CN106683748A - Environment-friendly low-temperature sintered high-heat-conduction dielectric paste and preparation method therefor - Google Patents
Environment-friendly low-temperature sintered high-heat-conduction dielectric paste and preparation method therefor Download PDFInfo
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- CN106683748A CN106683748A CN201611128410.XA CN201611128410A CN106683748A CN 106683748 A CN106683748 A CN 106683748A CN 201611128410 A CN201611128410 A CN 201611128410A CN 106683748 A CN106683748 A CN 106683748A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/084—Glass or glass wool in binder
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C12/00—Powdered glass; Bead compositions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/087—Chemical composition of glass
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Abstract
The invention discloses environment-friendly low-temperature sintered high-heat-conduction dielectric paste and a preparation method therefor. The dielectric paste is prepared from the following materials based on weight percentages: 5-30% of low-melting-point glass powder, 10-60% of high-heat-conduction filler and 15-60% of organic binding phase; and the organic binding phase is prepared from the following materials based on weight percentages: 5-50% of resin, 10-90% of solvent and 0.8-21% of auxiliaries. The dielectric paste has the following advantages as follows: 1, no environmental pollution content and achieving a good environmental protection effect; 2, comprising low-melting-point glass powder and having low-temperature sintering characteristic; and 3, by virtue of the added high-heat-conduction filler, achieving a high heat conduction effect; the preparation method comprises the following technological steps of 1, preparing the low-melting-point glass powder; 2, preparing the organic binding phase; and 3, preparing the dielectric paste; and by adoption of the preparation method, the environment-friendly low-temperature sintered high-heat-conduction dielectric paste can be effectively produced and prepared.
Description
Technical field
The present invention relates to technical field of electronic materials, more particularly to a kind of Environment-friendlylow-temperature low-temperature sintering high heat conduction dielectric paste and
Its preparation method.
Background technology
Dielectric paste be manufacture thick film heating element basic material, be one kind by glass powder with low melting point, organic binder bond
And additive is through the paste of three-roll rolling mix homogeneously（Can association into appearance such as toothpaste, paint）.For dielectric paste
Speech, on the one hand it can be used as the transition zone of the substrate with electric heating function interlayer of heater element, to alleviate inter-laminar stress and improve electricity
The bond strength of hot cell and base material；On the other hand can be used as the encapsulating material of heat-generating disc, it is ensured that the insulation on heating surface
Property and improve its heating uniformity, heat transfer rate.
There is dielectric paste product miscellaneous in prior art；However, relevant cryogenic media slurry, especially resistance to height
The dielectric paste report of the high heat conduction characteristic of gentle heat pyrexia film is less.
The content of the invention
Present invention aims to the deficiencies in the prior art and a kind of Environment-friendlylow-temperature low-temperature sintering high heat conduction medium is provided
Slurry, the Environment-friendlylow-temperature low-temperature sintering high heat conduction dielectric paste has advantages below, specially：1st, dielectric paste all the components and work
Skill process non-environmental-pollution composition, i.e., with good environmental protection characteristic；2nd, glass powder with low melting point is contained in dielectric paste, its thawing
Temperature has low-temperature sintering characteristic less than 400 DEG C, the i.e. dielectric paste；3rd, high heat conduction filler is with the addition of in dielectric paste, i.e., should
There is good heat-conducting effect after dielectric paste sintering film forming, and PI films, aluminum can be widely used in as medium or packaging slurry
Plate, ceramics and mica heating disc.
Another object of the present invention is to the preparation method that a kind of Environment-friendlylow-temperature low-temperature sinters high heat conduction dielectric paste is provided, should
Preparation method can effectively be produced and prepare above-mentioned Environment-friendlylow-temperature low-temperature sintering high heat conduction dielectric paste.
To reach above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of Environment-friendlylow-temperature low-temperature sinters high heat conduction dielectric paste, includes the material of following weight portion, specially：
Glass powder with low melting point 5%-30%
High heat conduction filler 10%-60%
Organic adhesive phase 15%-60%；
Organic adhesive is made up of resin, solvent, auxiliary agent, in organic adhesive phase the weight portion of resin be 5%-50%, organic adhesive
The weight portion of solvent is 10%-90% in phase, and the weight portion of auxiliary agent is 0.8%-21% in organic adhesive phase.
Wherein, the glass powder with low melting point is formed by hopcalite high temperature melting, and hopcalite includes
There is Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, CuO, BaO, Bi in hopcalite2O3、V2O5、TeO2、B2O3、ZnO、
SnO2, the weight portion of eight kinds of materials is followed successively by CuO, BaO：1%-70%、1%-50%、1%-65%、1%-30%、0%-25%、0%-
35%、1%-30%、0%-25%。
Wherein, the particle size values of the glass powder with low melting point are less than 5 μm.
Wherein, the high heat conduction filler is inorganic oxide, nitride or carbide, and high heat conduction filler is included
Al2O3、MgO、ZnO、SiO2、AlN、BN、Si3N4Or SiC.
Wherein, the particle size values of the high heat conduction filler are less than 5 μm.
Wherein, the resin be ethyl cellulose, hydroxyethyl cellulose, polyvinylpyrrolidone, polyvinyl butyral resin,
A kind of or at least two mixture for being constituted in epoxy resin, polyester resin, phenolic resin, acrylic resin.
Wherein, the solvent is dibasic acid ester, terpineol, butyl carbitol, butyl carbitol acetate, makes phthalic acid
A kind of or at least two mixture for being constituted in dibutyl ester, tributyl citrate, diethylene glycol ether acetate alone.
Wherein, the auxiliary agent is mixed by dispersant, defoamer, levelling agent, thixotropic agent, is divided in the organic adhesive phase
Powder, defoamer, levelling agent, the weight portion of thixotropic agent are followed successively by 0.1%-5%, 0.1%-3%, 0.1%-5%, 0.5%-8%.
A kind of Environment-friendlylow-temperature low-temperature sinters the preparation method of high heat conduction dielectric paste, includes following processing step, specially：
1st, glass powder with low melting point is prepared：A, weighing Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, CuO, BaO and by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, CuO, BaO be put into and mixing be ground into grinder；B, be ground after by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, the compound that constituted of CuO, BaO load crucible, the crucible that then will be equipped with compound is placed in height
Heat treated is carried out in warm kiln, the heating-up temperature of high temperature kiln is more than 1000 DEG C, and temperature retention time is 0.5-5h, mixed in crucible
Close material and be fused into mixing liquid；C, by the mixing liquid rapid dumps for melting in corrosion resistant plate and rapidly cooling be pressed into it is thin
Piece, or the mixing liquid for melting is poured in normal-temperature water into quenching into glass dregs；D, thin slice or glass dregs are put into ball
Ball-milling treatment in grinding machine, Ball-milling Time is 1-10h, is then sieved to obtain glass powder with low melting point, Bi in glass powder with low melting point2O3、
V2O5、TeO2、B2O3、ZnO、SnO2, the weight portion of eight kinds of materials is followed successively by CuO, BaO：1%-70%、1%-50%、1%-65%、
1%-30%、0%-25%、0%-35%、1%-30%、0%-25%；
2nd, organic adhesive phase is prepared：Resin, auxiliary agent are added in solvent and heated and stirred is to being completely dissolved, to complete organic adhesive
Mutually prepare, resin, solvent, the weight portion of three kinds of materials of auxiliary agent are followed successively by organic adhesive phase：5%-50%、10%-90%、0.8%-
21%；
3rd, dielectric paste is prepared：Glass powder with low melting point, high heat conduction filler, organic adhesive phase are weighed, and by load weighted low melting point
Glass dust, high heat conduction filler are added into organic adhesive phase, and three-roll rolling is carried out after dispersed with stirring, to obtain dielectric paste, are situated between
The weight portion of three kinds of materials is followed successively by glass powder with low melting point, high heat conduction filler, organic adhesive phase in chylema material：5%-30%、
10%-60%, 15%-60%, high heat conduction filler is inorganic oxide, nitride or carbide, and high heat conduction filler includes Al2O3、
MgO、ZnO、SiO2、AlN、BN、Si3N4Or SiC.
Beneficial effects of the present invention are：A kind of Environment-friendlylow-temperature low-temperature of the present invention sinters high heat conduction dielectric paste, its bag
The material of following weight portion is included, specially：
Glass powder with low melting point 5%-30%
High heat conduction filler 10%-60%
Organic adhesive phase 15%-60%；
Organic adhesive is made up of resin, solvent, auxiliary agent, in organic adhesive phase the weight portion of resin be 5%-50%, organic adhesive
The weight portion of solvent is 10%-90% in phase, and the weight portion of auxiliary agent is 0.8%-21% in organic adhesive phase.Matched somebody with somebody by above-mentioned material
Than the Environment-friendlylow-temperature low-temperature sintering high heat conduction dielectric paste has advantages below, specially：1st, dielectric paste all the components and technique
Process non-environmental-pollution composition, i.e., with good environmental protection characteristic；2nd, glass powder with low melting point is contained in dielectric paste, it melts temperature
Degree has low-temperature sintering characteristic less than 400 DEG C, the i.e. dielectric paste；3rd, high heat conduction filler, i.e. Jie are with the addition of in dielectric paste
Chylema material sintering film forming after have good heat-conducting effect, and can as medium or packaging slurry be widely used in PI films, aluminium sheet,
Ceramics and mica heating disc.
