CN1220078C - 二维光导波装置和使用该装置的光电融合布线基板 - Google Patents
二维光导波装置和使用该装置的光电融合布线基板 Download PDFInfo
- Publication number
- CN1220078C CN1220078C CN03152348.XA CN03152348A CN1220078C CN 1220078 C CN1220078 C CN 1220078C CN 03152348 A CN03152348 A CN 03152348A CN 1220078 C CN1220078 C CN 1220078C
- Authority
- CN
- China
- Prior art keywords
- light
- guided wave
- mentioned
- optical
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 92
- 239000000758 substrate Substances 0.000 title description 34
- 230000000644 propagated effect Effects 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 109
- 238000009429 electrical wiring Methods 0.000 claims description 36
- 230000005622 photoelectricity Effects 0.000 claims description 28
- 239000012792 core layer Substances 0.000 claims description 23
- 230000001902 propagating effect Effects 0.000 claims description 20
- 230000008859 change Effects 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 3
- 230000008929 regeneration Effects 0.000 claims description 3
- 238000011069 regeneration method Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 230000009466 transformation Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 21
- 239000004065 semiconductor Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 230000008878 coupling Effects 0.000 description 13
- 238000010168 coupling process Methods 0.000 description 13
- 238000005859 coupling reaction Methods 0.000 description 13
- 238000004020 luminiscence type Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011162 core material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 208000034189 Sclerosis Diseases 0.000 description 2
- 208000004350 Strabismus Diseases 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000001093 holography Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910006585 β-FeSi Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12107—Grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP219251/2002 | 2002-07-29 | ||
| JP2002219251A JP2004061799A (ja) | 2002-07-29 | 2002-07-29 | 二次元光導波装置、およびそれを用いた光電融合配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1475824A CN1475824A (zh) | 2004-02-18 |
| CN1220078C true CN1220078C (zh) | 2005-09-21 |
Family
ID=30112894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN03152348.XA Expired - Fee Related CN1220078C (zh) | 2002-07-29 | 2003-07-29 | 二维光导波装置和使用该装置的光电融合布线基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7120325B1 (enExample) |
| EP (1) | EP1387193A1 (enExample) |
| JP (1) | JP2004061799A (enExample) |
| CN (1) | CN1220078C (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050004005A (ko) * | 2003-07-01 | 2005-01-12 | 마츠시타 덴끼 산교 가부시키가이샤 | 실장체, 광 전송로 및 광 전기 회로기판 |
| FI20035223L (fi) * | 2003-11-27 | 2005-05-28 | Asperation Oy | Piirilevy ja menetelmä sen valmistamiseksi |
| JP4789423B2 (ja) * | 2004-03-30 | 2011-10-12 | キヤノン株式会社 | 光導波装置 |
| US7483466B2 (en) * | 2005-04-28 | 2009-01-27 | Canon Kabushiki Kaisha | Vertical cavity surface emitting laser device |
| AT503585B1 (de) * | 2006-05-08 | 2007-11-15 | Austria Tech & System Tech | Leiterplattenelement sowie verfahren zu dessen herstellung |
| AT503027B1 (de) | 2006-05-08 | 2007-07-15 | Austria Tech & System Tech | Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter |
| TW200807047A (en) * | 2006-05-30 | 2008-02-01 | Sumitomo Bakelite Co | Substrate for mounting photonic device, optical circuit substrate, and photonic device mounting substrate |
| JP2008158440A (ja) * | 2006-12-26 | 2008-07-10 | Toshiba Corp | 光電気配線板及び光電気配線装置の製造方法 |
| JP5020866B2 (ja) * | 2007-05-07 | 2012-09-05 | キヤノン株式会社 | 垂直共振器型面発光レーザ |
| WO2008149734A1 (ja) * | 2007-05-31 | 2008-12-11 | Sony Corporation | 光導波路、信号処理装置及び信号処理基板 |
| JP5370714B2 (ja) * | 2007-05-31 | 2013-12-18 | ソニー株式会社 | 光導波路、および信号処理装置 |
| US7912328B2 (en) * | 2008-11-26 | 2011-03-22 | General Electric Company | Optical waveguide EMI shield |
| DE102009051188A1 (de) * | 2009-10-29 | 2011-05-19 | Siemens Aktiengesellschaft | Lichtsignalgeber und Lichtempfänger für einen optischen Sensor |
| CN103119484B (zh) * | 2010-10-01 | 2015-05-20 | 住友电木株式会社 | 光波导模块、光波导模块的制造方法以及电子设备 |
| JPWO2012070381A1 (ja) * | 2010-11-22 | 2014-05-19 | 日本電気株式会社 | 実装構造及び実装方法 |
| US9377596B2 (en) * | 2014-07-22 | 2016-06-28 | Unimicron Technology Corp. | Optical-electro circuit board, optical component and manufacturing method thereof |
| EP2993462B1 (en) * | 2014-08-12 | 2019-05-22 | Personal Genomics Inc. | Optical sensor comprising a waveguide |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4611883A (en) | 1981-05-01 | 1986-09-16 | Hughes Aircraft Company | Two-dimensional optics element for correcting aberrations |
| US4838630A (en) | 1987-12-21 | 1989-06-13 | Physical Optics Corporation | Holographic planar optical interconnect |
| US5198008A (en) | 1990-11-09 | 1993-03-30 | National Semiconductor Corporation | Method of fabricating an optical interconnect structure |
| RU2097815C1 (ru) * | 1993-02-12 | 1997-11-27 | Фирма "Самсунг Электроникс Ко., Лтд." | Оптический процессор |
| JPH0996746A (ja) | 1995-09-29 | 1997-04-08 | Fujitsu Ltd | アクティブ光回路シートまたはアクティブ光回路基板 |
| US5835646A (en) | 1995-09-19 | 1998-11-10 | Fujitsu Limited | Active optical circuit sheet or active optical circuit board, active optical connector and optical MCM, process for fabricating optical waveguide, and devices obtained thereby |
| US5822475A (en) * | 1995-12-20 | 1998-10-13 | Fuji Xerox Co., Ltd. | Optical bus and signal processor |
| JP2000199827A (ja) | 1998-10-27 | 2000-07-18 | Sony Corp | 光導波装置およびその製造方法 |
| JP3728147B2 (ja) * | 1999-07-16 | 2005-12-21 | キヤノン株式会社 | 光電気混載配線基板 |
| US7020400B2 (en) | 1999-12-24 | 2006-03-28 | Altera Corporation | Multi-wavelength optical communication system |
| US6661940B2 (en) * | 2000-07-21 | 2003-12-09 | Finisar Corporation | Apparatus and method for rebroadcasting signals in an optical backplane bus system |
| JP3762208B2 (ja) * | 2000-09-29 | 2006-04-05 | 株式会社東芝 | 光配線基板の製造方法 |
| TW499581B (en) * | 2001-06-29 | 2002-08-21 | Ind Tech Res Inst | Planar waveguide diffractive beam splitter/beam coupler |
| JP2004013113A (ja) * | 2002-06-11 | 2004-01-15 | Sumitomo Electric Ind Ltd | 光信号処理器 |
-
2002
- 2002-07-29 JP JP2002219251A patent/JP2004061799A/ja not_active Withdrawn
-
2003
- 2003-07-25 US US10/626,535 patent/US7120325B1/en not_active Expired - Fee Related
- 2003-07-28 EP EP03017112A patent/EP1387193A1/en not_active Withdrawn
- 2003-07-29 CN CN03152348.XA patent/CN1220078C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1475824A (zh) | 2004-02-18 |
| JP2004061799A (ja) | 2004-02-26 |
| EP1387193A1 (en) | 2004-02-04 |
| US7120325B1 (en) | 2006-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1220078C (zh) | 二维光导波装置和使用该装置的光电融合布线基板 | |
| JP3848210B2 (ja) | 電子回路基板 | |
| US10797188B2 (en) | Optical semiconductor structure for emitting light through aperture | |
| US5848214A (en) | Optically-guiding multichip module | |
| CN1238744C (zh) | 光学元件和使用该元件的光学装置 | |
| CN108508553B (zh) | 一种光模组 | |
| CN1720679A (zh) | 提供混合式光学/无线通信的通信系统及相关方法 | |
| CN1601313A (zh) | 用于整体封装光电子装置、ic芯片、和光传输线的设备和方法 | |
| CN1402030A (zh) | 光元件、光波导装置、它们的制造方法以及使用它们的光电混载基板 | |
| CN1735828A (zh) | 光子电路板 | |
| US20240012215A1 (en) | Coupling microleds to optical communication channels | |
| JP2003279770A (ja) | 光伝送シート、これを用いた光電融合基板及び光伝送方法 | |
| JP2005062557A (ja) | 光素子装置、それを用いた二次元光導波路素子及び光電融合配線基板 | |
| CN1518245A (zh) | 光信号传输装置和信号处理装置 | |
| JP2000039531A (ja) | 光信号伝送システムおよびその製造方法 | |
| TWI393509B (zh) | 光電混載電路板及其製造方法 | |
| JP2003131081A (ja) | 半導体装置、光電融合基板それらの製造方法、およびこれを用いた電子機器 | |
| CN203480083U (zh) | 光接口装置 | |
| JP3500843B2 (ja) | 光バス及び情報処理装置 | |
| JP2007148087A (ja) | 光電気集積配線基板及び光電気集積配線システム | |
| CN213934310U (zh) | 一种垂直耦合光收发结构 | |
| JP3663310B2 (ja) | 光ビームスポット変換器及びこれを用いた光伝送モジュール並びに光伝送システム | |
| CN1174568C (zh) | 光通信设备和方法 | |
| CN1940612A (zh) | 包括半导体光放大器和光电二极管的集成光电器件 | |
| CN100365810C (zh) | 漫射和镭射光电偶合的集成电路信号线 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050921 Termination date: 20140729 |
|
| EXPY | Termination of patent right or utility model |