CN118250545A

CN118250545A - Camera module

Info

Publication number: CN118250545A
Application number: CN202211636661.4A
Authority: CN
Inventors: 俞杰; 许晨祥; 李铖辉; 陆锡松; 刘丽; 张�浩
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2024-06-25

Abstract

The application discloses a camera module, which comprises: a photosensitive assembly; the optical lens is arranged on the photosensitive path of the photosensitive assembly and comprises at least one lens substrate and at least one lens unit, wherein the at least one lens substrate is arranged at the top end of the light incident side of the optical lens, and the at least one lens unit is integrally formed on the light emergent side of the at least one lens substrate. In the above technical scheme, the lens substrate arranged at the top end of the light incident side of the optical lens is integrated in the wafer level lens, and the end face of the optical lens is protected by the lens substrate, so that the height of the image pickup module can be reduced.

Description

Camera module

Technical Field

The application relates to the technical field of camera modules, in particular to a camera module manufactured by adopting a wafer-level process.

Background

With the development of imaging technology, imaging modules are increasingly used in a variety of electronic devices, such as mobile phones, tablet computers, AR/VR. Among these, some electronic devices have a higher volume requirement on the camera module, and it is important how to make the size of the camera module smaller, so that the camera module can be applied to electronic devices with smaller installation space.

Therefore, the application provides an image pickup module using a wafer level lens and a manufacturing method thereof, so as to meet the requirements.

Disclosure of Invention

An object of the present application is to provide an image pickup module, which overcomes the defects of the prior art, integrates a lens substrate disposed at the top end of the light incident side of an optical lens into a wafer level lens, protects the end surface of the optical lens through the lens substrate, and can reduce the height of the image pickup module, thereby meeting the miniaturization requirement of the image pickup module.

According to an aspect of the present application, there is provided an image pickup module including:

A camera module, comprising:

A photosensitive assembly;

The optical lens is arranged on the photosensitive path of the photosensitive assembly and comprises at least one lens substrate and at least one lens unit, wherein the at least one lens substrate is arranged at the top end of the light incident side of the optical lens, and the at least one lens unit is integrally formed on the light emergent side of the at least one lens substrate.

In some embodiments, the optical lens includes at least one wafer level lens including an imaging portion and a structural portion surrounding an outer peripheral side of the imaging portion, at least a portion of the lens substrate is disposed at the structural portion, and at least a portion of the lens unit is disposed at the imaging portion.

In some embodiments, the lens substrate is made of glass, the lens unit is made of resin, and the lens unit is disposed on the light incident side or the light emergent side of the lens substrate and integrally formed on the lens substrate by an imprinting process.

In some embodiments, the at least one wafer level lens includes a first wafer level lens, a second wafer level lens, and a third wafer level lens sequentially disposed along an optical axis direction, the first wafer level lens being disposed on top of an incident side of the optical lens.

In some embodiments, the first wafer level lens includes a first lens substrate and a first lens unit integrally formed on a surface of the first lens substrate on a light-emitting side thereof, the first lens substrate being disposed on a top end of the optical lens.

In some embodiments, the optical lens further comprises a support disposed between the lens substrate of the first wafer level lens and the second wafer level lens.

In some embodiments, the second wafer level lens and the third wafer level lens are made of resin, and the second wafer level lens and the third wafer level lens are integrally formed through an imprinting process.

In some embodiments, the second wafer level lens includes a second lens substrate and a second lens unit, the second lens unit is integrally formed on the light incident side and/or the light emergent side of the second lens substrate, the third wafer level lens includes a third lens substrate and a third lens unit, the third lens unit is integrally formed on the light incident side and/or the light emergent side of the third lens substrate, and the second wafer level lens and the third wafer level lens are fixedly connected with the third lens substrate through the second lens substrate.

In some embodiments, the thickness of the first lens substrate is smaller than the thickness of the second lens substrate, the thickness of the second lens substrate is smaller than the thickness of the third lens substrate, and the thicknesses of the first lens substrate, the second lens substrate, and the third lens substrate, which are sequentially arranged in the optical axis direction, gradually increase.

In some embodiments, the camera module further comprises a package covering the photosensitive assembly and a peripheral side of the lens substrate of the optical lens.

Additional embodiments and features are set forth in part in the description which follows and in part will become apparent to those skilled in the art upon examination of the specification or may be learned by practice of the disclosed subject matter. A further understanding of the nature and advantages of the present disclosure may be realized by reference to the remaining portions of the specification and the drawings which form a part of this disclosure.

Drawings

Fig. 1 is a schematic cross-sectional view of an image pickup module according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a first embodiment of an image capturing module according to an embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a first embodiment of an imaging module according to an embodiment of the present application.

Fig. 4 is a schematic view of a method for manufacturing a lens panel according to a first embodiment of the present application.

Fig. 5 is a schematic diagram of a method of manufacturing an optical lens according to a first embodiment of the present application.

Fig. 6 is a schematic diagram of a method for manufacturing an image capturing module according to a first embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of a second embodiment of an imaging module according to an embodiment of the present application.

Fig. 8 is a schematic cross-sectional view of the height of an imaging module according to an embodiment of the present application.

Fig. 9 is a schematic view of a method for manufacturing a lens panel according to a second embodiment of the present application.

Fig. 10 is a schematic view of a method of manufacturing a glass mold according to an embodiment of the present application.

Fig. 11 is a schematic diagram of a method for manufacturing an image capturing module according to a second embodiment of the present application.

Fig. 12 is a schematic view of spray coating an encapsulation material according to an embodiment of the present application.

Fig. 13 is a schematic cross-sectional view of a third embodiment of an imaging module according to an embodiment of the present application.

Fig. 14 is a schematic cross-sectional view of a fourth embodiment of an imaging module according to an embodiment of the present application.

Detailed Description

The present application will be further described with reference to the following specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps.

In the description of the present application, it should be noted that, for the azimuth words such as terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present application and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present application that the device or element referred to must have a specific azimuth configuration and operation.

It should be noted that the terms "first," "second," and the like in the description and in the claims are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

The terms "comprises" and "comprising," along with any variations thereof, in the description and claims, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that, as used in the present application, the terms "substantially," "about," and the like are used as terms of approximation of a table, not as terms of degree of the table, and are intended to illustrate inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Various units, circuits, or other components may be described or described as "configured to" perform a task or tasks. In such contexts, "configured to" implies that the structure (e.g., circuitry) is used by indicating that the unit/circuit/component includes the structure (e.g., circuitry) that performs the task or tasks during operation. Further, "configured to" may include a general-purpose structure (e.g., a general-purpose circuit) that is manipulated by software and/or firmware to operate in a manner that is capable of performing one or more tasks to be solved. "configured to" may also include adjusting a manufacturing process (e.g., a semiconductor fabrication facility) to manufacture a device (e.g., an integrated circuit) suitable for performing or executing one or more tasks.

The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification and the appended claims, the singular forms "a," "an," and "the" are intended to cover the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

As used herein, the term "if" may be interpreted to mean "when..or" at..times "or" in response to a determination "or" in response to detection "depending on the context. Similarly, the phrase "if a condition or event is identified" or "if a condition or event is detected" may be interpreted to mean "upon identification of the condition or event," or "upon detection of the condition or event, depending on the context.

Fig. 1 to 13 show an image capturing module 1 and a method of manufacturing the image capturing module 1 according to an embodiment of the present application. The camera module 1 includes an optical lens 10, a photosensitive assembly 30 and a package 20, wherein the optical lens 10 is disposed on a photosensitive path of the photosensitive assembly 30. In one embodiment of the present application, the optical lens 10 includes opposite light-in and light-out sides, wherein the light-in side faces the subject and the light-out side faces the photosensitive assembly 30. The light enters from the light-entering side of the optical lens 10, and is transmitted in the optical lens 10 and then emitted from the light-emitting side of the optical lens 10 to reach the photosensitive assembly 30. The package 20 is disposed at a peripheral side of the optical lens 10 and/or the photosensitive assembly 30 to prevent stray light from entering to affect an imaging effect.

