JP2008182051A - Optical device, optical device apparatus, camera module and method for manufacturing the optical device apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress an optical noise attributable to a side face of a transparent member, and also to materialize downsizing. <P>SOLUTION: At least an upper end portion of a side face of a transparent member 22 disposed in an upper part of a main face of an optical element 10 is formed in a reverse tapered face shape with an angle greater than a maximum incident angle, whereby it is possible to prevent an incidence of a light from the side face of the transparent member 22 onto a light receiving element 10. Therefore, it is possible to suppress the optical noise attributable to the side face of the transparent member 22, and also to materialize downsizing. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical device that emits or receives light, an optical device device that includes the optical device, a camera module, and a method for manufacturing the optical device device.

  In recent years, as electronic devices have become smaller, thinner, lighter, and more functional, semiconductor devices are mainly mounted from conventional package-type mounting to flip-chip mounting that is mounted on a circuit board or the like in a bare chip or CSP configuration. It is moving. Such mounting approaches are also being considered for semiconductor imaging devices.

  In a semiconductor imaging device, it is common to provide a transparent cover glass on the upper surface of the image sensor. However, in the above flow, the cover glass is also being considered to be downsized. Things that are approaching are being considered.

Among them, since the influence of noise light caused by light incident from the side surface of the cover glass has become obvious, various countermeasures have been studied.
For example, the simplest method is to make the cover glass itself have a sufficient plane dimension that does not reach the image sensor even if noise light is generated due to the side surface.

  An example of this is shown in FIG. 13A and 13B are diagrams showing the structure of a conventional optical device. FIG. 13A is a plan view of the optical device, and FIG. 13B is a cross-sectional view taken along line XIIIa-XIIIa shown in FIG.

  Generally speaking, the optical device 101 includes an optical element 10, a transparent resin adhesive 24, and a transparent member 110. The optical device 101 is divided into several regions. A light detection region 14, a peripheral circuit region 16, and an electrode region 18 are provided on the semiconductor substrate 12. Furthermore, an electrode terminal 20 is provided on the electrode region 18.

  In this conventional example, noise light generated due to light incident from the side surface of the transparent member 110 does not reach the light detection region 14, and the transparent resin adhesive 24 closest to the light detection region 14 of the transparent member 110. The distance to the side surface is set to a certain value or more, and a plane dimension that is a dimension in a direction parallel to the formation surface of the optical element 10 of the semiconductor substrate is determined. The noise light reaching the upper surface of the optical element 10 is, for example, that the first incident light 26 enters the side surface of the transparent member 110 and is refracted on the side surface. In another example, the second incident light 36 enters the upper surface of the transparent member 110 and is reflected by the side surface of the transparent member 110 after refraction.

As another method, another configuration for reducing the reflected light on the side surface of the cover glass has been proposed. In this configuration, the solid-state imaging device provided on the semiconductor substrate is surrounded by a spacer, and the top is sealed with a cover glass. In addition, an antireflection film is formed on each side end surface of the cover glass and the inner wall surface of the spacer (see, for example, Patent Document 1).
JP 2006-41277 A

  In the first conventional example, it is necessary to enlarge the transparent member 110 in order to prevent the noise light from reaching the light detection region 14. Furthermore, for wire bonding, it is necessary to secure a distance from the side surface of the transparent member 110 for the position of the electrode terminal 20, and accordingly, the planar dimension of the semiconductor substrate 12 needs to be increased.

For this reason, it is not an effective method for the demand for downsizing.
Moreover, in the said 2nd prior art example, there is no reduction effect with respect to the noise light resulting from the incident light from the side surface of a cover glass, and it will increase conversely. The reflectance on the surface of a general glass is around 4%, and in the case where the antireflection film is not formed, the loss of noise light on the side surface of the cover glass is only around 4%. When there is an antireflection film, the loss is less than this.

  On the other hand, the incident light from the upper surface of the cover glass and the light reflected from the side surface loses about 4% when incident from the upper surface in the case where the antireflection film is not formed. Since only about 4% of the light is reflected, about 96.2% is eventually lost. When there is an antireflection film, instead of reducing the loss on the top surface, the reflection on the side surface is reduced, resulting in a larger loss.

For this reason, it can be said that the incident light from the side face is important from these points.
Furthermore, the reach distance of the noise light will be described with reference to FIG. FIGS. 14A to 14C are image diagrams showing an optical path of incident light to the cover glass. 14A and 14B are image diagrams of an optical path of incident light from a medium having a refractive index n0 to a medium having a refractive index n1 at an angle α from the upper side of FIG. Furthermore, it is an image figure of the optical path on a more specific condition.

  As shown in FIG. 14A, light is refracted at the boundary between media having different refractive indexes, but this angle can be obtained by Snell's law. Incident light from the top surface of the cover glass is refracted in the same image as this figure.

  On the other hand, the refraction of incident light from the side surface of the cover glass is basically the same, but the boundary surface of the medium itself is rotated by 90 °, so that it is easier to understand by considering in FIG. Snell's law is the defined angle of the incident surface with respect to the normal. When the incident angle is defined with respect to the upper surface of the cover glass, the angle after refraction becomes γ.

  Next, consider the case of FIG. Since the maximum value of the incident light angle in the camera module is generally about 20 °, the incident light from the side surface of the cover glass is assumed assuming a 20 ° incident light and a glass having a refractive index of 1.5. Compare the reach distance from the glass side surface when the incident light from the upper surface of the cover glass is reflected by the side surface.

