CN1220976C - 磁头万向架组件及其制造方法 - Google Patents
磁头万向架组件及其制造方法 Download PDFInfo
- Publication number
- CN1220976C CN1220976C CNB200310102680XA CN200310102680A CN1220976C CN 1220976 C CN1220976 C CN 1220976C CN B200310102680X A CNB200310102680X A CN B200310102680XA CN 200310102680 A CN200310102680 A CN 200310102680A CN 1220976 C CN1220976 C CN 1220976C
- Authority
- CN
- China
- Prior art keywords
- slide block
- flexible carrier
- removal portion
- film removal
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002304632A JP2004139687A (ja) | 2002-10-18 | 2002-10-18 | ヘッドジンバルアッセンブリ及びその製造方法 |
JP2002304632 | 2002-10-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1497536A CN1497536A (zh) | 2004-05-19 |
CN1220976C true CN1220976C (zh) | 2005-09-28 |
Family
ID=32089406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200310102680XA Expired - Fee Related CN1220976C (zh) | 2002-10-18 | 2003-10-16 | 磁头万向架组件及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7095590B2 (zh) |
JP (1) | JP2004139687A (zh) |
CN (1) | CN1220976C (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004036555A1 (en) * | 2002-10-15 | 2004-04-29 | Sae Magnetics (H.K.) Ltd. | Conductive adhesive for magnetic head assembly |
US7369364B2 (en) * | 2003-12-19 | 2008-05-06 | Samsung Electronics Co., Ltd. | Interconnect for dissipating electrostatic charges on a head slider |
JP4326484B2 (ja) * | 2005-02-21 | 2009-09-09 | 日本発條株式会社 | ヘッドサスペンション |
JP4386863B2 (ja) * | 2005-02-21 | 2009-12-16 | 日本発條株式会社 | ヘッド・サスペンション |
JP4146843B2 (ja) * | 2005-02-23 | 2008-09-10 | Tdk株式会社 | 磁気ヘッド |
US7474508B1 (en) * | 2005-03-09 | 2009-01-06 | Western Digital (Fremont), Inc. | Head gimbal assembly with air bearing slider crown having reduced temperature sensitivity |
JP2006260679A (ja) * | 2005-03-17 | 2006-09-28 | Fujitsu Ltd | 記録ディスク駆動装置およびヘッドサスペンションアセンブリ |
US7729089B1 (en) | 2006-10-13 | 2010-06-01 | Western Digital Technologies, Inc. | Head-gimbal assembly including a flexure tongue with stand-offs arranged to facilitate lateral light entry |
US7995310B1 (en) * | 2006-11-09 | 2011-08-09 | Western Digital Technologies, Inc. | Head-gimbal assembly including a flexure tongue with adhesive receptacles disposed adjacent to stand-offs |
JP5416887B2 (ja) * | 2007-05-18 | 2014-02-12 | 日本発條株式会社 | ディスク装置用サスペンションのクリーニング方法 |
US8300362B2 (en) * | 2009-06-15 | 2012-10-30 | Seagate Technology Llc | Slider-gimbal scratch mitigation |
JP5587219B2 (ja) | 2011-01-28 | 2014-09-10 | サンコール株式会社 | ステンレス鋼への導電材料の接合方法 |
JP5666676B2 (ja) * | 2013-11-05 | 2015-02-12 | サンコール株式会社 | 導電接合方法 |
US11557318B1 (en) * | 2022-03-29 | 2023-01-17 | Sae Magnetics (H.K.) Ltd. | Head gimbal assembly, manufacturing method thereof, and disk drive unit |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5499153A (en) * | 1993-06-10 | 1996-03-12 | Hitachi Metals, Ltd. | Floating magnetic head device and its securing method |
JP3355251B2 (ja) | 1993-11-02 | 2002-12-09 | 株式会社日立製作所 | 電子装置の製造方法 |
JP3727410B2 (ja) * | 1996-05-14 | 2005-12-14 | 日本メクトロン株式会社 | 磁気ヘッド用回路配線付きサスペンションの製造法 |
US5809534A (en) | 1996-06-13 | 1998-09-15 | Compaq Computer Corporation | Performing a write cycle to memory in a multi-processor system |
JPH11149625A (ja) | 1997-11-19 | 1999-06-02 | Fujitsu Ltd | ヘッドアセンブリ用サスペンション及びヘッドアセンブリ並びにヘッドアセンブリ用サスペンションの製造方法 |
JP2000215428A (ja) | 1999-01-27 | 2000-08-04 | Tdk Corp | ヘッドスライダ支持体およびヘッド装置、ならびにそれらの製造方法 |
JP2001196420A (ja) | 2000-01-13 | 2001-07-19 | Hitachi Ltd | 半導体装置の製造方法及び製造装置 |
JP3611198B2 (ja) | 2000-02-16 | 2005-01-19 | 松下電器産業株式会社 | アクチュエータとこれを用いた情報記録再生装置 |
-
2002
- 2002-10-18 JP JP2002304632A patent/JP2004139687A/ja active Pending
-
2003
- 2003-10-08 US US10/681,474 patent/US7095590B2/en not_active Expired - Fee Related
- 2003-10-16 CN CNB200310102680XA patent/CN1220976C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7095590B2 (en) | 2006-08-22 |
JP2004139687A (ja) | 2004-05-13 |
CN1497536A (zh) | 2004-05-19 |
US20040075946A1 (en) | 2004-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: TDK CORP. Free format text: FORMER OWNER: ALPS ELECTRIC CO., LTD. Effective date: 20080125 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20080125 Address after: Tokyo, Japan, Japan Patentee after: TDK Corp. Address before: Tokyo, Japan, Japan Patentee before: Alps Electric Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050928 Termination date: 20141016 |
|
EXPY | Termination of patent right or utility model |