The another of the present invention has the beneficial effect that：A kind of Environment-friendlylow-temperature low-temperature sintering high heat conduction dielectric paste of the present invention
Preparation method, it includes following processing step, specially：1st, glass powder with low melting point is prepared：A, weighing Bi2O3、V2O5、TeO2、
B2O3、ZnO、SnO2, CuO, BaO and by Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, CuO, BaO are put into into grinder carries out
Ground and mixed；B, be ground after by Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, the compound that constituted of CuO, BaO load earthenware
Crucible, the crucible that then will be equipped with compound is placed in high temperature kiln and carries out heat treated, and the heating-up temperature of high temperature kiln is more than
1000 DEG C, temperature retention time is 0.5-5h, and the compound in crucible is fused into mixing liquid；It is c, the mixing liquid for melting is quick
Corrosion resistant plate and rapidly cooling compacting flakiness are poured over, or pour in normal-temperature water the mixing liquid for melting into quenching into glass
Glass slag；D, thin slice or glass dregs are put into into ball mill ball-milling treatment, Ball-milling Time is 1-10h, then sieve to obtain
Glass powder with low melting point, Bi in glass powder with low melting point2O3、V2O5、TeO2、B2O3、ZnO、SnO2, in CuO, BaO eight kinds of materials weight
Part is followed successively by：1%-70%、1%-50%、1%-65%、1%-30%、0%-25%、0%-35%、1%-30%、0%-25%；2nd, prepare organic viscous
Knot phase：Resin, auxiliary agent are added in solvent and heated and stirred is to being completely dissolved, mutually prepared with completing organic adhesive, organic adhesive
Resin, solvent, the weight portion of three kinds of materials of auxiliary agent are followed successively by phase：5%-50%、10%-90%、0.8%-21%；3rd, medium slurry is prepared
Material：Glass powder with low melting point, high heat conduction filler, organic adhesive phase are weighed, and by load weighted glass powder with low melting point, high heat conduction filler
Add into organic adhesive phase, three-roll rolling is carried out after dispersed with stirring, to obtain dielectric paste, low-melting glass in dielectric paste
The weight portion of three kinds of materials is followed successively by powder, high heat conduction filler, organic adhesive phase：5%-30%, 10%-60%, 15%-60%, height is led
Hot filler is inorganic oxide, nitride or carbide, and high heat conduction filler includes Al2O3、MgO、ZnO、SiO2、AlN、BN、
Si3N4Or SiC.Designed by above-mentioned processing step, the preparation method can effectively be produced and prepare above-mentioned Environment-friendlylow-temperature low-temperature burning
Knot high heat conduction dielectric paste.
Specific embodiment
With reference to specific embodiment, the present invention will be described.
A kind of embodiment one, Environment-friendlylow-temperature low-temperature sinters high heat conduction dielectric paste, includes the material of following weight portion, specifically
For：
Glass powder with low melting point 10%
High heat conduction filler（AlN, particle diameter is 100nm） 45%
Organic adhesive phase 45%.
Wherein, the particle size values of glass powder with low melting point are less than 5 μm, and glass powder with low melting point carries out dispensing by following weight portion, tool
Body is：
Bi2O3 30%
V2O5 10%
TeO2 15%
B2O3 10%
ZnO 7%
SnO2 3%
CuO 10%
BaO 15%。
In addition, organic adhesive mutually includes resin, solvent, auxiliary agent；Wherein, resin is ethyl cellulose, and solvent is Oleum Pini
Alcohol, the dispersant employed in auxiliary agent is BYK-AT204, and the defoamer employed in auxiliary agent is BYK-066N, is adopted in auxiliary agent
Levelling agent is BYK-310, and the thixotropic agent employed in auxiliary agent is castor oil hydrogenated；Wherein, each material in organic adhesive phase
Weight portion be followed successively by：
Ethyl cellulose 8%
Terpineol 88%
BYK-AT204 1%
BYK-066N 0.8%
BYK-310 1%
Castor oil hydrogenated 1.2%.
By above-mentioned material proportion, the Environment-friendlylow-temperature low-temperature of the present embodiment one sintering high heat conduction dielectric paste has following excellent
Point, specially：1st, dielectric paste all the components and technical process non-environmental-pollution composition, i.e., with good environmental protection characteristic；2、
Contain glass powder with low melting point in dielectric paste, low its melt temperature is 380 DEG C, i.e. the dielectric paste has low-temperature sintering characteristic；
3rd, high heat conduction filler is with the addition of in dielectric paste, i.e., there is good heat-conducting effect after the dielectric paste sintering film forming, in conduct
During the encapsulating material of PI film base heating films, sintering can form strong bonded with PI films within 400 DEG C, improve the table of heating film
The uniformity of fever sensation of the face（The surface zones of different temperature difference is less than 10 DEG C）, and heat-transfer effect is good.
It should further be noted that for the Environment-friendlylow-temperature low-temperature of the present embodiment one sinters high heat conduction dielectric paste, it can be adopted
Following preparation method is prepared from, and specifically, a kind of Environment-friendlylow-temperature low-temperature sinters the preparation method of high heat conduction dielectric paste, and it includes
There is following processing step：
1st, glass powder with low melting point is prepared：A, weighing Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, CuO, BaO and by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, CuO, BaO be put into and mixing be ground into grinder；B, be ground after by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, the compound that constituted of CuO, BaO load crucible, the crucible that then will be equipped with compound is placed in height
Heat treated is carried out in warm kiln, the heating-up temperature of high temperature kiln is more than 1000 DEG C, and temperature retention time is 0.5-5h, mixed in crucible
Close material and be fused into mixing liquid；C, by the mixing liquid rapid dumps for melting in corrosion resistant plate and rapidly cooling be pressed into it is thin
Piece, or the mixing liquid for melting is poured in normal-temperature water into quenching into glass dregs；D, thin slice or glass dregs are put into ball
Ball-milling treatment in grinding machine, Ball-milling Time is 1-10h, is then sieved to obtain glass powder with low melting point, Bi in glass powder with low melting point2O3、
V2O5、TeO2、B2O3、ZnO、SnO2, the weight portion of eight kinds of materials is followed successively by CuO, BaO： 30%、10%、15%、10%、7%、3%、
10%、15%；
2nd, organic adhesive phase is prepared：Resin, auxiliary agent are added in solvent and heated and stirred is to being completely dissolved, to complete organic adhesive
Mutually prepare, resin is ethyl cellulose, and solvent is terpineol, the dispersant employed in auxiliary agent is BYK-AT204, institute in auxiliary agent
For BYK-066N, the levelling agent employed in auxiliary agent is BYK-310 to the defoamer for adopting, and the thixotropic agent employed in auxiliary agent is hydrogen
Change Oleum Ricini；Wherein, the weight portion of each material is followed successively by organic adhesive phase：
Ethyl cellulose 8%
Terpineol 88%
BYK-AT204 1%
BYK-066N 0.8%
BYK-310 1%
Castor oil hydrogenated 1.2%；
3rd, dielectric paste is prepared：Glass powder with low melting point, high heat conduction filler, organic adhesive phase are weighed, and by load weighted low melting point
Glass dust, high heat conduction filler are added into organic adhesive phase, and three-roll rolling is carried out after dispersed with stirring, to obtain dielectric paste, are situated between
The weight portion of three kinds of materials is followed successively by glass powder with low melting point, high heat conduction filler, organic adhesive phase in chylema material：10%、45%、
45%, wherein, high heat conduction filler is AlN.
Designed by above-mentioned processing step, the preparation method can effectively production prepare the present embodiment one environment-friendly type it is low
It is prepared by temperature sintering high heat conduction dielectric paste.
A kind of embodiment two, Environment-friendlylow-temperature low-temperature sinters high heat conduction dielectric paste, includes the material of following weight portion, specially：
Glass powder with low melting point 15%
High heat conduction filler（AlN, particle diameter is 1 μm） 40%
Organic adhesive phase 45%.
Wherein, the particle size values of glass powder with low melting point are less than 5 μm, and glass powder with low melting point carries out dispensing by following weight portion, tool
Body is：
Bi2O3 25%
V2O5 10%
TeO2 20%
B2O3 15%
ZnO 7%
SnO2 3%
CuO 10%
BaO 10%。
In addition, organic adhesive mutually includes resin, solvent, auxiliary agent；Wherein, resin is polyvinyl butyral resin, and solvent is
Terpineol, the dispersant employed in auxiliary agent is BYK-AT204, and the defoamer employed in auxiliary agent is BYK-066N, in auxiliary agent
For BYK-310, the thixotropic agent employed in auxiliary agent is castor oil hydrogenated to the levelling agent for being adopted；Wherein, it is each in organic adhesive phase
The weight portion of material is followed successively by：
Polyvinyl butyral resin 10%
Terpineol 86%
BYK-AT204 1.2%
BYK-066N 0.8%
BYK-310 0.8%
Castor oil hydrogenated 1.2%.
