CN1232289A - Wafer carrier with minimal contact - Google Patents
Wafer carrier with minimal contact Download PDFInfo
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- CN1232289A CN1232289A CN98122439A CN98122439A CN1232289A CN 1232289 A CN1232289 A CN 1232289A CN 98122439 A CN98122439 A CN 98122439A CN 98122439 A CN98122439 A CN 98122439A CN 1232289 A CN1232289 A CN 1232289A
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- Prior art keywords
- wafer
- carrier
- guide rod
- projection
- container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Abstract
A wafer carrier for transporting or holding wafers in a horizontal axially aligned arrangement has minimal four point regions of wafer support at the edge portion of the wafers. A preferred embodiment is an H-bar carrier with a plurality of slots defined by elongate wafer guides on the carrier sidewalls. Upwardly extended protrusions support the wafers with minimal contact with the carrier. The protrusions are sufficient in number and configuration to preclude contact with the top surface of the guides.
Description
The present invention relates to semiconductor processing equipment.Be specifically related to be used for the carrier of semiconductor wafer.
Along with the scale that semiconductor is integrated is increasing, promptly along with the increase of the circuit number of every cellar area, particulate has become important factor.The particle size that destroys circuit reduces, and near the rank of molecule.During all stages of manufacturing, processing, conveying and the storage of semiconductor wafer, be necessary to control particulate.During wafer inserts carrier and therefrom removes and during the conveying in the carrier the mobile generation particulate of wafer need reduce or avoid.
The accumulation of electrostatic charge and discharge can be catastrophic near semiconductor wafer.The electrostatic dissipation ability is the in demand characteristic of wafer carrier.Can be by path dissipation electrostatic charge by carrier ground connection.Contact arrangement or may contact wafer or may all will be benefited by any part of operator's contact from the path of ground connection.This part of carrier comprises chip support, mechanical handle and equipment interface.
Be starved of the visibility of wafer in the closed container, the terminal use may require.Need as Merlon etc. is suitable for the transparent plastic of this container, be because this plastics cost is low, but this plastics do not have the resistance to wear of suitable electrostatic dissipation ability or needs.
The material that is used for wafer carrier is also hard, with during preventing to carry to the damage of wafer, also need be during change of external conditions dimensionally stable.
Have as polyether etherketone etc. that low particulate produces characteristic, dimensionally stable and other needs the conventional desirable carrier material of physical characteristic opaque, expensive relatively, and be difficult to molded big unit and the shape of complexity, for example carrier and container.
Usually the container of storage and transfer wafers and carrier have been designed to carry and keep wafer in vertical plane.This carrier that is usually designed to as this area known H shape pin carrier (seeing Figure 18) also allows carrier position and wafer in the position of level, to handle and/or to insert and remove wafer.At horizontal level, wafer is usually by rib or wafer guide rod supports, and rib or wafer guide rod form the wafer slot and extend along the length direction of carrier inboard.The carrier side is crooked partly or tilt to meet the Waffer edge profile.This carrier along with contact or contacts also supporting wafers near two arcs of Waffer edge.
The conversion meeting of the insertion of conventional carrier from the vertical transport position to level in addition ,-remove-handle position makes wafer percussion, wafer shift, wafer instability, produces particulate and damage wafer.
To the bigger wafer of processing, that is, diameter 300mm direction develops just gradually in industry, therefore needs big carrier and container to keep wafer.In addition, industry just in carrier and the container direction of horizontal positioned wafer develop.The increase of carrier size has increased the weight of to shrink during molded and the difficulty of distortion.To the increase of machine dependent, particularly wafer is removed and inserted in carrier and the container, make tolerance become very crucial.Need be cheap, particulate produces less, the carrier of electrostatic dissipation, wherein wafer is stable, and location as one man, has reduced any particulate on the carrier and has transferred on the wafer.
The chip container of carrying or keeping horizontal axis ground to aim at the wafer that is provided with has the some district of four few supporting wafers in the marginal portion of wafer.Preferred embodiment has first container part and closable door.First container part has first molding part of static dissipative material, band and the vertical doorframe of planar top all-in-one-piece.The whole bottom base part of carrying device interface is also extended from doorframe.Second molding part has a transparent outer cover, is connected to doorframe, planar top and bottom base part.The molded wafer support legs of separating is connected to planar top and bottom base part, and comprises the vertically disposed support of supine projection, is used to provide the smallest point or the some district that contact with wafer.Support comprises the wafer stop tab, prevents by the moving forward or backward of the wafer of nipple support, and prevents to be inserted into outside the socket position.The side handle that first molding part and second molding part are bonded together is fixed together molding part.Mechanical handle is connected to planar top.Mechanical handle, chip support, side handle and doorframe have the conductive path by machine interface ground connection.