  Incident light from the side surface of the cover glass is calculated according to Snell's law and is considered to be an angle definition with respect to the upper surface of the cover glass. On the other hand, the incident light from the upper surface of the cover glass has an angle of 13.2 ° in the glass.

  Here, assuming that the cover glass thickness is T = 0.5 mm and assuming the upper surface end of the cover glass as the incident light from which the noise light reaches the farthest, the reach distance from the glass side surface is as follows. In the case of incident light from the side surface of the cover glass, L1 = 0.62 mm, and when incident light from the upper surface of the cover glass is reflected by the side surface, L2 = 0.12 mm.

  As can be seen from the above, it is noise light caused by incident light from the side surface of the cover glass that needs to be preferentially treated as noise light. That is, in the second conventional example, there is no countermeasure against the noise light caused by the incident light from the side surface of the cover glass which is the main component of the noise light, which is insufficient as a countermeasure against the noise light.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an optical device such as a semiconductor imaging device that is small in size and suppresses optical noise, and a method for manufacturing the same.

  In order to achieve the above object, the optical device according to claim 1 is an electrode in which an electrode terminal for connecting to an external circuit and a detection region capable of providing at least a region for detecting incident light and emitting light is formed. An optical element having a region, at least a transparent member having a plane dimension larger than at least the detection region disposed on a circuit forming surface of the detection region, and transparent adhesion for bonding and fixing the optical element and the transparent member An entire surface from the upper end to the lower end of the side surface of the transparent member is formed in a reverse tapered surface shape having a taper angle larger than the maximum incident angle of the incident light.

  The optical device according to claim 2 includes an optical element having at least a detection region capable of detecting incident light and emitting light and an electrode region on which an electrode terminal for connection to an external circuit is formed, and at least A first transparent member having a planar dimension larger than at least the detection region and disposed on the circuit forming surface of the detection region, and a transparent first adhesion for bonding and fixing the optical element and the first transparent member. An adhesive, a second transparent member disposed on the first transparent member, and a transparent second adhesive that bonds and fixes the first transparent member and the second transparent member; The entire surface from the upper end to the lower end of the side surface of the second transparent member is formed in a reverse tapered surface shape having a taper angle larger than the maximum incident angle of the incident light.

An optical device according to a third aspect is the optical device according to the second aspect, wherein a side surface of the first transparent member is formed in a tapered shape.
The optical device according to claim 4 includes an optical element having at least a detection region capable of detecting a light incident and emitting a light and an electrode region on which an electrode terminal for connection to an external circuit is formed, and at least A transparent member having a plane dimension larger than at least the detection region and disposed on the circuit forming surface of the detection region; and a transparent adhesive for bonding and fixing the optical element and the transparent member. A V-groove having an inclined surface having an inclination angle larger than the maximum incident angle of the incident light is formed on the side surface from at least the upper end to the inside.

  The optical device according to claim 5 is the optical device according to any one of claims 1 to 4, wherein the electrode region is formed around the detection region, and the transparent member is at least on the detection region. It is characterized by being arranged.

  The optical device according to claim 6 is the optical device according to any one of claims 1 to 4, wherein the optical element further includes a plurality of microlenses provided on the detection region, and the bonding is performed. The agent has a refractive index different from that of the plurality of microlenses.

  The optical device according to claim 7 is the optical device according to any one of claims 1 to 4, wherein the transparent member is made of any one material of optical glass, quartz, crystal, or optical transparent resin. It is characterized by being.

An optical device according to an eighth aspect is the optical device according to any one of the first to fourth aspects, wherein an antireflection film is formed on a side surface of the transparent member.
An optical device according to a ninth aspect is the optical device according to any one of the first to fourth aspects, wherein the optical element includes a light receiving element or both a light receiving element and a light emitting element.

  The optical device device according to claim 10 is provided on the substrate so as to surround the optical device according to any one of claims 1 to 9 mounted on the substrate, the optical device, and the optical device. And an external terminal that is electrically connected to the electrode terminal of the optical device, and a sealing resin that opens and seals the optical device at least on the transparent member.

A camera module according to an eleventh aspect includes the optical device device according to the tenth aspect.
13. The optical device device manufacturing method according to claim 12, wherein the optical device apparatus has at least a detection region capable of detecting an incident light and emitting a light and an electrode region on which an electrode terminal for connection to an external circuit is formed. A transparent element for adhering and fixing an element, a first transparent member having a plane dimension larger than at least the detection area disposed on a circuit forming surface of at least the detection area, and the optical element and the first transparent member; A step of mounting an optical device comprising a first adhesive on a substrate, a step of electrically connecting the electrode terminal of the optical device and an external terminal provided on the substrate, and an upper end to a lower end of a side surface. A step of adhering a second transparent member having a reverse taper surface shape with a taper angle larger than the maximum incident angle of the incident light on the first transparent member; and reducing the optical device. At least opening the second transparent member and sealing with resin, and after electrically connecting the electrode terminal of the optical device and the external terminal provided on the substrate, the second The transparent member is bonded.

  As described above, optical noise can be suppressed and downsizing can be realized.

  The optical device of the present invention is configured to receive light from the side surface of the transparent member by forming at least the upper end portion of the side surface of the transparent member arranged at the upper part of the main surface of the optical element in a reverse tapered surface shape having an angle larger than the maximum incident angle. Since the incident on the element can be prevented, optical noise due to the side surface of the transparent member can be suppressed and downsizing can be realized.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In these drawings, the thickness, length, etc. of each are different from the actual shape from the creation of the drawings. The number of electrode terminals on the optical element is also easy to show. Further, the same elements are denoted by the same reference numerals, and description thereof may be omitted.