By above-mentioned material proportion, the Environment-friendlylow-temperature low-temperature of the present embodiment two sintering high heat conduction dielectric paste has following excellent
Point, specially：1st, dielectric paste all the components and technical process non-environmental-pollution composition, i.e., with good environmental protection characteristic；2、
Contain glass powder with low melting point in dielectric paste, low its melt temperature is 392 DEG C, i.e. the dielectric paste has low-temperature sintering characteristic；
3rd, high heat conduction filler is with the addition of in dielectric paste, i.e., there is good heat-conducting effect after the dielectric paste sintering film forming, in conduct
When the medium or encapsulating material of aluminium base heating film, sintering can form strong bonded, and heat-transfer effect with aluminium sheet within 400 DEG C
It is good.
It should further be noted that for the Environment-friendlylow-temperature low-temperature of the present embodiment two sinters high heat conduction dielectric paste, it can be adopted
Following preparation method is prepared from, and specifically, a kind of Environment-friendlylow-temperature low-temperature sinters the preparation method of high heat conduction dielectric paste, and it includes
There is following processing step：
1st, glass powder with low melting point is prepared：A, weighing Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, CuO, BaO and by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, CuO, BaO be put into and mixing be ground into grinder；B, be ground after by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, the compound that constituted of CuO, BaO load crucible, the crucible that then will be equipped with compound is placed in height
Heat treated is carried out in warm kiln, the heating-up temperature of high temperature kiln is more than 1000 DEG C, and temperature retention time is 0.5-5h, mixed in crucible
Close material and be fused into mixing liquid；C, by the mixing liquid rapid dumps for melting in corrosion resistant plate and rapidly cooling be pressed into it is thin
Piece, or the mixing liquid for melting is poured in normal-temperature water into quenching into glass dregs；D, thin slice or glass dregs are put into ball
Ball-milling treatment in grinding machine, Ball-milling Time is 1-10h, is then sieved to obtain glass powder with low melting point, Bi in glass powder with low melting point2O3、
V2O5、TeO2、B2O3、ZnO、SnO2, the weight portion of eight kinds of materials is followed successively by CuO, BaO： 25%、10%、20%、15%、7%、3%、
10%、10%；
2nd, organic adhesive phase is prepared：Resin, auxiliary agent are added in solvent and heated and stirred is to being completely dissolved, to complete organic adhesive
Mutually prepare, resin is polyvinyl butyral resin, and solvent is terpineol, the dispersant employed in auxiliary agent is BYK-AT204, auxiliary agent
Employed in defoamer be BYK-066N, the levelling agent employed in auxiliary agent be BYK-310, the thixotropic agent employed in auxiliary agent
For castor oil hydrogenated；Wherein, the weight portion of each material is followed successively by organic adhesive phase：
Polyvinyl butyral resin 10%
Terpineol 86%
BYK-AT204 1.2%
BYK-066N 0.8%
BYK-310 0.8%
Castor oil hydrogenated 1.2%；
3rd, dielectric paste is prepared：Glass powder with low melting point, high heat conduction filler, organic adhesive phase are weighed, and by load weighted low melting point
Glass dust, high heat conduction filler are added into organic adhesive phase, and three-roll rolling is carried out after dispersed with stirring, to obtain dielectric paste, are situated between
The weight portion of three kinds of materials is followed successively by glass powder with low melting point, high heat conduction filler, organic adhesive phase in chylema material：15%、40%、
45%, wherein, high heat conduction filler is AlN.
Designed by above-mentioned processing step, the preparation method can effectively production prepare the present embodiment two environment-friendly type it is low
It is prepared by temperature sintering high heat conduction dielectric paste.
A kind of embodiment three, Environment-friendlylow-temperature low-temperature sinters high heat conduction dielectric paste, includes the material of following weight portion, specially：
Glass powder with low melting point 20%
High heat conduction filler（AlN, particle diameter is 500nm） 40%
Organic adhesive phase 40%.
Wherein, the particle size values of glass powder with low melting point are less than 5 μm, and glass powder with low melting point carries out dispensing by following weight portion, tool
Body is：
Bi2O3 30%
V2O5 10%
TeO2 25%
B2O3 10%
ZnO 8%
SnO2 2%
CuO 8%
BaO 12%。
In addition, organic adhesive mutually includes resin, solvent, auxiliary agent；Wherein, resin is polyvinyl butyral resin, and solvent is
Terpineol, the dispersant employed in auxiliary agent is BYK-AT204, and the defoamer employed in auxiliary agent is BYK-066N, in auxiliary agent
For BYK-310, the thixotropic agent employed in auxiliary agent is castor oil hydrogenated to the levelling agent for being adopted；Wherein, it is each in organic adhesive phase
The weight portion of material is followed successively by：
Polyvinyl butyral resin 9%
Terpineol 87%
BYK-AT204 1.2%
BYK-066N 0.8%
BYK-310 0.8%
Castor oil hydrogenated 1.2%.
