CN1184300A - Infrared light remote controller and its package method - Google Patents
Infrared light remote controller and its package method Download PDFInfo
- Publication number
- CN1184300A CN1184300A CN96120534A CN96120534A CN1184300A CN 1184300 A CN1184300 A CN 1184300A CN 96120534 A CN96120534 A CN 96120534A CN 96120534 A CN96120534 A CN 96120534A CN 1184300 A CN1184300 A CN 1184300A
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- substrate
- infrared light
- remote controller
- housing
- light remote
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Abstract
The present invention aims at provides one small, cheap and excellent IR remote controller and its packaging method. The IR remote controller is packaged through the processes of element positioning, soldering and adhesion, casing assembly, encapsulation, insertion, stoving and demoulding and consists of base board, casing and solidified colloid compound layer. The base board has soldered ICs, optoelectronic element and pins; the earthed casing on the base board has signal window; and the solidified colloid compound layer covers the surface of the base board and the casing.
Description
The invention belongs to infrared light control field, particularly a kind of infrared light remote controller and method for packing thereof.
But the isolating electromagnetic of commonly using disturb telepilot or as Fig. 4, shown in Figure 5, by the metal cap that mutually combines, crown cap and place forming in it to conduct electricity the printed circuit board (PCB) that raw material is bonded with integrated circuit (IC) chip, near-infrafed photodiodes, chip element and pin.Or United States Patent (USP) as shown in Figure 6 the 5350943rd, adopt the mode of amounting to encapsulation; Or as Fig. 7, SHARP company shown in Figure 8 with integrated circuit (IC) chip, near-infrafed photodiodes etc. with connection, solid welding, press seal, punching press separation and covering moulding.Or as Fig. 9, Sony Corporation shown in Figure 10 with integrated circuit (IC) chip, near-infrafed photodiodes etc. with connection, solid welding, encapsulating baking, assembling and covering moulding.Above-mentioned these products and manufacture method thereof or small product size is big, cost is high; Or manufacturing process complexity.
But the purpose of this invention is to provide that a kind of volume is little, cost is low, the good isolating electromagnetic of usability,, element pin function strong and the easy infrared light remote controller that changes of what and make the good infrared light remote controller method for packing of product usability that product manufacturing process is simple, cost is low, make at interval to the immunity of electronic musical instrument industry (EMI) noise.
Infrared light remote controller of the present invention is made up of substrate, housing and curing colloidal compound layer, and cementation has integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate; Housing is provided with signal window, and housing is arranged on the substrate, and makes its ground connection; Solidify the colloidal compound layer and solidify the surface that is coated on assembling all-in-one-piece substrate and housing in the mode of thermosetting.
The method for packing of infrared light remote controller of the present invention comprises the following steps: step 1
Location: integrated circuit (IC) chip (IC), photovalve and the plural branch connecting pin selected for use are positioned on the substrate;
Cementation: integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin are cemented on the substrate;
Assembling: housing is installed on the substrate, and makes frame ground;
Encapsulating: with the assembling after substrate and the corresponding plug-in type mould of hull shape in pour into colloidal compound;
Step 5
Insert: will assemble the insertion of all-in-one-piece substrate and housing and pour in the plug-in type mould of colloidal compound;
Step 6
Baking: baking pours into colloidal compound and inserts the plug-in type mould of assembling all-in-one-piece substrate and housing, makes the surface of colloidal compound thermosetting at assembling all-in-one-piece substrate and housing;
Step 7
From mould: treat that colloidal compound solidifies and the outside surface of assembling all-in-one-piece substrate and housing form solidify the colloidal compound layer after, the plug-in type mould is separated with it.
Because product of the present invention is made up of substrate, housing and curing colloidal compound layer, cementation has integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate; Housing is provided with signal window, and housing is arranged on the substrate, and makes its ground connection; Solidify the colloidal compound layer and solidify the surface that is coated on assembling all-in-one-piece substrate and housing in the mode of thermosetting.But make not only isolating electromagnetic of product, and make it have the immunity of better electronic musical instrument industry (EMI) noise; It cements in element pin function and easily what variation at interval on the substrate, and usability is good.
Method of the present invention comprises that element location, welding cementation, housing assembling, encapsulating, insertion, baking reach from mould.Make the product usability that product manufacturing process is simple, cost is low, make good.Thereby reach purpose of the present invention.
Fig. 1, be the process chart of the inventive method.
Fig. 2, be the embodiment of the invention one PBS Product Breakdown Structure signal and assembling process stereographic map.
Fig. 3, be the embodiment of the invention two PBS Product Breakdown Structures signals and assembling process stereographic map.
But Fig. 4, for the isolating electromagnetic commonly used disturb the telepilot process chart.
But Fig. 5, for the isolating electromagnetic commonly used disturb signal of telepilot decomposition texture and assembling process stereographic map.
Fig. 6, be United States Patent (USP) the 5350943rd assembly drawing.
Fig. 7, be SHARP company product manufacture process flow diagram.
Fig. 8, be SHARP company product assembly drawing.
Fig. 9, be Sony Corporation's product manufacture process flow diagram.
Figure 10, be Sony Corporation's product assembly drawing.
Below in conjunction with accompanying drawing the present invention is further elaborated.
As shown in Figure 2, infrared light remote controller of the present invention is made up of substrate 1, housing 2 and curing colloidal compound layer 3, cementation has integrated circuit (IC) chip (IC) 11, photovalve 12 and plural branch connecting pin 13 on the substrate 1, also can be as shown in Figure 3, also cementation has far red light diode 14, and photovalve 12 is a light-emittingdiode.Also can be photoelectric crystal; Housing 2 is provided with received signal window 21, also can be provided with on housing 2 and be respectively two signal windows 22,23 that transmit and receive as shown in Figure 3, and housing 2 is arranged on the substrate 1, and makes its ground connection; Solidify colloidal compound layer 3 and solidify the surface that is coated on assembling all-in-one-piece substrate 1 and housing 2 in the mode of thermosetting.
