CN1183210C - Medium size - Google Patents
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- CN1183210C CN1183210C CNB021146411A CN02114641A CN1183210C CN 1183210 C CN1183210 C CN 1183210C CN B021146411 A CNB021146411 A CN B021146411A CN 02114641 A CN02114641 A CN 02114641A CN 1183210 C CN1183210 C CN 1183210C
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Abstract
The present invention discloses medium slurry which can be used for manufacturing plasma display panels (PDP). The known medium slurry is prepared from 20 to 40 portions by weight of organic binding agent, not less than 35 portions by weight of low melting point glass powder and not more than 35 portions by weight of high melting point filler powder, wherein the surface coefficients of the low melting point glass powder and the high melting point filler powder are correspondingly from 6000cm<2>/g to 1000cm<2>/g and 6000cm<2>/g to 1200cm<2>/g; at this time, the maximum quantity of the low melting point glass powder is 45 portions by weight, and the minimum quantity of the high melting point filler powder is 25 portions by weight. A high melting point filler is magnesia powder or aluminia-corundum powder or bauxite; an organic binding agent is (2.5 to 5)% of terpineol solution of ethyl cellulose with or without (2.5 to 5)% of terpineol solution of ethyl cellulose of (15 to 30)% dibutyl phthalate. The medium slurry prepared accordingly to the present invention can form a medium covering layer with high quality on an electrode of PDP.
Description
One, affiliated field
The invention belongs to the geseous discharge technical field, can be used for making gas panel (PDP).
Two, background technology
According to the literature retrieval that the applicant carried out, the prior art data relevant or approaching with present patent application comprises following several pieces:
1. known French Patent patent application N 2492394 C09D 11,/00 1982, a kind of dielectric paste is disclosed, form by glass powder and organic binder bond, when forming the structural unit of gas panel (PDP) with this dielectric paste since when thermal treatment the strong contraction of dielectric paste and free-running property and can not guarantee the stability of shape.
2. known dielectric paste is formed (Soviet Union certificate of invention N 1,554 294 C03C 8,/22 1989) by low melting glass, glass crystallization cement and organic binder bond.The shortcoming of this dielectric paste is to make the dielectric passivation of PDP separating element above can not being used to form.Because in the process that medium layer melts, the crystallization of glass crystallization cement takes place in the medium layer, make the medium layer surface form " bulge ", cause that being coated in the slurry that is used to form the separation barrier on the medium layer scatters.
3. the most approaching slurry of the slurry that proposes with the present invention contains the high-melting-point filler powder (Russ P N 202580 HOIB 3/08 1994-prototype) of the organic binder bond of 20-40 weight unit, the glass powder with low melting point that is no less than 35 weight unit and no more than 35 weight unit.The shortcoming of this slurry is, after the dielectric passivation fusing that forms with this slurry, unfairness occurs on its surface, and this makes not only tectum itself, and makes that the quality of formed structural unit degenerates greatly on dielectric passivation.
Three, summary of the invention
At defective or the deficiency that above-mentioned prior art exists, the purpose of this invention is to provide a kind of because the homogeneity of dielectric paste and can form the dielectric paste of high-quality dielectric passivation when improving sintering.
To achieve these goals, the technical solution used in the present invention is, in the known media slurry of the high-melting-point filler powder of the glass powder with low melting point of the organic binder bond that contains the 20-40 weight unit, 35-45 weight unit and 25-35 weight unit, its glass powder with low melting point should be 6000cm mutually with the surface coefficient of high-melting-point filler powder
2/ g-10000cm
2/ g and 6000cm
2/ g-12000cm
2/ g.At this moment the maximum quantity of glass powder with low melting point is 45 weight unit, and the minimum quantity of high-melting-point filler powder is 25 weight unit.
Other characteristics of the present invention are that described high-melting-point filler is magnesium oxide or alumina or aluminum oxide-corundum.Described organic binder bond is the ethyl cellulose terpinol solution of (2.5-5) % or the DBP that adds (15-30) % in this solution.
Dielectric paste of the present invention can form high-quality dielectric passivation, because can guarantee the homogeneity of the moiety of dielectric paste when this dielectric paste of sintering.
Four, embodiment
The present invention is described in further detail below in conjunction with embodiment.
According to technical scheme of the present invention, contain the dielectric paste (weight unit) of the mixture of following composition:
Glass powder with low melting point, surface coefficient are (6000-10000) cm
2/ g 35-45
High-melting-point filler, surface coefficient are (6000-12000) cm
2/ g 25-35
Organic binder bond 20-40
The dielectric paste that obtains after the mixing can form dielectric passivation continuously on thick membrane electrode.
The applicant proves through repeatedly testing: if the surface coefficient of glass powder with low melting point and high-melting-point filler powder is less than 6000cm
2/ g, then tectum fusing back forms " bulge " on its surface.When forming structural unit on such tectum, the locality of meeting generation dielectric paste is wandering in the bulge.
If use surface coefficient respectively greater than 10000cm
2/ g and 12000cm
2When the glass powder with low melting point of/g and high-melting-point filler powder, the rheological property of dielectric paste will degenerate widely.Consequently can not apply out the uniform dielectric passivation of successive.
