CN118155937A - Anisotropic conductive film and preparation method thereof - Google Patents
Anisotropic conductive film and preparation method thereof Download PDFInfo
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- CN118155937A CN118155937A CN202410552003.XA CN202410552003A CN118155937A CN 118155937 A CN118155937 A CN 118155937A CN 202410552003 A CN202410552003 A CN 202410552003A CN 118155937 A CN118155937 A CN 118155937A
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- transfer printing
- anisotropic conductive
- resin adhesive
- conductive film
- microspheres
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- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000004005 microsphere Substances 0.000 claims abstract description 78
- 229920005989 resin Polymers 0.000 claims abstract description 75
- 239000011347 resin Substances 0.000 claims abstract description 75
- 238000010023 transfer printing Methods 0.000 claims abstract description 55
- 239000002313 adhesive film Substances 0.000 claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 239000003822 epoxy resin Substances 0.000 claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 35
- 230000008569 process Effects 0.000 claims abstract description 22
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 239000002002 slurry Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000007822 coupling agent Substances 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 239000012745 toughening agent Substances 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 36
- 238000012546 transfer Methods 0.000 claims description 25
- 238000001723 curing Methods 0.000 claims description 21
- 238000001035 drying Methods 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 8
- -1 alicyclic glycidyl ester Chemical class 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011258 core-shell material Substances 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 229910021485 fumed silica Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000000016 photochemical curing Methods 0.000 claims description 5
- 238000007781 pre-processing Methods 0.000 claims description 5
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 claims description 3
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 claims description 3
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 17
- 238000012360 testing method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The invention provides an anisotropic conductive film and a preparation method thereof, and provides conductive microspheres distributed in an array, wherein the conductive microspheres are uniformly distributed in a miniature transfer printing die in an array mode, and each conductive microsphere is arranged in a hole of the miniature transfer printing die; preparing a resin adhesive film, namely fully stirring 20-45% of epoxy resin, 10-50% of solvent, 10-18% of toughening agent, 1-10% of curing agent, 0.1-5% of coupling agent and 1-20% of thixotropic agent into slurry according to mass ratio, and coating the slurry on a release film by using a coating machine to prepare the resin adhesive film; covering the resin adhesive film on the conductive microspheres distributed in the array for transfer printing, and transferring the conductive microspheres onto the resin adhesive film through a jacking mechanism of a miniature transfer printing die in the transfer printing process to form an ACF layer; the invention improves the transfer printing rate of the conductive microspheres through the miniature transfer printing die.
Description
Technical Field
The specification relates to the technical field of conductive films, in particular to an anisotropic conductive film and a preparation method thereof.
Background
Along with miniaturization of chip size, intelligent equipment is becoming more miniaturized and portable, and an ACF layer is adopted for connecting an NCF layer in the common anisotropic conductive film at present; the adhesive film prepared by the conventional method has a single-layer structure, the fluidity is high, 80-90% of conductive particles flow to the SPACE between the electrodes along with the melt flow of the resin, more particles are gathered at the SPACE to easily cause the connection of adjacent electrodes so as to be short-circuited, and meanwhile, the uniformity is poor in the conductive particle transfer process by adopting the conventional die, so that the conductive microsphere transfer rate is low.
Accordingly, it is desirable to provide an anisotropic conductive film and a method of manufacturing the same.
Disclosure of Invention
One of the embodiments of the present disclosure provides a method for preparing an anisotropic conductive film, which realizes uniform distribution of conductive microspheres in an array, improves transfer rate of the conductive microspheres, and makes the conductive film have better conductive performance.