(First embodiment)
FIG. 1 is a diagram showing the structure of an optical device according to the first embodiment. FIG. 1A is a plan view showing the optical device according to the first embodiment, and FIG. It is sectional drawing in the Ia-Ia line.

  As shown in FIG. 1, the optical device 1 of the present embodiment includes an optical element 10 having an electrode region 18 including a semiconductor substrate 12, a light detection region 14, a peripheral circuit region 16, and an electrode terminal 20, a transparent member 22, A transparent resin adhesive 24 that bonds and fixes the optical element 10 and the transparent member 22 is provided. Here, as the optical element 10, one or both of a light receiving element and a light emitting element are provided in the optical device 1. The light receiving element is an image sensor such as a CMOS sensor or a CCD sensor, and the light emitting element is a laser or a light emitting diode, for example. When the optical element 10 is a light receiving element, the light detection area 14 indicates an imaging area. As the incident light 26, incident light having a maximum incident angle in a lens system (not shown) to be used is assumed.

  The light detection region 14 is formed in the central portion of the semiconductor substrate 12, and includes a plurality of photoelectric conversion elements (not shown) arranged in a matrix, and a color filter and a microlens provided on each photoelectric conversion element. have.

The peripheral circuit region 16 is formed in a region surrounding the light detection region 14 in the semiconductor substrate 12 and has a circuit for processing an electric signal output from the photoelectric conversion element.
An electrode region 18 including a plurality of electrode terminals 20 is formed in the outermost peripheral region of the semiconductor substrate 12. The electrode terminal 20 is used for connection with an external device. The semiconductor substrate 12 is usually a silicon substrate made of a single crystal of silicon, but other semiconductor substrates may be used.

  The entire surface of the transparent member 22 from the upper end to the lower end of the side surface is formed in a reverse tapered surface, and the taper angle is larger than that of the incident light 26. For example, if the maximum incident angle in the lens system used is 15 °, the taper angle is preferably about 20 °. Further, the bottom surface of the transparent member 22 has a shape having an area larger than at least the light detection region 14 (hereinafter referred to as a large planar shape), and the bottom surface of the transparent member 22 is transparent on the surface of the optical element 10. The resin adhesive 24 is bonded and fixed. The thickness of the transparent member 22 is, for example, 200 μm or more and 500 μm or less, and preferably about 350 μm.

An upper surface and a lower surface of at least a portion of the transparent member 22 disposed above the light detection region 14 are parallel and flat to each other, and form an optical plane.
As a constituent material of the transparent member 22, for example, optical glass, quartz, quartz, optical transparent resin, or the like is used. As an optical transparent resin, epoxy resin, acrylic resin, methacrylic resin, polycarbonate resin, polyolefin resin, polyester resin, fluorine-containing polymer, fluorinated polyimide, etc. are generally used for optics. Any resin material can be used.

  The transparent resin adhesive 24 is for bonding and fixing the optical element 10, particularly the light detection region 14 and the transparent member 22, and is required to be made of an optically transparent material. Further, the refractive index is required to be different from that of the microlens formed in the light detection region 14, and it is particularly desirable that the refractive index is lower than that of the microlens because a light condensing effect can be expected. In addition, when the optical element 10 has a light emitting element, the light detection region 14 becomes a light emitting region.

  With such a configuration, since the taper angle is larger than the incident angle, there is no light incident from the side surface of the transparent member, so that noise light caused by the incident light from the side surface of the transparent member 22 can be suppressed.

  Further, this makes it possible to reduce the size of the optical device, which will be described below with reference to FIG. FIGS. 2A to 2C are image diagrams for explaining the miniaturization effect of the optical device according to the first embodiment. FIGS. 2A to 2C are all wire-bonded. The tip of the capillary 28 was described. FIG. 2A shows an optical device according to the first embodiment of the present invention. FIG. 2B is a side view of the optical device on which the transparent member 22 having the same planar dimension as that of FIG. In FIG. 2C, the planar dimension is increased so that noise light incident from the side surface of the transparent member 22 having no reverse taper formed on the side surface does not reach the light detection region 14, and the reverse taper is formed on the side surface. It is a side view of the optical device carrying the transparent member 22 which is not.

  First, in FIG. 2A, the transparent member 22 is set to have a planar dimension so that normal incident light that is not noise incident from the upper surface thereof reaches the light detection region 14. Therefore, in FIG. 2A, the first incident light 36 at the maximum incident angle reaching the end of the light detection region 14 also enters from the upper surface of the transparent member 22 and reaches the end of the light detection region 14. ing. Next, since the second incident light 26 at the maximum incident angle is smaller than the angle of the reverse taper formed on the side surface of the transparent member 22, it does not reach the side surface of the transparent member 22.

  In addition, the electrode terminal 20 is disposed on the electrode terminal 20 at a position where the capillary 28 does not contact the transparent member 22 even during wire bonding. Furthermore, although the minimum value in the distance between the electrode terminal 20 and the end face of the semiconductor substrate 12 is restricted according to the design rule of the semiconductor substrate, it is assumed that the minimum value is set in FIG. Here, a distance from the end of the transparent member 22 to the electrode terminal 20 is A, and a distance between the electrode terminal 20 and the end face of the semiconductor substrate 12 is B.

