CN118317530A - Printed circuit board and preparation method thereof - Google Patents

Abstract

The invention discloses a printed circuit board and a preparation method thereof, wherein the preparation method of the printed circuit board comprises the following steps: obtaining at least two components with different heights; determining the height of the basic lead frame based on the height of the component with the smallest height of the at least two components; determining the height of the laminated lead frame based on the height difference between the components; correspondingly preparing accommodating grooves on the basic lead frame, the laminated lead frame and the dielectric layer based on the size of each component; and correspondingly placing each component in the accommodating groove for lamination so as to prepare the printed circuit board. Through the mode, the invention can realize the light weight and the miniaturization of the printed circuit board.

Description

Printed circuit board and preparation method thereof

Technical Field

The invention is applied to the technical field of printed circuit boards, in particular to a printed circuit board and a preparation method thereof.

Background

PCB (Printed Circuit Board), also known as printed wiring boards or printed circuit boards, are important electronic components in a wide range of applications, as support for electronic components, and as carrier for the electrical connection of electronic components.

When components with different heights need to be buried into the printed circuit board at the same time, the components can be buried on different printed circuit sub-boards respectively, and then the communication between the printed circuit sub-boards is realized by crimping or other modes.

But are respectively embedded on different printed circuit boards, the process is complex, the cost is high, and the whole plate is unfavorable for lightening and miniaturization.

Disclosure of Invention

The invention provides a printed circuit board and a preparation method thereof, which are used for solving the problem that the embedding of components with different heights of the printed circuit board is unfavorable for the light weight and the miniaturization of the whole plate.

In order to solve the technical problems, the invention provides a preparation method of a printed circuit board, which comprises the following steps: obtaining at least two components with different heights; determining the height of the basic lead frame based on the height of the component with the smallest height of the at least two components; determining the height of the laminated lead frame based on the height difference between the components; correspondingly preparing accommodating grooves on the basic lead frame, the laminated lead frame and the dielectric layer based on the size of each component; and correspondingly placing each component in the accommodating groove for lamination so as to prepare the printed circuit board.

Wherein the step of determining the height of the stacked lead frame based on the height difference between the components includes: sequentially sequencing the heights of at least two components according to the height order to obtain a height sequence; performing difference on adjacent and unequal heights in the height sequence to obtain at least one height difference of at least two components; the height of the at least one stacked leadframe is correspondingly determined based on the at least one height difference.

Wherein the step of correspondingly determining the height of the at least one stacked lead frame based on the at least one height difference comprises: and taking the sum of the height differences and the first preset value as the height of the corresponding laminated lead frame.

Wherein the step of determining the height of the base lead frame based on the height of the smallest component among the at least two components comprises: and taking the sum of the height of the component with the smallest height and the first preset value as the height of the basic lead frame.

Wherein the first preset value is in the range of 30-200 microns.

Wherein, the step of correspondingly preparing the accommodating groove on the basic lead frame, the laminated lead frame and the dielectric layer based on the size of each component comprises the following steps: determining the position of the accommodating groove corresponding to each component based on the height of each component; and preparing the accommodating grooves corresponding to the positions of the accommodating grooves corresponding to the components based on the length and the width of the components.

Wherein, the step of correspondingly preparing the accommodating groove on the basic lead frame, the corresponding laminated lead frame and the corresponding dielectric layer based on the length and the width of each component comprises the following steps: determining the length of the corresponding accommodating groove based on the sum of the length of each component and the second preset value; determining the width of the corresponding accommodating groove based on the sum of the width of each component and the second preset value; preparing accommodating grooves at positions of the corresponding accommodating grooves of the components based on the length and the width of each accommodating groove; wherein the second preset value is in the range of 20-150 microns.

Wherein, correspondingly placing each component in the accommodating groove for pressing so as to prepare the printed circuit board, the method comprises the following steps: stacking the basic lead frame, the dielectric layer and the stacked lead frame, and correspondingly placing each component in the accommodating groove to obtain a plate to be pressed; respectively placing strippable pressing plates on two opposite sides of the plate to be pressed for pre-pressing to obtain a pre-pressed plate; removing the peelable pressing plates on two opposite sides of the pre-pressing plate piece; and respectively preparing outer-layer circuits on two opposite sides of the pre-pressed plate piece to prepare the printed circuit board.