A method for preparing an anisotropic conductive film, comprising the steps of:
S1, providing conductive microspheres distributed in an array, wherein the conductive microspheres are uniformly distributed in an array in a micro transfer printing die, and each conductive microsphere is arranged in a hole of the micro transfer printing die; holes distributed in an array are uniformly formed in the micro transfer printing die, the micro transfer printing die is connected with a jacking mechanism in a sliding manner, the jacking mechanism comprises a jacking plate, an elastic piece and a thimble, the jacking plate is connected with the side wall of the micro transfer printing die in a sliding manner, the elastic piece is connected between the jacking plate and the upper bottom of the micro transfer printing die, the thimble is fixed on the jacking plate, and the thimble is correspondingly arranged in the hole; the air blowing mechanism is arranged at the joint of the thimble and the hole and comprises an air inlet and an air storage cavity, the air storage cavity is provided with the air inlet, and the top of the air storage cavity is provided with the air outlet.
S2, preparing a resin adhesive film, namely fully stirring 20-45% of epoxy resin, 10-50% of solvent, 10-18% of toughening agent, 1-10% of curing agent, 0.1-5% of coupling agent and 1-20% of thixotropic agent into slurry according to mass ratio, and coating the slurry on a release film by using a coating machine to prepare the resin adhesive film;
S3, covering the resin adhesive film on the conductive microspheres distributed in the array for transfer printing, and transferring the conductive microspheres onto the resin adhesive film through a jacking mechanism of a miniature transfer printing die in the transfer printing process to form an ACF layer;
S4, preprocessing is realized in the S3 transfer printing process, the resin adhesive film is softened by hot air through a jacking mechanism, and the conductive microspheres are quickly embedded into the resin adhesive layer;
s5, performing photo-pre-curing on the ACF layer, and performing UV photo-curing on the ACF layer to enable the conductive microspheres distributed in the array to be pre-cured on the resin adhesive film;
S6, coating resin dispersion liquid on one side or two sides of the resin adhesive film containing the conductive microspheres distributed in an array to form an NCF layer, wherein the thickness of the single NCF layer is 3-20 mu m, and drying to obtain the anisotropic conductive film.
The epoxy resin in the S2 is a mixture of NPEL epoxy resin and multifunctional epoxy resin; the multifunctional epoxy resin is alicyclic glycidyl ester type multifunctional epoxy resin EPM-386; the solvent is at least one selected from p-tert-butylphenyl glycidyl ether, phenyl glycidyl ether and trimethylolethane triglycidyl ether; the toughening agent is core-shell toughened epoxy resin EPX-125; the curing agent is DDA-5; the coupling agent is a silane coupling agent; the thixotropic agent is fumed silica.
Specifically, the thickness of the resin adhesive film is 3-10 mu m.
Specifically, the thickness of the resin adhesive film is 3-5 μm.
Specifically, the conductive microspheres have a diameter of 3 μm, and the conductive microspheres are used in the ACF layer in an amount of 1 to 30% by weight, preferably 5 to 20% by weight, based on the total weight of the conductive microspheres after transfer, and may be conductive particles conventionally used in anisotropic conductive films, for example, metal particles such as gold particles, silver particles, nickel particles, or the like, resin particles such as benzoguanamine resin, styrene resin, or the like, or metal-coated resin particles such as gold, nickel, zinc, or the like, coated on the resin particle surfaces thereof.
Specifically, the thixotropic agent accounts for 8-15% by mass.
Specifically, the drying temperature is 30-80 ℃ and the drying time is 1-8 min.
Specifically, the drying temperature is 40-60 ℃ and the drying time is 3-5 min.
Specifically, the maximum diameter of the cavity of the micro transfer mold is 3-6 μm.
Specifically, the diameter of the holes is 3-3.5 μm.
Specifically, the guiding mechanism is installed to mechanism of blowing and thimble junction, guiding mechanism includes the mount, the spliced pole, uide bushing and guiding hole, the center department sliding connection of gas storage cavity has the spliced pole, the top board is connected to the one end of spliced pole, the thimble is connected to the other one end of spliced pole, be fixed with hollow cylindrical mount on the spliced pole, and the mount is located the thimble outside, the tip fixedly connected with elasticity tubaeform uide bushing of mount, and the outward flange of uide bushing and the lateral wall fixed connection in hole, evenly be equipped with conical guiding hole on the uide bushing, and the air inlet of guiding hole is greater than the gas outlet.
