CN118076074A - Temperature equalizing plate, shell and electronic equipment - Google Patents

Abstract

The invention provides a temperature equalizing plate, which comprises a first packaging shell, a second packaging shell and a middle plate, wherein the first packaging shell is connected to one side surface of the middle plate in a sealing way so as to form a first fluid space; the second packaging shell is connected to the other opposite side face of the middle plate in a sealing mode so as to form a second fluid space; and a through hole and/or a through groove for communicating the first fluid space and the second fluid space are formed in the middle plate, and a liquid injection channel is arranged between the first packaging shell and the middle plate or between the second packaging shell and the middle plate. The invention also provides a shell provided with the temperature equalizing plate and electronic equipment provided with the shell.

Description

Temperature equalizing plate, shell and electronic equipment

Technical Field

The invention relates to the field of electronic equipment, in particular to a temperature equalizing plate, a shell provided with the temperature equalizing plate and electronic equipment provided with the shell.

Background

With the continuous improvement of the performance of portable electronic devices such as mobile phones or flat panels, the power consumption of the portable electronic devices is continuously increased, and at present, the temperature equalizing plate is widely applied to the heat dissipation of the portable electronic devices due to the excellent heat transfer performance and the temperature equalizing property. The existing temperature equalization plate generally adopts a three-layer packaging shell to form a two-layer temperature equalization cavity through an integrated welding packaging process. However, since the conventional temperature equalization plate is provided with two stacked temperature equalization cavities and two liquid injection channels, one of the liquid injection channels is communicated with one of the temperature equalization cavities, and the other liquid injection channel is communicated with the other temperature equalization cavity, two liquid injection and four degassing processes are required in the manufacturing process of the temperature equalization plate, the number of manufacturing process steps is more, and the risk of the reduction of the full-process through yield of the temperature equalization plate is increased.

Disclosure of Invention

The application provides a temperature equalizing plate, a shell provided with the temperature equalizing plate and electronic equipment provided with the shell.

The application provides a temperature equalization plate, which comprises a first packaging shell, a second packaging shell and a middle plate, wherein the first packaging shell is connected to a first side surface of the middle plate in a sealing way so as to form a first fluid space; the second packaging shell is connected to the opposite second side face of the middle plate in a sealing mode so as to form a second fluid space; and a through hole and/or a through groove for communicating the first fluid space and the second fluid space is formed in the middle plate, and a liquid injection channel is formed between the first packaging shell and the middle plate or between the second packaging shell and the middle plate.

The application also provides a shell, which comprises a middle frame and a temperature equalizing plate, wherein the temperature equalizing plate comprises a first packaging shell, a second packaging shell and a middle plate, and the first packaging shell is connected to the first side surface of the middle plate in a sealing way so as to form a first fluid space; the second packaging shell is connected to the opposite second side face of the middle plate in a sealing mode so as to form a second fluid space; the middle plate is provided with a through hole and/or a through groove which are communicated with the first fluid space and the second fluid space, a liquid injection channel is arranged between the first packaging shell and the middle plate or between the second packaging shell and the middle plate, and the temperature equalizing plate is positioned in the middle frame.

The application also provides electronic equipment, which comprises a shell, wherein the shell comprises a middle frame and a temperature equalizing plate, the temperature equalizing plate comprises a first packaging shell, a second packaging shell and a middle plate, and the first packaging shell is connected to the first side surface of the middle plate in a sealing way so as to form a first fluid space; the second packaging shell is connected to the opposite second side face of the middle plate in a sealing mode so as to form a second fluid space; the middle plate is provided with a through hole and/or a through groove which are communicated with the first fluid space and the second fluid space, a liquid injection channel is arranged between the first packaging shell and the middle plate or between the second packaging shell and the middle plate, and the temperature equalizing plate is positioned in the middle frame.