By above-mentioned material proportion, the Environment-friendlylow-temperature low-temperature of the present embodiment three sintering high heat conduction dielectric paste has following excellent
Point, specially：1st, dielectric paste all the components and technical process non-environmental-pollution composition, i.e., with good environmental protection characteristic；2、
Contain glass powder with low melting point in dielectric paste, its melt temperature has low-temperature sintering characteristic less than 385 DEG C, the i.e. dielectric paste；
3rd, high heat conduction filler is with the addition of in dielectric paste, i.e., there is good heat-conducting effect after the dielectric paste sintering film forming, in conduct
During the encapsulating material of PI film base heating films, sintering can form strong bonded with PI films within 400 DEG C, improve the table of heating film
The uniformity of fever sensation of the face（The surface zones of different temperature difference is less than 10 DEG C）, and heat-transfer effect is good.
It should further be noted that for the Environment-friendlylow-temperature low-temperature of the present embodiment three sinters high heat conduction dielectric paste, it can be adopted
Following preparation method is prepared from, and specifically, a kind of Environment-friendlylow-temperature low-temperature sinters the preparation method of high heat conduction dielectric paste, and it includes
There is following processing step：
1st, glass powder with low melting point is prepared：A, weighing Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, CuO, BaO and by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, CuO, BaO be put into and mixing be ground into grinder；B, be ground after by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, the compound that constituted of CuO, BaO load crucible, the crucible that then will be equipped with compound is placed in height
Heat treated is carried out in warm kiln, the heating-up temperature of high temperature kiln is more than 1000 DEG C, and temperature retention time is 0.5-5h, mixed in crucible
Close material and be fused into mixing liquid；C, by the mixing liquid rapid dumps for melting in corrosion resistant plate and rapidly cooling be pressed into it is thin
Piece, or the mixing liquid for melting is poured in normal-temperature water into quenching into glass dregs；D, thin slice or glass dregs are put into ball
Ball-milling treatment in grinding machine, Ball-milling Time is 1-10h, is then sieved to obtain glass powder with low melting point, Bi in glass powder with low melting point2O3、
V2O5、TeO2、B2O3、ZnO、SnO2, the weight portion of eight kinds of materials is followed successively by CuO, BaO： 30%、10%、25%、10%、8%、2%、
8%、12%；
2nd, organic adhesive phase is prepared：Resin, auxiliary agent are added in solvent and heated and stirred is to being completely dissolved, to complete organic adhesive
Mutually prepare, resin is polyvinyl butyral resin, and solvent is terpineol, the dispersant employed in auxiliary agent is BYK-AT204, auxiliary agent
Employed in defoamer be BYK-066N, the levelling agent employed in auxiliary agent be BYK-310, the thixotropic agent employed in auxiliary agent
For castor oil hydrogenated；Wherein, the weight portion of each material is followed successively by organic adhesive phase：
Polyvinyl butyral resin 9%
Terpineol 87%
BYK-AT204 1.2%
BYK-066N 0.8%
BYK-310 0.8%
Castor oil hydrogenated 1.2%；
3rd, dielectric paste is prepared：Glass powder with low melting point, high heat conduction filler, organic adhesive phase are weighed, and by load weighted low melting point
Glass dust, high heat conduction filler are added into organic adhesive phase, and three-roll rolling is carried out after dispersed with stirring, to obtain dielectric paste, are situated between
The weight portion of three kinds of materials is followed successively by glass powder with low melting point, high heat conduction filler, organic adhesive phase in chylema material：20%、40%、
40%, wherein, high heat conduction filler is AlN.
Designed by above-mentioned processing step, the preparation method can effectively production prepare the present embodiment three environment-friendly type it is low
It is prepared by temperature sintering high heat conduction dielectric paste.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's
Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention
Restriction.
Claims (9)
1. a kind of Environment-friendlylow-temperature low-temperature sinters high heat conduction dielectric paste, it is characterised in that include the material of following weight portion, specifically
For：
Glass powder with low melting point 5%-30%
High heat conduction filler 10%-60%
Organic adhesive phase 15%-60%；
Organic adhesive is made up of resin, solvent, auxiliary agent, in organic adhesive phase the weight portion of resin be 5%-50%, organic adhesive
The weight portion of solvent is 10%-90% in phase, and the weight portion of auxiliary agent is 0.8%-21% in organic adhesive phase.
2. a kind of Environment-friendlylow-temperature low-temperature according to claim 1 sinters high heat conduction dielectric paste, it is characterised in that：The eutectic
Point glass dust is formed by hopcalite high temperature melting, and hopcalite includes Bi2O3、V2O5、TeO2、B2O3、
ZnO、SnO2, CuO, BaO, Bi in hopcalite2O3、V2O5、TeO2、B2O3、ZnO、SnO2, eight kinds of materials in CuO, BaO
Weight portion be followed successively by：1%-70%、1%-50%、1%-65%、1%-30%、0%-25%、0%-35%、1%-30%、0%-25%.