Another embodiment is a kind of H shape pin wafer carrier of routine, is added with projection at the upper surface of wafer guide rod, when placing H shape pin and make the planar horizontal of wafer, carries out minimum by globule on the wafer guide rod or projection wafer with carrier and contacts thus.
The features and advantages of the present invention are that carrier provides the minimum wafer support that contacts with firm wafer.
The another feature of combination container embodiment of the present invention and advantage are that Combination Design can be optimized materials used, the material of expensive wear-resistant and electrostatic dissipation for example, PEEK for example, be used as that part of container that contacts with wafer or equipment, use cheap transparent plastic, for example Merlon is used for the support structure of container and can sees the wafer that container is interior.Thus, can select molded parameter and material, to optimize performance and to reduce cost for each independent molding part.
The feature and advantage again of combination container embodiment of the present invention are that combining structure has reduced as distortion and contraction etc. and the relevant negative effect of molded big carrier.
The another feature and advantage of combination container embodiment of the present invention are that the part of all keys all partly is electrically connected to ground by the equipment interface of carrier.
Also feature and advantage of the present invention are the supports by suitable shape, and wafer remains on specific socket position inactively.
Another feature and advantage of the present invention are to use lug, tab and the fin relevant with the side handle, and the carrier of combination can assemble and be fixed together at last.
Feature and advantage more of the present invention are to contact with the wafer of carrier by transmission that reduces this particle matter and minimizing, and wafer has reduced the gathering of particulate on the wafer with contacting of projection or globule.
Projection or extension on the upper surface that another feature and advantage of the present invention are wafer guide rods can form multiple shape.
Also feature and advantage of the preferred embodiments of the present invention are that minimum point contacts the swing that has reduced single wafer, for bigger variation is provided in molded, have kept consistency and correct wafer orientation simultaneously.Compare with the whole length of contact area on the conventional wafer guide rod, the key that keep minimum dimension is the top of projection.
Fig. 1 is the partial, exploded perspective view that has the resultant wafer container that can lock a door.
Fig. 2 is the front perspective view that has the chip container of three wafer support legs that are fixed to the U-shaped transparent outer cover.
Fig. 3 is and the similar carrier rear perspective of Fig. 2 that the plastics jumper is provided to the path on ground by equipment interface.
Fig. 4 for band side handle, mechanical flange and the combination container that can lock a door front perspective view.
Fig. 5 is the front perspective view according to uncovered wafer carrier of the present invention.
Fig. 6 is the cross sectional side view of carrier.
Fig. 7 is the front perspective view of an embodiment of first molding part of wafer carrier.
Fig. 8 is the rear perspective of first molding part of an embodiment of wafer carrier.
Fig. 9 is the shell of an embodiment of wafer carrier or the front perspective view of second molding part.
Figure 10 is the perspective view of the side handle of combination container.
Figure 11 is the detailed cross sectional view that connects between first molding part and second molding part.
Figure 12 is the perspective view that is used for a wafer support legs of wafer carrier.
Figure 13 is the perspective view that is used for the wafer support legs of Fig. 5 carrier.
Figure 14 is the detailed cross sectional view of part wafer support legs.
Figure 15 is the plan cross-sectional view of wafer carrier.
Figure 16 is the profile along the line 16-16 intercepting of Figure 15.
Figure 17 is the plane graph of Waffer edge part, and contact of smallest point wafer and support are shown.
Figure 18 is the perspective view of the wafer carrier of prior art.
Figure 19 is the perspective view of the left-handed crystal sheet guide rod of the wafer carrier sidewall shown in Figure 18.
Figure 20 A-D is the wafer guide rod upside vertical view that different embodiments of the invention are shown.
Figure 21 A-D is the front view of the wafer guide rod of Figure 20 A-D.
Figure 22 A-D is the end view of the wafer guide rod of Figure 20 A-D and 21A-D.