According to the invention, the liquid injection channel communicated with the first fluid space is arranged between the first packaging shell and the middle plate of the temperature equalization plate, and the through hole and the through groove communicated with the first fluid space and the second fluid space are arranged on the middle plate, so that the interconnection and intercommunication of the liquid medium between the first fluid space and the second fluid space are realized. Compared with the temperature equalizing plate in the prior art, the temperature equalizing plate has two liquid injection channels, wherein one liquid injection channel is communicated with a first fluid space, the other liquid injection channel passes through a second fluid space, and the manufacturing of the temperature equalizing plate in the prior art needs two liquid injection processes and four degassing processes; according to the invention, only one liquid injection channel is formed on the temperature-equalizing plate, so that the liquid medium injection process and the degassing process can be completed for the first fluid space and the second fluid space at one time, namely, the manufacturing of the temperature-equalizing plate only needs to pass through one liquid injection process and two degassing processes, and the three processes of one liquid injection process and two degassing processes are omitted for producing the temperature-equalizing plate under the condition of ensuring the invariable material performance, so that the manufacturing process steps of the temperature-equalizing plate are reduced, the process yield caused by the complexity of the processes is reduced to a certain extent, and the material manufacturing cost is optimized.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are of some embodiments of the invention and that other drawings may be derived from these drawings without undue effort.

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present application;

FIG. 2 is an exploded schematic view of the electronic device of FIG. 1;

fig. 3 is an enlarged view of a perspective structure of the temperature equalization plate in fig. 2;

FIG. 4 is a schematic perspective view of another view of the isopipe of FIG. 3;

FIG. 5 is an exploded schematic view of the temperature equalization plate of FIG. 3;

FIG. 6 is an exploded schematic view of the temperature equalization plate of FIG. 4;

FIG. 7 is a perspective cross-sectional view of one of the isoplates of FIG. 3;

FIG. 8 is a cross-sectional view of the isopipe of FIG. 7;

fig. 9 is an enlarged view of the portion IX in fig. 8;

FIG. 10 is another perspective cross-sectional view of the isopipe of FIG. 3;

FIG. 11 is a further perspective cross-sectional view of the isopipe of FIG. 3;

FIG. 12 is a further perspective cross-sectional view of the isopipe of FIG. 3;

FIG. 13 is a cross-sectional view of the isopipe of FIG. 12;

fig. 14 is an enlarged view of the XIV portion in fig. 13.

The main reference numerals illustrate:

100. An electronic device; 20. a housing; 22. a middle frame; 221. a middle support plate; 223. a side plate; 225. an end plate; 226. an accommodating space; 30. a display screen; 40. a circuit board; 60. a temperature equalizing plate; 61. a first package housing; 610. a first fluid space; 612. a first support plate; 614. a first package wall; 615. a first support portion; 616. a first liquid injection nozzle; 62. a liquid injection channel; 63. a second package case; 630. a second fluid space; 6301. a first fluid zone; 6303. a second fluid zone; 632. a second support plate; 6321. a first support section; 6323. a second support section; 634. a second package wall; 635. a second supporting part; 6351. a second circular protrusion; 6353. a third circular protrusion; 6354. a support bar; 6356. an inclined bar; 65. an intermediate plate; 651. a first side; 652. a second side; 653. a through hole; 655. a through groove; 6552. a first through groove; 6554. a second through slot; 6556. a third through slot; 66. a first wicking layer; 67. a second wicking layer.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without any inventive effort, are intended to be within the scope of the invention.

Furthermore, the following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present application are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "disposed on … …" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1 to 6, an electronic device 100 according to an embodiment of the invention includes a housing 20, a display screen 30, a circuit board 40 and a temperature equalizing board 60, wherein the housing 20 includes a middle frame 22, the circuit board 40 is mounted in the middle frame 22, and the display screen 30 covers the front surface of the middle frame 22; the circuit board 40 is provided with electronic devices such as a processor, a memory and the like; the temperature equalization plate 60 is positioned within the center 22 and affixed to the processor, memory, etc. The temperature equalizing plate 60 includes a first package housing 61, a second package housing 63, and an intermediate plate 65, where the first package housing 61 is hermetically connected to a first side 651 of the intermediate plate 65 to form a first fluid space 610; second enclosure housing 63 is sealingly connected to an opposite second side 652 of intermediate plate 65 to form second fluid space 630; the intermediate plate 65 is provided with a through hole 653 and/or a through groove 655 for communicating the first fluid space 610 and the second fluid space 630, and a liquid injection channel 62 is provided between the first package housing 61 and the intermediate plate 65 or between the second package housing 63 and the intermediate plate 65. In this embodiment, the middle plate 65 is provided with a plurality of through holes 653 and a plurality of through grooves 655, the plurality of through holes 653 are communicated with the first fluid space 610 and the second fluid space 630, and the plurality of through grooves 655 are communicated with the first fluid space 610 and the second fluid space 630; a liquid injection channel 62 is arranged between the first package shell 61 and the same end of the middle plate 65, and the liquid injection channel 62 is communicated with the first fluid space 610.