As shown in fig. 1 to 3, 7 and 12, in the embodiment of the application, the photosensitive assembly 30 includes a photosensitive chip 31 and an electrical connection portion 33 disposed on the photosensitive chip 31, wherein other functional elements may be integrated on the electrical connection portion 33 for further processing the electrical signal converted by the photosensitive chip 31.

The photosensitive chip 31 has a front surface facing the optical lens 10 and a back surface opposite to the front surface, wherein the front surface of the photosensitive chip 31 includes a photosensitive area and a non-photosensitive area, the non-photosensitive area surrounds the periphery of the photosensitive area, and the photosensitive area is used for performing photosensitive function.

In one embodiment of the present application, the electrical connection 33 is disposed on the back side of the photo-sensing chip 31, wherein the electrical connection 33 may be implemented as a plurality of solder balls, which may be replaced with solder bumps, solder pads or other electrical connection elements; in another embodiment of the present application, the electrical connection portion 33 may be disposed at a non-photosensitive region of the front surface of the photosensitive chip 31, wherein the electrical connection portion 33 may be implemented as a plurality of pads, which may be replaced with solder bumps, solder pads, or other electrical connection elements, which the present application is not limited to.

It can be said that the light-sensing chip 31 packaged by the wafer level CSP adopts the manner that the bottom surface directly leads out the electric connection part 33, the light-sensing chip 31 is directly electrically connected to the main board of the external electronic device through the electric connection part 33 on the bottom surface, so that the signal transmission distance can be effectively shortened, the attenuation is reduced, the anti-interference and noise-proof performances of the light-sensing chip 31 can be improved, the transverse size of the light-sensing assembly 30 is reduced, and the structure of the light-sensing assembly 30 is more compact.

In one embodiment of the present application, the photosensitive chip 31 employs a wafer level CSP package, also referred to as a wafer level chip. In this embodiment, the photosensitive chip 31 further includes a protection member 32, and the protection member 32 is disposed above the photosensitive chip 31 to protect the photosensitive chip 31. In a specific example of the present application, the protective member 32 may be made of a light-transmitting material, such as transparent glass or transparent resin, and the protective member 32 is fixed to the non-photosensitive area of the front surface of the photosensitive chip 31 by means of adhesive or the like.

It should be understood that the photosensitive chip 31 of the wafer level CSP package is disposed between the protector 32 and the electrical connection portion 33, and the protector 32 and the electrical connection portion 33 are disposed opposite to the front and back surfaces of the photosensitive chip 31.

In an embodiment of the present application, the camera module 1 further includes a filter element, which has an infrared cut-off function, and is capable of filtering light entering the photosensitive chip 31 to remove stray light, such as infrared light, which is not required for imaging. In a specific example of the present application, the filter element may be disposed above the protection member 32 and located on the photosensitive path of the photosensitive chip 31. That is, the optical filter is disposed between the optical lens 10 and the photosensitive member 30, and the image capturing module 1 sequentially includes the optical lens 10, the optical filter, the protective cover, the photosensitive chip 31, and the electrical connection portion 33 in the height direction.

In another specific example of the present application, the protection member 32 has an infrared cut-off function, that is, the protection member 32 is used as a filtering element, so that the protection member 32 can filter the light entering the photosensitive chip 31, and this arrangement eliminates the need of separately providing the filtering element, so that on one hand, the cost of the camera module 1 can be reduced, and on the other hand, the overall height of the camera module 1 can be reduced. The infrared cut-off function of the protector 32 may be achieved by, for example, the protector 32 itself having an infrared absorption function, or the surface of the protector 32 being coated with an infrared cut-off film, so that the filter element and the protector 32 are integrated.

In still another specific example of the present application, the optical lens 10 has an infrared cut-off function, and filters light entering the photosensitive chip 31. The infrared cut-off function of the optical lens 10 may be achieved by the material itself having a function of absorbing infrared rays, or by plating an infrared cut-off film on the surface of the optical lens 10. The arrangement avoids the need of arranging a filter element independently, so that the cost of the camera module 1 can be reduced, and the overall height of the camera module 1 can be reduced.

In one embodiment of the present application, the package 20 is disposed around the peripheral side of the optical lens 10 and/or the photosensitive element 30, wherein at least a portion of the peripheral side of the optical lens 10 and/or the photosensitive element 30 is covered by the package 20 to prevent stray light from entering. The package 20 is made of a light-impermeable material, such as a dark glue or a dark molding material, to absorb stray light.

Further, in a specific example of the present application, the peripheral side of the optical lens 10 and/or the photosensitive member 30 of the package 20 extends in the height direction of the image capturing module 1, so that the peripheral side of the optical lens 10 and/or the photosensitive member 30 is entirely covered by the package 20. It should be understood that the package 20 may be formed by dispensing, spraying, or injection molding, and the present application will be described in detail below.

As shown in fig. 2 to 12, an optical lens 10 according to an embodiment of the present application is illustrated, wherein the optical lens 10 is manufactured by a wafer level manufacturing process, and includes at least one wafer level lens 11 and a light shielding portion 12, and the light shielding portion 12 is disposed on the light incident side of the at least one wafer level lens 11 to reduce stray light entering the at least one wafer level lens 11. In a specific example of the present application, the light shielding portion 12 may be implemented as a diaphragm. Or in another specific example of the present application, the light shielding portion 12 may be implemented as a light shielding coating, a dark paint, such as black, or the like.

In one embodiment of the present application, the optical lens 10 has an optical axis, and the optical axis of the optical lens 10 is also the optical axis of the at least one wafer level lens 11. Further, the at least one wafer level lens 11 includes at least one wafer level lens disposed in sequence along the optical axis direction, it should be understood that the number of the at least one wafer level lens may be one, two, three or more according to the optical design requirement. At least one of the wafer level lenses 11 is made of a light transmitting material suitable for transmitting visible light, such as a glass material or a resin material.

The at least one wafer level lens 11 includes a structural portion 1102 and an imaging portion 1101, wherein the structural portion 1102 is disposed around the outer peripheral side of the imaging portion 1101, the imaging portion 1101 can refract the light entering the at least one wafer level lens 11, and the structural portion 1102 can support the at least one wafer level lens 11 or adjust the distance between two adjacent wafer level lenses.

In one embodiment of the present application, the light shielding portion 12 is disposed on the light incident side of the at least one wafer level lens 11, and further, the light shielding portion 12 is disposed on the structural portion 1102 of the at least one wafer level lens 11, so as to reduce stray light without affecting the light incident amount of the optical lens 10. For example, the light shielding portion 12 is provided in the light-incident-side structural portion 1102 of the first wafer-level lens. It should be understood that the first wafer level lens refers to a wafer level lens located closest to the subject on the light entrance side.

Further, the optical lens 10 further includes an adhesive layer 13, and the adhesive layer 13 is disposed between adjacent wafer-level lenses to fix the adjacent wafer-level lenses. Of course, the adhesive layer 13 may be disposed between the wafer level lens and the light shielding portion 12 to fix the wafer level lens and the light shielding portion 12; alternatively, the adhesive layer 13 may be disposed between the wafer level lens and the photosensitive member 30, for fixing the wafer level lens and the photosensitive member 30.