Figure 23 A-D is the profile that inserts the above H shape pin wafer carrier of retracted position chip support in difference.
Figure 24 is the profile of the line 24-24 of Figure 23 D.
With reference to figure 1, Fig. 1 is the perspective view of the preferred embodiment of the horizontal wafer carrier on the equipment that is placed on 22.Fig. 2,3,4 and 5 shows other embodiment.Wafer carrier is made of the container part 26 that comprises wafer support legs 27 and cooperation door 28 usually.Container part 26 has open front 30, the left side 32, the back side 34, the right side 36, top 38 and bottom 40.Fig. 1,2,3 and 4 embodiment have the closed side and a closed left side and the right side.The embodiment of Fig. 5 is common uncovered carrier, has uncovered rear portion and the top and the bottom that are connected by wafer support legs and support.
With reference to the embodiment shown in figure 1,4 and 6, chip container part 26 can be by first molding part 50 and second molding part, 52 molded forming particularly.As shown in figs. 1 and 4, or form, shown in Fig. 2 and 3 by the individual unit molding part is molded.Be illustrated in first molding part 50 among Fig. 7 and 8 individually by forming with the rectangle doorframe 56 of horizontal upper ledge part 58, a pair of vertical munnion part 60,62 and the lower frame part 64 of level.
With reference to figure 9, form transparent plastic housing by second molding part 52, have mild U-shaped bending plate 150, upper plate part 152, form the upper rim 154 of splayed flange, also have the perpendicular side plate 156 and 158 of splayed flange portion 160, the splayed flange 162 and an a pair of outward extending side extending projection 164,166 of lower horizontal.
With reference to Figure 11, at length demonstrate the marginal portion 96 that splayed flange 162 is connected to first molding part 50.Joint is formed tongue in the slot type interface 170.
With reference to Figure 10, drawn the perspective component diagram of right handles 128.The side handle has by post 176,178 and is connected to gripping portion 174 by the handle set 180 that constitutes band.Band has Y shape part 18 separately, comprises the fin 188,190 of the downward extension in the groove 136 of horizontal top 74 of 184,186 and two first molding parts 50 of packing into of sweep of the curved top portion marginal portion that is wound on transparent plastic shell.The horizontal top 189,191 of side handle 128 also has face connecting part to divide 194,196, engages with lug 134 on also being positioned at horizontal top 74.The lower end 200 of side handle 128 has the reception slot 202 of the fin 138 on the lower base part 76 that is used for first molding part 50.Lower end 200 also has slot 208, engages and the fixing projection 176 on the perpendicular side plate 156 of transparent plastic shell.
With reference to Figure 12,13,14,15 and 16, the wafer support legs 27 that demonstrates has two kinds of basic structures.Figure 13 is the wafer support legs that is suitable for uncovered carrier shown in Figure 5.Figure 12 and 14 shows the structure of the wafer support legs 27 of the carrier embodiment use that is suitable for Fig. 1 and Fig. 4.Wafer support legs 27 is fixed in their carriers separately by fin 138 or lug 134.Also can utilize other mechanical fastening device.With particular reference to Figure 12,13 and 14, wafer support legs 27 comprises a plurality of wafer guide rods or the support 220 that is connected to vertical supporting member 222 and rear pillar 225 by back stop tab 226.Upper and lower tab part or lug 228,229 extend from vertical supporting member 222, and fixing by corresponding groove or cast socket element 106,108,110,112.Another structure of wafer support legs 27 is presented in Fig. 2 and 3.These wafer support legs 27 for example directly are fixed to U-shaped plate 150 by screw 231.Each of Fig. 2 and 3 wafer support legs all has a plurality of independently chip supports 220, and each support has single wafer copulational protuberance 230 and forms elongated beading (bead).Notice that wafer support legs becomes an integral body with carrier, but still many above-indicated advantages and feature can be provided in some embodiments of the invention.
With reference to figure 6,14,15 and 16, demonstrate more detailed details of wafer support legs 27 and support and location.Each support 236 has corresponding relative support 238 at the opposite side of carrier.Relative wafer support legs 27 with relative support is positioned at passes on the wafer and the center line perpendicular to the insertion of wafer W and the direction 229 removed that wafer is parallel to open front 30 and doorframe 56.Want supporting wafers, each relative support is with spaced apart less than the distance of wafer diameter D.Each wafer guide rod 120 has the relative wafer guide rod that is positioned on the carrier opposite side.