It can be understood that the front surface refers to the surface facing the light emitting surface of the display screen 30, and the back surface refers to the surface facing away from the light emitting surface of the display screen 30; the electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, or the like, and may be used for other electronic products requiring the temperature equalizing plate 60. The middle frame 22 may house electronics such as a battery, motherboard, processor, memory, speaker, earpiece, camera, or keys. "connected" in the description of the embodiments of the present invention is intended to include both direct connection and indirect connection, such as where the a and B connections include direct connection of a and B or other connection through a third element C or more. The connection also comprises two cases of integrated connection and non-integrated connection, wherein the integrated connection means that A and B are integrally formed and connected, and the non-integrated connection means that A and B are non-integrally formed and connected.

In the present invention, a liquid injection channel 62 communicating with a first fluid space 610 is provided between a first package housing 61 and an intermediate plate 65 of the temperature equalizing plate 60, and a through hole 653 and a through groove 655 communicating with a first fluid space 610 and a second fluid space 630 are provided on the intermediate plate 65, so as to implement interconnection and intercommunication of a liquid medium between the first fluid space 610 and the second fluid space 630. Compared with the prior art, the temperature equalizing plate has two liquid injection channels, wherein one liquid injection channel is communicated with the first fluid space 610, and the other liquid injection channel is communicated with the second fluid space 630, so that the prior art for producing the temperature equalizing plate needs two liquid injection processes and four degassing processes; the process of injecting liquid medium and degassing for the first fluid space 610 and the second fluid space 630 can be completed at one time by only opening one liquid injection channel 62 on the temperature equalizing plate 60, namely, the manufacturing of the temperature equalizing plate 60 only needs to go through one liquid injection process and two degassing processes, and three processes of one liquid injection process and two degassing processes are omitted for producing the temperature equalizing plate under the condition of ensuring the invariable material performance, so that the steps of the manufacturing process of the temperature equalizing plate 60 are reduced, the process yield caused by the complexity of the process is reduced to a certain extent, and the material manufacturing cost is optimized.

Optionally, the middle frame 22 includes a middle supporting plate 221, two side plates 223 disposed on opposite sides of the middle supporting plate 221, and two end plates 225 disposed on opposite ends of the middle supporting plate 221, wherein the middle supporting plate 221, the two side plates 223, and the two end plates 225 enclose an accommodating space 226, the circuit board 40 is accommodated in the accommodating space 226, and the temperature equalizing plate 60 is accommodated in the accommodating space 226 and is attached to the circuit board 40.

Optionally, the intermediate plate 65 is provided with a plurality of through holes 653, and the plurality of through holes 653 are close to the liquid injection channel 62; specifically, the middle plate 65 is a rectangular plate, and the middle plate 65 includes a first side 651 and a second side 652 on opposite sides thereof, and the first side of the middle plate 65 has 9 through holes 653,9 and through holes 653 arranged in three rows and three columns at uniform intervals at one end. In other embodiments, the number of through holes 653 can be designed to be greater than 9 or less than 9 as desired. The through holes 653 may be, but are not limited to, circular holes, rectangular holes, polygonal holes, or elliptical holes, etc.; in this embodiment, the through hole 653 is a circular hole, and the diameter of the through hole 653 is not smaller than 2 mm.

Optionally, the intermediate plate 65 is provided with a plurality of through grooves 655, and the plurality of through grooves 655 are arranged at intervals along the edge of the first package housing 61, and each through groove 655 has a width not less than 2 mm. In this embodiment, the plurality of through grooves 655 includes a first through groove 6552, a second through groove 6554, and a third through groove 6556, the first through groove 6552 is located on one side of the first side 651, and the length direction of the first through groove 6552 is parallel to the length direction of the middle plate 65; the second through slot 6554 is located on the opposite side of the first side 651, and the length direction of one end of the second through slot 6554 is parallel to the length direction of the intermediate plate 65, and the length direction of the opposite end of the second through slot 6554 is parallel to the width direction of the intermediate plate 65; the third through-channel 6556 is located at an end of the first side 651 away from the through-hole 653, and a length direction of the third through-channel 6556 is parallel to a width direction of the intermediate plate 65. In other embodiments, the number and positions of the through grooves 655 formed in the middle plate 65 may be set according to practical needs, for example, one through groove is respectively formed on two opposite sides of the first side 651 of the middle plate 65, each through groove is communicated with the first fluid space 610 and the second fluid space 630, and the length direction of the through groove is parallel to the length direction of the middle plate 65; or more than four through grooves are provided on the first side 651 of the intermediate plate 65, each through groove communicating the first fluid space 610 with the second fluid space 630, the more than four through grooves being arranged around the edge of the first fluid space 610.

Optionally, the thickness of the intermediate plate 65 is not greater than 0.3 mm, so that interconnection between the first fluid space 610 and the second fluid space 630 can be better achieved; specifically, the thickness of the intermediate plate 65 is greater than 0.1 mm and less than or equal to 0.3 mm, i.e., the intermediate plate 65 may be, but is not limited to, 0.3 mm, 0.28 mm, 0.25 mm, 0.23 mm, 0.2 mm, 0.18 mm, 0.15 mm, 0.12 mm, 0.1 mm, etc.

Optionally, the temperature equalization plate 60 further includes a first capillary structure layer 66 and a second capillary structure layer 67, wherein the first capillary structure layer 66 is adhered to one side surface of the middle plate 65 and is accommodated in the first fluid space 610, and the second capillary structure layer 67 is adhered to the opposite other side surface of the middle plate 65 and is accommodated in the second fluid space 630. Specifically, the first capillary structure layer 66 is attached to the first side 651, and the first capillary structure layer 66 covers the through holes 653 and the through grooves 655; the second capillary structure layer 67 is adhered to the second side 652, and the second capillary structure layer 67 covers the through holes 653 and the through grooves 655. The through holes 653 and the through grooves 655 on the intermediate plate 65 are both in communication with the first wick layer 66 and the second wick layer 67. The first and second capillary layers 66 and 67, respectively, may be, but are not limited to, sintered powder, sintered wire mesh, or micro-channel. The thickness of the first capillary structure layer 66 and the second capillary structure layer 67 is in the range of 0.02mm to 0.1 mm.

It will be appreciated that the shapes, sizes and positions of the through holes 653 and the through grooves 655 on the intermediate plate 65 are not limited to the above embodiments, so long as the manufacturing is facilitated and the liquid medium interconnection and intercommunication between the first capillary structure layer 66 and the second capillary structure layer 67 on opposite sides of the intermediate plate 65 can be realized.

Optionally, the first package housing 61 includes a first support plate 612, a first package wall 614 surrounding an edge of the first support plate 612, and a plurality of first support portions 615 spaced apart from each other, wherein the plurality of first support portions 615 are respectively connected to a first inner surface (i.e., a side facing the middle plate 65) of the first support plate 612. The first package case 61 may be manufactured by punching or etching, and in this embodiment, the first package case 61 is manufactured by punching. Specifically, the first support plate 612 may be a regular or irregular flat plate, in this embodiment, the first support plate 612 is generally a first rectangular plate, the cross section of the first packaging wall 614 is L-shaped, the first packaging wall 614 encloses a circle along the edge of the first rectangular plate, and the first support plate 612 and the first packaging wall 614 enclose the first fluid space 610; it will be appreciated that a first package housing 61 is stamped from one side of the first rectangular plate to the opposite side. The first support part 615 is a first circular protrusion protruding from the first support plate 612 toward the first fluid space 610, and a plurality of first circular protrusions are uniformly spaced apart from an inner surface of the first support plate 612; specifically, the first support portion 615 is punched from a side of the first support plate 612 facing away from the first fluid space 610 toward the first fluid space 610 to form a first circular protrusion. The liquid injection passage 62 is provided at one end of the first package case 61 and communicates with the first fluid space 610, and specifically, the liquid injection passage 62 is formed by punching, that is, the liquid injection passage 62 and the first support portion 615 are formed simultaneously at the time of punching the first package case 61. The first support portion 615 has smaller fluid resistance, and can accelerate the speed of the liquid medium flowing back to the first capillary structure layer 66, thereby accelerating the speed of gas-liquid circulation and improving the heat dissipation efficiency.

Optionally, the first package housing 61 further includes a first filling nozzle 616 connected to the first package wall 614, an end of the first filling nozzle 616 away from the first package wall 614 extends to an edge of the middle plate 65, the filling channel 62 is disposed on the first filling nozzle 616, one end of the filling channel 62 communicates with the first fluid space 610, and an opposite end of the filling channel 62 penetrates through an end face of the first filling nozzle 616 facing away from the first package wall 614. In this embodiment, the first filling nozzle 616 is disposed at one end of the first support plate 612, and the first filling nozzle 616 is close to the plurality of through holes 653. In other embodiments, the first nozzle 616 may also be disposed on one side of the first support plate 612, and the injection channel 62 on the first nozzle 616 communicates with the first fluid space 610.

The second package housing 63 includes a second support plate 632, a second package wall 634 surrounding an edge of the second support plate 632, and a plurality of second support portions 635 spaced apart from each other, the plurality of second support portions 635 being respectively connected to a second inner surface (i.e., a side facing the middle plate 65) of the second support plate 632. The second package housing 63 may be manufactured by punching or etching, and in this embodiment, the second package housing 63 is manufactured by punching. Specifically, the second support plate 632 may be a regular or irregular flat plate, in this embodiment, the second support plate 632 is a second rectangular plate, the cross section of the second packaging wall 634 is L-shaped, the second packaging wall 634 encloses a circle along the edge of the second rectangular plate, and the second support plate 632 and the second packaging wall 634 enclose a second fluid space 630; it will be appreciated that a second package housing 63 is stamped on one side of the second rectangular plate facing the opposite side. The second support plate 632 includes a first support section 6321 and a second support section 6323 at opposite ends thereof, the first inner surface of the first support section 6321 being farther from the intermediate plate 65 than the second inner surface of the second support section 6323, the through-hole 653 on the intermediate plate 65 facing the first support section 6321, and the partial through-slot 655 on the intermediate plate 65 facing the second support section 6323. The second fluid space 630 includes a first fluid region 6301 and a second fluid region 6303 at opposite ends of the second package body 63, the first support section 6321 and the second package wall 634 at the edge thereof enclose the first fluid region 6301, and the second support section 6323 and the second package wall 634 at the edge thereof enclose the second fluid region 6303. The liquid injection channel 62 is located at one end of the first fluid area 6301 away from the second fluid area 6303, the through hole 653 is close to the liquid injection channel 62, at least one through groove 655 communicates the second fluid area 6303 with the first fluid space 610, and the through hole 653 communicates the first fluid area 6301 with the first fluid space 610.

The second support 635 includes a second circular protrusion 6351 protruding from an inner surface of the first support section 6321 and a third circular protrusion 6353 provided on an inner surface of the second support section 6323, an axial dimension of the second circular protrusion 6351 being larger than an axial dimension of the third circular protrusion 6353, a diameter of the second circular protrusion 6351 being larger than a diameter of the third circular protrusion 6353. In this embodiment, the second circular protrusion 6351 is punched from the side of the first support section 6321 facing away from the second fluid space 630 towards the first fluid region 6301 to form a circular protrusion; the third circular protrusion 6353 is punched from the side of the second support section 6323 facing away from the second fluid space 630 towards the second fluid region 6303 to form a circular protrusion. The plurality of second circular protrusions 6351 are uniformly spaced apart from the inner surface of the first support section 6321, and the plurality of third circular protrusions 6353 are uniformly spaced apart from the inner surface of the second support section 6323. In other embodiments, the second circular protrusion 6351 and the third circular protrusion 6353 may be rectangular protrusions, polygonal protrusions, elliptical protrusions, or the like, respectively.