In the present application, the adhesive layer 13 may be implemented as a UV glue that can be cured by ultraviolet irradiation (it is worth mentioning that the UV glue in the present application includes not only glue that can be cured by ultraviolet irradiation only, but also glue that can be cured by ultraviolet irradiation and other means at the same time, such as a UV thermosetting glue). It should be understood that the materials of the adhesive layer 13 disposed at different positions may be the same or different, for example, in a specific example of the present application, the adhesive layer 13 may be glue, and when the adhesive layer 13 is disposed, the glue may be continuously applied, or may be applied at dot intervals. In another specific example of the present application, the adhesive layer 13 may be a solid adhesive such as a double-sided adhesive tape, which is not limited in the present application.

As shown in fig. 2 to 6, in one embodiment of the present application, the at least one wafer level lens 11 includes a first wafer level lens L11, a second wafer level lens L12, and a third wafer level lens L13, and the first wafer level lens L11, the second wafer level lens L12, and the third wafer level lens L13 are sequentially disposed along the optical axis. In a specific example of the present application, the first wafer level lens L11 is fixed to the light incident side of the second wafer level lens L12 by the structural portion 1102, the second wafer level lens L12 is fixed to the light incident side of the third wafer level lens L13 by the structural portion 1102, and the distances between the adjacent wafer level lenses and the distance between the wafer level lens and the photosensitive member 30 are adjusted by the structural portions 1102 of the first, second and third wafer level lenses L11, L12 and L13, respectively.

The first wafer level lens L11, the second wafer level lens L12, and the third wafer level lens L13 may individually include at least an incident surface facing light from the outside and an exit surface opposite to the incident surface. For example, the light incident surface and the light emergent surface of the first wafer level lens L11, the light incident surface and the light emergent surface of the second wafer level lens L12, and the light incident surface and the light emergent surface of the third wafer level lens L13. In a specific example of the present application, the light incident surface and the light emergent surface of the first wafer level lens L11 are both convex; the light incident surface and the light emergent surface of the second wafer level lens L12 are convex surfaces; the light incident surface and the light emergent surface of the third wafer level lens L13 are concave. It should be understood that convex refers to a curved surface that curves toward the light entry side and concave refers to a curved surface that curves toward the light exit side.

Further, an adhesive layer 13 is disposed between the structural portion 1102 of the first wafer level lens L11 and the structural portion 1102 of the second wafer level lens L12, and an adhesive layer 13 is disposed between the structural portion 1102 of the second wafer level lens L12 and the structural portion 1102 of the third wafer level lens L13 to combine the first wafer level lens L11, the second wafer level lens L12 and the third wafer level lens L13 together.

It should be understood that, in this embodiment of the present application, the first wafer level lens L11, the second wafer level lens L12 and the third wafer level lens L13 are all made of resin materials, and the Coefficient of Thermal Expansion (CTE) of the resin materials is relatively close, so that the deformation amounts of the first wafer level lens L11 and the second wafer level lens L12 are relatively close under high-low temperature impact, so that the optical lens 10 avoids the problems of cracking, deformation, etc., that is, the reliability of the optical lens 10 is higher, and the imaging effect of the imaging module 1 is better.

As shown in fig. 2 and 3, in this embodiment of the application, the optical lens 10 further includes a light-transmitting cover plate 111, and the light-transmitting cover plate 111 is disposed on the top surface of the light-incident side of the at least one wafer level lens 11 to protect the at least one wafer level lens 11. In one embodiment of the present application, the top surface of the at least one wafer level lens 11 is a plane, so that the transparent cover plate 111 can be stably attached to the top surface of the at least one wafer level lens 11. Further, in an embodiment of the present application, the light incident side surface of the light-transmitting cover plate 111 may be provided with a light shielding layer, such as by coating, spraying, silk-screening, etc., to prevent stray light from entering the optical lens 10.

Specifically, the light-transmitting cover plate 111 is disposed on the top surface of the first wafer level lens L11, and the light-transmitting cover plate 111 is fixed to the structural portion 1102 of the first wafer level lens L11 by, for example, gluing. That is, the light-transmitting cover plate 111 is disposed on the light incident side of the first wafer level lens L11, so as to prevent the first wafer level lens L11 from being directly exposed to the external environment, and further prevent the first wafer level lens L11 from being scratched or damaged. It should be understood that an adhesive layer 13 is disposed between the light-transmitting cover plate 111 and the structural portion 1102 of the first wafer level lens L11 to fix the light-transmitting cover plate 111.

The width of the transparent cover 111 along the horizontal direction is not smaller than the width of at least one wafer level lens 11 along the horizontal direction. That is, the lateral dimension of the transparent cover plate 111 is greater than or equal to the lateral dimension of the at least one wafer level lens 11. Further, the transparent cover 111 may be made of a transparent material such as glass, so as to be suitable for transmitting light. The horizontal direction or the transverse direction is perpendicular or approximately perpendicular to the optical axis, and the height direction is a direction parallel to the optical axis, which is not described in detail in the present application.

It should be understood that, in other embodiments of the present application, the light shielding portion 12 may be disposed on the light incident side surface of the light-transmitting cover 111 to prevent stray light from entering the at least one wafer level lens 11, which is not limited in the present application.

In one embodiment of the present application, as shown in fig. 4, at least one wafer level lens 11 is formed by dividing a lens tile 41, the lens tile 41 comprising a plurality of connected wafer level lenses, the wafer level lenses being manufactured in large quantities at low cost by dividing the lens tile 41, the wafer level lenses being obtained with relatively small dimensions.

Further, there is provided a method for manufacturing a lens panel 41, which adopts an integral stamping method, comprising the following steps:

s110: a lower mold is provided and a wafer level lens material layer 45 is provided on the lower mold. Wherein the wafer level lens material layer 45 is a resin material;

S120: providing an upper mold, aligning and pressing the upper mold and the lower mold, solidifying the wafer-level lens material layer 45, and removing the upper mold and the lower mold to form the lens jointed board 41 comprising a plurality of wafer-level lenses. Wherein the wafer level lens comprises an imaging portion 1101 and a structural portion 1102 surrounding the imaging portion 1101;

S130: the lens tile 41 is singulated to form a plurality of wafer level lenses. The lens panels 41 may be cut by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching cutting, and the like, thereby obtaining a single wafer level lens.

It should be appreciated that the entire wafer level lens is molded by embossing a resin material in the above method, which has the advantages of uniform stress at high temperature, more flexible surface design, thinner thickness, one-step molding, simple manufacturing process, and the like.

With the above method, in the technical solution of the present application, as shown in fig. 5, a first wafer level lens tile 411, a second wafer level lens tile 412 and a third wafer level lens tile 413 having different surface structures may be formed, the first wafer level lens tile 411, the second wafer level lens tile 412 and the third wafer level lens tile 413 are stacked and an adhesive layer is disposed between two adjacent wafer level lens tiles 41 to form the optical lens tile 41. Finally, the optical lens panels 41 are cut to form individual optical lenses 10.

