CN120019459A - 电容器 - Google Patents

电容器 Download PDF

Info

Publication number
CN120019459A
CN120019459A CN202380074060.5A CN202380074060A CN120019459A CN 120019459 A CN120019459 A CN 120019459A CN 202380074060 A CN202380074060 A CN 202380074060A CN 120019459 A CN120019459 A CN 120019459A
Authority
CN
China
Prior art keywords
substrate
width
dielectric layer
cross
fibrous conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202380074060.5A
Other languages
English (en)
Chinese (zh)
Inventor
柳井创太
清水康弘
永田真己
白井畅明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN120019459A publication Critical patent/CN120019459A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/158—Carbon nanotubes
    • C01B32/168—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202380074060.5A 2022-11-01 2023-07-14 电容器 Withdrawn CN120019459A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-175699 2022-11-01
JP2022175699 2022-11-01
PCT/JP2023/026070 WO2024095536A1 (ja) 2022-11-01 2023-07-14 キャパシタ

Publications (1)

Publication Number Publication Date
CN120019459A true CN120019459A (zh) 2025-05-16

Family

ID=90930117

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380074060.5A Withdrawn CN120019459A (zh) 2022-11-01 2023-07-14 电容器

Country Status (4)

Country Link
US (1) US20250203891A1 (https=)
JP (1) JP7652330B2 (https=)
CN (1) CN120019459A (https=)
WO (1) WO2024095536A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007110899A1 (ja) 2006-03-24 2007-10-04 Fujitsu Limited 炭素系繊維のデバイス構造およびその製造方法
JP5091242B2 (ja) 2006-10-04 2012-12-05 エヌエックスピー ビー ヴィ Ｍｉｍキャパシタ
CN101826467B (zh) 2009-03-02 2012-01-25 清华大学 热界面材料的制备方法
WO2018173884A1 (ja) 2017-03-21 2018-09-27 日本電産リード株式会社 プローブ構造体、及びプローブ構造体の製造方法
JP7151907B2 (ja) 2019-09-25 2022-10-12 株式会社村田製作所 キャパシタおよびその製造方法
JP7459971B2 (ja) 2020-11-27 2024-04-02 株式会社村田製作所 キャパシタ

Also Published As

Publication number Publication date
US20250203891A1 (en) 2025-06-19
JP7652330B2 (ja) 2025-03-27
WO2024095536A1 (ja) 2024-05-10
JPWO2024095536A1 (https=) 2024-05-10

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20250516