Wherein, the step of preparing the outer layer circuit respectively at the opposite sides of the pre-pressing plate piece to prepare the printed circuit board comprises the following steps: sequentially placing a dielectric layer and a conductive layer on two opposite sides of the pre-pressing plate piece for pressing to obtain a pressing plate piece; drilling at least one side of the pressed plate until the corresponding components are exposed; and electroplating and etching the two opposite sides of the laminated plate in sequence to prepare an outer layer circuit and communicate the components and the outer layer circuit.

In order to solve the technical problems, the invention also provides a printed circuit board, which is prepared by the preparation method of any one of the printed circuit boards, comprising the following steps: at least two components of unequal heights; the circuit board main body comprises a basic lead frame, a laminated lead frame and a dielectric layer; at least two accommodating grooves are formed on the circuit board main body, and at least two components are correspondingly arranged in the accommodating grooves; wherein each accommodating groove is prepared based on the size of each component; wherein the height of the base lead frame is determined based on the height of the smallest component among the at least two components, and the height of the stacked lead frame is determined based on the height difference between the components.

In order to solve the technical problems, the preparation method of the printed circuit board provided by the invention obtains at least two components with different heights; determining the height of the basic lead frame based on the height of the component with the smallest height of the at least two components; determining the height of the laminated lead frame based on the height difference between the components; correspondingly preparing accommodating grooves on the basic lead frame, the laminated lead frame and the dielectric layer based on the size of each component; each component is correspondingly placed in the accommodating groove to be pressed to prepare the printed circuit board, so that the components with different heights can be embedded at one time, the processing efficiency is improved, and the cost is reduced; and the height of the printed circuit board is determined by only a single component with the largest height, and the heights of other components are overlapped with the component with the largest height, so that the vertical space of the plate is reused, the integral height of the embedded printed circuit board can be reduced, and the thinning and miniaturization of the printed circuit board are realized.

Drawings

FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention;

Fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention;

FIG. 3 is a schematic illustration of a height difference of an embodiment of a component;

FIG. 4 is a schematic diagram of an exploded construction of one embodiment of a receiving tank;

FIG. 5 is a schematic view of an embodiment of a laminated board;

Fig. 6 is a schematic structural diagram of an embodiment of a printed circuit board according to the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention.

Step S11: at least two components with different heights are obtained.

The types of components may include one or more of electronic devices such as a chip, a resistor, a capacitor, an inductor, a transistor, a field effect transistor, etc., and may be specifically set based on the preparation requirement of a printed circuit board, which is not limited herein.

The heights of different components may be different, and the embodiment aims at the plate embedding treatment of at least two components with different heights, so that the whole plate is light, thin and miniaturized.

Step S12: the height of the base lead frame is determined based on the height of the smallest component of the at least two components.

And selecting the component with the smallest height from all the components, and determining the height of the basic lead frame based on the height of the component with the smallest height.

The Lead Frame (LF) is a component or chip carrier in an integrated circuit, and is a key structural member for forming an electrical loop by electrically connecting a circuit leading-out end of the component or chip with a peripheral lead or a circuit by means of bonding materials (gold wires, aluminum wires, copper wires) or other modes, so as to protect the component or the chip and realize a bridge effect of connecting external wires.

The basic lead frame is used for accommodating the component with the smallest height and the part of other components, the height of which coincides with the component with the smallest height.

In a specific application scenario, when two components, namely an a component of 1 cm and a B component of 2 cm, exist, the a component with the smallest height is selected to determine the height of the basic lead frame so as to accommodate the height of the a component and the height of the overlapping part of the B component and the a component.

Step S13: the height of the stacked lead frame is determined based on the height difference between the components.

Since there are at least two components of unequal height in the printed circuit board, the height of the stacked lead frame is determined based on the height differences between the components.