As shown in fig. 6, in one embodiment of the present application, there is further provided a method for manufacturing an image capturing module 1, which includes the steps of:

S210: a light-transmitting cover plate panel 43 is provided, and the single optical lens 10 is attached to the surface of the light-transmitting cover plate panel 43 in a reverse-sticking manner. Wherein, a plurality of optical lenses 10 can be arranged on one light-transmitting cover plate jointed board 43, namely, one light-transmitting cover plate can be divided into a plurality of light-transmitting cover plates 111, and the light-transmitting cover plate jointed board 43 is made of glass material;

S220: the single photosensitive assembly 30 is attached to the optical lens 10 in a reverse manner such that the optical lens 10 is positioned on a photosensitive path of the photosensitive assembly 30. Wherein, one photosensitive component 30 corresponds to one optical lens 10 to form a semi-finished product of the camera module 1;

s230: the gaps between two adjacent optical lenses 10 and between two adjacent photosensitive chips 31 are filled with the packaging material 21 to shield and protect the side walls of the semi-finished product of the camera module 1 from stray light. Wherein, the packaging material 21 is solidified to form a packaging body 20 which covers the periphery sides of the optical lens 10 and the photosensitive chip 31;

S240: the light-transmitting cover plate jointed boards 43 are cut along the gaps between the adjacent semi-finished products of the two camera modules 1 from the light-entering side to form a plurality of light-transmitting cover plates 111, and the packaging materials 21 are filled in the gaps after the light-transmitting cover plate jointed boards 43 are cut. Wherein the encapsulation material 21 covers the peripheral side of the light-transmitting cover plate 111;

s250: the light shielding material is cut in the height direction to form a single image pickup module 1. The package 20 is coated with the light-transmitting cover 111, the optical lens 10 and the photosensitive assembly 30 along the peripheral side.

It should be understood that the reverse adhesion in the present application means that the light-transmitting cover 111 is located below the optical lens 10 along the optical axis direction, the optical lens 10 is located below the photosensitive assembly 30, and the light-transmitting cover 111, the optical lens 10 and the photosensitive assembly 30 are sequentially fixed.

Since the glass material and the resin material have different Coefficients of Thermal Expansion (CTE), cracks may be generated in the glass material or the glass material may be broken when the impact is performed at high and low temperatures. Therefore, in order to solve the above-described problem, in the present application, the package 20 is also provided on the peripheral side of the light-transmitting cover plate 111 to shield and protect the peripheral side of the light-transmitting cover plate 111. Further, the package body 20 may cover the entire area of the peripheral side of the light-transmitting cover plate 111.

Further, in the above-mentioned method for manufacturing the camera module 1, the encapsulating material 21 may overflow when the encapsulating material 21 is filled in step S230, and the encapsulating material 21 overflows to the chip surface, resulting in poor adhesive overflow. Therefore, in the technical solution of the present application, the dam 42 is disposed on the transparent cover 111, where the dam 42 extends from the surface of the transparent cover 111 along the height direction and is disposed on the outer peripheral side of the semi-finished products of the plurality of camera modules 1, that is, the dam 42 is disposed near the outermost semi-finished product of the camera modules 1, and filling the packaging material 21 between the dam 42 and the semi-finished product of the camera modules 1 is beneficial to avoiding the overflow of the packaging material 21.

Further, when the semi-finished product of the camera module 1 is reversely attached to the transparent cover 111, if the height of the dam 42 is higher than the height of the photosensitive chip 31, glue overflow may occur due to glue climbing. Therefore, in one embodiment of the present application, the height of the dam 42 is flush with the height of the photosensitive chip 31 to avoid the light shielding material from overflowing to the chip surface.

It should be understood that in the above-mentioned method for manufacturing the image capturing module 1, in step S210 and step S220, the optical lens 10 and the photosensitive element 30 may be assembled together, and then attached to the surface of the transparent cover 111 by reverse adhesion, and then subjected to the steps of filling and dividing.

In the above method, the adhesive layers 13 are respectively disposed between the light-transmitting cover plate 111 and the optical lens 10, and between the optical lens 10 and the photosensitive member 30, so as to fix them to form the image pickup module 1.

In the above method, the light-transmitting cover plate 111 is divided twice, and the light-transmitting cover plate 111 is shielded and protected by filling the packaging material 21 into the gap formed after the division; the plurality of image pickup modules 1 formed of the light-transmitting cover plate 111, the optical lens 10, and the photosensitive member 30 are divided along the encapsulation material 21 for the second time to form a single image pickup module 1 having at least a part of the side surface covered with the encapsulation material 21.

Of course, in another embodiment of the present application, the encapsulation material 21 may not be provided during the manufacturing process of the camera module 1, and the encapsulation body 20 may be formed by spraying glue on the outer periphery side of the camera module 1 after the manufacturing process of the camera module 1 is completed. Specifically, the single optical lens 10 is attached to the surface of the light-transmitting cover plate 111 in a reverse-sticking manner; attaching the single photosensitive assembly 30 to the optical lens 10 in a reverse manner; dicing is performed along the gap between the adjacent two optical lenses 10 and the gap between the adjacent two photosensitive chips 31 to form a single image pickup module 1; the encapsulation material 21 is provided on the outer peripheral side of the camera module 1 by spraying glue, and the encapsulation material 21 is cured to form the encapsulation body 20, and the encapsulation body 20 covers at least a part of the peripheral side of the camera module 1. For example, the package 20 covers the peripheral side of the light-transmitting cover plate 111, the peripheral side of the optical lens 10, and the peripheral side of the photosensitive member 30. The thickness of the side wall of the camera module 1 can be reduced by adopting the glue spraying mode to set the package body 20, which is beneficial to reducing the size of the camera module 1.

That is, in the technical solution of the present application, the image capturing module 1 includes the optical lens 10, the photosensitive member 30, and the package 20 disposed on the peripheral sides of the optical lens 10 and the photosensitive member 30. Wherein the optical lens 10 includes a first wafer level lens L11, a second wafer level lens L12, and a third wafer level lens L13 sequentially arranged in an optical axis direction, in a specific example of the present application, the first wafer level lens L11, the second wafer level lens L12, and the third wafer level lens L13 are manufactured by a process of integrally imprint molding a resin material. The photosensitive assembly 30 includes a photosensitive chip 31, a protection member 32, and an electrical connection portion 33, wherein the protection member 32 is disposed on the front surface of the photosensitive chip 31, the electrical connection portion 33 is disposed on the back surface of the photosensitive chip 31, and the third wafer level lens L13 of the optical lens 10 is disposed on the protection member 32, so that the optical lens 10 is disposed on the photosensitive path of the photosensitive assembly 30, and the photosensitive chip 31 is electrically connected to other components such as a motherboard of an electronic device through the electrical connection portion 33.

Further, the optical lens 10 further includes a light-transmitting cover plate 111, and the light-transmitting cover plate 111 is disposed on the top surface of the light incident side of the optical lens 10 to protect the optical lens 10. The peripheral side of the transparent cover plate 111 is covered by the package 20, so as to prevent the transparent cover plate 111 from being broken and prevent stray light from entering the optical lens 10.

Fig. 7 to 12 illustrate at least one wafer level lens 11 according to another embodiment of the present application, and as shown in fig. 7 to 12, in another embodiment of the present application, the at least one wafer level lens 11 includes a first wafer level lens L21, a second wafer level lens L22, and a third wafer level lens L23, and the first wafer level lens L21, the second wafer level lens L22, and the third wafer level lens L23 are sequentially disposed along an optical axis. In a specific example of the present application, the first wafer level lens L21 is fixed to the light incident side of the second wafer level lens L22, and the second wafer level lens L22 is fixed to the light incident side of the third wafer level lens L23.

As described above, in order to protect at least one wafer level lens 11, a transparent cover plate 111 is required to be disposed on the top surface of the light incident side of at least one wafer level lens 11 to prevent the wafer level lens from being directly exposed to the outside and damaged. However, the addition of the transparent cover 111 increases the height of the camera module 1, which is not compatible with the miniaturization requirement of the camera module 1, so the technical scheme of the application further provides a new wafer level lens, which protects the wafer level lens on one hand and reduces the height of the camera module 1 on the other hand.

In this embodiment of the present application, the optical lens 10 includes at least one lens substrate 113 and at least one lens unit 114, wherein the at least one lens substrate 113 is disposed at the top of the light incident side of the optical lens 10, and the at least one lens unit 114 is integrally formed on the light emergent side of the at least one lens substrate 113.