3. a kind of Environment-friendlylow-temperature low-temperature according to claim 1 sinters high heat conduction dielectric paste, it is characterised in that：The eutectic
The particle size values of point glass dust are less than 5 μm.
4. a kind of Environment-friendlylow-temperature low-temperature according to claim 1 sinters high heat conduction dielectric paste, it is characterised in that：The height is led
Hot filler is inorganic oxide, nitride or carbide, and high heat conduction filler includes Al2O3、MgO、ZnO、SiO2、AlN、BN、
Si3N4Or SiC.
5. a kind of Environment-friendlylow-temperature low-temperature according to claim 1 or 4 sinters high heat conduction dielectric paste, it is characterised in that：Institute
The particle size values for stating high heat conduction filler are less than 5 μm.
6. a kind of Environment-friendlylow-temperature low-temperature according to claim 1 sinters high heat conduction dielectric paste, it is characterised in that：The resin
For ethyl cellulose, hydroxyethyl cellulose, polyvinylpyrrolidone, polyvinyl butyral resin, epoxy resin, polyester resin, phenol
A kind of or at least two mixture for being constituted in urea formaldehyde, acrylic resin.
7. a kind of Environment-friendlylow-temperature low-temperature according to claim 1 sinters high heat conduction dielectric paste, it is characterised in that：The solvent
For dibasic acid ester, terpineol, butyl carbitol, butyl carbitol acetate, make phthalic acid dibutyl ester, tributyl citrate,
A kind of or at least two mixture for being constituted in diethylene glycol ether acetate alone.
8. a kind of Environment-friendlylow-temperature low-temperature according to claim 1 sinters high heat conduction dielectric paste, it is characterised in that：The auxiliary agent
Mixed by dispersant, defoamer, levelling agent, thixotropic agent, dispersant in the organic adhesive phase, defoamer, levelling agent, touched
The weight portion for becoming agent is followed successively by 0.1%-5%, 0.1%-3%, 0.1%-5%, 0.5%-8%.
9. a kind of Environment-friendlylow-temperature low-temperature sinters the preparation method of high heat conduction dielectric paste, it is characterised in that include following technique step
Suddenly, specially：
1st, glass powder with low melting point is prepared：A, weighing Bi2O3、V2O5、TeO2、B2O3、ZnO、SnO2, CuO, BaO and by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, CuO, BaO be put into and mixing be ground into grinder；B, be ground after by Bi2O3、V2O5、
TeO2、B2O3、ZnO、SnO2, the compound that constituted of CuO, BaO load crucible, the crucible that then will be equipped with compound is placed in height
Heat treated is carried out in warm kiln, the heating-up temperature of high temperature kiln is more than 1000 DEG C, and temperature retention time is 0.5-5h, mixed in crucible
Close material and be fused into mixing liquid；C, by the mixing liquid rapid dumps for melting in corrosion resistant plate and rapidly cooling be pressed into it is thin
Piece, or the mixing liquid for melting is poured in normal-temperature water into quenching into glass dregs；D, thin slice or glass dregs are put into ball
Ball-milling treatment in grinding machine, Ball-milling Time is 1-10h, is then sieved to obtain glass powder with low melting point, Bi in glass powder with low melting point2O3、
V2O5、TeO2、B2O3、ZnO、SnO2, the weight portion of eight kinds of materials is followed successively by CuO, BaO：1%-70%、1%-50%、1%-65%、
1%-30%、0%-25%、0%-35%、1%-30%、0%-25%；
2nd, organic adhesive phase is prepared：Resin, auxiliary agent are added in solvent and heated and stirred is to being completely dissolved, to complete organic adhesive
Mutually prepare, resin, solvent, the weight portion of three kinds of materials of auxiliary agent are followed successively by organic adhesive phase：5%-50%、10%-90%、0.8%-
21%；
3rd, dielectric paste is prepared：Glass powder with low melting point, high heat conduction filler, organic adhesive phase are weighed, and by load weighted low melting point
Glass dust, high heat conduction filler are added into organic adhesive phase, and three-roll rolling is carried out after dispersed with stirring, to obtain dielectric paste, are situated between