The stacked lead frame is used for accommodating components other than the component with the smallest height, and the components exceed part of the height of the component with the smallest height.

The number of different level differences for each component determines the number of stacked lead frames.

In a specific application scenario, when two components, namely an a component of 1 cm and a B component of 2 cm, exist, the height of the stacked lead frame is determined based on the height difference between the a component and the B component of 1 cm, so as to accommodate the part of the B component exceeding the a component. In another specific application scenario, when three components, namely an a component of 1 cm, a B component of 2 cm and a C component of 2.5 cm, exist, the height of the first stacked lead frame is determined based on the height difference between the a component and the B component of 1 cm so as to accommodate the height of the C component and the part of the B component exceeding the a component, and then the height of the second stacked lead frame is determined based on the height difference between the B component and the C component of 0.5 cm so as to accommodate the part of the C component exceeding the B component.

Step S14: and correspondingly preparing accommodating grooves on the basic lead frame, the laminated lead frame and the dielectric layer based on the sizes of the components.

Because at least two components with different heights are required to be buried in the printed circuit board, the accommodating grooves are correspondingly prepared on the basic lead frame, the laminated lead frame and the dielectric layer based on the sizes of the components, so that the components with different heights can be correspondingly accommodated through the accommodating grooves.

The dielectric layer is used for bonding and fixing the basic lead frame and the laminated lead frame between the basic lead frame and the laminated lead frame after being pressed.

In a specific application scenario, when two components, namely an a component of 1 cm and a B component of 2 cm, exist, two grooves are formed in the base lead frame based on the sizes of the a component and the B component, and a groove is formed in the laminated lead frame and the dielectric layer based on the size of the B component. The accommodating grooves corresponding to the A components are formed independently based on grooves formed on the basic lead frame based on the sizes of the A components and are used for accommodating the A components. And grooves formed on the basic lead frame, the laminated lead frame and the dielectric layer based on the size of the B component jointly form accommodating grooves corresponding to the B component of the accommodating grooves, and the accommodating grooves are used for accommodating the B component.

In a specific application scenario, when three components, namely an A component of 1 cm, a B component of 2 cm and a C component of 2.5 cm exist, three grooves are formed in the basic lead frame based on the sizes of the A component, the B component and the C component; two grooves are formed in the first stacked lead frame and the dielectric layer based on the dimensions of the B component and the C component, and one groove is formed in the second stacked lead frame and the dielectric layer based on the dimensions of the C component. The accommodating grooves corresponding to the A components are formed independently based on grooves formed on the basic lead frame based on the sizes of the A components and are used for accommodating the A components. And grooves formed on the base lead frame, the first laminated lead frame and the dielectric layer based on the size of the B component jointly form accommodating grooves corresponding to the B component of the accommodating grooves, and the accommodating grooves are used for accommodating the B component. And grooves formed on the base lead frame, the first laminated lead frame, the second laminated lead frame and the dielectric layer based on the size of the C component jointly form accommodating grooves corresponding to the B component of the accommodating groove, and the accommodating grooves are used for accommodating the C component.

The accommodating groove is arranged to realize the one-time embedding of at least two components with different heights, the surface of the plate is flat, and the vertical space of the plate is reused by the preparation method, so that the overall height of the embedded printed circuit board can be reduced, and the light weight, the thinness and the miniaturization of the printed circuit board are realized.

Step S15: and correspondingly placing each component in the accommodating groove for lamination so as to prepare the printed circuit board.

Because the setting of holding tank prepares based on the size of each components and parts own, will each components and parts correspond to place in the holding tank and pressfitting, obtain the printed circuit board of surface smoothness.

The basic lead frame can accommodate the part height of all components overlapping with the component with the smallest height, and the laminated lead frame can accommodate the part height of other components higher than the component with the smallest height, so that the height of the printed circuit board is only determined by the component with the largest height, and the heights of other components overlap with the component with the largest height, thereby realizing the light weight and miniaturization of the printed circuit board.