The at least one wafer level lens 11 of the at least one wafer level lens 11 comprises a lens substrate 113 and at least one lens unit 114, the at least one lens unit 114 being disposed on one or both sides of the lens substrate 113. Wherein, the at least one lens unit 114 may be fixed to one side or both sides of the lens substrate 113 by means of, for example, adhesion, insert molding, embossing, or the like. The at least one lens unit 114 may converge or diverge light. Wherein at least a portion of the lens unit 114 is located in the imaging portion 1101 of the at least one wafer level lens 11, and at least a portion of the lens substrate 113 is located in the structural portion 1102 of the at least one wafer level lens 11.

In one embodiment of the present application, the at least one wafer level lens 11 includes a lens substrate 113 and a lens unit 114 disposed on the light incident side or the light exiting side of the lens substrate 113. That is, at least one of the wafer level lenses 11 has a planar surface shape on one side and a curved surface shape on the other side. In another embodiment of the present application, the at least one wafer level lens 11 includes a lens substrate 113 and two lens units 114 disposed on the light incident side and the light emergent side of the lens substrate 113, i.e. two opposite sides of the at least one wafer level lens 11 are curved surface type. It should be understood that the curved surface shape may be spherical, aspherical, or free-form.

At least one structural portion 1102 of the wafer level lens 11 surrounds the outer peripheral side of the imaging portion 1101, at least a portion of the lens substrate 113 is disposed on the structural portion 1102, and at least a portion of the lens unit 114 is disposed on the imaging portion 1101.

The lens substrate 113 and the lens unit 114 are made of a light-transmitting material, for example, the lens substrate 113 is made of glass, and the lens unit 114 is made of resin.

In this embodiment of the present application, the lens substrate 113 is disposed on the top surface of the light incident side of at least one wafer level lens 11, and since the lens substrate 113 may be made of glass, it may be disposed on the top surface of the optical lens 10 instead of the light-transmitting cover 111. By the arrangement mode, on one hand, the optical lens 10 can be protected, and at least one wafer-level lens 11 is prevented from being directly exposed to the outside to be damaged; on the other hand, the light-transmitting cover plate 111 does not need to be arranged separately, so that the height of the optical lens 10 is further reduced, and the height of the camera module 1 is further reduced.

Further, the width of the lens substrate 113 along the horizontal direction is not smaller than the width of the at least one wafer level lens 11 along the horizontal direction. That is, the lateral dimension of the lens substrate 113 is greater than or equal to the lateral dimension of the at least one wafer level lens 11. To protect at least one wafer level lens 11. Further, in one embodiment of the present application, the light-incident side surface of the lens substrate 113 may be provided with a light shielding layer, such as by coating, spraying, silk-screening, or the like, to prevent stray light from entering the optical lens 10.

In the present application, the at least one wafer level lens 11 may further include a supporting member 112, wherein the supporting member 112 is disposed between adjacent wafer level lenses, and the supporting member 112 supports the adjacent wafer level lenses and is adapted to adjust the distance between the adjacent wafer level lenses. It should be appreciated that in order to avoid affecting the propagation of light within the wafer level lens, the support 112 is disposed on the lens substrate 113 without contacting the lens unit 114. That is, the support 112 is provided to the structural portion 1102 of the wafer level lens to avoid affecting imaging. It should be understood that the support 112 may be made of glass or resin.

As shown in fig. 8, in the technical solution of the present application, the right side is the camera module shown in fig. 3, the top end of the camera module is the transparent cover plate 111, and the height of the camera module is H at this time; on the left is the camera module shown in fig. 7, the top of which is the wafer level lens 11 comprising the lens substrate 113 and the lens unit 114, where the height of the camera module is h. As can be seen by comparison, H is less than H. This is because the light-transmitting cover plate 111 is eliminated from the left image pickup module and its function is integrated into the wafer level lens, and because the lens substrate 113 of the wafer level lens 11 is disposed on the top end of the image pickup module, it can not only realize the function of protecting the wafer level lens, but also realize the reduction of the height of the image pickup module.

In this embodiment of the present application, the first wafer level lens L21 includes a first lens substrate 113a and a first lens unit 114a, the first lens unit 114a is integrally formed on a light-emitting side surface of the first lens substrate 113a, and the first lens substrate 113a is disposed on a top end of the optical lens 10. That is, the light incident side of the first wafer level lens L21 is a planar surface, and the light emergent side of the first wafer level lens L21 is a curved surface. Further, the first lens substrate 113a is made of glass, and the first lens unit 114a is made of resin. That is, the lens substrate 113 is located on the top surface of the light incident side of the at least one wafer level lens 11, and this arrangement eliminates the need for the light-transmitting cover 111, thereby reducing the height of the optical lens 10 and the image capturing module 1. It can also be said that the light-transmitting cover plate 111 is integrated with the first wafer level lens L21, so that the first wafer level lens L21 can not only realize the converging and diverging functions of light, but also realize the protection function of the optical lens 10.

Wherein at least a portion of the first lens unit 114a is located at the imaging portion 1101 of the first wafer level lens L21, and at least a portion of the first lens substrate 113a is located at the structural portion 1102 of the first wafer level lens L21. In this way, at least a portion of the first lens unit 114a of the first wafer level lens L21 may converge or diverge light, and at least a portion of the first lens substrate 113a of the first wafer level lens L21 may support the first wafer level lens L21 or adjust a distance between the first wafer level lens L21 and the second wafer level lens L22.

With continued reference to fig. 7, in one embodiment of the present application, the second and third wafer level lenses L22 and L23 are different in structure from the first wafer level lens L21, and the second and third wafer level lenses L22 and L23 are wafer level lenses integrally molded by embossing a resin material. The first and second wafer level lenses L21 and L22 are supported and fixed by the support 112, and the second and third wafer level lenses L22 and L23 are supported and fixed by the resultant portions thereof.

Of course, in another embodiment of the present application, the second wafer level lens L22 and the third wafer level lens L23 have the same structure as the first wafer level lens L21, and the lens unit 114 is formed on the lens substrate 113.

Specifically, the support 112 is disposed between the first lens substrate 113a of the first wafer level lens L21 and the structural portion 1102 of the second wafer level lens L22 to support the first wafer level lens L21 and the second wafer level lens L22 by the support 112, and also to support the distance between the first wafer level lens L21 and the second wafer level lens L22 by the support 112.

The first wafer level lens L21, the second wafer level lens L22, and the third wafer level lens L23 may individually include at least an incident light surface facing light from the outside and an exit light surface opposite to the incident light surface. For example, the light incident surface and the light emergent surface of the first wafer level lens L21, the light incident surface and the light emergent surface of the second wafer level lens L22, and the light incident surface and the light emergent surface of the third wafer level lens L23. In a specific example of the present application, the light incident surface of the first wafer level lens L21 is a plane, and the light emergent surface of the first wafer level lens L21 is a convex surface; the light incident surface and the light emergent surface of the second wafer level lens L22 are convex surfaces; the light incident surface and the light emergent surface of the third wafer level lens L23 are concave. It should be understood that convex refers to a curved surface that curves toward the light entry side and concave refers to a curved surface that curves toward the light exit side.

Further, an adhesive layer 13 is disposed between one end of the supporting member 112 and the first lens substrate 113a of the first wafer level lens L21, and an adhesive layer 13 is disposed between the other end of the supporting member 112 and the structural portion 1102 of the second wafer level lens L22, and an adhesive layer 13 is disposed between the structural portion 1102 of the second wafer level lens L22 and the structural portion 1102 of the third wafer level lens L23, so as to combine the first wafer level lens L21, the second wafer level lens L22 and the third wafer level lens L23 into a whole.

In another embodiment of the present application, as shown in fig. 9, a new method of manufacturing a lens panel 41 is provided to manufacture a wafer level lens comprising a lens substrate 113 and a lens unit 114. It should be appreciated that at least one wafer level lens 11 is formed by dividing a lens tile 41, the lens tile 41 comprising a plurality of connected wafer level lenses, the wafer level lenses being manufactured in large numbers and at low cost by dividing the lens tile 41, the wafer level lenses being obtained with relatively small dimensions.

Further, a method for manufacturing the lens panel 41 includes the following steps:

S310: a lens substrate tile 44 is provided and a layer of wafer level lens material 45 is provided over lens substrate tile 44. Wherein the lens substrate board 44 is made of glass material, the wafer-level lens material layer 45 is made of resin material, and the lens substrate board 44 can be divided into a plurality of lens substrates 113;

S320: an upper mold is provided, the upper mold is pressed with the lens substrate 113, the wafer-level lens material layer 45 is cured and the upper mold is removed to form a plurality of lens units 114 on the lens substrate 113, so as to form the lens jigsaw 41 comprising the lens substrate 113 and the plurality of lens units 114.

S330: the lens tile 41 is divided along the gap between two adjacent lens units 114 to form a plurality of wafer level lenses. The wafer level lens includes a lens substrate 113 and a lens unit 114, and the lens unit 114 is disposed on one side of the lens substrate 113. The lens panels 41 may be cut by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching cutting, and the like, thereby obtaining a single wafer level lens.

It should be appreciated that in the above method, the wafer level lens is embossed by the lens substrate 113 and the lens unit 114, which has a transparent base support made of glass, is easily resistant to reflow soldering, and is manufactured without yellowing, and has high light transmittance.

The above method may mold the lens unit 114 on one side of the lens substrate 113, and when it is required to mold the lens unit 114 on both sides of the lens substrate 113, providing a lower mold and disposing the wafer level lens material layer 45 on the lower mold after the above step S320; the opposite side of the lens substrate 113 having the plurality of lens units 114 formed on one side is pressed with the lower mold, and then the wafer level lens material layer 45 is cured and the lower mold is removed to continue forming the plurality of lens units 114 on the lens substrate 113. Wherein, the lens substrate 113 has a plurality of lens units 114 on both sides.

It should be understood that in the method for manufacturing the lens panel 41, if the wafer level lens material layer 45 is continuously coated on the lens substrate 113, on one hand, insufficient mold filling is generated, and gaps are generated, so that the surface of the lens unit 114 is not satisfactory; on the other hand, a residual layer is generated during the imprinting of the mold. Therefore, in the solution of the present application, the dispensing mechanism is used to apply the wafer level lens material layer 45 at the discrete locations on the lens substrate 113 at the positions corresponding to the stamping and forming of the mold, so as to solve the above-mentioned problem.

Further, as shown in fig. 10, in the technical solution of the present application, the glass mold 46 may also be applied to the manufacture of the wafer level lens, so that the wafer level lens is easier to be cured by irradiating UV light during the manufacture process. Specifically, the present application provides a method for manufacturing a glass mold 46, firstly, a hard mold is provided, wherein the hard mold is a wafer type hard mold, and can be used for manufacturing a wafer level lens; disposing a light-transmitting material 461 on the hard mold, wherein the light-transmitting material can be, for example, polydimethylsiloxane (PDMS); the glass plate 462 is disposed on the light-transmitting material 461, that is, the light-transmitting material 461 is sandwiched between the glass plate 462 and the hard mold, and the light-transmitting material is cured by UV exposure or the like, and the hard mold is removed. In this way, the glass mold 46 may be formed, and since the glass mold 46 may also allow light to pass through, a UV lamp may be disposed directly over the glass mold 46 during the process of manufacturing the wafer level lens to facilitate curing and molding of the wafer level lens material layer 45.

In the technical solution of the present application, the method of steps S310 to S330 may be used to mold the first wafer level lens L21, or other wafer level lenses with different surface structures may be also molded, which is not limited in the present application. With the formation of the second wafer level lens tile 412 and the third wafer level lens tile 413 using steps S110 to S130 described above, the support 112 is disposed between the first wafer level lens tile 411 and the second wafer level lens tile 412, and the support 112 is fixed between the first wafer level lens tile 411 and the second wafer level lens tile 412 by the adhesive layer 13. Further, an adhesive layer 13 is provided between the second wafer level lens tab 412 and the third wafer level lens tab 413, the first wafer level lens tab 411, the second wafer level lens tab 412 and the third wafer level lens tab 413 are overlapped in the optical axis direction, and are fixed to form an optical lens tab 41, which is then cut to form individual optical lenses 10.

As shown in fig. 11, in one embodiment of the present application, there is further provided a method for manufacturing an image capturing module 1, comprising the steps of:

S410: an optical lens 10 is provided to obtain back focal data of the optical lens 10. Wherein the optical lens 10 includes a first wafer level lens L21, a second wafer level lens L22, and a third wafer level lens L23 sequentially arranged in the optical axis direction, the first wafer level lens L21 including a lens substrate 113 and a lens unit 114 disposed on the light-emitting side thereof;

S420: a photosensitive assembly 30 is provided, and attitude data of the photosensitive assembly 30 is acquired, including the height and position of the photosensitive chip 31. The photosensitive assembly 30 is a wafer-level chip, and includes a photosensitive chip 31, a protection member 32 disposed on the front surface of the photosensitive chip 31, and an electrical connection portion 33 disposed on the back surface of the photosensitive chip 31;

s430: the relative positions of the optical lens 10 and the photosensitive chip 31 are determined based on the back focus data of the optical lens 10 and the posture data of the photosensitive assembly 30, and then the optical lens 10 is disposed on the photosensitive path of the photosensitive assembly 30 according to the relative positional relationship, and the adhesive layer 13 is disposed between the optical lens 10 and the photosensitive assembly 30 and cured to fix the optical lens 10 and the photosensitive assembly 30, forming the image pickup module 1.

Further, in step S410, a light source is disposed above the optical lens 10, the optical lens 10 receives and condenses the light projected by the light source, and emits the light to a receiving platform, and the distance between the receiving platform and the optical lens 10 is adjusted to make the optical lens 10 condense the received light on the receiving platform, so as to obtain back focal data of the optical lens 10. The back focal data of the optical lens 10 includes a back focal distance of the optical lens 10, by which a desired distance between the optical lens 10 and the photosensitive assembly 30 can be obtained, and the adjusting member 115 of a suitable thickness can be selected to fix the desired distance between the optical lens 10 and the photosensitive assembly 30. In other words, in the present application, the distance between the optical lens 10 and the photosensitive member 30 can be determined by the back focal distance of the optical lens 10.

Further, in step S420, height information of a plurality of points on the top surface of the photosensitive assembly 30 may be acquired by the laser altimeter apparatus, respectively, so as to acquire attitude data of the photosensitive assembly 30. The posture data of the photosensitive assembly 30 includes height position information of the photosensitive assembly 30, and by acquiring the height position information of the photosensitive assembly 30, a position where the optical lens 10 should be disposed can be determined, so that the optical lens 10 is disposed above the photosensitive assembly 30 and an image plane of the optical lens 10 can overlap with a photosensitive area of the photosensitive chip 31 of the photosensitive assembly 30. Specifically, the attitude data of the photosensitive assembly 30 may be obtained by laser altimetry.

It should be understood that, in the technical solution of the present application, the back focal data of the optical lens 10 includes, in addition to the back focal distance of the optical lens 10, image plane data of the optical lens 10, where the image plane data includes an inclined posture of the image plane of the optical lens 10, so in the present application, the inclined angle of the optical lens 10 relative to the photosensitive assembly 30 may be further adjusted so that the image plane of the optical lens 10 overlaps with the photosensitive area of the photosensitive chip 31. Further, the posture data of the photosensitive assembly 30 may further include inclination data of the photosensitive assembly 30, so as to more precisely adjust the inclination angle between the optical lens 10 and the photosensitive assembly 30 to overlap the image plane of the optical lens 10 with the photosensitive area of the photosensitive chip 31. For example, the tilt angle of the optical lens 10 and the tilt angle of the photosensitive assembly 30 may be adjusted, respectively, to improve adjustment efficiency.

In step S430, the adhesive layer 13 may be adjusted according to a desired distance between the optical lens 10 and the photosensitive member 30, and the thickness of the adhesive layer 13 is equal to the desired distance between the optical lens 10 and the photosensitive member 30. For example, when the thickness between the optical lens 10 and the photosensitive member 30 is 20 μm, the thickness of the adhesive layer 13 is made 20 μm. It should be noted that, when the inclination angle exists between the optical lens 10 and the photosensitive assembly 30, the thickness of the annular adhesive layer 13 in the circumferential direction is not uniform, so as to match the gap between the optical lens 10 and the photosensitive assembly 30.

In a specific example of the present application, the adhesive layer 13 may be implemented as a UV glue that can be cured by ultraviolet irradiation (it is worth mentioning that in the present application UV glue includes not only glue that can be cured by ultraviolet irradiation only, but also glue that can be cured by ultraviolet irradiation and other means at the same time, such as UV thermosetting glue). Further, the adhesive layer 13 may be a particle adhesive, specifically, the adjusting element 115 includes glue and particles wrapped therein, and the diameter of the particles may be according to a desired distance between the optical lens 10 and the photosensitive assembly 30.

After the image pickup module 1 is obtained by the above method, the encapsulation material 21 is sprayed on the peripheral side of the image pickup module 1, and the encapsulation body 20 is formed after the encapsulation material 21 is cured, and the encapsulation body 20 covers the peripheral side of the image pickup module 1, as shown in fig. 12. The package 20 may cover a part of the peripheral area of the image pickup module 1 or may cover the entire peripheral area of the image pickup module 1. Further, protection devices may be provided on the top and bottom surfaces of the camera module 1, for example, on the top surface of the lens substrate 113 and the bottom surface of the electrical connection portion 33, so as to ensure that the packaging material 21 does not affect the top and bottom surfaces of the camera module 1 during the process of disposing the package 20 on the peripheral side of the camera module 1.

In the embodiment of the present application, at least a part of the periphery of the image pickup module 1 is provided with the package 20. Wherein the package 20 covers the peripheral side of the optical lens 10 and the peripheral side of the photosensitive assembly 30. It should be understood that the first lens substrate 113a of the first wafer level lens L21 is made of glass, and the glass may crack or crack during high and low temperature impact. Therefore, in order to solve the above-described problem, in the present application, the package 20 is also provided on the peripheral side of the first lens substrate 113a to shield and protect the peripheral side of the first lens substrate 113 a. That is, the package 20 covers the entire area of the peripheral side of the optical lens 10.

That is, in the technical solution of the present application, the image capturing module 1 includes the optical lens 10, the photosensitive member 30, and the package 20 disposed on the peripheral sides of the optical lens 10 and the photosensitive member 30. The optical lens 10 includes a first wafer-level lens L21, a second wafer-level lens L22, and a third wafer-level lens L23 sequentially disposed along the optical axis, and in a specific example of the present application, the first wafer-level lens L21 is manufactured by a process of embossing the lens unit 114 on the lens substrate 113, and the second wafer-level lens L22 and the third wafer-level lens L23 may be manufactured by the same manufacturing process as the first wafer-level lens L21 or by a manufacturing process of integrally embossing the resin material. The photosensitive assembly 30 includes a photosensitive chip 31, a protection member 32 and an electrical connection portion 33, wherein the protection member 32 is disposed on the front surface of the photosensitive chip 31, the electrical connection portion 33 is disposed on the back surface of the photosensitive chip 31, the optical lens 10 is disposed on the protection member 32, and the photosensitive chip 31 is electrically connected to other components such as a motherboard of an electronic device through the electrical connection portion 33.

Further, the package 20 is provided on the peripheral side of the image pickup module 1, and covers the entire area of the peripheral side of the optical lens 10 and the entire area of the peripheral side of the photosensitive member 30.

Fig. 13 shows at least one wafer level lens 11 according to still another embodiment of the present application, as shown in fig. 13, in which at least one wafer level lens 11 includes a first wafer level lens L31, a second wafer level lens L32, and a third wafer level lens L33, and the first wafer level lens L31, the second wafer level lens L32, and the third wafer level lens L33 are sequentially disposed along an optical axis. In a specific example of the present application, the first wafer level lens L31 is fixed to the light incident side of the second wafer level lens L32, and the second wafer level lens L32 is fixed to the light incident side of the third wafer level lens L33.

In the solution of the present application, the first wafer level lens L31 includes a first lens substrate 113a and a first lens unit 114a, the second wafer level lens L32 includes a second lens substrate 113b and a second lens unit 114b, and the third wafer level lens L33 includes a third lens substrate 113c and a third lens unit 114c. The second lens unit 114b is integrally formed on the light incident side and/or the light emergent side of the second lens substrate 113b, and the third lens unit 114c is integrally formed on the light incident side and/or the light emergent side of the third lens substrate 113 c. That is, the first wafer level lens L31, the second wafer level lens L32, and the third wafer level lens L33 are manufactured by a process of embossing the lens unit 114 on the lens substrate 113.

The first lens unit 114a is located on the light emitting side of the first lens substrate 113a, the second lens unit 114b is located on the light incident side of the second lens substrate 113b, and the third lens unit 114c is located on the light emitting side of the third lens substrate 113 c. Namely, the light incident surface of the first wafer level lens L31 is a plane, and the light emergent surface of the first wafer level lens L31 is a convex surface; the light incident surface of the second wafer level lens L32 is a convex surface, and the light emergent surface of the second wafer level lens L32 is a plane; the light incident surface of the third lens stage L33 is a plane, and the light emergent surface of the third lens stage L33 is a concave surface.

Specifically, a supporting member 112 is disposed between the first wafer level lens L31 and the second wafer level lens L32, and the first wafer level lens L31 and the second wafer level lens L32 are supported and fixed by the supporting member 112; the second lens substrate 113b of the second wafer level lens L32 and the third lens substrate 113c of the third wafer level lens L33 are connected to each other to support and fix the second wafer level lens L32 and the third wafer level lens L33. Specifically, the second wafer level lens L32 and the third wafer level lens L33 are fixedly connected to the third lens substrate 113c through the second lens substrate 113 b.

Further, an adhesive layer 13 is disposed between one end of the support 112 and the first lens substrate 113a of the first wafer level lens L31, an adhesive layer 13 is disposed between the other end of the support 112 and the second lens substrate 113b of the second wafer level lens L32, and an adhesive layer 13 is disposed between the lens substrate 113 of the second wafer level lens L32 and the lens substrate 113 of the third wafer level lens L33, so as to adhesively fix the first wafer level lens L31, the second wafer level lens L32, and the third wafer level lens L33 together.