With reference to figure 6,15 and 16, the spacing between vertical adjacent every pair of wafer guide rod and define wafer across the distance of carrier inside and insert and remove plane and wafer slot 244.Similarly, insert the plane by the area limiting between the vertically adjacent chip support 220.The wafer slot is further defined to the zone on the carrier between the vertical support of crossing over wafer support legs.Each support has a pair of supine wafer copulational protuberance 230, forms pearl.Pearl can be to be generally hemispheric fritter, shown in the part numbers among Figure 14 231, or is semi-cylindrical, and the part numbers of smooth end is 230.With reference to Figure 17, provide minimum some contact 246 or the minimum radially directed basically line contact of shortening 248 like this on the summit 233 of projection.The downside of summit 236 contact wafer W or lower surface 235 in the marginal portion.Illustrated elongated beading radially extend internally basically.Each chip support 220 has one forward, promptly towards the wafer stop tab 232 of front, is configured to vertical contact surface, when wafer is positioned at as shown in figure 15 wafer socket position, meets the circumferential shapes of wafer W.Wafer stop tab 232 does not forward extend to the plane that wafer inserts and removes, but has influenced the outside motion that is inserted in wafer in the wafer socket position.The wafer of the correspondence of the chip support that each is relative forward the distance D between the stop tab 1 less than the diameter D of wafer W.
Each support has the part of back wafer stop tab 226 as rear pillar 225.Back wafer stop tab extends upward the rear portion limit that defines the wafer slot.Distance D 2 between the wafer stop tab of the chip support correspondence that each is relative is less than the diameter D of wafer W.Back wafer stop tab 226 extends in the plumb cut of wafer slot.Back wafer stop tab 226 also plays the guiding wafer and is inserted in the wafer socket position 237, is best shown in Figure 15 and 16.
Above can ground, unit molded as the mark component shown in the part of first molding part 50, be integral with described each other parts thus.Similarly, the ground, second molding part Unit 52 of formation transparent plastic shell is molded.Wafer support legs 27 is formed by electrostatic dissipation, high anti-mold materials.Side handle and mechanical flange are also molded by static dissipative material.Because first molding part 50 is also formed by static dissipative material, so by being the equipment interface of first molding part, 50 parts and the ground connection interface on the junction apparatus, provide the conductive path of ground connection for mechanical flange, side handle and chip support 220 and wafer support legs 27.Notice that equipment interface can be illustrated three balls or three groove motion connections, or for connecting the conventional H shape pin interface that each parts is formed by static dissipative material, shown in Fig. 1,4 and 5, parts can connect conductively by the conductive plastics jumper 241 that for example suitably is connected to parts shown in Figure 3.
The general surface resistivity of working as is at 105 to 1012 ohms per squares, and carrier or parts are considered to electrostatic dissipation so.For the material that conductive path is provided, for example arrive ground, be suitable less than the resistance of this value.
Figure 18 shows existing H shape pin wafer carrier 280.This H shape pin wafer carrier has both direction, and wherein they can be placed on equipment or other surface.The vertical stacked arrangement of the wafer of a position, wafer is axially aimed at substantially horizontal wafer axis.Place with 5 the same wafer-level of embodiment as Fig. 1,2 second position.Wafer carrier 280 has end face 281, bottom surface 282, the back side 285, left side wall 300 and right side wall 400.Bottom surface 282 comprises the end or end wall 283, has the H shape flange 284 that is connected with the wafer processing apparatus (not shown).Though the wafer that shows in the drawings in the wafer carrier 280 is vertically aimed at, reference is generally the end of level or the direction of end wall 283 and substantially horizontal wafer can identify parts.
Figure 19 shows when can at least one wafer of horizontal positioned, the part of the left side wall 300 of wafer carrier 280.Left side wall 300 comprises level and extends internally a plurality of elongate wafer guide rods 310 of a plurality of substantially horizontal wafer slots 320 of qualification.The leading edge 313 that wafer guide rod 310 also has extends to the length (not shown) of wafer guide rod 310 at the back side 302 of wafer carrier from open front 301.Wafer guide rod 310 has and comprises a plurality of projections or extension 330.1; 330.2; 330.3; 330.4; With 330.5 upper surface 311.