Through the steps, the preparation method of the printed circuit board of the embodiment obtains at least two components with different heights; determining the height of the basic lead frame based on the height of the component with the smallest height of the at least two components; determining the height of the laminated lead frame based on the height difference between the components; correspondingly preparing accommodating grooves on the basic lead frame, the laminated lead frame and the dielectric layer based on the size of each component; each component is correspondingly placed in the accommodating groove to be pressed to prepare the printed circuit board, so that the components with different heights can be embedded at one time, the processing efficiency is improved, and the cost is reduced; and the height of the printed circuit board is determined by only a single component with the largest height, and the heights of other components are overlapped with the component with the largest height, so that the vertical space of the plate is reused, the integral height of the embedded printed circuit board can be reduced, and the thinning and miniaturization of the printed circuit board are realized.

Referring to fig. 2, fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention.

Step S21: at least two components with different heights are obtained.

The step is the same as the step S11 in the foregoing embodiment, please refer to the foregoing, and the description is omitted.

Step S22: and taking the sum of the height of the component with the smallest height and the first preset value as the height of the basic lead frame.

And selecting the component with the smallest height from all the components, and taking the sum of the height of the component with the smallest height and a first preset value as the height of the basic lead frame.

The first preset value is in a range of 30-200 micrometers, and specifically can be 30 micrometers, 42 micrometers, 53 micrometers, 59 micrometers, 65 micrometers, 78 micrometers, 82 micrometers, 95 micrometers, 100 micrometers, 110 micrometers, 123 micrometers, 134 micrometers, 150 micrometers, 160 micrometers, 172 micrometers, 186 micrometers, 195 micrometers, 200 micrometers or the like.

Assuming that the height of the basic lead frame is a and the height of the component with the smallest height is h, h+30μm.ltoreq.a.ltoreq.h+200μm.

The basic lead frame can be selected from one or more of BT/BT-like materials, copper-based materials, aluminum-based materials or ceramic-based materials.

Step S23: sequentially sequencing the heights of at least two components according to the height order to obtain a height sequence; performing difference on adjacent and unequal heights in the height sequence to obtain at least one height difference of at least two components; the height of the at least one stacked leadframe is correspondingly determined based on the at least one height difference.

Since there are at least two components of unequal height in the printed circuit board, the height of the stacked lead frame is determined based on the height differences between the components.

The stacked lead frame is used for accommodating components other than the component with the smallest height, and the components exceed part of the height of the component with the smallest height.

Specifically, the heights of at least two components are sequentially ordered according to the height order, so that a height sequence is obtained; and carrying out difference on adjacent and unequal heights in the height sequence to obtain at least one height difference of at least two components.

The number of different level differences between the components determines the number of stacked lead frames. Referring to fig. 3, fig. 3 is a schematic view illustrating a height difference of an embodiment of a device.

The component of the present embodiment includes a first component C1, a second component C2, and a third component C3. Wherein, the height H3 of the third component C3 is greater than the height H2 of the second component C2. The height H2 of the second component C2 is greater than the height H1 of the first component C1.

The heights of the first component C1, the second component C2 and the third component C3 are sequentially ordered according to the height order, and a height sequence H3, H2 and H1 is obtained.

The adjacent and unequal heights in the height sequence are subjected to difference, so that two height differences are obtained, namely, a first height difference s=H2-H2 and a second height difference c=H2-H1. When the height difference is determined, only the component heights adjacent to and not equal to the difference are made, and the component heights not adjacent to or equal to the difference are not calculated.

Since the present embodiment obtains two height differences in total, the heights of the two stacked lead frames are determined based on the two height differences.

Specifically, the sum of each height difference and the first preset value is taken as the height of the corresponding laminated lead frame.

The height j of the first stacked lead frame is determined by the sum of the first height difference s and a first preset value, and s+30μm.ltoreq.j.ltoreq.s+200μm, and the first stacked lead frame is used for accommodating the part of the third component C3 exceeding the second component C2. The height b of the second laminated lead frame is determined by the sum of the second height difference C and the first preset value, and c+30μm.ltoreq.b.ltoreq.c+200μm, and the second laminated lead frame is used for accommodating the part of the height of the second component C2 exceeding the first component C1. And the base lead frame is used for accommodating the first component C1, the part height of the second component C2 overlapped with the first component C1, and the part height of the third component C3 overlapped with the first component C1.