Specifically, the holes are in a conical structure.
Specifically, the elastic piece is a spring or a shrapnel.
The invention also provides another embodiment of the anisotropic conductive film, which is prepared by the preparation method.
The beneficial effects of the invention are as follows:
(1) The invention improves the transfer printing rate of the conductive microspheres through the miniature transfer printing die.
(2) The thixotropic agent is added into the resin adhesive film to reduce the fluidity of the internal conductive microspheres, and in the transfer printing process, the conductive microspheres are quickly and correctly embedded into the resin adhesive film in an array mode through the double matching effect of hot air and the pre-pressing mechanism, meanwhile, the hot air is uniformly discharged from the conductive microspheres, so that the resin adhesive film can be softened, and the conductive microspheres are further improved to smoothly enter the resin adhesive film.
(3) The ACF layer micro-flow can ensure that conductive particles are added with fewer particles than the conventional flowable adhesive film under the pressure condition of pressurizing and heating, but have higher conductive particle capturing rate, reduce cost, reduce connection impedance and avoid short circuit.
Drawings
The present specification will be further elucidated by way of example embodiments, which will be described in detail by means of the accompanying drawings. The embodiments are not limiting, in which like numerals represent like structures, wherein:
FIG. 1 is a flow chart of a method of preparation according to some embodiments of the present description;
FIG. 2 is a schematic diagram of the overall structure of the micro transfer mold of the present invention;
FIG. 3 is a schematic diagram of the hole distribution of the micro transfer mold of the present invention;
FIG. 4 is a schematic representation of the transfer of conductive microspheres using a micro transfer mold in accordance with the present invention;
FIG. 5 is a schematic diagram showing a state of transferring conductive microspheres using a micro transfer mold according to the present invention;
FIG. 6 is a schematic diagram showing a three-stage transfer of conductive microspheres using a micro transfer mold according to the present invention;
FIG. 7 is an enlarged schematic view of the invention at A in FIG. 2;
FIG. 8 is an enlarged schematic view of the invention at B in FIG. 2;
FIG. 9 is a schematic view of the structure of conductive films of different thicknesses according to the present invention;
FIG. 10 is a graph of conductive film test for different thicknesses of the present invention;
FIG. 11 is a schematic diagram showing the distribution of the conductive microspheres of the present invention under a microscope.
In the accompanying drawings: 1. a miniature transfer mold; 11. a hole; 12. a protrusion; 2. conductive microspheres; 3. a jacking mechanism; 31. a top pressing plate; 32. an elastic member; 33. a thimble; 4. an air blowing mechanism; 41. an air inlet; 42. a gas storage cavity; 5. a guide mechanism; 51. a fixing frame; 52. a connecting column; 53. a guide sleeve; 54. a guide hole; 6. and (3) a resin adhesive layer.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present specification, and it is possible for those of ordinary skill in the art to apply the present specification to other similar situations according to the drawings without inventive effort. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.
It will be appreciated that "system," "apparatus," "unit" and/or "module" as used herein is one method for distinguishing between different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.
As used in this specification and the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.
A flowchart is used in this specification to describe the operations performed by the system according to embodiments of the present specification. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.
Example 1
As shown in fig. 1 to 11, a method for preparing an anisotropic conductive film, the method comprising the steps of:
S1, providing conductive microspheres 2 distributed in an array, wherein the conductive microspheres 2 are uniformly distributed in an array in a micro transfer printing die 1, and each conductive microsphere 2 is arranged in a hole 11 of the micro transfer printing die 1; holes 11 distributed in an array are uniformly formed in the micro transfer printing die 1, the micro transfer printing die 1 is connected with a jacking mechanism 3 in a sliding manner, the jacking mechanism 3 comprises a jacking plate 31, an elastic piece 32 and a thimble 33, the jacking plate 31 is connected with the side wall of the micro transfer printing die 1 in a sliding manner, the elastic piece 32 is connected between the jacking plate 31 and the upper bottom of the micro transfer printing die 1, the thimble 33 is fixed on the jacking plate 31, and the thimble 33 is correspondingly arranged in the holes 11; the air blowing mechanism 4 is arranged at the joint of the thimble 33 and the hole 11, the air blowing mechanism 4 comprises an air inlet 41 and an air storage cavity 42, the air inlet 41 is arranged on the air storage cavity 42, and an air outlet hole is arranged at the top of the air storage cavity 42;
S2, preparing a resin adhesive film, fully stirring 20% of epoxy resin, 10% of solvent, 10% of toughening agent, 1% of curing agent, 0.1% of coupling agent and 1% of thixotropic agent into slurry according to mass ratio, and coating the slurry on a release film by using a coating machine to prepare the resin adhesive film;
S3, covering the resin adhesive film on the conductive microspheres 2 distributed in the array for transfer printing, and transferring the conductive microspheres 2 onto the resin adhesive layer 6 through a pressing mechanism 3 of the micro transfer printing die 1 in the transfer printing process to form an ACF layer;
s4, preprocessing is realized in the S3 transfer printing process, hot air softens the resin adhesive film through the jacking mechanism 3, and the conductive microspheres are quickly embedded into the resin adhesive layer 6;
S5, performing photo-pre-curing on the ACF layer, and performing UV photo-curing on the ACF layer to enable the conductive microspheres 2 distributed in the array to be pre-cured on the resin adhesive film; the pre-cured ACF layer has certain hardness, the fluidity is reduced compared with the ACF layer which is not subjected to curing, the heated and pressed fluidity of the ACF layer is reduced in the later stage of application of the pressure, the deformation is reduced, and the arrangement of the conductive particle array form is not easy to be damaged.
And S6, coating resin dispersion liquid on one side or two sides of the conductive microspheres 2 which are distributed in an array on the resin adhesive film to form an NCF layer, and performing hot pressing curing treatment to obtain the anisotropic conductive film.
Preferably, the epoxy resin in the step S2 is a mixture of NPEL epoxy resin and multifunctional epoxy resin; the multifunctional epoxy resin is alicyclic glycidyl ester type multifunctional epoxy resin EPM-386; the solvent is p-tert-butylphenyl glycidyl ether; the toughening agent is core-shell toughened epoxy resin EPX-125 (EPX-125 is provided by Hubei Maidsao chemical industry Co., ltd. Or Shanghai complex high new material Co., ltd.); the curing agent is DDA-5; the coupling agent is a silane coupling agent; the thixotropic agent is fumed silica.
Specifically, the thickness of the resin adhesive film is 3 μm.
Preferably, the thickness of the resin film is 3 μm.
Further, the diameter of the conductive microsphere is 3 μm.
The thixotropic agent is 8% in mass ratio.
Specifically, the drying temperature was 30℃and the time was 1min.
The drying temperature was 40℃and the time was 3min.
Specifically, the maximum diameter of the cavity 11 of the micro transfer mold 1 is 3 μm.
Preferably, the diameter of the cavity 11 is 3. Mu.m.
Example two
The technical scheme of the embodiment is basically the same as that of the first embodiment, except that 45% of epoxy resin, 50% of solvent, 18% of toughening agent, 10% of curing agent, 5% of coupling agent and 20% of thixotropic agent are fully stirred into slurry according to the mass ratio when preparing the resin adhesive film in the step S2, and then the slurry is coated on a release film by using a coating machine to prepare the resin adhesive film;
S3, covering the resin adhesive film on the conductive microspheres 2 distributed in the array for transfer printing, and transferring the conductive microspheres 2 onto the resin adhesive layer 6 through a pressing mechanism 3 of the micro transfer printing die 1 in the transfer printing process to form an ACF layer;
s4, preprocessing is realized in the S3 transfer printing process, hot air softens the resin adhesive film through the jacking mechanism 3, and the conductive microspheres are quickly embedded into the resin adhesive layer 6;
S5, performing photo-pre-curing on the ACF layer, and performing UV photo-curing on the ACF layer to enable the conductive microspheres 2 distributed in the array to be pre-cured on the resin adhesive film; the pre-cured ACF layer has certain hardness, the fluidity is reduced compared with the ACF layer which is not subjected to curing, the heated and pressed fluidity of the ACF layer is reduced in the later stage of application of the pressure, the deformation is reduced, and the arrangement of the conductive particle array form is not easy to be damaged.
And S6, coating resin dispersion liquid on one side or two sides of the conductive microspheres 2 which are distributed in an array on the resin adhesive film to form an NCF layer, and performing hot pressing curing treatment to obtain the anisotropic conductive film.
Preferably, the epoxy resin in the step S2 is a mixture of NPEL epoxy resin and multifunctional epoxy resin; the multifunctional epoxy resin is alicyclic glycidyl ester type multifunctional epoxy resin EPM-386; the solvent is phenyl glycidyl ether; the toughening agent is core-shell toughened epoxy resin provided by Hubei Maillard chemical industry Co., ltd, and EPX-125 provided by Shanghai complex high new material Co., ltd; the curing agent is DDA-5; the coupling agent is a silane coupling agent; the thixotropic agent is fumed silica.
Specifically, the thickness of the resin adhesive film is 10 μm.
Preferably, the thickness of the resin film is 5 μm.
Further, the diameter of the conductive microsphere is 3 μm.
The thixotropic agent is 15% by mass.
Specifically, the drying temperature was 80℃and the drying time was 8min.
The drying temperature was 60℃and the time was 5min.
Specifically, the maximum diameter of the cavity 11 of the micro transfer mold 1 is 4 μm.
Preferably, the diameter of the cavity 11 is 3.5. Mu.m.
Example III
The technical scheme of the embodiment is basically the same as that of the first and second embodiments, except that when the resin adhesive film is prepared in the step S2, 30% of epoxy resin, 30% of solvent, 15% of toughening agent, 5% of curing agent, 2% of coupling agent and 15% of thixotropic agent are fully stirred into slurry according to mass ratio, and then the slurry is coated on a release film by using a coating machine to prepare the resin adhesive film;
S3, covering the resin adhesive film on the conductive microspheres 2 distributed in the array for transfer printing, and transferring the conductive microspheres 2 onto the resin adhesive layer 6 through a pressing mechanism 3 of the micro transfer printing die 1 in the transfer printing process to form an ACF layer;
s4, preprocessing is realized in the S3 transfer printing process, hot air softens the resin adhesive film through the jacking mechanism 3, and the conductive microspheres are quickly embedded into the resin adhesive layer 6;
S5, performing photo-pre-curing on the ACF layer, and performing UV photo-curing on the ACF layer to enable the conductive microspheres 2 distributed in the array to be pre-cured on the resin adhesive film; the pre-cured ACF layer has certain hardness, the fluidity is reduced compared with the ACF layer which is not subjected to curing, the heated and pressed fluidity of the ACF layer is reduced in the later stage of application of the pressure, the deformation is reduced, and the arrangement of the conductive particle array form is not easy to be damaged.
And S6, coating resin dispersion liquid on one side or two sides of the conductive microspheres 2 which are distributed in an array on the resin adhesive film to form an NCF layer, and performing hot pressing curing treatment to obtain the anisotropic conductive film.
Preferably, the epoxy resin in the step S2 is a mixture of NPEL epoxy resin and multifunctional epoxy resin; the multifunctional epoxy resin is alicyclic glycidyl ester type multifunctional epoxy resin EPM-386; the solvent is trimethylolethane triglycidyl ether; the toughening agent is core-shell toughened epoxy resin provided by Hubei Maillard chemical industry Co., ltd, and EPX-125 provided by Shanghai complex high new material Co., ltd; the curing agent is DDA-5; the coupling agent is a silane coupling agent; the thixotropic agent is fumed silica.
Specifically, the thickness of the resin adhesive film is 5 μm.
Preferably, the thickness of the resin film is 5 μm.
Further, the diameter of the conductive microsphere is 3 μm.
The thixotropic agent is 10% by mass.
Specifically, the drying temperature was 50℃and the time was 5min.
The drying temperature was 50℃and the time was 4min.
Specifically, the maximum diameter of the cavity 11 of the micro transfer mold 1 is 3 μm.
Preferably, the diameter of the cavity 11 is 3. Mu.m.
The conductive films produced in examples one, two and three were tested to meet the use requirements.
Example IV
The technical scheme of the embodiment is basically the same as that of the first, second and third embodiments, except that a guide mechanism 5 is arranged at the joint of the air blowing mechanism 4 and the thimble 33, and the guide mechanism 5 comprises a fixing frame 51, a connecting column 52, a guide sleeve 53 and a guide hole 54; the center of the air storage cavity 42 is slidably connected with a connecting column 52, one end of the connecting column 52 is connected with the top pressing plate 31, the other end of the connecting column 52 is connected with the thimble 33, a hollow cylindrical fixing frame 51 is fixed on the connecting column 52, the fixing frame 51 is positioned on the outer side of the thimble 33, the end part of the fixing frame 51 is fixedly connected with an elastic horn-shaped guide sleeve 53, the outer edge of the guide sleeve 53 is fixedly connected with the side wall of the hole 11, conical guide holes 54 are uniformly formed in the guide sleeve 53, and the air inlet of the guide holes 54 is larger than the air outlet.
Preferably, the hole 11 has a conical structure, which prevents the conductive microsphere 2 from being blocked in the hole 11, and is beneficial to pushing out the hot air inside when the ejector pin 33 is ejected.
Preferably, the elastic member 32 is a spring or a shrapnel, so as to facilitate the resetting of the micro transfer mold 1.
In the specific production and manufacturing process, the provided conductive microspheres 2 distributed in an array are uniformly distributed in a micro transfer printing die 1, and each conductive microsphere 2 is arranged in a hole 11 of the micro transfer printing die 1; elastic hemispherical bulges 12 are uniformly arranged on the holes 11 along the circumferential direction, the hemispherical bulges 12 can reduce the contact area between the conductive microspheres 2 and the holes 11, in order to realize the subsequent rapid transfer of the conductive microspheres 2 into resin adhesive, save transfer time and improve transfer efficiency, in the transfer process, the conductive microspheres 2 are transferred onto the resin adhesive layer 6 through the jacking mechanism 3 of the miniature transfer mold 1 to form an ACF layer, in specific operation, each hole 11 is internally provided with one conductive microsphere 2, the jacking plate 31 of the externally arranged jacking mechanism 3 moves upwards under external micro-power to drive the ejector pins 33 on the jacking plate 31 to move upwards, the ejector pins 33 gradually contact with the conductive microspheres 2 and eject the conductive microspheres 2 in the movement process, the conductive microspheres 2 can be rapidly jacked into the resin adhesive layer 6 from the holes 11 to accelerate the transfer efficiency, as shown in FIG. 11, the conductive microspheres 2 with 3 μm are uniformly distributed in an array under a microscope, which means that the micro transfer printing die 1 can improve the transfer printing rate, the efficiency is greatly improved in the transfer printing process of the conductive microspheres 2, meanwhile, the conductive microspheres 2 with high transfer printing rate can ensure that the stability of the anisotropic film is better in the subsequent use process, further, in the jacking process of the jacking mechanism 3, the conically arranged holes 11 can prevent the conductive microspheres 2 from being clamped, the guiding mechanism 5 arranged in the holes 11 can prevent the ejector pins 33 from shifting in the jacking process, the transfer printing of the conductive microspheres 2 is ensured, the blowing mechanism 4 in the holes 11 can soften the resin adhesive layer 6 by hot air in the jacking process, ensure that the conductive microspheres 2 quickly enter the resin adhesive layer 6, and prevent the conductive microspheres 2 from shifting, the thimble 33 can compress the guide sleeve 53 in the pressing process, and can push out the hot air in the upper half part of the hole 11 from the edge gap of the conductive microsphere 2.