  Subsequently, in FIG. 2B, a transparent member 22 having the same planar dimension as that of FIG. 2A and having no reverse taper on the side surface is disposed. In this case, the planar dimensions of the semiconductor substrate 12 are the same as those in FIG. Also in this case, in FIG. 2B, the first incident light 36 at the maximum incident angle reaching the end of the light detection region 14 also enters from the upper surface of the transparent member 22, and enters the end of the light detection region 14. Has reached. However, since the second incident light 26 at the next maximum incident angle is larger than the angle of the side surface of the transparent member 22, it reaches the side surface of the transparent member 22, enters, and reaches the light detection region 14 after refraction. That is, noise light caused by the side surface of the transparent member 22 reaches the light detection region 14.

  For this reason, in FIG. 2C, the planar dimension of the transparent member 22 is set so that incident light from the side surface of the transparent member 22 reaches the outside of the light detection region 14. For this reason, the second incident light 26 at the maximum incident angle does not reach the light detection region 14. Further, the first incident light 36 at the maximum incident angle reaching the end of the light detection region 14 is incident from the upper surface of the transparent member 22 and reaches the end of the light detection region 14. In this case, since the planar dimension of the transparent member 22 is large, the planar dimension of the planar substrate 12 obtained by adding A and B to the planar dimension of the transparent member 22 is also compared with the case of FIG. It is getting bigger.

  That is, in the optical device according to the first embodiment of the present invention, it can be seen that the planar dimension of the semiconductor substrate 12 can be reduced by forming the side surface of the transparent member 22 in a reverse tapered shape.

(Second Embodiment)
FIG. 3 is a diagram showing the structure of the optical device according to the second embodiment, FIG. 3A is a plan view showing the optical device according to the second embodiment, and FIG. 3B is FIG. 3A. It is sectional drawing in the IIIa-IIIa line | wire.

  As shown in FIG. 3, the optical device 2 of the present embodiment includes an optical element 10 having a semiconductor substrate 12, a light detection region 14, a peripheral circuit region 16, and an electrode region 18 including electrode terminals 20, and a first transparent member. 30, the first transparent resin adhesive 24 that bonds and fixes the optical element 10 and the first transparent member 30, the second transparent member 32, the first transparent member 30, and the second transparent member 32 Is provided with a second transparent resin adhesive 34. Here, as the optical element 10, one or both of a light receiving element and a light emitting element are provided in the optical device 2. The light receiving element is an image sensor such as a CMOS sensor or a CCD sensor, and the light emitting element is a laser or a light emitting diode, for example. When the optical element 10 is a light receiving element, the light detection area 14 indicates an imaging area. As the incident light 26, incident light having a maximum incident angle in a lens system (not shown) to be used is assumed.

  The light detection region 14 is formed in the central portion of the semiconductor substrate 12, and includes a plurality of photoelectric conversion elements (not shown) arranged in a matrix, and a color filter and a microlens provided on each photoelectric conversion element. have.

The peripheral circuit region 16 is formed in a region surrounding the light detection region 14 in the semiconductor substrate 12 and has a circuit for processing an electric signal output from the photoelectric conversion element.
An electrode region 18 including a plurality of electrode terminals 20 is formed in the outermost peripheral region of the semiconductor substrate 12. The electrode terminal 20 is used for connection with an external device. The semiconductor substrate 12 is usually a silicon substrate made of a single crystal of silicon, but other semiconductor substrates may be used.

  The first transparent member 30 is preferably formed with a tapered side surface, but the tapered surface may not be formed. Further, the bottom surface of the first transparent member 30 has a planar shape larger than at least the light detection region 14, and the bottom surface of the first transparent member 30 is formed on the surface of the optical element 10 by the transparent resin adhesive 24. Bonded and fixed.

  The entire surface from the upper end to the lower end of the side surface of the second transparent member 32 is formed in a reverse tapered surface, and the taper angle is larger than that of the incident light 26. For example, if the maximum incident angle in the lens system used is 15 °, the taper angle is preferably about 20 °. The bottom surface of the second transparent member 32 has a planar shape larger than at least the light detection region 14, and the bottom surface of the second transparent member 32 adheres to the surface of the first transparent member 30 with a transparent resin. The adhesive 34 is bonded and fixed. The thickness of the second transparent member 32 is, for example, 200 μm or more and 500 μm or less, and preferably about 350 μm.

  Of the first transparent member 30 and the second transparent member 32, at least the upper surface and the lower surface of the portion disposed above the light detection region 14 are parallel and flat to each other, forming an optical plane.

  In addition, as a constituent material of the 1st transparent member 30 and the 2nd transparent member 32, optical glass, quartz, quartz, optical transparent resin, etc. are used, for example. As an optical transparent resin, epoxy resin, acrylic resin, methacrylic resin, polycarbonate resin, polyolefin resin, polyester resin, fluorine-containing polymer, fluorinated polyimide, etc. are generally used for optics. Any resin material can be used.

  The first transparent resin adhesive 24 is used to bond and fix the optical element 10, particularly the light detection region 14 and the first transparent member 30, and is required to be made of an optically transparent material. . Further, the refractive index is required to be different from that of the microlens formed in the light detection region 14, and it is particularly desirable that the refractive index is lower than that of the microlens because a light condensing effect can be expected. The second transparent resin adhesive 34 is also required to be made of an optically transparent material. In addition, when the optical element 10 has a light emitting element, the light detection region 14 becomes a light emitting region.

  By adopting such a configuration, noise light caused by incident light from the side surface of the second transparent member 32 can be suppressed as in the first embodiment. In actual use, it is necessary to shield the side surface of the transparent member 30 to prevent incident light from entering from the side surface of the transparent member 30. In addition, the planar dimension of the optical device 2 can be reduced in combination, and will be described below with reference to FIG.