Figure 20-22 shows and comprises projection or extension 330.1; 330.2; 330.3; 330.4; Orthogonal graph with the part of the wafer guide rod 310 of 330.5 different embodiment.
Figure 20 A-D is the part vertical view of wafer guide rod 310, shows projection or extension 330.1; 330.2; 330.3; 330.4; With 330.5 different embodiment.In Figure 20 A, projection or extension 330.3 are set make it cross over the forward position 313 of wafer guide rod 310 and the distance between the rear portion 314 basically.As can be seen from the figure, projection or extension 330.3 generally are elongated, and forward position 313 quadratures of preferred and wafer guide rod 310, make the longitudinal axis (not shown) of projection or extension 330.3 inwardly point to the center of wafer carrier.In Figure 20 B, projection or extension 330.4 form fritter projectedly.Though projection or extension 330.4 only are illustrated in the forward position 313 of wafer guide rod 310 and the centre at rear portion 314, should be understood that projection or extension 330.4 can more close forward position 313 or rear portion 314 be provided with, and do not break away from the spirit and scope of the present invention.In Figure 20 C, two projections or extension 330.1 and 330.2 are arranged, adjacent along the axle inwardly that extends to the center of wafer carrier from the forward position of wafer guide rod 310.Figure 20 D shows oval-shaped projection or globule 330.5.
Figure 21 A-D is a front view of taking from the forward position 313 of the wafer guide rod 310 shown in Figure 20 A-D.As can be seen, projection or extension 330.2; 330.3; 330.4; Give prominence to from the upper surface 311 of wafer guide rod 310 with 330.5, and the lower surface 312 of wafer guide rod is generally the plane.Though it is outstanding from the upper surface 311 of wafer guide rod 310 suddenly that projection or extension 300A-D seem to seem to a certain extent, does so only in order to illustrate the present invention better.Should be appreciated that if desired projection or extension can be upper surface 311 and projection or extension 330.1; 330.2; 330.3; 330.4; And provide smooth transition between 330.5, and do not break away from the spirit and scope of the present invention.
Figure 22 A-D is the end view of the wafer guide rod 310 shown in Figure 20 A-D.As can be seen, projection or extension 330.1; 330.2; 330.3; 330.4; Give prominence to from the upper surface 311 of wafer guide rod 310 with 330.5.Notice that Figure 22 A is different with Figure 22 B-D to a certain extent, be general projection or extension 330.3 from the forward position 313 width that pass wafer guide rod 310 to the rear portion.
With reference to figure 23A, 23B, 23C and 23D, show the profile of H shape pin wafer carrier, wafer carrier is in the direction of H shape pin end face level.This series of drawing demonstrates the characteristics that wafer is only supported by the projection in the wafer slot in the carrier 330.3.In other words, all positions in wafer can place horizontal level on chip support or the guide rod 310, described wafer is only supported by upwardly extending projection 330.3, has minimum the contact with wafer carrier thus.As can be seen, the spacing between the projection on the wafer guide rod provides support continuous on all these positions.The spacing of this projection 330.3 depends on the concrete structure of the relative size and the projection of wafer carrier and wafer.That is, become fritter 330.4 shown in Figure 19 and be offset in the situation of interior forward position 313 1 segment distances of wafer guide rod, need how this fritter for the situation of the elongated beading 330.3 that extend the whole length of wafer guide rod than projection in protrusions configuration.
With reference to Figure 24, show along the profile of the H shape pin wafer carrier of the line 24-24 of Figure 23 D intercepting, and illustrate engaging of wafer 290 and wafer guide rod 310.The upper surface 352 of projection 330.3 is circular, is usually displayed among Figure 19 and Figure 21 A-D and the 22A-D.Every pair of adjacent wafer guide rod defines insertion, takes away and places the slot 354 of wafer 290.The centre of every pair of wafer guide rod is the wafer plain cushion (flat) 356 of each wafer slot 354.The zone defines wafer basically and moves into or shift out insertion and retraction plane or the zone that carrier passes between the relative wafer plain cushion, and can the contact wafer guide rod, as long as wafer is positioned at the carrier center.Notice that as shown in figure 24 the upper surface 352 of wafer guide rod tilts a little with the plane of the wafer 290 that inserts, lower surface 360 horizontal planes same and wafer 290 the wide-angle slightly that tilts.Had the upper surface 352 that tilts, the joint of wafer 290 is positioned at the inferior horn 357 of qualified point 364 place's wafers on the projection 330.3.When in the placement location of upper surface 352 at it with the parallel plane situation of wafer in, joint will strictly be restricted to the subregion that is a bit larger tham restriction.The distance that the upper surface 311 of wafer and wafer guide rod separates in the time of during Figure 24 shows and inserts and remove and on being placed on projection 330.3 is the thickness of projection.Thus, any particulate on the described upper surface 311 of guide rod can contact wafer 290, therefore generally has no chance to adhere to described wafer 290.
With reference to Figure 25,26 and 27, show three kinds of different containers, all known in this area, and use together in conjunction with H shape pin carrier.Figure 25 shows the carrier of SMIF container 378 types, and wherein lower surface 380 comprises the removable door that is placed on the H shape pin carrier.Figure 26 shows mode transmission module 381, and the dismountable H shape of door 382 usefulness pin carrier 280 is closed open front 385.Figure 27 shows the box 389 of sealing and transport of H shape pin carrier.All these carriers can be opened, and take wafer away with the H shape pin carrier that separates, and all these is suitable for the minimum contacting structure on the wafer guide rod of H shape pin carrier.
The present invention can other specific forms implement, and the spirit or the basic attribute that do not break away from it, therefore wish which point thinks that all present embodiment is illustrative rather than determinate from, indicate scope of the present invention with reference to subsidiary claims rather than above explanation.
Claims (25)
1. chip container, flatly keep wafer in the mode that axially aligns placement, container has the front portion of sealing, the top of sealing, the bottom of sealing, the back of sealing, the left side of sealing, the right side of sealing and unlimited inside, chip container can be opened insertion and take wafer away, and container comprises:
Vertically aligned chip support in a plurality of correspondences of the inside, right side of a plurality of vertically aligned wafer guide rod of the inside, left side of container and container, be used for axially aligned mode supporting wafers essentially horizontally, each wafer guide rod has at least one upwardly extending projection, is used for supporting each wafer in the bottom of described wafer with the minimum contact.
2. according to the chip container of claim 1, wherein the wafer guide rod comprises at least two pillars that are oppositely arranged, each one each pillar extends to the bottom of sealing from the top of sealing on each side of container, and pillar is connected to the top of sealing and the bottom of sealing conductively.
3. according to the chip container of claim 1, wherein wafer carrier also comprises the wafer carrier that can insert and remove from the uncovered inside of container, and wafer carrier comprises vertically aligned wafer guide rod.
4. wafer carrier, to keeping substantially horizontal wafer, wafer has lower surface at vertical pivot, and carrier has open front, back, top, bottom, the left side and the right side, and carrier also comprises:
The a pair of wafer support legs that extends to the bottom from the top, a pillar is positioned at the right side, another is positioned at the left side, each wafer support legs comprises a plurality of vertical arrangements and horizontally extending elongated wafer guide rod, being parallel to each side extends, define a plurality of slots of admitting wafer, each guide rod comprises a plurality of upwardly extending projections, contact with the lower surface of wafer is minimum in each prominence, each slot also has the insertion plane of wafer and places the plane, wafer can be inserted in the carrier by the open front of inserting the plane thus, and be placed on downwards on the interior upwardly extending projection in placement plane of socket position, projection quantity on the upper surface of each wafer guide rod is enough, is configured to when at placement location, and the lower surface of wafer is only by upwardly extending nipple support.
5. according to the wafer carrier of claim 4, wherein each wafer guide rod also is included in the stop tab of placing in the plane forward, upwardly extending projection at least partly forward also inwardly, disturb thus and be positioned at travelling forward of placement location wafer, each wafer guide rod also has and is positioned at upwardly extending projection forward and the stop tab backward that inwardly is provided with, disturb the motion backward that is positioned at described placement location wafer thus, described stop tab does not forward extend to and inserts in the plane, wafer can insert the plane insertion and remove thus, and does not disturb described stop forward.
6. according to the wafer carrier of claim 2, also comprise integrally molded outer transparent shell, it extends towards periphery, and sealing left side, dorsal part and right side.
7. according to the wafer carrier of claim 4, its middle and upper part, bottom and wafer support legs form by static dissipative material is molded respectively, and mechanically connect.