Example five
The embodiment of the present disclosure further provides an anisotropic conductive film, which is prepared by the above preparation method, and fig. 9 is a graph of various types of conductive films, and fig. 10 is a graph of peel force test for four types of conductive films, the test speed is 50.000mm/min, the maximum force for the type one conductive film test is 23.00N, the deformation is minimum, the maximum force for the type two conductive film test is 19.13N, the deformation is centered, the maximum force for the type three conductive film test is 17.02N, the deformation is maximum, the maximum force for the type four conductive film test is 16.45N, and the deformation is centered.
According to the invention, the tester is adopted to detect particles captured by the electrode region, and the transfer rate of the invention is improved because the ACF layer hardly flows.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the foregoing examples, and that the foregoing description and description are merely illustrative of the principles of this invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (14)
1. A method for preparing an anisotropic conductive film, comprising the steps of:
S1, providing conductive microspheres (2) distributed in an array, wherein the conductive microspheres (2) are uniformly distributed in an array in a micro transfer printing die (1), and each conductive microsphere (2) is arranged in a hole (11) of the micro transfer printing die (1); holes (11) distributed in an array are uniformly formed in the micro transfer printing die (1), the micro transfer printing die (1) is connected with a jacking mechanism (3) in a sliding mode, the jacking mechanism (3) comprises a jacking plate (31), an elastic piece (32) and a thimble (33), the jacking plate (31) is connected with the side wall of the micro transfer printing die (1) in a sliding mode, the elastic piece (32) is connected between the jacking plate (31) and the upper bottom of the micro transfer printing die (1), the thimble (33) is fixed on the jacking plate (31), and the thimble (33) is correspondingly arranged in the holes (11); the air blowing mechanism (4) is arranged at the joint of the thimble (33) and the hole (11), the air blowing mechanism (4) comprises an air inlet (41) and an air storage cavity (42), the air inlet (41) is arranged on the air storage cavity (42), and an air outlet hole is arranged at the top of the air storage cavity (42);
S2, preparing a resin adhesive film, namely fully stirring 20-45% of epoxy resin, 10-50% of solvent, 10-18% of toughening agent, 1-10% of curing agent, 0.1-5% of coupling agent and 1-20% of thixotropic agent into slurry according to mass ratio, and coating the slurry on a release film by using a coating machine to prepare the resin adhesive film;
s3, covering the resin adhesive film on the conductive microspheres (2) distributed in the array for transfer printing, and transferring the conductive microspheres (2) to the inside of the resin adhesive layer (6) through a pressing mechanism (3) of a miniature transfer printing die (1) in the transfer printing process to form an ACF layer;
S4, preprocessing is realized in the S3 transfer printing process, the resin adhesive film is softened by hot air through the jacking mechanism (3), and the conductive microspheres are quickly embedded into the resin adhesive layer (6);
s5, performing photo-pre-curing on the ACF layer, and performing UV photo-curing on the ACF layer to enable the conductive microspheres (2) distributed in the array to be pre-cured on the resin adhesive film;
and S6, coating resin dispersion liquid on one side or two sides of the conductive microspheres (2) which are distributed in an array on the resin adhesive film to form an NCF layer, and drying to obtain the anisotropic conductive adhesive film.
2. The method of manufacturing an anisotropic conductive film according to claim 1, wherein the epoxy resin in S2 is a mixture of NPEL epoxy resin and multifunctional epoxy resin; the multifunctional epoxy resin is alicyclic glycidyl ester type multifunctional epoxy resin EPM-386; the solvent is at least one selected from p-tert-butylphenyl glycidyl ether, phenyl glycidyl ether and trimethylolethane triglycidyl ether; the toughening agent is core-shell toughened epoxy resin EPX-125; the curing agent is DDA-5; the coupling agent is a silane coupling agent; the thixotropic agent is fumed silica.
