CN1219099A - 确定电路组装操作精确度的方法以及使用此方法的机器 - Google Patents
确定电路组装操作精确度的方法以及使用此方法的机器 Download PDFInfo
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- CN1219099A CN1219099A CN98122482A CN98122482A CN1219099A CN 1219099 A CN1219099 A CN 1219099A CN 98122482 A CN98122482 A CN 98122482A CN 98122482 A CN98122482 A CN 98122482A CN 1219099 A CN1219099 A CN 1219099A
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- 238000000034 method Methods 0.000 title claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 238000001514 detection method Methods 0.000 claims description 19
- 238000004364 calculation method Methods 0.000 claims description 5
- 239000002674 ointment Substances 0.000 description 54
- 238000003466 welding Methods 0.000 description 15
- 238000007689 inspection Methods 0.000 description 11
- 239000004744 fabric Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000000205 computational method Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000008521 reorganization Effects 0.000 description 2
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000008141 laxative Substances 0.000 description 1
- 230000002475 laxative effect Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Analysis (AREA)
Abstract
Description
直线段的定位点1/2 | 直线段1/2 | 直线段1的斜率 | 直线段2的斜率 | 直线段1的截距 | 直线段2的截距 | 交点 | 交点在直线段1和2的定位点之间吗? | 阵列中的交点/阵列中的位置 |
(18,15.5)(18,4)/(20.5,13)(21.5,1.5) | 216/220 | 无限大 | -11.5 | 无限大 | 248.75 | (18,41.75) | 不是 | ... |
(18,15.5)(18,4)/(21.5,1.5)(4,0) | 216/221 | 无限大 | 0.0857 | 无限大 | -0.3426 | (18,1.2) | 不是 | ... |
(18,15.5)(18,4)/(4,0)(2.5,11.25) | 216/222 | 无限大 | -7.5 | 无限大 | 30 | (18,-105) | 不是 | ... |
(18,15.5)(18,4)/(2.5,11.25)(20.5,13) | 216/223 | 无限大 | 0.0972 | 无限大 | 11.007 | (18,12.75) | 是 | (18,12.75)/[1,1] |
(18,4)(0,4)/(20.5,13)(21.5,1.5) | 217/220 | 0 | -11.5 | 4 | 248.75 | (21.28,4) | 不是 | ... |
(18,4)(0,4)/(21.5,1.5)(4,0) | 217/221 | 0 | 0.0857 | 4 | -0.3426 | (50.67,4) | 不是 | ... |
(18,4)(0,4)/(4,0)(2.5,11.25) | 217/222 | 0 | -7.5 | 4 | 30 | (3.47,4) | 是 | (3.47,4)/[1,2] |
(18,4)(0,4)/(2.5,11.25)(20.5,13) | 217/223 | 0 | 0.0972 | 4 | 11.007 | (-72.09,4) | 不是 | ... |
(0,4)(0,15.5)/(20.5,13)(21.5,1.5) | 218/220 | 无限大 | -11.5 | 无限大 | 248.75 | (0,248.75) | 不是 | ... |
(0,4)(0,15.5)/(21.5,1.5)(4,0) | 218/221 | 无限大 | 0.0857 | 无限大 | -0.3426 | (0,-0.3426) | 不是 | ... |
(0,4)(0,15.5)/(4,0)(2.5,11.25) | 218/222 | 无限大 | -7.5 | 无限大 | 30 | (0,30) | 不是 | ... |
(0,4)(0,15.5)/(2.5,11.25)(20.5,13) | 218/223 | 无限大 | 0.0972 | 无限大 | 11.007 | (0,11.007) | 不是 | ... |
(0,15.5)(18,15.5)/(20.5,13)(21.5,1.5) | 219/220 | 0 | -11.5 | 15.5 | 248.75 | (20.28,15.5) | 不是 | ... |
(0,15.5)(18,15.5)/(21.5,1.5)(4,0) | 219/221 | 0 | 0.0857 | 15.5 | -0.3426 | (-184.86,15.5) | 不是 | ... |
(0,15.5)(18,15.5)/(4,0)(2.5,11.25) | 219/222 | 0 | -7.5 | 15.5 | 30 | (1.933,15.5) | 不是 | ... |
(0,15.5)(18,15.5)/(2.5,11.25)(20.5,13) | 219/223 | 0 | 0.0972 | 15.5 | 11.007 | (46.224,15.5) | 不是 | ... |
第一多边形的定位点/定位点坐标 | 第二多边形的直线段/直线段点的坐标 | 第二多边形的参考点 | 定位点与参考点时垂直直线段的相对方位 | 定位点与参考点时水平直线段的相对方位 | 非垂直非水平直线段的斜率 | 非垂直非水平直线段的截距 | 定位点与参考点对非垂直非水平直线段的相对方位 | 方位>0(即定位点与参考点在直线段的同一侧吗?) | 定位点被所有直线段包围吗?/阵列中的定位点/阵列中的位置 |
208/(18,15.5) | 220/(20.5,13)(21.5,1.5) | (2.5,11.25) | ... | ... | -11.5 | 248.75 | 5479.688 | 是 | ... |
208/(18,15.5) | 221/(21.5,1.5)(4,0) | (20.5,13) | ... | ... | 0.0857 | -0.3426 | 165.676 | 是 | ... |
208/(18,15.5) | 222/(4,0)(2.5,11.25) | (21.5,1.5) | ... | ... | -7.5 | 30 | 15996.375 | 是 | ... |
208/(18,15.5) | 223/(2.5,11.25)(20.5,13) | (4,0) | ... | ... | 0.0972 | 11.007 | -31.263 | 不是 | 不是 |
209/(18,4) | 220/(20.5,13)(21.5,1.5) | (2.5,11.25) | ... | ... | -11.5 | 248.75 | 7880.313 | 是 | ... |