  4A and 4B are image diagrams for explaining the miniaturization effect of the optical device according to the second embodiment. 4 (a) and 4 (b) are side views of the optical device in which the tip of the capillary 28 is described when wire bonding is performed. FIG. 4A shows an optical device according to the second embodiment of the present invention. FIG. 4B shows an optical device according to the first embodiment of the present invention. Normally, the minimum value in the distance between the electrode terminal 20 and the end face of the semiconductor substrate 12 is limited according to the design rule of the semiconductor substrate, but in FIG. 4 (a) and FIG. 4 (b), the minimum value is set. To do. Here, the distance from the end of the light detection region 14 to the electrode terminal 20 is C, and the distance between the electrode terminal 20 and the end face of the semiconductor substrate 12 is B.

  First, in FIG. 4A, since the side surface of the first transparent member 30 is formed in a tapered surface shape, the first transparent member 30 has a shape that is difficult to contact with the capillary 28 that is thicker upward. For this reason, it is possible to bring the wire bonding closer to the light detection region 14 by adopting a manufacturing process in which the second transparent member 32 is bonded after the wire bonding. That is, the electrode terminal 20 can be brought close to the light detection region 14.

  Next, in FIG. 4B, since the side surface of the transparent member 22 is formed in an inversely tapered shape, a capillary that is thicker toward the top at the upper end where the planar dimension is the largest at the time of wire bonding. Will approach 28. For this reason, the position of the electrode terminal 20 is limited by the planar dimension of the transparent member 22.

  From the above, in the optical device according to the second embodiment of the present invention shown in FIG. 4A, compared with the optical device according to the first embodiment of the present invention shown in FIG. The distance C from the end of the light detection region 14 to the electrode terminal 20 can be reduced. As a result, the planar dimension of the planar substrate 12 including the distance C from the end of the light detection region 14 to the electrode terminal 20 and the distance B between the electrode terminal 20 and the end surface of the semiconductor substrate 12 is added to the light detection region 14. The optical device according to the second embodiment of the present invention can be made small.

(Third embodiment)
FIG. 5 is a view showing the structure of the optical device according to the third embodiment. FIG. 5A is a plan view showing the optical device according to the third embodiment, and FIG. It is sectional drawing in the Va-Va line | wire.

  As shown in FIG. 5, the optical device 3 of the present embodiment includes a semiconductor substrate 12, a light detection region 14, an optical element 10 having an electrode region 18 including a peripheral circuit region 16 and an electrode terminal 20, a transparent member 38, A transparent resin adhesive 24 that bonds and fixes the optical element 10 and the transparent member 38 is provided. Here, as the optical element 10, one or both of a light receiving element and a light emitting element are provided in the optical device 3. The light receiving element is an image sensor such as a CMOS sensor or a CCD sensor, and the light emitting element is a laser or a light emitting diode, for example. When the optical element 10 is a light receiving element, the light detection area 14 indicates an imaging area. As the incident light 26, incident light having a maximum incident angle in a lens system (not shown) to be used is assumed.

  The light detection region 14 is formed in the central portion of the semiconductor substrate 12, and includes a plurality of photoelectric conversion elements (not shown) arranged in a matrix, and a color filter and a microlens provided on each photoelectric conversion element. have.

The peripheral circuit region 16 is formed in a region surrounding the light detection region 14 in the semiconductor substrate 12 and has a circuit for processing an electric signal output from the photoelectric conversion element.
An electrode region 18 including a plurality of electrode terminals 20 is formed in the outermost peripheral region of the semiconductor substrate 12. The electrode terminal 20 is used for connection with an external device. The semiconductor substrate 12 is usually a silicon substrate made of a single crystal of silicon, but other semiconductor substrates may be used.

  The transparent member 38 is formed with a V-groove 40 having an inclined surface at least from the upper end to the inside on the side surface, and the inclination angle of the V-groove upper side surface 42 is larger than the incident light 26. For example, if the maximum incident angle in the lens system used is 15 °, the taper angle is preferably about 20 °. In actual use, it is necessary to shield the lower side surface of the V-groove to prevent the incident light from entering from the side surface of the transparent member 38. Further, the bottom surface of the transparent member 38 has a planar shape larger than at least the light detection region 14, and the bottom surface of the transparent member 38 is bonded and fixed on the surface of the optical element 10 by the transparent resin adhesive 24. The thickness of the transparent member 38 is, for example, 200 μm or more and 500 μm or less, and preferably about 350 μm.

The upper surface and the lower surface of at least a portion of the transparent member 38 disposed above the light detection region 14 are parallel and flat to each other, forming an optical plane.
As a constituent material of the transparent member 38, for example, optical glass, quartz, quartz, optical transparent resin, or the like is used. As an optical transparent resin, epoxy resin, acrylic resin, methacrylic resin, polycarbonate resin, polyolefin resin, polyester resin, fluorine-containing polymer, fluorinated polyimide, etc. are generally used for optics. Any resin material can be used.

  The transparent resin adhesive 24 is for bonding and fixing the optical element 10, particularly the light detection region 14 and the transparent member 38, and is required to be made of an optically transparent material. Further, the refractive index is required to be different from that of the microlens formed in the light detection region 14, and it is particularly desirable that the refractive index is lower than that of the microlens because a light condensing effect can be expected. In addition, when the optical element 10 has a light emitting element, the light detection region 14 becomes a light emitting region.

By adopting such a configuration, similarly to the second embodiment, noise light caused by incident light from the V-groove upper side surface 42 on the side surface of the transparent member 38 can be suppressed.
Further, this makes it possible to reduce the size of the optical device, which will be described below with reference to FIG. FIG. 6 is an image diagram for explaining the miniaturization effect of the optical device according to the third embodiment, and is a side view of the optical device in which the tip of the capillary 28 is described when wire bonding is performed. FIG. 6A shows an optical device according to the third embodiment of the present invention. In FIG. 6B, the planar dimension is increased so that noise light incident from the side surface of the transparent member 38 having no V groove formed on the side surface does not reach the light detection region 14, and a V groove is formed on the side surface. It is a side view of the optical device carrying the transparent member 38 which is not.

  First, in FIG. 6A, the transparent member 38 has a planar dimension so that normal incident light that is not noise incident from the upper surface thereof reaches the light detection region 14. For this reason, in FIG. 6A, the first incident light 36 at the maximum incident angle reaching the end of the light detection region 14 also enters from the upper surface of the transparent member 22 and reaches the end of the light detection region 14. is doing. Next, since the second incident light 26 at the maximum incident angle is smaller than the inclination angle of the V groove upper side surface 42 of the V groove 40 formed on the side surface of the transparent member 38, the V groove upper side surface 42 on the side surface of the transparent member 38. Never reach. In addition, the electrode terminal 20 is disposed at a position where the capillary 28 does not contact the transparent member 38 even during wire bonding. Further, the minimum value of the distance between the electrode terminal 20 and the end face of the semiconductor substrate 12 is limited according to the design rule of the semiconductor substrate, but it is assumed that the minimum value is set in FIG. Here, the distance from the transparent member 38 end to the electrode terminal 20 is A, and the distance between the electrode terminal 20 and the end face of the semiconductor substrate 12 is B.

  In FIG. 6B, the planar dimension of the transparent member 38 is set so that incident light from the side surface of the transparent member 38 reaches the outside of the light detection region 14. For this reason, the second incident light 26 at the maximum incident angle does not reach the light detection region 14. Further, the first incident light 30 at the maximum incident angle reaching the end of the light detection region 14 also enters from the upper surface of the transparent member 38 and reaches the end of the light detection region 14. In this case, since the planar dimension of the transparent member 38 is large, the planar dimension of the planar substrate 12 obtained by adding A and B to the planar dimension of the transparent member 38 is also compared with the case of FIG. It is getting bigger.

  That is, it can be seen that in the optical device according to the third embodiment of the present invention, the planar dimension of the semiconductor substrate 12 can be reduced by forming the V-groove on the side surface of the transparent member 38.

(Fourth embodiment)
As a fourth embodiment of the present invention, an optical device apparatus using the optical device according to the first embodiment and its modification and a manufacturing method thereof will be described.

FIG. 7 is a cross-sectional view showing an optical device device according to the fourth embodiment.
As shown in the figure, the optical device device 5 of this embodiment is mounted on a substrate 54 using a substrate 54 and an adhesive 52, and has the electrode terminal 20 described in the first embodiment. A frame body 58 that is provided on the substrate 54 and surrounds the optical device 1, and an external terminal 56 that is exposed on the outer surface (here, the bottom surface) of the optical device 1 and is connected to the electrode terminal 20 by, for example, a thin metal wire 60. A part of the optical device 1 and the fine metal wire 60 are sealed, and a sealing resin 62 filled in the frame body 58 is provided.

  The sealing resin 62 is preferably filled up to the position of the upper surface end of the transparent member 22, but it is technically difficult to prevent resin burrs from being generated on the upper surface of the transparent member 22. It is preferable to fill the sealing resin 62 to the side. For this reason, in the optical device device 5 of the present embodiment, the upper side surface of the transparent member 22 is exposed. However, since the transparent member 22 has a reverse tapered surface, the incident light 26 does not enter the side surface of the transparent member 22.

The optical device device 5 is preferably used for a camera module or the like.
-First modification-
FIG. 8 is a cross-sectional view showing an optical device device according to a first modification.

  As shown in FIG. 8, the optical device 2 of the optical device device 6 according to the first modified example has a shape different from that of the fourth embodiment on the optical element used in the fourth embodiment. 1 transparent member 30 is mounted thereon, and further a second transparent member 32 is mounted thereon via a second transparent resin adhesive 34, and the optical device 2 is the same as in the second embodiment, Other members are the same as those of the optical device device of the fourth embodiment.

In the optical device device 6 of this modification, it is essential that the filling amount of the sealing resin 62 reaches the side surface of the second transparent member 32.
As in the optical device according to the fourth embodiment, the optical device device 6 having the above-described configuration is caused by the optical element or the surface of the fine metal wire since the upper portion of the optical element or the fine metal wire is covered with the sealing resin. Noise light is not generated.

  In addition, since the optical device 2 is mounted, the planar size of the optical device can be reduced as described in the second embodiment. For this reason, the planar dimension of the optical device device can be reduced.

Hereinafter, a method for manufacturing the optical device device 6 according to the first modification will be described with reference to FIGS.
First, FIG. 9 is a process cross-sectional view illustrating the first transparent member bonding and fixing process in the method of manufacturing the optical device device of the first modification.

First, as shown in FIG. 9A, the optical element 10 described in the first modification is prepared.
Next, as shown in FIG. 9B, the first transparent resin adhesive 24 is applied on the circuit formation surface of the region including the light detection region 14 and the peripheral circuit region 16 in the optical element 10.

  Next, as shown in FIG. 9C, after the first transparent member 30 is aligned with respect to the light detection region 14 of the optical element 10, the first transparent resin adhesive 24 is used to place the first transparent member 30 on the optical element 10. The first transparent member 30 is bonded and fixed. At this time, if the first transparent resin adhesive 24 is an ultraviolet curing type, only the region of the optical element 10 where the first transparent member 30 is bonded is irradiated with ultraviolet rays and cured.