As shown in Figure 1 and Figure 2, the method for packing of infrared light remote controller of the present invention comprises the following steps:
Step 1
Location:, or mechanically be positioned on the substrate 1 with integrated circuit (IC) chip (IC) 11, photovalve 12 and the plural branch connecting pin 13 usefulness conductive materials selected for use mode with surface adhesion;
Cementation: integrated circuit (IC) chip (IC) 11, photovalve 12 and plural branch connecting pin 13 mode with bonding wire is cemented on the substrate 1;
Assembling: housing 2 is installed on the substrate 1, and makes housing 2 ground connection;
Encapsulating: with the assembling after substrate 1 and the corresponding plug-in type mould 4 of housing 2 shapes in pour into colloidal compound 30;
Step 5
Insert: will assemble all-in-one-piece substrate 1 and housing 2 insertions have poured in the plug-in type mould 4 of colloidal compound 30;
Step 6
Baking: baking pours into colloidal compound 30 and inserts the plug-in type mould 4 of assembling all-in-one-piece substrate 1 and housing 2, makes the surface of colloidal compound 30 thermosettings at assembling all-in-one-piece substrate 1 and housing 2;
Step 7
From mould: treat that colloidal compound 30 solidifies and the outside surface of assembling all-in-one-piece substrate and housing form solidify colloidal compound layer 3 after, plug-in type mould 4 is separated with it.
Claims (14)
1, a kind of infrared light remote controller is characterized in that it by substrate, housing and solidify the colloidal compound layer and form, and cementation has integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate; Housing is provided with more than one signal window, and housing is arranged on the substrate, and makes its ground connection; Solidify the colloidal compound layer and solidify the surface that is coated on assembling all-in-one-piece substrate and housing in the mode of thermosetting.
2, infrared light remote controller according to claim 1, it is characterized in that going back on the described substrate cementation has the far red light diode; Housing is provided with and is respectively two signal windows that transmit and receive.
3, infrared light remote controller according to claim 1 and 2 is characterized in that described photovalve is a light-emittingdiode.
4, infrared light remote controller according to claim 1 and 2 is characterized in that described photovalve is a photoelectric crystal.
5, infrared light remote controller according to claim 3 is characterized in that described light-emittingdiode and integrated circuit (IC) chip are combined into vision integrated circuit (IC) chip (OPIC).
6, infrared light remote controller according to claim 1 and 2 is characterized in that described substrate is a stent-type.
7, infrared light remote controller according to claim 1 and 2 is characterized in that described substrate is a frame-type.
8, infrared light remote controller according to claim 1 and 2 is characterized in that described substrate is a printed circuit board (PCB).
9, a kind of method for packing of infrared light remote controller is characterized in that it comprises the following steps:
Step 1
Location: integrated circuit (IC) chip (IC), photovalve and the plural branch connecting pin selected for use are positioned on the substrate;
Step 2
Cementation: integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin are cemented on the substrate;
Step 3
Assembling: housing is installed on the substrate, and makes frame ground;
Step 4
Encapsulating: with the assembling after substrate and the corresponding plug-in type mould of hull shape in pour into colloidal compound;
Step 5
Insert: will assemble the insertion of all-in-one-piece substrate and housing and pour in the plug-in type mould of colloidal compound;
Step 6
Baking: baking pours into colloidal compound and inserts the plug-in type mould of assembling all-in-one-piece substrate and housing, makes the surface of colloidal compound thermosetting at assembling all-in-one-piece substrate and housing;
Step 7
From mould: treat that colloidal compound solidifies and the outside surface of assembling all-in-one-piece substrate and housing form solidify the colloidal compound layer after, the plug-in type mould is separated with it.
10, the method for packing of infrared light remote controller according to claim 9 is characterized in that described step 1 is positioned at integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate for the mode with surface adhesion.
11, the method for packing of infrared light remote controller according to claim 9 is characterized in that described step 1 is for mechanically being positioned at integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate.
12, the method for packing of infrared light remote controller according to claim 10 is characterized in that described step 1 can be positioned at integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate with conductive material.
13,, it is characterized in that described step 2 cements in integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate for the mode with bonding wire according to the method for packing of claim 9 or 10 described infrared light remote controllers.
14,, it is characterized in that described step 2 cements in integrated circuit (IC) chip (IC), photovalve and plural branch connecting pin on the substrate for the mode with bonding wire according to the method for packing of claim 9 or 11 described infrared light remote controllers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96120534A CN1184300A (en) | 1996-11-29 | 1996-11-29 | Infrared light remote controller and its package method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN96120534A CN1184300A (en) | 1996-11-29 | 1996-11-29 | Infrared light remote controller and its package method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1184300A true CN1184300A (en) | 1998-06-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96120534A Pending CN1184300A (en) | 1996-11-29 | 1996-11-29 | Infrared light remote controller and its package method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1184300A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192260A (en) * | 2013-03-28 | 2013-07-10 | 格兰达技术（深圳）有限公司 | Automatic assembling machine and method of air conditioner remote controller |
-
1996
- 1996-11-29 CN CN96120534A patent/CN1184300A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192260A (en) * | 2013-03-28 | 2013-07-10 | 格兰达技术（深圳）有限公司 | Automatic assembling machine and method of air conditioner remote controller |
| CN103192260B (en) * | 2013-03-28 | 2015-04-08 | 格兰达技术（深圳）有限公司 | Automatic assembling machine and method of air conditioner remote controller |
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| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |