CN1227153C - Silicon-aluminium-silicon structure micro machinery processing method of full dry method - Google Patents
Silicon-aluminium-silicon structure micro machinery processing method of full dry method Download PDFInfo
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- CN1227153C CN1227153C CN 200310109717 CN200310109717A CN1227153C CN 1227153 C CN1227153 C CN 1227153C CN 200310109717 CN200310109717 CN 200310109717 CN 200310109717 A CN200310109717 A CN 200310109717A CN 1227153 C CN1227153 C CN 1227153C
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- Prior art keywords
- silicon
- single crystal
- type single
- crystal silicon
- sheet
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- 238000000034 method Methods 0.000 title claims abstract description 25
- -1 Silicon-aluminium-silicon structure Chemical group 0.000 title claims abstract description 22
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 238000001259 photo etching Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 34
- 229910052710 silicon Inorganic materials 0.000 claims description 34
- 239000010703 silicon Substances 0.000 claims description 34
- 229920002120 photoresistant polymer Polymers 0.000 claims description 33
- 238000000992 sputter etching Methods 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 14
- 238000003475 lamination Methods 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 230000009977 dual effect Effects 0.000 claims description 5
- 238000001459 lithography Methods 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 238000000313 electron-beam-induced deposition Methods 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 28
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 238000004377 microelectronic Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 3
- 231100000614 poison Toxicity 0.000 abstract description 3
- 230000007096 poisonous effect Effects 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 abstract 1
- 238000000708 deep reactive-ion etching Methods 0.000 abstract 1
- 238000003801 milling Methods 0.000 abstract 1
- 238000001039 wet etching Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 108091092878 Microsatellite Proteins 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000036244 malformation Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000000505 pernicious effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004874 x-ray synchrotron radiation Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200310109717 CN1227153C (en) | 2003-12-25 | 2003-12-25 | Silicon-aluminium-silicon structure micro machinery processing method of full dry method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200310109717 CN1227153C (en) | 2003-12-25 | 2003-12-25 | Silicon-aluminium-silicon structure micro machinery processing method of full dry method |
Publications (2)
Publication Number | Publication Date |
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CN1554566A CN1554566A (en) | 2004-12-15 |
CN1227153C true CN1227153C (en) | 2005-11-16 |
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Application Number | Title | Priority Date | Filing Date |
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CN 200310109717 Expired - Fee Related CN1227153C (en) | 2003-12-25 | 2003-12-25 | Silicon-aluminium-silicon structure micro machinery processing method of full dry method |
Country Status (1)
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CN (1) | CN1227153C (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1325367C (en) * | 2005-09-16 | 2007-07-11 | 中国电子科技集团公司第二十四研究所 | Method for producing MEMS sensor suspension beam structure |
CN100396595C (en) * | 2005-12-27 | 2008-06-25 | 北京大学 | Method for preparing nanometer suspension arm structure using nanometer embossing and reactive ion etching technology |
KR101527627B1 (en) * | 2008-12-23 | 2015-06-10 | 실텍트라 게엠베하 | Method for producing thin, free-standing layers of solid state materials with structured surfaces |
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2003
- 2003-12-25 CN CN 200310109717 patent/CN1227153C/en not_active Expired - Fee Related
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Publication number | Publication date |
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CN1554566A (en) | 2004-12-15 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: HEBEI LEDE ELECTRONICS Co.,Ltd. Assignor: THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY Group Corp. Contract fulfillment period: 2007.11.15 to 2012.11.15 Contract record no.: 2008130000008 Denomination of invention: Silicon-aluminium-silicon structure micro machinery processing method of full dry method Granted publication date: 20051116 License type: Exclusive license Record date: 20081016 |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: HEBEI LEDE ELECTRONICS Co.,Ltd. Assignor: THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY Group Corp. Contract fulfillment period: 2007.11.15 to 2012.11.15 Contract record no.: 2008130000008 Denomination of invention: Silicon-aluminium-silicon structure micro machinery processing method of full dry method Granted publication date: 20051116 License type: Exclusive license Record date: 20081016 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.11.15 TO 2012.11.15; CHANGE OF CONTRACT Name of requester: HEBEI LIDE ELECTRONICS CO., LTD. Effective date: 20081016 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051116 |