Here, as the constituent material of the transparent member, as described in the first embodiment, not only an inorganic material such as glass, quartz, and quartz, but also a transparent resin material can be used.
Here, for the sake of convenience, what is completed in FIG. 9 is referred to as an optical element + transparent member 11.

  Next, FIG. 10 is a process cross-sectional view showing the manufacturing method of the optical device device of the first modified example, and in the manufacturing process of the optical device device 6 of the modified example, the optical element + transparent member 11 is attached to the substrate 54. It is sectional drawing which shows the process mounted on the top and resin-sealing after wire bonding.

  First, as shown in FIG. 10A, a substrate 54 is prepared, and an adhesive 52 is applied to a predetermined position for mounting the optical element + transparent member 11 in a recess 54A of the substrate. Although an adhesive is used here, an adhesive sheet or the like may be used.

  Next, as shown in FIG. 10B, after aligning the optical element + transparent member 11, the optical element + transparent member 11 is bonded and fixed on the substrate 54 with an adhesive 52. This figure further shows the capillary 28 approaching the electrode terminal 20 for wire bonding. From this, it can be seen that the capillary 28 does not interfere with the first transparent member 30 during wire bonding.

Next, as shown in FIG. 10C, the electrode terminal 20 formed on the optical element 10 and the external electrode 56 formed on the substrate 54 are connected by a thin metal wire 60.
Subsequently, as shown in FIG. 10D, an adhesive 52 is applied to the upper surface of the first transparent member 30, the second transparent member 32 is aligned with the optical element 10, and then the second transparent member 32 is aligned. The second transparent member 32 is bonded and fixed on the first transparent member 30 by the transparent resin adhesive 34. At this time, similarly to the first transparent resin adhesive 34, the second transparent resin adhesive 34 is irradiated with ultraviolet rays only on the region where the second transparent member 32 is bonded if it is an ultraviolet curing type. Harden.

Further, as a constituent material of the transparent member, not only an inorganic material such as glass, quartz, crystal, etc., but also a transparent resin material can be used as in the first transparent resin adhesive.
Finally, as shown in FIG. 10 (e), the sealing resin 62 is injected into the inside of the frame body 58 of the substrate to obtain the optical device device 5.

  As described in the second embodiment, in the method of manufacturing the optical device device 6 according to the first modification, by mounting the second transparent member having a reverse taper after the wire bonding, the wire bonding is performed. It is possible to prevent the capillary used for the interference with the second transparent member, and the planar dimension of the optical device can be reduced. For this reason, the planar dimension of the optical device apparatus can also be reduced.

-Second modification-
FIG. 11 is a cross-sectional view showing an optical device device according to a second modification.
As shown in FIG. 11, the optical device 3 of the optical device device 7 according to the second modification has a shape different from that of the fourth embodiment on the optical element 10 used in the fourth embodiment. The optical device 3 is the same as that of the third embodiment, and the other members are the same as those of the optical device device of the fourth embodiment.

In the optical device device 7 of this modification, it is essential that the filling amount of the sealing resin 62 reaches the V groove upper side surface 42 of the transparent member 38.
The optical device device 7 configured as described above is caused by the optical element and the surface of the fine metal wire since the upper portion of the optical element and the fine metal wire is covered with the sealing resin, similarly to the optical device according to the fourth embodiment. Noise light is not generated.

  Further, since the optical device 3 is mounted, noise light caused by incident light from the V-groove upper side surface 42 on the side surface of the transparent member 38 can be suppressed as described in the third embodiment of the present invention. Furthermore, since there is only one transparent member, it is possible to make the optical device device thinner than in the first modification.

  Further, as described in the third embodiment, in the optical device device 7 according to the second modified example, the planar size of the optical device can be reduced, and thus the planar size of the optical device device is also increased. It can be made smaller.

(Fifth embodiment)
As a fifth embodiment of the present invention, a camera module including the optical device device according to the fourth embodiment will be described.

  FIG. 12 is a cross-sectional view showing a camera module according to the fifth embodiment. The camera module here refers to various devices such as a digital camera, a surveillance camera, a video camera, and a camera for a mobile phone. When used in a camera module, the optical element in the optical device is a light receiving element such as an image sensor.

  The camera module of this embodiment includes a wiring board 201, an optical device device 5 mounted on the wiring board 201, a positioning spacer 203 disposed on the wiring board 201 and around the optical device device 5, and positioning. It is fixed above the wiring board 201 with the spacer 203 in between, a lens barrel base 205 formed with a cylindrical opening above the light detection area (see FIG. 1 and the like), and disposed above the light detection area. A glass plate 207 fixed to the bottom of the opening of the lens barrel base 205, a lens storage portion 209 provided in the opening of the lens barrel base 205, a lens holder 213 fixed in the lens storage portion 209, and a lens The lens 211 is supported by the holder 213 and disposed above the light detection region. The wiring provided on the wiring board 201 is connected to the external terminal 56 of the optical device device 5.

  Since the planar dimension of the optical device device 5 is small, the planar dimension of the camera module of this embodiment is small. Further, since the optical member is disposed on the surface of the optical element, the deviation of the optical axis is small, and a clear image can be taken. In addition, since noise light incident from the side surface of the transparent member is suppressed, an image in which occurrence of smear and flare is suppressed can be obtained.

  In the present embodiment, the optical device device 6 and the optical device device 7 which are two modified examples of the fourth embodiment may be mounted as the optical device device to be mounted.

