CN120418891A - 电线 - Google Patents

电线

Info

Publication number
CN120418891A
CN120418891A CN202380089202.5A CN202380089202A CN120418891A CN 120418891 A CN120418891 A CN 120418891A CN 202380089202 A CN202380089202 A CN 202380089202A CN 120418891 A CN120418891 A CN 120418891A
Authority
CN
China
Prior art keywords
layer
electric wire
mass
less
core wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380089202.5A
Other languages
English (en)
Chinese (zh)
Inventor
池田智昭
小川光靖
粕谷浩二
星间昭人
松冈健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CN120418891A publication Critical patent/CN120418891A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
CN202380089202.5A 2023-02-10 2023-10-31 电线 Pending CN120418891A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-018992 2023-02-10
JP2023018992 2023-02-10
PCT/JP2023/039220 WO2024166459A1 (ja) 2023-02-10 2023-10-31 電線

Publications (1)

Publication Number Publication Date
CN120418891A true CN120418891A (zh) 2025-08-01

Family

ID=92262818

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380089202.5A Pending CN120418891A (zh) 2023-02-10 2023-10-31 电线

Country Status (4)

Country Link
JP (1) JPWO2024166459A1 (https=)
CN (1) CN120418891A (https=)
DE (1) DE112023005768T5 (https=)
WO (1) WO2024166459A1 (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011162301A1 (ja) * 2010-06-24 2011-12-29 株式会社フジクラ 自動車用電線
US11505856B2 (en) * 2018-08-07 2022-11-22 Sumitomo Electric Industries, Ltd. Copper-coated steel wire and stranded wire

Also Published As

Publication number Publication date
JPWO2024166459A1 (https=) 2024-08-15
DE112023005768T5 (de) 2025-11-20
WO2024166459A1 (ja) 2024-08-15

Similar Documents

Publication Publication Date Title
TWI521072B (zh) 電子暨電氣機器用銅合金、電子暨電氣機器用銅合金塑性加工材、電子暨電氣機器用零件以及端子
TWI878425B (zh) Cu-Ni-Si系銅合金板材及其製造方法和通電零件
CN104204268B (zh) 具有氧化铝阻挡层的铸造产品及其制造方法
TWI605559B (zh) Bonding wire for semiconductor device
JP7583813B2 (ja) 無方向性電磁鋼板およびその製造方法
CN101809177B (zh) 电气电子部件用铜合金板材
CN103069026B (zh) 铜合金板材及其制造方法
JP5400877B2 (ja) 銅合金板材およびその製造方法
WO2007138956A1 (ja) 高強度、高導電率および曲げ加工性に優れた銅合金
WO2004070075A1 (ja) めっき密着性に優れた合金化溶融亜鉛めっき鋼板およびその製造方法
WO2016135993A1 (ja) 半導体装置用ボンディングワイヤ
JP7614824B2 (ja) Ｃｕ－Ｎｉ－Ｓｉ系銅合金板材およびその製造方法並びに通電部品
KR20200075875A (ko) 구리 합금 판재 및 그 제조 방법 및 전기 전자기기용 방열 부품 및 실드 케이스
WO2011019042A1 (ja) 電気電子部品用銅合金材料
JP2007270266A (ja) Ｓｎめっき銅合金材料およびその製造方法
CN120418891A (zh) 电线
RU2524021C2 (ru) Холоднокатаный стальной лист, обладающий превосходной сгибаемостью и способ его производства
Rafieazad et al. Effects of laser-powder bed fusion process parameters on the microstructure and corrosion properties of AlSi10Mg alloy
JP5682278B2 (ja) 電子・電気機器用銅合金
JP2009084593A (ja) Ｃｕ−Ｃｒ−Ｓｉ系合金箔
JP2004002988A (ja) 曲げ加工性に優れたりん青銅条
JPWO2018211772A1 (ja) ワイヤ放電加工用電極線
CN120035685A (zh) 钛材、化学装置部件和化学装置
TWI918991B (zh) Ｃｕ-Ｔｉ系銅合金板材、其製造方法、通電零件及散熱零件
CN117677735A (zh) 半导体制造装置用铝构件及其制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination