CN1168792C - Medium size - Google Patents
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- CN1168792C CN1168792C CNB021146446A CN02114644A CN1168792C CN 1168792 C CN1168792 C CN 1168792C CN B021146446 A CNB021146446 A CN B021146446A CN 02114644 A CN02114644 A CN 02114644A CN 1168792 C CN1168792 C CN 1168792C
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Abstract
The present invention discloses medium slurry which can be used for manufacturing a plasma display panel (PDP). The medium slurry is prepared from 2 to 6 portions by weight of high-melting point filler powder and 94 to 98 portions by weight of organic binding agent, wherein the surface coefficient of the high-melting point filler is from 10000cm<2>/g to 30000cm<2>/g, and the high-melting point filler is the oxide of one of Mg, Yt, La, Th, Al, etc.; the organic binding agent is a mixture of 4% to 8% of terpineol solution of ethyl cellulose and butyl biphthalate at a certain proportion. When the medium slurry is used, a thin and transparent coating layer in an unfolded structure can be formed, and the coating layer is essential for the manufacture of PDP with an electron emitting layer but without the reduction of luminescence brightness of the PDP.
Description
One, affiliated field
The invention belongs to the geseous discharge technical field, a kind of specifically dielectric paste that is used to make gas panel (PDP).
Two, background technology
According to the literature retrieval that the applicant carried out, the prior art data relevant or approaching with present patent application comprises following several pieces:
1. known a kind of dielectric paste is formed (French Patent patent application N 2492394 C09D 11,/00 1982) by glass powder and organic binder bond.In the time of will making the bottom of emission layer with this slurry above being formed on, can not obtain to have the coating of unfolded structure.It is long consequently to observe the hysteresis timing statistics that produces discharge in PDP.
2. known a kind of dielectric paste is formed (Russ P N 2025803 HOIB 3/08 1994-prototype) by glass powder with low melting point, high-melting-point filler powder and organic binder bond.In the time of will constituting the bottom of emission layer with this slurry above being formed on, as last a kind of slurry, the electron emission layer that can not obtain having the unfolded structure.
3. the most approaching dielectric paste of the slurry that proposes with the present invention contains organic binding agent (A.C.439505C 08 11/04 1974-prototypes).The shortcoming of this slurry is the bottom that it can not form thin transparent emission layer.
Three, summary of the invention
According to defective that exists in the above-mentioned prior art or deficiency, task of the present invention provides a kind of dielectric paste that is used to make gas panel, and the composition of this dielectric paste can form thin, transparent and have the coating on height unfolded surface.
To achieve these goals, the present invention reaches by following technical measures.
In the dielectric paste that contains high-melting-point filler and organic binder bond, the content of the composition that is proposed following (weight unit):
High-melting-point filler-2%-6%
Organic binder bond-94%-98%
The specific surface area of above-mentioned high-melting-point filler is 10000cm
2/ g-30000cm
2/ g.
In dielectric paste, use ethyl cellulose terpinol solution (terpineol solution) and butyl phthalate as organic binder bond.Its prescription is (weight unit):
Ethyl cellulose 4%-8%
Terpinol 92%-96%
The prescription of organic binder bond is (weight unit):
Above-mentioned ethyl cellulose terpinol solution 93%-97%
Butyl phthalate 3%-7%
When the coated media slurry, the coating of using this organic binder bond can obtain uniformly, approach.
Use this dielectric paste can form thin, transparent and have the coating of unfolded structure.This coating is essential for manufacturing the plasma display that has electron emission layer and do not reduce its luminosity.When using this dielectric paste, best result be with the oxide compound of one of following material as the high-melting-point filler: obtain when magnesium, yttrium, lanthanum, thorium, aluminium.Because the existence of the oxide compound of these materials is arranged in dielectric paste, make to obtain such bottom, can form thereon and eliminate fissured electron emission layer.
Four, embodiment
For a more clear understanding of the present invention, the present invention is described in further detail below in conjunction with embodiment.
According to technical scheme of the present invention, dielectric paste is the synthetics (weight unit) that comprises following ingredients:
High-melting-point filler 2%-6%
Organic binder bond 94%-98%
Wherein the specific surface area of high-melting-point filler powder is 10000cm
2/ g-30000cm
2/ g, this slurry is feasible that can form continuously, approach, transparent, and has the dielectric coated on unfolded surface.
The applicant if the content of the high-melting-point filler in the slurry is less than 2% weight unit, will lose successive property through repeatedly experiment showed,, if more than 6 parts of weight unit, then coating will become opaque, and coating also can come off.
When the specific surface area of high-melting-point filler powder less than 10000cm
2/ g can form the surface of " uneven " when coutinuity of coating is bad; And work as specific surface area greater than 30000cm
2/ g, then the surface will have not " unfolded " structure, and this is equivalent to there is not bottom below electron emission layer.
Best result be with the oxide compound of one of following material as the high-melting-point filler: obtain when magnesium, yttrium, lanthanum, thorium, aluminium.Because the existence of the oxide compound of these materials is arranged in dielectric paste, make to obtain such bottom, can form thereon and eliminate fissured electron emission layer.
In slurry, use above-mentioned ethyl cellulose terpinol solution and butyl phthalate as organic binder bond, when its composition is following proportionlity (weight unit %), can obtain thin uniform coating:
The ethyl cellulose terpinol solution 93%-97% of 4%-8%
Butyl phthalate 3%-7%
Below be the embodiment that the contriver provides, but the invention is not restricted to these embodiment.
Embodiment 1: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 15000cm by specific surface area
2The yttrium oxide powder of/g and organic binder bond are formed.The quantity of yttrium oxide and organic binder bond should be 3.0 weight unit and 97 weight unit mutually.Organic binder bond comprises that the ethyl cellulose cellulose content is the ethyl cellulose terpinol solution and the butyl phthalate of 4% (weight unit), and quantity is pressed following relation (weight unit %):
4% ethyl cellulose terpinol solution-95%
Butyl phthalate-5%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Applied thickness is the magnesium oxide of 0.18 μ m-0.2 μ m then.
Embodiment 2: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 10000cm by specific surface area
2The yttrium oxide powder of/g and organic binder bond are formed.The quantity of yttrium oxide and organic binder bond should be 6.0 weight unit and 94 weight unit mutually.Organic binder bond comprises the ethyl cellulose terpinol solution and the butyl phthalate of ethyl cellulose cellulose content 6% (weight unit), and quantity is pressed following relation (weight unit %):
6% ethyl cellulose terpinol solution-93%
Butyl phthalate-7%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Be coated with then and apply the magnesium oxide that thickness is 0.18 μ m-0.2 μ m.
Embodiment 3: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 30000cm by specific surface area
2The magnesia powder of/g and organic binder bond are formed.The quantity of magnesium oxide and organic binder bond should be 4.0 weight unit and 96 weight unit mutually.Organic binder bond comprises solid content 8% ethyl cellulose terpinol solution and butyl phthalate, and quantity is pressed following relation (weight unit %):
8% ethyl cellulose terpinol solution-97%
Butyl phthalate-3%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Be coated with then and apply the magnesium oxide that thickness is 0.18 μ m-0.2 μ m.
Embodiment 4: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 20000cm by specific surface area
2The lanthanum trioxide powder of/g and organic binder bond are formed.The quantity of lanthanum trioxide and organic binder bond should be 5.0 weight unit and 95 weight unit mutually.Organic binder bond comprises the ethyl cellulose terpinol solution and the butyl phthalate of solids content 5% (weight unit), and quantity is pressed following relation (weight unit %):
5% ethyl cellulose terpinol solution-97%
Butyl phthalate-3%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Be coated with then and apply the magnesium oxide that thickness is 0.18 μ m-0.2 μ m.
Embodiment 5: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 20000cm by specific surface area
2The aluminum oxide powder of/g and organic binder bond are formed.The quantity of aluminum oxide and organic binder bond should be 6.0 weight unit and 94 weight unit mutually.Organic binder bond comprises that solids content is the ethyl cellulose terpinol solution and the butyl phthalate of 5% (weight unit), and quantity is pressed following relation (weight unit %):
5% ethyl cellulose terpinol solution-94%
Butyl phthalate-6%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Be coated with then and apply the magnesium oxide that thickness is 0.18 μ m-0.2 μ m.
Embodiment 6: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 15000cm by specific surface area
2The yttrium oxide powder of/g and organic binder bond are formed.The quantity of yttrium oxide and organic binder bond should be 6.0 weight unit and 94 weight unit mutually.Organic binder bond comprises that solids content is the ethyl cellulose terpinol solution and the butyl phthalate of 5% (weight unit), and quantity is pressed following relation (weight unit %):
5% ethyl cellulose terpinol solution-94%
Butyl phthalate-6%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Be coated with then and apply the magnesium oxide that thickness is 0.18 μ m-0.2 μ m.
Embodiment 7: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 15000cm by specific surface area
2The lanthanum trioxide powder of/g and organic binder bond are formed.The quantity of lanthanum trioxide and organic binder bond should be 4.0 weight unit and 96 weight unit mutually.Organic binder bond comprises that solids content is the ethyl cellulose terpinol solution and the butyl phthalate of 8% (weight unit), and quantity is pressed following relation (weight unit):
8% ethyl cellulose terpinol solution-97%
Butyl phthalate-3%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Be coated with then and apply the magnesium oxide that thickness is 0.18 μ m-0.2 μ m.
Embodiment 8: for being 7 μ m-8 μ m having formed thickness, width is that 0.07mm-0.08mm and pitch are the thick film gold electrode of 1mm, and apply electron emission layer being coated with on the electrode on the glass plate of 500 * 500mm of the medium layer of low melting glass continuously that thickness is 50 μ m-55 μ m, prepared slurry.The high-melting-point filler of slurry is 15000cm by specific surface area
2The Thorotrast powder of/g and organic binder bond are formed.The quantity of Thorotrast and organic binder bond should be 3.0 weight unit and 97 weight unit mutually.Organic binder bond comprises that solids content is the ethyl cellulose terpinol solution and the butyl phthalate of 6% (weight unit), and quantity is pressed following relation (weight unit %):
6% ethyl cellulose terpinol solution-95.5%
Butyl phthalate-4.5%
Applied continuously that thickness is the dielectric coated of 3 μ m-5 μ m, and under 450 ℃ of temperature, carried out sintering.The result has obtained having the Clear coating of height unfolded structure.Be coated with then and apply the magnesium oxide that thickness is 0.18 μ m-0.2 μ m.
After using the structure of making according to the described method of the foregoing description to be assembled into device, its geseous discharge is kept loss of voltage 30%, and the timing statistics that produces the hysteresis of discharge simultaneously reduces more than 10 times.
Above-mentioned embodiment according to the made dielectric paste formation dielectric passivation of technical scheme of the present invention can exemplify a lot, here repeat no more, so long as by using in the proportional range described in the technical solution of the present invention, its dielectric paste can obtain the continuous unfolded coating of transparent continuous, can form high-quality emission layer.
Claims (2)
1. a dielectric paste that is used to make gas panel contains high-melting-point filler powder and organic binder bond, it is characterized in that, the mentioned component that is contained is by following weight unit proportioning:
High-melting-point filler powder 2%-6%
Organic binder bond 94%-98%
Described high-melting-point filler powder adopts the oxide compound of magnesium or yttrium or lanthanum or thorium or aluminium, and its specific surface area is 10000cm
2/ g-30000cm
2/ g;
Described organic binder bond is that the terpinol solution and the butyl phthalate that contain the 4%-8% ethyl cellulose constitute.
2. according to the described dielectric paste that is used to make gas panel of claim 1, it is characterized in that the formulation weight unit of described terpinol solution and butyl phthalate is:
Terpinol solution 93%-97%
Butyl phthalate 3%-7%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021146446A CN1168792C (en) | 2002-06-24 | 2002-06-24 | Medium size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021146446A CN1168792C (en) | 2002-06-24 | 2002-06-24 | Medium size |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1392206A CN1392206A (en) | 2003-01-22 |
| CN1168792C true CN1168792C (en) | 2004-09-29 |
Family
ID=4743214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021146446A Expired - Fee Related CN1168792C (en) | 2002-06-24 | 2002-06-24 | Medium size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1168792C (en) |
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2002
- 2002-06-24 CN CNB021146446A patent/CN1168792C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1392206A (en) | 2003-01-22 |
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| ASS | Succession or assignment of patent right |
Owner name: IRICO GROUP ELECTRONICS CO., LTD. Free format text: FORMER OWNER: CAIHONG GROUP CO Effective date: 20041231 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20041231 Address after: 712021 No. 1 Rainbow Road, Shaanxi, Xianyang Patentee after: IRICO Group Electronics Co., Ltd. Address before: 100085, No. 11, information road, Haidian District, Beijing Patentee before: IRICO Group Corp. |
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| ASS | Succession or assignment of patent right |
Owner name: SICHUAN SHIJI SHUANGHONG DISPLAY DEVICES CO., LTD Free format text: FORMER OWNER: IRICO GROUP ELECTRONICS CO., LTD. Effective date: 20070629 |
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Effective date of registration: 20070629 Address after: 621000, Zhou Yonghong, No. 35 Tung Hing East Road, hi tech Zone, Sichuan, Mianyang Patentee after: Sichuan Sterope Orion Display Co., Ltd. Address before: 712021 No. 1 Rainbow Road, Shaanxi, Xianyang Patentee before: IRICO Group Electronics Co., Ltd. |
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