The maximum quantity of glass powder with low melting point is 45 weight unit in dielectric paste, and the minimum quantity of high-melting-point filler powder is 25 weight unit.
If the quantity of glass powder with low melting point is greater than 45 weight unit, and the quantity of high-melting-point filler powder is less than 25 weight unit, then the thickness of the dielectric passivation of Xing Chenging will have the big deviation that can not allow.
In order to obtain uniform dielectric paste, the ethyl cellulose terpinol solution of (2.5-5) % of the ethyl cellulose terpinol solution of use (2.5-5) % or the DBP of interpolation (15-30) % suits as organic binder bond when applying.
If the quantity of ethyl cellulose is less than 2.5% in the organic binder bond, layering will take place in dielectric paste, and this can not guarantee that high-quality slurry applies.The quantity of ethyl cellulose is greater than 5%, and slurry just becomes very " sticking ", causes slurry to apply difficulty, this make for obtain the measured trace of matter must be when the printing with the gap between big scraper pressure and big " stencil-bed-plate ".The stretching fast of stencil can be taken place like this.
The DBP that adds (15-30) % in organic binder bond makes and relatively easily obtain uniform dielectric passivation in the process that forms dielectric passivation.
The contriver has provided following embodiment, but the invention is not restricted to these embodiment.
Embodiment 1: forming thickness on the glass plate of 500 * 500mm size is 15 μ m-18 μ m, width 0.17mm-0.1gmm, pitch be 0.35mm be the thick membrane electrode of main component with silver.Must prepare dielectric paste for forming the electrode tectum.Get 45 weight unit, surface coefficient is 6000cm
2The glass powder with low melting point of/g and 25 weight unit, surface coefficient are 12000cm
2The high-melting-point filler powder of/g mixes, and the high-melting-point filler uses magnesia powder.And add the organic binder bond of 30 weight unit.Use 2.5% the ethyl cellulose terpinol solution wherein add 15% DBP as organic binder bond.On the flat board of doing electrode,, by the stencil coating thickness coating of 18 μ m-24 μ m then with ready dielectric paste for constituting the thick dielectric passivation of 15 μ m-20 μ m.
Be under 570 ℃ dielectric paste to be handled 30 minutes in temperature then, measure the coat-thickness of different positions.Forming width then in interelectrode gap is 0.1mm-0.11mm, and pitch is the isolated location of 0.35mm.
Embodiment 2: forming thickness on the glass plate of 500 * 500mm size is 15 μ m-18 μ m, width 0.17mm-0.18mm, pitch be 0.35mm be the thick membrane electrode of main component with silver.Must prepare dielectric paste for forming the electrode tectum.Get 40 weight unit, surface coefficient is 10000cm
2The glass powder with low melting point of/g and 30 weight unit, surface coefficient are 6000cm
2The high-melting-point filler powder of/g mixes.The high-melting-point filler uses aluminum oxide-lapis amiridis.Add the organic binder bond of 30 weight unit.Use 3.5% the ethyl cellulose terpinol solution wherein add 25% DBP as organic binder bond.On the flat board of doing electrode,, by the stencil coating thickness coating of 18 μ m-24 μ m then with ready dielectric paste for constituting the thick dielectric passivation of 15 μ m-20 μ m.
Be under 570 ℃ dielectric paste to be handled 30 minutes in temperature then, measure the coat-thickness of different positions.Forming width then in interelectrode gap is 0.1mm-0.11mm, and pitch is the isolated location of 0.35mm.
Embodiment 3: forming thickness on the glass plate of 500 * 500mm size is 15 μ m-18 μ m, width 0.17mm-0.18mm, pitch be 0.35mm be the thick membrane electrode of main component with silver.Must prepare dielectric paste for forming the electrode tectum.Get 35 weight unit, surface coefficient is 8000cm
2The glass powder with low melting point of/g and 35 weight unit, surface coefficient are 9000cm
2The high-melting-point filler powder of/g mixes, and adds the organic binder bond of 30 weight unit.The high-melting-point filler uses alumina.The ethyl cellulose terpinol solution of use 5% is as organic binder bond.On the flat board of doing electrode,, by the stencil coating thickness coating of 18 μ m-24 μ m then with ready dielectric paste for constituting the thick dielectric passivation of 15 μ m-20 μ m.
Be under 570 ℃ dielectric paste to be handled 30 minutes in temperature then, and measure the coat-thickness of different positions.Forming width then in interelectrode gap is 0.1mm-0.11mm, and pitch is the isolated location of 0.35mm.
Embodiment 4: forming thickness on the glass plate of 500 * 500mm size is 15 μ m-18 μ m, width 0.17mm-0.18mm, pitch be 0.35mm be the thick membrane electrode of main component with silver.Must prepare dielectric paste for forming the electrode tectum.Get 45 weight unit, surface coefficient is 7000cm
2The glass powder with low melting point of/g and 25 weight unit, surface coefficient are 11000cm
2The high-melting-point filler powder of/g mixes, and the high-melting-point filler uses magnesium oxide.And add the organic binder bond of 30 weight unit.Use 4.5% the ethyl cellulose terpinol solution wherein add 20% DBP as organic binder bond.On the flat board of doing electrode,, by the stencil coating thickness coating of 18 μ m-24 μ m then with ready dielectric paste for constituting the thick dielectric passivation of 15 μ m-20 μ m.