3. The method for producing an anisotropic conductive film according to claim 2, wherein the thickness of the resin film is 3-10 μm.
4. The method for producing an anisotropic conductive film according to claim 2, wherein the thickness of the resin film is 3-5 μm.
5. The method for producing an anisotropic conductive film according to claim 1, wherein the conductive microspheres have a diameter of 3 μm.
6. The method for producing an anisotropic conductive film according to claim 1, wherein the thixotropic agent is 8 to 15% by mass.
7. The method for producing an anisotropic conductive film according to claim 1, wherein the drying temperature is 30 to 80 ℃ and the time is 1 to 8 minutes.
8. The method of producing an anisotropic conductive film according to claim 6, wherein the drying temperature is 40 to 60 ℃ and the time is 3 to 5 minutes.
9. The method for producing an anisotropic conductive film according to claim 1, wherein the maximum diameter of the cavity (11) of the micro transfer mold (1) is 3 to 4 μm.
10. The method of producing an anisotropic conductive film according to claim 8, wherein the holes (11) have a diameter of 3 to 3.5 μm.
11. The method for preparing the anisotropic conductive film according to claim 9, wherein the connection part of the air blowing mechanism (4) and the ejector pin (33) is provided with the guide mechanism (5), the guide mechanism (5) comprises a fixing frame (51), a connecting column (52), a guide sleeve (53) and a guide hole (54), the connecting column (52) is slidably connected to the center of the air storage cavity (42), one end of the connecting column (52) is connected with the ejector plate (31), the other end of the connecting column (52) is connected with the ejector pin (33), the connecting column (52) is fixedly provided with a hollow cylindrical fixing frame (51), the fixing frame (51) is positioned at the outer side of the ejector pin (33), the end part of the fixing frame (51) is fixedly connected with the elastic horn-shaped guide sleeve (53), the outer edge of the guide sleeve (53) is fixedly connected with the side wall of the hole (11), the guide sleeve (53) is uniformly provided with the conical guide hole (54), and the air inlet of the guide hole (54) is larger than the air outlet.
12. The method of producing an anisotropic conductive film according to claim 10, wherein the cavity (11) has a tapered structure.
13. The method of manufacturing an anisotropic conductive film according to claim 11, wherein the elastic member (32) is a spring or a leaf spring.
14. An anisotropic conductive film prepared by the method of any one of claims 1-11.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030019662A (en) * | 2001-08-29 | 2003-03-07 | 주식회사 엘지화학 | Reflection Cloth with Microsphere and the method of Manufacturing thereof |
| WO2015102304A1 (en) * | 2013-12-31 | 2015-07-09 | 주식회사 아이에스시 | Sheet-type connector and electrical connector device |
| JP2015149125A (en) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | Anisotropic conductive film and method for manufacturing the same |
| CN111009806A (en) * | 2018-10-05 | 2020-04-14 | 株式会社Isc | Method for producing conductive particles and conductive particles produced by the method |
| KR20230157257A (en) * | 2022-05-09 | 2023-11-16 | 주식회사 마이다스에이치앤티 | Stretchable anisotropic conductive film containing conductive balls and its manufacturing method |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030019662A (en) * | 2001-08-29 | 2003-03-07 | 주식회사 엘지화학 | Reflection Cloth with Microsphere and the method of Manufacturing thereof |
| WO2015102304A1 (en) * | 2013-12-31 | 2015-07-09 | 주식회사 아이에스시 | Sheet-type connector and electrical connector device |
| JP2015149125A (en) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | Anisotropic conductive film and method for manufacturing the same |
| CN111009806A (en) * | 2018-10-05 | 2020-04-14 | 株式会社Isc | Method for producing conductive particles and conductive particles produced by the method |
| KR20230157257A (en) * | 2022-05-09 | 2023-11-16 | 주식회사 마이다스에이치앤티 | Stretchable anisotropic conductive film containing conductive balls and its manufacturing method |
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