temperature of the MEMS module package according to the third embodiment The temperature is 83.4 ° C. The finite element analysis method is applied here.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, the MEMS module package using the sealing cap having a heat dissipation function and a method of manufacturing the same have an effect of dissipating heat generated in each device through an effective heat dissipation structure.

In addition, the MEMS module package using a sealing cap having a heat dissipation function according to the present invention and a method of manufacturing the same have the effect of dissipating heat generated by using a sealing cap connected to each device.

In addition, the MEMS module package and the manufacturing method using a sealing cap having a heat dissipation function according to the present invention has an effect that can effectively dissipate heat generated in the device by forming a variety of heat dissipation structure combined with the sealing cap.

In addition, the MEMS module package using the sealing cap having a heat dissipation function according to the present invention and a method of manufacturing the same by placing a thermally conductive material between the sealing cap and each element, to facilitate the processing of the sealing cap, if necessary, sealing cap Has the effect of freely adjusting the internal structure of the.

In addition, the MEMS module package using the sealing cap having a heat dissipation function according to the present invention and a method of manufacturing the same has the effect of dissipating heat generated in each device through the sealing cap and the heat sink.

Although the above has been described with reference to a preferred embodiment of the present invention, those of ordinary skill in the art to the present invention without departing from the spirit and scope of the present invention and equivalents thereof described in the claims below It will be understood that various modifications and changes can be made.

Claims (14)

Lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; And MEMS using a sealing cap having a heat dissipation function having a protrusion for a MEMS element in physical contact with the MEMS element, a groove accommodating the MEMS element and the driver IC, and including a sealing cap in contact with the lower substrate. Modular package. The method of claim 1, And the sealing cap further comprises a protrusion for the driver IC in physical contact with the driver IC. Lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap contacting the lower substrate; And A MEMS module package using a sealing cap having a heat dissipation function, which is accommodated in a groove formed in the sealing cap and includes a thermally conductive material for the MEMS element that physically contacts the MEMS element and the sealing cap. The method of claim 3, The MEMS module package using a sealing cap having a heat dissipation function, characterized in that it further comprises a thermally conductive material for a driver IC received in a groove formed in the sealing cap and in physical contact with the driver IC. The method of claim 4, wherein The MEMS module package using the sealing cap having a heat release function, characterized in that the thermally conductive material for the MEMS device or the thermally conductive material for the driver IC is a thermally conductive paste or a thermally conductive pad. The method according to claim 1 or 3, The lower substrate is a MEMS module package using a sealing cap having a heat release function, characterized in that formed of a transparent material. The method according to claim 1 or 3, Located on the sealing cap, the MEMS module package using a sealing cap having a heat dissipation function further comprising a printed circuit board for transmitting an electrical signal to the driver IC. The method according to claim 1 or 3, Located under the lower substrate, the MEMS module package using a sealing cap having a heat dissipation function further comprises a printed circuit board for transmitting an electrical signal to the driver IC. The method according to claim 1 or 3, The material of the sealing cap is a MEMS module package using a sealing cap having a heat release function, characterized in that the metal. The method of claim 7, wherein And a heat dissipation plate accommodated in a hole formed in the printed circuit board and capable of thermal conduction from the sealing cap. The method of claim 10, The material of the heat dissipation plate is a MEMS module package using a sealing cap having a heat dissipation function, characterized in that the metal. The method of claim 7, wherein Located on the printed circuit board, further comprising a heat dissipation plate capable of heat conduction from the sealing cap, And the heat dissipation plate and the sealing cap are connected by one or more heat paths formed on the printed circuit board. The method of claim 12, MEMS module package using a sealing cap having a heat dissipation function, characterized in that the heat path formed on the printed circuit board is a metal. The method according to claim 1 or 3, The MEMS device is a MEMS module package using a sealing cap having a heat emission function, characterized in that the optical modulator for reflecting and diffracting the light modulated in accordance with the drive signal received from the driver IC.

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