Be under 570 ℃ dielectric paste to be handled 30 minutes in temperature then, and measure the coat-thickness of different positions.Forming width then in interelectrode gap is 0.1mm-0.11mm, and pitch is the isolated location of 0.35mm.
Embodiment 5: forming thickness on the glass plate of 500 * 500mm size is 15 μ m-18 μ m, width 0.17mm-0.18mm, pitch be 0.35mm be the thick membrane electrode of main component with silver.Must prepare dielectric paste for forming the electrode tectum.Get 35 weight unit, surface coefficient is 9000cm
2The glass powder with low melting point of/g and 35 weight unit, surface coefficient are 10000cm
2The high-melting-point filler powder of/g mixes, and the high-melting-point filler uses magnesia powder.And add the organic binder bond of 30 weight unit.The ethyl cellulose terpinol solution of use 4.0% is as organic binder bond.On the flat board of doing electrode,, by the stencil coating thickness coating of 18 μ m-24 μ m then with ready dielectric paste for constituting the thick dielectric passivation of 15 μ m-20 μ m.
Be under 570 ℃ dielectric paste to be handled 30 minutes in temperature then, and measure the coat-thickness of different positions.Forming width then in interelectrode gap is 0.1mm-0.11mm, and pitch is the isolated location of 0.35mm.
Above-mentioned according to the made dielectric paste of technical scheme of the present invention, the embodiment that forms dielectric passivation can enumerate a lot, here repeat no more, so long as by adjusting in the proportional range described in the technical solution of the present invention, no matter the result who is obtained is the thickness of dielectric passivation, still the width of formed isolated location all has minimum deviation on dielectric passivation.Experimental result shows, the dielectric paste of making according to the present invention make can be on the electrode of PDP the dielectric passivation of form height quality.
The applicant is to the state of the art analysis that the present invention carried out, and comprises to the retrieval of patent and scientific and technical information data and to the investigation of the similar product report of the invention that contains Yu applied for, also do not find at present to have with feature class of the present invention like like product.
In order to verify the present invention, the applicant has also carried out the additional retrieval to known solution, and result for retrieval shows that the present invention is not the result who draws from known state of the art for the expert who is engaged in this field significantly.Because do not find on thick membrane electrode and to obtain uniformly, and be to have the such technical scheme of powder of certain surface coefficient by in the composition of dielectric paste, using without any the medium layer of the particle of projection.
Claims (2)
1. a dielectric paste that is used to make gas panel is characterized in that, mixes by following formulation weight unit:
Glass powder with low melting point: surface coefficient is 6000cm
2/ g-10000cm
2/ g 35%-45%
The high-melting-point filler: surface coefficient is 6000cm
2/ g-12000cm
2/ g 25%-35%
The high-melting-point filler is magnesia powder or aluminum oxide-lapis amiridis or alumina;
Organic binder bond: 20%-40%
Above-mentioned organic binder bond is the ethyl cellulose terpinol solution of 2.5%-5%, the dielectric paste that obtains after the mixing.
2. the dielectric paste that is used to make gas panel as claimed in claim 1 is characterized in that, the ethyl cellulose terpinol solution of described 2.5%-5% also contains the DBP of 15%-30%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021146411A CN1183210C (en) | 2002-06-24 | 2002-06-24 | Medium size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021146411A CN1183210C (en) | 2002-06-24 | 2002-06-24 | Medium size |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1392205A CN1392205A (en) | 2003-01-22 |
| CN1183210C true CN1183210C (en) | 2005-01-05 |
Family
ID=4743211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021146411A Expired - Fee Related CN1183210C (en) | 2002-06-24 | 2002-06-24 | Medium size |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4487595B2 (en) * | 2004-02-27 | 2010-06-23 | Ｔｄｋ株式会社 | Method for manufacturing multilayer unit for multilayer ceramic electronic component |
| CN102604450A (en) * | 2012-02-17 | 2012-07-25 | 深圳顺络电子股份有限公司 | Laminated plate-type surface protective coating for electronic components and coating method thereof |
| CN106683748A (en) * | 2016-12-09 | 2017-05-17 | 东莞珂洛赫慕电子材料科技有限公司 | Environment-friendly low-temperature sintered high-heat-conduction dielectric paste and preparation method therefor |
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2002
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Owner name: SICHUAN SHIJI SHUANGHONG DISPLAY DEVICES CO., LTD Free format text: FORMER OWNER: IRICO GROUP ELECTRONICS CO., LTD. Effective date: 20070629 |
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Effective date of registration: 20070629 Address after: 621000, Zhou Yonghong, No. 35 Tung Hing East Road, hi tech Zone, Sichuan, Mianyang Patentee after: Sichuan Sterope Orion Display Co., Ltd. Address before: 712021 No. 1 Rainbow Road, Shaanxi, Xianyang Patentee before: IRICO Group Electronics Co., Ltd. |
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