209/(18,4) | 221/(21.5,1.5)(4,0) | (20.5,13) | ... | ... | 0.0857 | -0.3426 | 32.440 | 是 | ... |
209/(18,4) | 222/(4,0)(2.5,11.25) | (21.5,1.5) | ... | ... | -7.5 | 30 | 14469.75 | 是 | ... |
209/(18,4) | 223/(2.5,11.25)(20.5,13) | (4,0) | ... | ... | 0.0972 | 11.007 | 99.788 | 是 | 是/(18,4)/[1,3] |
210/(0,4) | 220/(20.5,13)(21.5,1.5) | (2.5,11.25) | ... | ... | -11.5 | 248.75 | 51091.563 | 是 | ... |
210/(0,4) | 221/(21.5,1.5)(4,0) | (20.5,13) | ... | ... | 0.0857 | -0.3426 | 50.312 | 是 | ... |
210/(0,4) | 222/(4,0)(2.5,11.25) | (21.5,1.5) | ... | ... | -7.5 | 30 | -3451.5 | 不是 | 不是 |
211/(0,15.5) | 220/(20.5,13)(21.5,1.5) | (2.5,11.25) | ... | ... | -11.5 | 248.75 | 48690.638 | 是 | ... |
211/(0,15.5) | 221/(21.5,1.5)(4,0) | (20.5,1 3) | ... | ... | 0.0857 | -0.3426 | 183.548 | 是 | ... |
211/(0,15.5) | 222/(4,0)(2.5,11.25) | (21.5,1.5) | ... | ... | -7.5 | 30 | 1924.875 | 不是 | 不是 |
212/(20.5,13) | 216/(18,15.5)(18,4) | (0,15.5) | -45 | ... | ... | ... | ... | 不是 | 不是 |
213/(21.5,1.5) | 216/(18,15.5)(18,4) | (0,15.5) | -63 | ... | ... | ... | ... | 不是 | 不是 |
214/(4,0) | 216/(18,15.5)(18,4) | (0,15.5) | 252 | ... | ... | ... | ... | 是 | ... |
214/(4,0) | 217/(18,4)(0,4) | (18,15.5) | ... | -46 | ... | ... | ... | 不是 | 不是 |
215/(2.5,11.25) | 216/(18,15.5)(18,4) | (0,15.5) | 279 | ... | ... | ... | ... | 是 | ... |
215/(2.5,11.25) | 217/(18,4)(0,4) | (18,15.5) | ... | 83.375 | ... | ... | ... | 是 | ... |
215/(2.5,11.25) | 218/(0,4)(0,15.5) | (18,4) | 45 | ... | ... | ... | ... | 是 | ... |
215/(2.5,11.25) | 219/(0,15.5)(18,15.5) | (0,4) | ... | 48.875 | ... | ... | ... | 是 | 是/(2.5,11.25)/[1,4] |
阵列1:(18,12.75)2:(3.47,4)3:(18,4)4:(2.5,11.25) | 起始点1 | 下一点234 | 到下一点的距离16.948.7515.57 | 最近点3 | 交换点2 | 重排的阵列1324 |
1324 | 3 | 24 | 14.517.11 | 2 | ... | ...(无变化) |
1324 | 2 | 4(阵列的止点) | ... | ... | ... | ... |
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US972554 | 1997-11-18 | ||
US08/972,554 US6047084A (en) | 1997-11-18 | 1997-11-18 | Method for determining accuracy of a circuit assembly process and machine employing the same |
US972,554 | 1997-11-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1219099A true CN1219099A (zh) | 1999-06-09 |
CN1115093C CN1115093C (zh) | 2003-07-16 |
Family
ID=25519804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN98122482A Expired - Fee Related CN1115093C (zh) | 1997-11-18 | 1998-11-17 | 确定电路组装操作精确度的方法以及使用此方法的机器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6047084A (zh) |
CN (1) | CN1115093C (zh) |
GB (1) | GB2331362A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1301402C (zh) * | 1999-09-14 | 2007-02-21 | 良瑞科技股份有限公司 | 检测印刷电路板上受检器件或受检对象位置的方法 |
CN104378926A (zh) * | 2013-08-12 | 2015-02-25 | 上海斐讯数据通信技术有限公司 | PoP芯片整合治具及其使用方法 |
CN112135511A (zh) * | 2020-09-28 | 2020-12-25 | 怀化建南机器厂有限公司 | 一种pcb板锡膏印刷品检方法、装置及系统 |
Families Citing this family (23)
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US6434264B1 (en) * | 1998-12-11 | 2002-08-13 | Lucent Technologies Inc. | Vision comparison inspection system |
US7181058B2 (en) * | 1999-12-13 | 2007-02-20 | Gsi Group, Inc. | Method and system for inspecting electronic components mounted on printed circuit boards |
JP3639516B2 (ja) * | 2000-09-28 | 2005-04-20 | 矢崎総業株式会社 | 端子金具の検査装置 |
US7813559B2 (en) * | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
US7555831B2 (en) | 2001-11-13 | 2009-07-07 | Cyberoptics Corporation | Method of validating component feeder exchanges |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
CH697278B1 (de) * | 2003-09-12 | 2008-07-31 | Oerlikon Assembly Equipment Ag | Einrichtung und Verfahren für die Montage oder Verdrahtung von Halbleiterchips. |