8. according to the wafer carrier of claim 7, wherein upwardly extending projection is circular, elongated, and direction is inside.
9. wafer carrier, substantial horizontal is piled up and is placed ground maintenance wafer, wafer has the lower surface on plane, carrier comprises open front, dorsal part, top, bottom, left side wall and the right side wall that inserts and remove wafer, each is right and left side wall has a plurality of elongated horizontal extensions and towards interior wafer guide rod, define the wafer slot of a plurality of substantial horizontal band vertical axises, a plurality of wafer guide rods have upper surface and lower surface, each wafer guide rod has at least two and protrudes upward circular projection, with minimum contact supporting wafers between wafer and carrier.
10. according to the wafer carrier of claim 9, wherein each wafer guide rod has linear basically part, and parallel with the wafer direction of insertion basically, each wafer guide rod also has the part of inside convergence, along with the wafer guide rod near dorsal part, the part of each convergence is divided adjacent with each linear portion.
11. according to the wafer carrier of claim 10, wherein the projection quantity on each wafer guide rod upper surface is enough, and is configured to during inserting and removing except in described prominence, makes wafer can not contact the upper surface of the wafer guide rod under the described wafer.
12. according to the wafer carrier of claim 11, wherein each projection is elongated and inside point.
13. according to the wafer carrier of claim 11, wherein the bottom comprises equipment interface.
14. according to the wafer carrier of claim 13, wherein equipment interface is a H shape pin.
15. wafer carrier according to Claim 8, wherein each protrusions configuration is a fritter.
16. wafer carrier, keep a plurality of wafers, wafer carrier comprises open front, dorsal part, top, bottom, left side wall and the right side wall that inserts and remove wafer, each right and left side wall have a plurality of levels, elongated, towards interior and substantially horizontal wafer guide rod, the wafer guide rod defines a plurality of wafer slots, a plurality of wafer guide rods have upper surface and lower surface, improvement comprises at least two projections, stretch out up from the upper surface of wafer guide rod, contact supporting wafers with minimum with the wafer guide rod.
17. according to the wafer carrier of claim 16, wherein each wafer guide rod has the part of inside convergence, along with the wafer guide rod near dorsal part, the part of each convergence is divided adjacent with each linear portion.
18. according to the wafer carrier of claim 16, wherein the projection quantity on each wafer guide rod upper surface is enough, is configured to during inserting and removing except in described prominence, makes wafer can not contact the upper surface of the wafer guide rod under the described wafer.
19. according to the wafer carrier of claim 16, wherein each projection is elongated and inside point.
20. according to the wafer carrier of claim 16, wherein each projection is the shape of projection.
21. according to the wafer carrier of claim 16, wherein the bottom comprises equipment interface.
22. according to the wafer carrier of claim 21, wherein equipment interface is a H shape pin.
23. according to the wafer carrier of claim 10, wherein each projection is circular, is configured as fritter.
24. according to the wafer carrier of claim 16, wherein carrier forms by static dissipative material is molded integratedly.
25. a wafer carrier keeps at least one wafer, wafer has the lower surface on plane, and carrier comprises:
Insert and remove the open front of at least one wafer, wafer is gone into wafer at the directional interpolation across open front; And