  INDUSTRIAL APPLICABILITY The present invention can suppress optical noise, achieve downsizing, and is useful for an optical device that emits or receives light, an optical device device that includes the optical device, a camera module, and a method for manufacturing the optical device device. is there.

The figure which shows the structure of the optical device in 1st Embodiment. The image figure for demonstrating the miniaturization effect of the optical device in 1st Embodiment The figure which shows the structure of the optical device in 2nd Embodiment. The image figure for demonstrating the miniaturization effect of the optical device in 2nd Embodiment The figure which shows the structure of the optical device in 3rd Embodiment. The image figure for demonstrating the miniaturization effect of the optical device in 3rd Embodiment Sectional drawing which shows the optical device apparatus in 4th Embodiment Sectional drawing which shows the optical device apparatus in a 1st modification Process sectional drawing which shows the adhesion fixing process of the 1st transparent member in the manufacturing method of the optical device apparatus of a 1st modification. Process sectional drawing which shows the manufacturing method of the optical device apparatus of a 1st modification Sectional drawing which shows the optical device apparatus in a 2nd modification Sectional drawing which shows the camera module in 5th Embodiment The figure which shows the structure of the conventional optical device Image diagram showing optical path of incident light to cover glass

Explanation of symbols

1, 2, 3, 101 Optical device 5, 6, 7 Optical device apparatus 10 Optical element 11 Optical element + transparent member 12 Semiconductor substrate 14 Photodetection area 16 Peripheral circuit area 18 Electrode area 20 Electrode terminal 22, 30, 32, 38 , 110 Transparent member 24, 34 Transparent resin adhesive 26, 36 Incident light 28 Capillary 40 V groove 42 Upper surface of V groove 52 Adhesive 54A Substrate recess 54 Substrate 56 External terminal 58 Frame 60 Metal fine wire 62 Sealing resin 201 Wiring board 203 Positioning spacer 205 Lens barrel base 207 Glass plate 209 Lens housing portion 211 Lens 213 Lens holder

Claims (12)

An optical element having at least a detection region capable of detecting an incident light and emitting a light and an electrode region on which an electrode terminal for connection to an external circuit is formed;
A transparent member having a plane dimension larger than at least the detection region disposed on at least the circuit formation surface of the detection region;
A transparent adhesive for bonding and fixing the optical element and the transparent member, and the entire surface from the upper end to the lower end of the side surface of the transparent member is formed in a reverse tapered surface shape having a taper angle larger than the maximum incident angle of the incident light. An optical device formed. An optical element having at least a detection region capable of detecting an incident light and emitting a light and an electrode region on which an electrode terminal for connection to an external circuit is formed;
A first transparent member having a plane dimension larger than at least the detection region disposed on a circuit forming surface of at least the detection region;
A transparent first adhesive that bonds and fixes the optical element and the first transparent member;
A second transparent member disposed on the first transparent member;
A transparent second adhesive for adhering and fixing the first transparent member and the second transparent member, and the maximum incidence of the incident light on the entire surface from the upper end to the lower end of the side surface of the second transparent member An optical device, wherein the optical device is formed in a reverse tapered surface shape having a taper angle larger than the corner.   The optical device according to claim 2, wherein a side surface of the first transparent member is formed in a tapered shape. An optical element having at least a detection region capable of detecting an incident light and emitting a light and an electrode region on which an electrode terminal for connection to an external circuit is formed;
A transparent member having a plane dimension larger than at least the detection region disposed on at least the circuit formation surface of the detection region;
A transparent adhesive that bonds and fixes the optical element and the transparent member;
An optical device, wherein a V-groove having an inclined surface having an inclination angle larger than a maximum incident angle of the incident light is formed at least on the side surface of the transparent member from the upper end to the inside. The electrode region is formed around the detection region,
The optical device according to claim 1, wherein the transparent member is disposed at least on the detection region. The optical element further includes a plurality of microlenses provided on the detection region,
The optical device according to claim 1, wherein the adhesive has a refractive index different from that of the plurality of microlenses.   5. The optical device according to claim 1, wherein the transparent member is made of any one material of optical glass, quartz, crystal, or optical transparent resin.   The optical device according to claim 1, wherein an antireflection film is formed on a side surface of the transparent member.   The optical device according to claim 1, wherein the optical element includes a light receiving element or both a light receiving element and a light emitting element. A substrate,
The optical device according to any one of claims 1 to 9, which is mounted on the substrate;
A frame provided on the substrate so as to surround the optical device;
An external terminal electrically connected to the electrode terminal of the optical device;
An optical device apparatus comprising: a sealing resin that opens and seals at least the transparent member on the optical device.   A camera module comprising the optical device device according to claim 10. An optical element having at least a detection region capable of detecting an incident light and emitting a light and an electrode region on which an electrode terminal for connection to an external circuit is formed, and at least on a circuit formation surface of the detection region An optical device comprising a first transparent member having a planar dimension larger than at least the detection region and a transparent first adhesive that bonds and fixes the optical element and the first transparent member to a substrate. Mounting process,
Electrically connecting the electrode terminal of the optical device and an external terminal provided on the substrate;
Bonding the second transparent member formed on the entire surface from the upper end to the lower end of the side surface in a reverse tapered surface shape having a taper angle larger than the maximum incident angle of the incident light on the first transparent member;
A step of opening the optical device on at least the second transparent member and sealing with resin, and after electrically connecting the electrode terminal of the optical device and the external terminal provided on the substrate, A method for manufacturing an optical device device, comprising bonding the second transparent member.

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