US7559134B2 (en) * | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
US7706595B2 (en) * | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
US20060016066A1 (en) * | 2004-07-21 | 2006-01-26 | Cyberoptics Corporation | Pick and place machine with improved inspection |
GB2417073A (en) * | 2004-08-13 | 2006-02-15 | Mv Res Ltd | A machine vision analysis system and method |
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
EP1701231A1 (en) * | 2005-03-08 | 2006-09-13 | Mydata Automation AB | Method of calibration |
US20070003126A1 (en) * | 2005-05-19 | 2007-01-04 | Case Steven K | Method and apparatus for evaluating a component pick action in an electronics assembly machine |
US8219940B2 (en) * | 2005-07-06 | 2012-07-10 | Semiconductor Insights Inc. | Method and apparatus for removing dummy features from a data structure |
US7545514B2 (en) * | 2005-09-14 | 2009-06-09 | Cyberoptics Corporation | Pick and place machine with improved component pick image processing |
US20070130755A1 (en) * | 2005-10-31 | 2007-06-14 | Duquette David W | Electronics assembly machine with embedded solder paste inspection |
US20070276867A1 (en) * | 2006-05-23 | 2007-11-29 | David Fishbaine | Embedded inspection image archival for electronics assembly machines |
US8256084B1 (en) | 2009-01-25 | 2012-09-04 | Your Dent Guy, Inc. | Metal stencil coin repair method |
JP2013214588A (ja) * | 2012-04-02 | 2013-10-17 | Panasonic Corp | 電子部品実装システム |
US10192300B2 (en) * | 2013-08-22 | 2019-01-29 | Fuji Corporation | Board production work method, board imaging conditions determination method, and board production work device |
CN113940152B (zh) * | 2019-06-21 | 2023-05-02 | 株式会社富士 | 容许值设定系统、基板检查机、容许值设定方法、基板检查方法 |
Family Cites Families (7)
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---|---|---|---|---|
DE3750285T2 (de) * | 1986-10-03 | 1995-03-30 | Omron Tateisi Electronics Co | Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe. |
US4866837A (en) * | 1987-12-03 | 1989-09-19 | Hughes Aircraft Company | Dual port alignment assembly station for attaching components to circuit boards |
IE882350L (en) * | 1988-07-29 | 1990-01-29 | Westinghouse Electric Systems | Image processing system for inspecting articles |
CA1285661C (en) * | 1988-08-19 | 1991-07-02 | Randy Tsang | Automatic visual measurement of surface mount device placement |
US5023916A (en) * | 1989-08-28 | 1991-06-11 | Hewlett-Packard Company | Method for inspecting the leads of electrical components on surface mount printed circuit boards |
JPH0833293B2 (ja) * | 1991-04-15 | 1996-03-29 | 松下電器産業株式会社 | 半田の形状検査方法 |
JP3355978B2 (ja) * | 1997-02-06 | 2002-12-09 | 松下電器産業株式会社 | ボンド塗布検査装置及びボンドの塗布検査方法 |
-
1997
- 1997-11-18 US US08/972,554 patent/US6047084A/en not_active Expired - Lifetime
-
1998
- 1998-11-16 GB GB9824911A patent/GB2331362A/en not_active Withdrawn
- 1998-11-17 CN CN98122482A patent/CN1115093C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1301402C (zh) * | 1999-09-14 | 2007-02-21 | 良瑞科技股份有限公司 | 检测印刷电路板上受检器件或受检对象位置的方法 |
CN104378926A (zh) * | 2013-08-12 | 2015-02-25 | 上海斐讯数据通信技术有限公司 | PoP芯片整合治具及其使用方法 |
CN104378926B (zh) * | 2013-08-12 | 2018-07-31 | 上海斐讯数据通信技术有限公司 | PoP芯片整合治具及其使用方法 |
CN112135511A (zh) * | 2020-09-28 | 2020-12-25 | 怀化建南机器厂有限公司 | 一种pcb板锡膏印刷品检方法、装置及系统 |
Also Published As
Publication number | Publication date |
---|---|
CN1115093C (zh) | 2003-07-16 |
GB9824911D0 (en) | 1999-01-06 |
US6047084A (en) | 2000-04-04 |
GB2331362A (en) | 1999-05-19 |
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