CN119137229A - 膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 - Google Patents

膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 Download PDF

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Publication number
CN119137229A
CN119137229A CN202480002343.3A CN202480002343A CN119137229A CN 119137229 A CN119137229 A CN 119137229A CN 202480002343 A CN202480002343 A CN 202480002343A CN 119137229 A CN119137229 A CN 119137229A
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film
adhesive
semiconductor chip
component
mass
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Chinese (zh)
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黑田孝博
市川顺一
细野庆太
丹羽孝明
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Resonac Corp
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Resonac Corp
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1434—Memory
    • H01L2924/1435—Random access memory [RAM]
    • H01L2924/1438—Flash memory
    • H10W72/073—
    • H10W72/07338—
    • H10W72/354—
    • H10W72/884—
    • H10W90/24—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—

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CN202480002343.3A 2023-03-15 2024-03-14 膜状黏合剂、切割晶粒接合一体型膜、以及半导体装置及其制造方法 Pending CN119137229A (zh)

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