CN1211129C - 用于工件的运载和支承装置以及商业上用的消毒方法 - Google Patents

用于工件的运载和支承装置以及商业上用的消毒方法 Download PDF

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Publication number
CN1211129C
CN1211129C CN01814055.6A CN01814055A CN1211129C CN 1211129 C CN1211129 C CN 1211129C CN 01814055 A CN01814055 A CN 01814055A CN 1211129 C CN1211129 C CN 1211129C
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CN
China
Prior art keywords
plate
workpiece
delivery
plates
top board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN01814055.6A
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English (en)
Chinese (zh)
Other versions
CN1460027A (zh
Inventor
V·J·巴尔默
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Ion Beam Applications SA
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Ion Beam Applications SA
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Publication of CN1460027A publication Critical patent/CN1460027A/zh
Application granted granted Critical
Publication of CN1211129C publication Critical patent/CN1211129C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/08—Radiation
    • A61L2/087—Particle radiation, e.g. electron-beam, alpha or beta radiation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/08—Radiation
    • A61L2/081—Gamma radiation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/26—Accessories or devices or components used for biocidal treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

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  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Jigs For Machine Tools (AREA)
CN01814055.6A 2000-08-15 2001-08-14 用于工件的运载和支承装置以及商业上用的消毒方法 Expired - Fee Related CN1211129C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US22528700P 2000-08-15 2000-08-15
US60/225,287 2000-08-15
US09/826,978 US6475432B2 (en) 2000-08-15 2001-04-05 Carrier and support for work pieces
US09/826,978 2001-04-05

Publications (2)

Publication Number Publication Date
CN1460027A CN1460027A (zh) 2003-12-03
CN1211129C true CN1211129C (zh) 2005-07-20

Family

ID=26919475

Family Applications (1)

Application Number Title Priority Date Filing Date
CN01814055.6A Expired - Fee Related CN1211129C (zh) 2000-08-15 2001-08-14 用于工件的运载和支承装置以及商业上用的消毒方法

Country Status (8)

Country Link
US (1) US6475432B2 (enExample)
EP (1) EP1361900B1 (enExample)
CN (1) CN1211129C (enExample)
AT (1) ATE429253T1 (enExample)
AU (1) AU2001295006A1 (enExample)
DE (1) DE60138485D1 (enExample)
DK (1) DK1361900T3 (enExample)
WO (1) WO2002014163A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2847240B1 (fr) * 2002-11-15 2005-06-10 Bosch Gmbh Robert Element de rangement pour disque de frein et module comportant au moins un tel element.
WO2004097845A2 (en) * 2003-05-01 2004-11-11 Stirling Andrew J Improvements in shielded irradiation zone of production line
US20050077199A1 (en) * 2003-10-14 2005-04-14 Lori Ogaard Compact utility holder for drinking glasses, cups, mugs, utensils, condiment and cosmetic container
JP5632616B2 (ja) * 2010-01-26 2014-11-26 ラピスセミコンダクタ株式会社 半導体装置の製造方法及び基板収容構造
WO2011109348A2 (en) * 2010-03-03 2011-09-09 Veeco Instruments Inc. Wafer carrier with sloped edge
TWI486288B (zh) * 2011-05-06 2015-06-01 Hon Hai Prec Ind Co Ltd 承載裝置
JP6291981B2 (ja) 2013-04-08 2018-03-14 富士電機株式会社 半導体装置の製造方法
CN103170438B (zh) * 2013-04-11 2016-04-20 肇庆市宝利达机电设备有限公司 人造革漆皮淋漆生产线
FR3114081B1 (fr) 2020-09-11 2022-08-19 A Raymond Et Cie Plateau de livraison et systeme d’emballage d’elements medicaux
EP4296182A1 (en) * 2022-06-21 2023-12-27 SCHOTT Pharma Schweiz AG Frame for holding secondary pharmaceutical packaging
CN117839986B (zh) * 2023-12-28 2024-08-09 深圳市磐锋精密技术有限公司 一种基于视觉传感的组装工序检测系统及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4350578A (en) * 1981-05-11 1982-09-21 International Business Machines Corporation Cathode for etching
DE3342104C2 (de) * 1983-11-18 1986-10-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur Siedekühlung eines zwischen zwei Wärmeableitern eingespannten scheibenförmigen Halbleiterbauelements
US5191224A (en) * 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
US5821175A (en) * 1988-07-08 1998-10-13 Cauldron Limited Partnership Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface
SG52794A1 (en) * 1990-04-26 1998-09-28 Hitachi Ltd Semiconductor device and method for manufacturing same
US5174453A (en) * 1992-05-27 1992-12-29 Jill Stoeffler Tray system for surgical instruments
US5422067A (en) * 1992-09-15 1995-06-06 Barney; Everett A. Instrument cassette and method for using the same
US5844683A (en) * 1996-05-22 1998-12-01 Applied Materials, Inc. Position sensor system for substrate holders
JP3920399B2 (ja) * 1997-04-25 2007-05-30 株式会社東芝 マルチチップ半導体装置用チップの位置合わせ方法、およびマルチチップ半導体装置の製造方法・製造装置
US6152075A (en) * 1998-08-31 2000-11-28 Advanced Micro Devices, Inc. Method and system for heating semiconductor wafers

Also Published As

Publication number Publication date
DE60138485D1 (enExample) 2009-06-04
ATE429253T1 (de) 2009-05-15
US6475432B2 (en) 2002-11-05
EP1361900B1 (en) 2009-04-22
AU2001295006A1 (en) 2002-02-25
EP1361900A2 (en) 2003-11-19
WO2002014163A2 (en) 2002-02-21
EP1361900A4 (en) 2004-08-18
US20020021981A1 (en) 2002-02-21
DK1361900T3 (da) 2009-08-03
CN1460027A (zh) 2003-12-03
WO2002014163A3 (en) 2002-06-06

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050720

Termination date: 20170814

CF01 Termination of patent right due to non-payment of annual fee