The weight portion of three kinds of materials is followed successively by glass powder with low melting point, high heat conduction filler, organic adhesive phase in chylema material：5%-30%、
10%-60%, 15%-60%, high heat conduction filler is inorganic oxide, nitride or carbide, and high heat conduction filler includes Al2O3、
MgO、ZnO、SiO2、AlN、BN、Si3N4Or SiC.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113851255A (en) * | 2021-09-08 | 2021-12-28 | 常州精瓷仪器科技有限公司 | High-insulation easy-rheological thermocouple boron nitride-based filling material and filling method |
| CN114685102A (en) * | 2020-12-30 | 2022-07-01 | 辽宁省轻工科学研究院有限公司 | Low-temperature glass slurry and preparation method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1392205A (en) * | 2002-06-24 | 2003-01-22 | 彩虹集团公司 | Medium size |
| CN101740160A (en) * | 2009-11-20 | 2010-06-16 | 湖南利德电子浆料有限公司 | Dielectric paste for metal aluminum substrate thick film circuit and preparation method thereof |
| CN102529222A (en) * | 2010-12-15 | 2012-07-04 | 新高电子材料（中山）有限公司 | High-insulation metal-based copper-clad plate with low thermal resistance and preparation method thereof |
| CN102649896A (en) * | 2012-05-29 | 2012-08-29 | 邱璟 | Novel high heat conduction and heat dissipation coating and manufacturing method thereof |
| CN102795771A (en) * | 2012-07-04 | 2012-11-28 | 四川虹欧显示器件有限公司 | Plastic display screen post-medium slurry and preparation method thereof |
| CN104973785A (en) * | 2014-04-03 | 2015-10-14 | 博思株式会社 | Glass Frit Using Glass Powder With Low Melting Point And Crystalline Ceramic Filler With Low Expansion And Paste Comprising The Same |
| CN105315970A (en) * | 2015-11-16 | 2016-02-10 | 华中科技大学 | Thermal interface material for chip testing and preparation method of thermal interface material |
| CN105384339A (en) * | 2014-08-29 | 2016-03-09 | 日立化成株式会社 | Unleaded low-melting-point glass composition and glass material and element using the composition |
| CN105800942A (en) * | 2016-03-16 | 2016-07-27 | 西南科技大学 | Preparation method of tellurite glass powder for silicon solar battery positive electrode silver paste |
| CN105873248A (en) * | 2016-05-11 | 2016-08-17 | 东莞珂洛赫慕电子材料科技有限公司 | Low-temperature sintering paste for heating film and preparation method thereof |
-
2016
- 2016-12-09 CN CN201611128410.XA patent/CN106683748A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1392205A (en) * | 2002-06-24 | 2003-01-22 | 彩虹集团公司 | Medium size |
| CN101740160A (en) * | 2009-11-20 | 2010-06-16 | 湖南利德电子浆料有限公司 | Dielectric paste for metal aluminum substrate thick film circuit and preparation method thereof |
| CN102529222A (en) * | 2010-12-15 | 2012-07-04 | 新高电子材料（中山）有限公司 | High-insulation metal-based copper-clad plate with low thermal resistance and preparation method thereof |
| CN102649896A (en) * | 2012-05-29 | 2012-08-29 | 邱璟 | Novel high heat conduction and heat dissipation coating and manufacturing method thereof |
| CN102795771A (en) * | 2012-07-04 | 2012-11-28 | 四川虹欧显示器件有限公司 | Plastic display screen post-medium slurry and preparation method thereof |
| CN104973785A (en) * | 2014-04-03 | 2015-10-14 | 博思株式会社 | Glass Frit Using Glass Powder With Low Melting Point And Crystalline Ceramic Filler With Low Expansion And Paste Comprising The Same |
| CN105384339A (en) * | 2014-08-29 | 2016-03-09 | 日立化成株式会社 | Unleaded low-melting-point glass composition and glass material and element using the composition |
| CN105315970A (en) * | 2015-11-16 | 2016-02-10 | 华中科技大学 | Thermal interface material for chip testing and preparation method of thermal interface material |
| CN105800942A (en) * | 2016-03-16 | 2016-07-27 | 西南科技大学 | Preparation method of tellurite glass powder for silicon solar battery positive electrode silver paste |
| CN105873248A (en) * | 2016-05-11 | 2016-08-17 | 东莞珂洛赫慕电子材料科技有限公司 | Low-temperature sintering paste for heating film and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114685102A (en) * | 2020-12-30 | 2022-07-01 | 辽宁省轻工科学研究院有限公司 | Low-temperature glass slurry and preparation method thereof |
| CN114685102B (en) * | 2020-12-30 | 2023-02-03 | 辽宁省轻工科学研究院有限公司 | Low-temperature glass slurry and preparation method thereof |
| CN113851255A (en) * | 2021-09-08 | 2021-12-28 | 常州精瓷仪器科技有限公司 | High-insulation easy-rheological thermocouple boron nitride-based filling material and filling method |
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