In other embodiments, when the printed circuit board includes other numbers or heights of components, the height difference and the height determination of the stacked lead frame are similar to those of the above embodiments, and will not be described again.

The material of the laminated lead frame comprises one or more of BT-like materials, copper base, aluminum base, ceramic base and the like.

Step S24: and determining the position of the accommodating groove corresponding to each component based on the height of each component.

Accommodating grooves for accommodating components are correspondingly prepared in the basic lead frame, the laminated lead frame and the dielectric layer. The dielectric layer is used to bond the base leadframe with the stacked leadframe, or a different stacked leadframe. The dielectric layer can be one or more of prepregs, phenolic resin adhesives, epoxy resin adhesives, polyimide adhesives and the like.

And determining the position of the accommodating groove corresponding to each component based on the height of each component, namely the positions of the basic lead frame, the laminated lead frame and the dielectric layer which are required to be occupied by each component.

In a specific application scenario, to prepare the accommodating groove for accommodating the third component C3, considering the height H3 of the third component C3, a groove needs to be formed on the base lead frame, the first stacked lead frame, the second stacked lead frame, and the two dielectric layers to prepare the accommodating groove for accommodating the third component C3.

In a specific application scenario, if the accommodating groove accommodating the first component C1 is to be prepared, only the base lead frame needs to be grooved to prepare the accommodating groove accommodating the first component C1 in consideration of the height H1 of the first component C1.

Step S25: and preparing the accommodating grooves corresponding to the positions of the accommodating grooves corresponding to the components based on the length and the width of the components.

After the positions of the accommodating grooves corresponding to the components are determined, the accommodating grooves are correspondingly prepared on the basic lead frame, the laminated lead frame and the dielectric layer corresponding to the components based on the length and the width of the components.

Wherein, the preparation of the accommodating groove can be performed by adopting the processes of mechanical depth control, laser ablation, water jet knife and the like, and the accommodating groove is not limited herein.

Specifically, determining the length of the corresponding accommodating groove based on the sum of the length of each component and a second preset value; determining the width of the corresponding accommodating groove based on the sum of the width of each component and the second preset value; and preparing the accommodating grooves at the positions of the accommodating grooves corresponding to the components based on the length and the width of each accommodating groove.

The second preset value is in the range of 20-150 microns. Specifically, it may be 20, 30, 40, 50, 60, 75, 85, 96, 103, 112, 125, 130, 145 or 150 microns, etc.

Referring to fig. 4, fig. 4 is a schematic diagram of an exploded structure of an embodiment of a receiving tank.

The positions of the first accommodating grooves 47 corresponding to the first component C1 including the base lead frame 41 can be determined based on the heights of the first component C1, the second component C2 and the third component C3; the second accommodating groove 48 corresponding to the second component C2 includes the base lead frame 41, the first dielectric layer 42, and the first stacked lead frame 43; the third accommodating groove 46 corresponding to the third component C3 includes a base lead frame 41, a first dielectric layer 42, a first stacked lead frame 43, a second dielectric layer 44, and a second stacked lead frame 45.

The length and width of the first accommodating groove 47 are obtained based on the corresponding addition of the second preset value to the length L1 and width W1 of the first component C1, that is, the size design of the first accommodating groove 47: the length of L1+20μm is less than or equal to L1+150μm, and the width of W1+20μm is less than or equal to W1+150μm. I.e. the base lead frame 41 is grooved based on the above dimensions, resulting in the first receiving groove 47.

The length and width of the second accommodating groove 48 are obtained based on the corresponding addition of the second preset value to the length L2 and width W2 of the second component C2, that is, the second accommodating groove 48 is sized: the length of L2+20μm is less than or equal to L2+150μm, and the width of W2+20μm is less than or equal to W2+150μm. Namely, the base lead frame 41, the first dielectric layer 42, and the first stacked lead frame 43 are grooved based on the above dimensions, to obtain the second accommodating groove 48.

The length and width of the third accommodating groove 46 are obtained based on the corresponding addition of the second preset value to the length L3 and width W3 of the third component C3, that is, the third accommodating groove 46 is sized: the length of L3+20μm is less than or equal to L3+150μm, and the width of W3+20μm is less than or equal to W3+150μm. Namely, the base lead frame 41, the first dielectric layer 42, the first stacked lead frame 43, the second dielectric layer 44, and the second stacked lead frame 45 are grooved based on the above dimensions, to obtain the third accommodating groove 46.

In other embodiments, when the printed circuit board includes other numbers or heights of components, the slot is similar to the above embodiments, and will not be described again.

According to the embodiment, through the arrangement of the first preset value and the second preset value, enough space is reserved, and the subsequent dielectric layer is convenient to glue between the component and the lead frame for bonding. And the arrangement of the space can also prevent the occurrence of stress collision between the component and the lead frame, and the structural stability is affected.

Step S26: stacking the basic lead frame, the dielectric layer and the stacked lead frame, and correspondingly placing each component in the accommodating groove to obtain a plate to be pressed; respectively placing strippable pressing plates on two opposite sides of the plate to be pressed for pre-pressing to obtain a pre-pressed plate; and removing the peelable press plates on the opposite sides of the pre-press plate member.

After preparing the accommodating grooves corresponding to the components, stacking the basic lead frame, the dielectric layer and the laminated lead frame, and correspondingly placing the components in the accommodating grooves to obtain the plate to be pressed. The dielectric layer is placed between the basic lead frame and the laminated lead frame and between different laminated lead frames so as to bond the basic lead frame and the laminated lead frame to form an integral plate.

After the plates are placed, respectively placing strippable pressing plates on two opposite sides of the plates to be pressed, and performing pre-pressing to obtain the pre-pressed plates. The strippable pressing plate can comprise a bearing plate which is arranged in a fitting way and a micro-mucous membrane/release film, and one side of the micro-mucous membrane/release film is close to the plate to be pressed. The strippable pressing plate is used for receiving the force applied by the pressing machine to realize the forced pressing of the plate to be pressed to obtain the pre-pressed plate.

The accommodating groove is formed based on the size of each component, and each component is correspondingly placed in the accommodating groove to be pre-pressed, so that the pre-pressed plate piece with a flat surface is obtained. The basic lead frame can accommodate the part height of all components overlapping with the components with the smallest height, and the laminated lead frame can accommodate the part height of other components higher than the components with the smallest height, so that the height of the pre-pressed plate is determined by only the component with the largest height, and the heights of other components overlap with the components with the largest height, thereby realizing the light weight and miniaturization of the printed circuit board.

Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of a pressing plate.

The pre-compression bonding sheet 500 of this embodiment includes a sheet body 520 and two layers of peelable pressure plates 510. The board body 520 is formed by stacking a base lead frame, a stacked lead frame and a dielectric layer, and the components are accommodated therein.

The two peelable pressure plates 510 are respectively adhered to opposite sides of the panel body 520. The peelable pressure plate 510 includes a release film 502 and a carrier plate 501 that are adhered to each other, and the release film 502 is disposed toward the panel body 520.

After lamination, the peelable pressure plates 510 on opposite sides of the pre-laminated sheet 500 are removed using the release film 502 arrangement.

The plates are pre-pressed, so that the positions between the plates and the components are determined, and the components are prevented from being subjected to rigid stress during subsequent pressing.

Step S27: and respectively preparing outer-layer circuits on two opposite sides of the lamination plate to prepare the printed circuit board.

And after the strippable pressing plates on the two opposite sides of the pre-pressed plate piece are removed, respectively preparing outer-layer circuits on the two opposite sides of the pressed plate piece to prepare the printed circuit board.

Specifically, dielectric layers and conductive layers are sequentially placed on two opposite sides of the pre-pressing plate to be pressed, and the pressed plate is obtained.

The pre-pressing plate can be turned over for 180 degrees for the times to prevent the components from falling, then the strippable pressing plate with the smallest height close to one side of the components is removed, the strippable pressing plate is correspondingly replaced and configured to be a medium layer and a conductive layer, and pre-pressing is performed; and turning the pre-pressed plate 180 degrees for several times, removing the strippable pressing plate with the smallest component far away from one side, and correspondingly replacing the strippable pressing plate with the dielectric layer and the conductive layer. And performing high-temperature lamination to enable the dielectric layer to fully flow and fill gaps among the plates, so as to obtain the laminated plate.

Drilling at least one side of the pressed plate until the corresponding components are exposed; electroplating and etching are sequentially carried out on two opposite sides of the laminated plate to prepare an outer layer circuit and communicate components and the outer layer circuit, so that the communication between the components and the outer layer circuit is realized, and the circuit function of the printed circuit board is realized.

In a specific application scenario, if the printed circuit board needs to be added, the step of laminating the dielectric layer and the conductive layer, drilling, electroplating and etching can be continuously performed on the basis of the plate until the layer number requirement is met.

Through the steps, the preparation method of the printed circuit board of the embodiment obtains at least two components with different heights; taking the sum of the height of the component with the smallest height and a first preset value as the height of the basic lead frame, and sequentially sequencing the heights of at least two components according to the height order to obtain a height sequence; performing difference on adjacent and unequal heights in the height sequence to obtain at least one height difference of at least two components; the method comprises the steps of correspondingly determining the height of at least one laminated lead frame based on at least one height difference, determining the position of a containing groove corresponding to each component based on the height of each component, correspondingly preparing the containing groove based on the length and the width of each component at the position of the containing groove corresponding to each component, laminating and placing a basic lead frame, a dielectric layer and the laminated lead frame, and correspondingly placing each component in the containing groove, so that the components with different heights can be buried at one time, the processing efficiency is improved, and the cost is reduced; and the height of the printed circuit board is determined by only a single component with the largest height, and the heights of other components are overlapped with the component with the largest height, so that the vertical space of the plate is reused, the integral height of the embedded printed circuit board can be reduced, and the thinning and miniaturization of the printed circuit board are realized.

Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of a printed circuit board according to the present invention.

The printed circuit board 600 of the present embodiment includes: at least two components 640 of unequal height and a circuit board body 670.

Wherein the circuit board body 670 includes a base lead frame 610, a stacked lead frame 620, and a dielectric layer 630; dielectric layer 630 is disposed between base leadframe 610 and stacked leadframe 620 and between different stacked leadframes 620.

At least two accommodating grooves (not labeled in the figure) are formed on the circuit board main body 670, the number of the accommodating grooves is the same as that of the components 640, and at least two components 640 are correspondingly arranged in the accommodating grooves; wherein each receiving groove is prepared based on the size of each component 640.

Wherein the height of the base lead frame 610 is determined based on the height of the smallest component 640 of the at least two components 640, and the height of the stacked lead frame 620 is determined based on the height difference between the components 640.

The printed circuit board 600 of this embodiment is prepared by the method for preparing a printed circuit board of any of the above embodiments.

Through the structure, the height of the printed circuit board is determined by only a single component with the largest height, and the heights of other components are overlapped with the component with the largest height, so that the vertical space of the plate is reused, the whole height of the embedded printed circuit board can be reduced, and the light weight and the miniaturization of the printed circuit board are realized.

In other embodiments, the circuit board body 670 further includes an outer layer of traces 660. The two outer-layer circuits 660 are respectively attached to two opposite sides of the circuit board main body 670. The circuit board main body 670 further has a via 650 formed therein, and the via 650 communicates with the outer circuit 660 and the corresponding component 640.

The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.

Claims (10)

1. The preparation method of the printed circuit board is characterized by comprising the following steps of:

obtaining at least two components with different heights;

Determining the height of the basic lead frame based on the height of the component with the smallest height of the at least two components;

determining the height of the laminated lead frame based on the height difference between the components;

correspondingly preparing accommodating grooves on the basic lead frame, the laminated lead frame and the dielectric layer based on the size of each component;

And correspondingly placing the components in the accommodating groove for lamination so as to prepare the printed circuit board.