Dorsal part, the top, the bottom, left side wall and right side wall, each is right and left side wall has a plurality of elongated horizontal extensions and towards interior wafer guide rod, the wafer guide rod has linear basically part, be arranged essentially parallel to the wafer direction of insertion, each wafer guide rod also has the part of inside convergence, along with the wafer guide rod divides adjacent near the part of each convergence of dorsal part with each linear portion, define a plurality of substantially horizontal wafers and insert translot, a plurality of wafer guide rods have upper surface and lower surface, each upper surface has at least two projections, supports at least one wafer with minimum contact between wafer and carrier.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US95464097A | 1997-10-20 | 1997-10-20 | |
| US08/954640 | 1997-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1232289A true CN1232289A (en) | 1999-10-20 |
| CN1165963C CN1165963C (en) | 2004-09-08 |
Family
ID=25495730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB981224393A Expired - Lifetime CN1165963C (en) | 1997-10-20 | 1998-10-20 | Wafer carrier with minimal contact |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPH11204629A (en) |
| KR (1) | KR100830654B1 (en) |
| CN (1) | CN1165963C (en) |
| DE (1) | DE19848147A1 (en) |
| FR (1) | FR2770498B1 (en) |
| HK (1) | HK1023228A1 (en) |
| IT (1) | IT1303138B1 (en) |
| NL (1) | NL1010321C2 (en) |
| SG (1) | SG81942A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| JP4146718B2 (en) | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | Thin plate support container |
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| KR102223033B1 (en) * | 2014-04-29 | 2021-03-04 | 삼성전자주식회사 | wafer storage container |
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| KR200493303Y1 (en) * | 2018-12-27 | 2021-03-10 | 위아코퍼레이션 주식회사 | Slot bar for wafer carrier |
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| US5492229A (en) * | 1992-11-27 | 1996-02-20 | Toshiba Ceramics Co., Ltd. | Vertical boat and a method for making the same |
| JP3145252B2 (en) * | 1994-07-29 | 2001-03-12 | 淀川化成株式会社 | Substrate supporting side plate and cassette using the same |
| JPH0864669A (en) * | 1994-08-25 | 1996-03-08 | Hitachi Cable Ltd | Wafer box |
| US5452795A (en) * | 1994-11-07 | 1995-09-26 | Gallagher; Gary M. | Actuated rotary retainer for silicone wafer box |
| US5534074A (en) * | 1995-05-17 | 1996-07-09 | Heraeus Amersil, Inc. | Vertical boat for holding semiconductor wafers |
| JP3328763B2 (en) * | 1995-10-30 | 2002-09-30 | エヌティティエレクトロニクス株式会社 | Wafer support structure for vertical wafer boat |
| JPH1098096A (en) * | 1996-09-25 | 1998-04-14 | Nippon Valqua Ind Ltd | Semiconductor wafer cassette |
-
1998
- 1998-10-15 NL NL1010321A patent/NL1010321C2/en not_active IP Right Cessation
- 1998-10-16 IT IT1998TO000879A patent/IT1303138B1/en active IP Right Grant
- 1998-10-20 JP JP10298859A patent/JPH11204629A/en active Pending
- 1998-10-20 SG SG9804226A patent/SG81942A1/en unknown
- 1998-10-20 KR KR1019980043797A patent/KR100830654B1/en not_active IP Right Cessation
- 1998-10-20 FR FR9813123A patent/FR2770498B1/en not_active Expired - Fee Related
- 1998-10-20 DE DE19848147A patent/DE19848147A1/en not_active Ceased
- 1998-10-20 CN CNB981224393A patent/CN1165963C/en not_active Expired - Lifetime
-
2000
- 2000-04-20 HK HK00102409A patent/HK1023228A1/en not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111489984A (en) * | 2015-10-22 | 2020-08-04 | 朗姆研究公司 | Front-opening type ring box |
| CN107706144A (en) * | 2017-09-14 | 2018-02-16 | 德淮半导体有限公司 | Wafer cleaning fixing device and cleaning equipment |
| CN110610885A (en) * | 2018-06-14 | 2019-12-24 | 家登精密工业股份有限公司 | Substrate carrier |
| CN110610885B (en) * | 2018-06-14 | 2022-08-26 | 家登精密工业股份有限公司 | Substrate carrier |
| CN109003928A (en) * | 2018-07-21 | 2018-12-14 | 江苏德尔科测控技术有限公司 | A kind of silicon wafer carrying device |
| CN109003928B (en) * | 2018-07-21 | 2021-03-09 | 江苏德尔科测控技术有限公司 | Silicon wafer bearing device |
Also Published As
| Publication number | Publication date |
|---|---|
| NL1010321A1 (en) | 1999-04-21 |
| NL1010321C2 (en) | 1999-09-08 |
| JPH11204629A (en) | 1999-07-30 |
| ITTO980879A1 (en) | 2000-04-16 |
| SG81942A1 (en) | 2001-07-24 |
| KR100830654B1 (en) | 2008-11-11 |
| FR2770498A1 (en) | 1999-05-07 |
| FR2770498B1 (en) | 2000-06-16 |
| DE19848147A1 (en) | 1999-04-22 |
| KR19990037214A (en) | 1999-05-25 |
| HK1023228A1 (en) | 2000-09-01 |
| CN1165963C (en) | 2004-09-08 |
| IT1303138B1 (en) | 2000-10-30 |
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