Further, in the technical scheme of the present application, an adjusting element 115 is disposed between the optical lens 10 and the photosensitive assembly 30, and since the image capturing module 1 in the present application is a fixed focus module, the back focus of the image capturing module 1 can be adjusted by the height of the adjusting element 115, so that the photosensitive chip 31 is located on the focal plane of the optical lens 10 for imaging. In a specific example of the present application, the adjusting element 115 is disposed between the third wafer level lens L33 and the protecting member 32 of the photosensitive assembly 30, and the adjusting element 115 has a certain height, so that the light passing through the optical lens 10 can reach the photosensitive chip 31. Wherein the adjustment element 115 is a light transmissive material, such as glass or resin.

Further, the supporting member 112 is disposed between the adjusting element 115 and the third lens element L33 to support and fix the third lens element L33, so as to avoid the contact between the adjusting element 115 and the third lens unit 114c of the third lens element L33 and the damage to the third lens unit 114c of the third lens element L33.

It should be understood that the adjusting element 115 has an infrared cut-off function, that is, the adjusting element 115 is used as a filtering element, so that the adjusting element 115 can filter the light entering the photosensitive chip 31, and the arrangement manner omits to separately provide the filtering element, so that on one hand, the cost of the camera module 1 can be reduced, and on the other hand, the overall height of the camera module 1 can be reduced. The infrared cut-off function of the adjustment element 115 may be achieved by, for example, the material of the adjustment element 115 itself having a function of absorbing infrared rays, or the surface of the adjustment element 115 is coated with an infrared cut-off film, so that the filter element and the adjustment element 115 are integrated.

In the present embodiment, the first wafer level lens L31, the second wafer level lens L32, and the third wafer level lens L33 may be manufactured and molded by the methods of the foregoing steps S310 to S330, and the first wafer level lens L31, the second wafer level lens L32, and the third wafer level lens L33 may be stacked in the optical axis direction and fixed by the adhesive layer 13 to form the optical lens 10.

The method of the foregoing step S410 to step S440 is adopted to manufacture the image capturing module 1, wherein the steps S410 to S440 further include: an adjustment element 115 is disposed between the third wafer level lens L33 and the photosensitive member 30, and the relative position between the optical lens 10 and the photosensitive member 30 is adjusted by the adjustment element 115.

Further, in the present application, the thickness of the lens substrate 113 of at least one wafer level lens 11 in the optical lens 10 is different to adapt to the optical design requirement of each wafer level lens 11, so as to reduce the height of the optical lens 10, and it is noted that the thickness of the lens substrate 113 in the present application refers to the dimension of the lens substrate 113 along the optical axis direction.

As shown in fig. 14, in one example, the thickness of the lens substrate 113 of the at least one wafer level lens 11 gradually increases from the object side to the image side of the optical axis, in other words, the thickness of the lens substrate 113 of the at least one wafer level lens 11 increases in the light incident direction. Since the thickness of the wafer level lens 11 of the optical lens 10 adopted in the present application gradually increases from the object side to the image side of the optical axis, the thickness of the lens substrate 113 of at least one wafer level lens 11 gradually increases from the object side to the image side of the optical axis, so that the volume ratio of the lens substrate 113 in the wafer level lens 11 is increased, the volume ratio of the lens unit 114 is reduced, the shrinkage of the lens unit 114 is reduced, and the expansion and shrinkage difference between the lens unit 114 and the lens substrate 113 due to different materials is reduced. It will be appreciated that, during the process of manufacturing the optical lens 10 and the image capturing module 1, transition between high temperature and normal temperature is required, and excessive expansion and contraction difference may result in degradation of the imaging quality of the optical lens 10 and the image capturing module 1 that are finally obtained.

It should be noted that, in one example of the present application, the refractive index of the lens substrate 113 is larger than that of the lens unit 114, so that the volume ratio of the lens substrate 113 in the wafer level lens 11 is increased, and the thickness of the wafer level lens 11 can be reduced, so that the overall height of the optical lens 10 and the image capturing module 1 is reduced. In a specific example, the lens substrate 113 is made of a glass material, and the lens unit 114 is made of a resin material, wherein the refractive index of the lens substrate 113 is 1.5178, and the refractive index of the lens unit 114 is 1.50547.

With continued reference to fig. 14, in one example, the first lens unit 114a is formed on the image side of the first lens substrate 113a by nanoimprint, the first lens substrate 113a is made of glass material, and the first lens unit 114a is made of resin material; the second lens unit 114b is formed on the object side of the second lens substrate 113b by nano-imprinting, the second lens substrate 113b is made of glass material, and the second lens unit 114b is made of resin material; the third lens unit 114c is formed on the image side of the third lens substrate 113c by nanoimprint, the third lens substrate 113c is made of glass material, and the third lens unit 114c is made of resin material. In this example, the thickness of the first lens substrate 113a is smaller than the thickness of the second lens substrate 113b, and the thickness of the second lens substrate 113b is smaller than the thickness of the third lens substrate 113c, so that the thicknesses of the first lens substrate 113a, the second lens substrate 113b, and the third lens substrate 113c, which are sequentially distributed along the object side to the image side of the optical axis, gradually increase. For example, the thickness of the first lens substrate 113a is about 0.05mm, the thickness of the second lens substrate 113b is about 0.18mm, and the thickness of the third lens substrate 113c is about 0.34mm.

It should be noted that, in one example of the present application, the aperture value (Fno) of the optical lens 10 provided by the present application is 2.5, the total optical length (TTL) is 1.9mm, the angle of view is 104 °, and the object distance range is 30mm.

The foregoing has outlined the basic principles, features, and advantages of the present application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made therein without departing from the spirit and scope of the application, which is defined by the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.

Claims

1. A camera module, comprising:

A photosensitive assembly;

2. The camera module of claim 1, wherein the optical lens comprises at least one wafer level lens comprising an imaging portion and a structural portion, the structural portion surrounding an outer peripheral side of the imaging portion, at least a portion of the lens substrate being disposed on the structural portion, at least a portion of the lens unit being disposed on the imaging portion.

3. The camera module according to claim 2, wherein the lens substrate is made of glass, the lens unit is made of resin, and the lens unit is disposed on the light incident side or the light emergent side of the lens substrate and integrally formed on the lens substrate by an embossing process.

4. The camera module according to claim 3, wherein the at least one wafer level lens comprises a first wafer level lens, a second wafer level lens and a third wafer level lens sequentially arranged along the optical axis direction, the first wafer level lens being disposed at a top end of the light incident side of the optical lens.

5. The camera module of claim 4, wherein the first wafer level lens comprises a first lens substrate and a first lens unit, the first lens unit is integrally formed on a surface of the first lens substrate on a light emitting side, and the first lens substrate is disposed on a top end of the optical lens.

6. The camera module of claim 5, wherein the optical lens further comprises a support disposed between the lens substrate of the first wafer level lens and the second wafer level lens.

7. The camera module of claim 6, wherein the second wafer level lens and the third wafer level lens are made of resin, and the second wafer level lens and the third wafer level lens are integrally formed through an imprinting process.

8. The camera module of claim 6, wherein the second wafer level lens comprises a second lens substrate and a second lens unit, the second lens unit is integrally formed on the light incident side and/or the light emergent side of the second lens substrate, the third wafer level lens comprises a third lens substrate and a third lens unit, the third lens unit is integrally formed on the light incident side and/or the light emergent side of the third lens substrate, and the second wafer level lens and the third wafer level lens are fixedly connected with the third lens substrate through the second lens substrate.

9. The image capturing module according to any of claims 7 or 8, wherein a thickness of the first lens substrate is smaller than a thickness of the second lens substrate, a thickness of the second lens substrate is smaller than a thickness of the third lens substrate, and thicknesses of the first lens substrate, the second lens substrate, and the third lens substrate, which are sequentially arranged in the optical axis direction, gradually increase.

10. The camera module of claim 9, wherein the camera module further comprises a package covering the photosensitive assembly and a peripheral side of the lens substrate of the optical lens.