2. The method of manufacturing a printed circuit board of claim 1, wherein the step of determining the height of the stacked lead frame based on the height difference between the components comprises:

sequentially sequencing the heights of the at least two components according to the height order to obtain a height sequence;

Performing difference on adjacent and unequal heights in the height sequence to obtain at least one height difference of the at least two components;

The height of at least one of the stacked lead frames is correspondingly determined based on at least one of the height differences.

3. The method of manufacturing a printed circuit board of claim 2, wherein the step of correspondingly determining the height of at least one of the stacked lead frames based on at least one of the height differences comprises:

and taking the sum of the height difference and the first preset value as the height of the corresponding laminated lead frame.

4. The method of manufacturing a printed circuit board according to claim 1, wherein the step of determining the height of the base lead frame based on the height of the smallest component among the at least two components comprises:

and taking the sum of the height of the component with the smallest height and the first preset value as the height of the basic lead frame.

5. The method for manufacturing a printed circuit board according to claim 3 or 4, wherein,

The first preset value ranges from 30 to 200 microns.

6. The method of manufacturing a printed circuit board according to claim 1, wherein the step of correspondingly manufacturing the accommodating groove on the base lead frame, the stacked lead frame, and the dielectric layer based on the size of each component comprises:

Determining the position of a containing groove corresponding to each component based on the height of each component;

and preparing the accommodating grooves correspondingly at the positions of the accommodating grooves corresponding to the components based on the length and the width of the components.

7. The method of manufacturing a printed circuit board according to claim 6, wherein the step of correspondingly manufacturing the accommodating groove on the base lead frame, the corresponding stacked lead frame, and the corresponding dielectric layer based on the length and the width of each component comprises:

determining the length of the corresponding accommodating groove based on the sum of the length of each component and a second preset value;

determining the width of the corresponding accommodating groove based on the sum of the width of each component and a second preset value;

preparing accommodating grooves at positions of the accommodating grooves corresponding to the components based on the length and the width of each accommodating groove;

wherein the second preset value is in the range of 20-150 microns.

8. The method of manufacturing a printed circuit board according to claim 1, wherein the step of placing each of the components in the accommodating groove correspondingly to perform lamination to manufacture the printed circuit board comprises:

placing the basic lead frame, the dielectric layer and the laminated lead frame in a laminated manner, and correspondingly placing each component in the accommodating groove to obtain a plate to be pressed;

Respectively placing strippable pressing plates on two opposite sides of the plate to be pressed for pre-pressing to obtain a pre-pressed plate;

Removing the peelable pressing plates on two opposite sides of the pre-pressing plate piece;

And respectively preparing outer-layer circuits on two opposite sides of the pre-pressing plate piece to prepare the printed circuit board.

9. The method of manufacturing a printed circuit board of claim 8, wherein the step of manufacturing the printed circuit board by manufacturing the outer layer lines on opposite sides of the pre-press plate member, respectively, comprises:

Sequentially placing a dielectric layer and a conductive layer on two opposite sides of the pre-pressing plate to press the dielectric layer and the conductive layer to obtain a pressing plate;

Drilling at least one side of the lamination plate until the corresponding components are exposed;

And electroplating and etching the two opposite sides of the laminated plate in sequence to prepare the outer layer circuit and communicate the components with the outer layer circuit.

10. A printed circuit board, characterized in that it is produced by the method for producing a printed circuit board according to any one of the preceding claims 1 to 9, comprising:

at least two components of unequal heights;

The circuit board main body comprises a basic lead frame, a laminated lead frame and a dielectric layer; at least two accommodating grooves are formed in the circuit board main body, and at least two components are correspondingly arranged in the accommodating grooves; wherein each accommodating groove is prepared based on the size of each component;

the height of the basic lead frame is determined based on the height of the component with the smallest height of the at least two components, and the height of the laminated lead frame is determined based on the height difference between the components.