In other embodiments, the inner surface of the first support section 6321 facing the second fluid space 630 is provided with a plurality of support columns that are uniformly spaced apart from the inner surface of the first support section 6321.

Optionally, the second supporting portion 635 further includes a supporting bar 6354 and an inclined bar 6356 protruding from an inner surface of the first supporting section 6321, one end of the supporting bar 6354 is close to the second supporting section 6323, and a length direction of the supporting bar 6354 is parallel to a length direction of the second package housing 63; the inclined bar 6356 is located at an end of the first support section 6321 away from the second support section 6323, the inclined bar 6356 is close to the through hole 653, and a length direction of the inclined bar 6356 is inclined to a length direction of the second support section 635. In this embodiment, a plurality of inclined bars 6356 are disposed on a side of the inner surface of the first support section 6321, which is far away from the through hole 653, at an end of the second support section 6323, and are spaced apart from each other in parallel, and each inclined bar 6356 is inclined to the length direction of the first support section 6321; the inner surface of the first support section 6321 is provided with a plurality of support bars 6354 spaced parallel to each other between the second support section 6323 and the plurality of inclined bars 6356, one end of each support bar 6354 is close to the second support section 6323, the opposite end of the support bar 6354 is close to the plurality of inclined bars 6356, and the inner surface of the first support section 6321 is provided with at least one support bar 6354 on one side of the plurality of inclined bars 6356. In this embodiment, the support bar 6354 is stamped from the side of the first support section 6321 facing away from the second fluid space 630 toward the first fluid region 6301 to form a bar-shaped protrusion; the sloped rib 6356 is stamped from the side of the first support section 6321 facing away from the second fluid space 630 toward the first fluid region 6301 to form a bar-shaped protrusion. When the second package case 63 is manufactured by punching, the second circular protrusion 6351, the third circular protrusion 6353, the support bar 6354, and the support bar 6354 are simultaneously formed. The supporting strips 6354 and the inclined strips 6356 are propped against the second capillary structure layer 67, and the fluid resistance of the supporting strips 6354, the inclined strips 6356, the second round protrusions 6351 and the third round protrusions 6353 is smaller than that of the second capillary structure layer 67, so that the speed of the liquid medium flowing back to the second fluid space 630 can be accelerated, the gas-liquid circulation speed is accelerated, and the heat dissipation efficiency is improved.

Alternatively, the first and second package cases 61 and 63 may be made of a metal material, which may be, but is not limited to, a copper sheet, a stainless steel sheet, a titanium alloy sheet, an aluminum sheet, or the like. The temperature equalizing plate 60 may directly or indirectly contact the heat generating source to achieve heat conduction, thereby absorbing and dissipating heat generated from the heat generating source. The heat source may be, but is not limited to, a motherboard, a processor, or various electronic devices capable of generating heat. Alternatively, the thickness of the first package case 61 is not more than 0.2 mm, and further, the thickness of the first package case 61 ranges from 0.1 mm to 0.2 mm. Alternatively, the thickness of the second pack case 63 is not more than 0.2 mm, and further, the thickness of the second pack case 63 ranges from 0.1 mm to 0.2 mm.

In other embodiments, the liquid injection channel 62 may be moved from the first package housing 61 to the second package housing 63, that is, the liquid injection channel 62 on the first package housing 61 is omitted, and the liquid injection channel 62 is disposed on the second package housing 63; specifically, the second package housing 63 further includes a second liquid injection nozzle connected to the second package wall 634, where an end of the second liquid injection nozzle away from the second package wall 634 extends to an edge of the middle plate 65, and the second liquid injection nozzle is provided with a liquid injection channel 62, one end of the liquid injection channel 62 is communicated with the second fluid space 630, and an opposite end of the liquid injection channel 62 penetrates through an end surface of the second liquid injection nozzle facing away from the second package wall 634. The second nozzle may be disposed at one end or one side of the second package 63, and the injection channel 62 on the second nozzle communicates with the second fluid space 630.

Referring to fig. 3-14, when manufacturing the temperature equalization plate 60, the first package housing 61 and the second package housing 63 are manufactured by punching, cutting, etc. the sheet material such as aluminum sheet or copper sheet, or the first package housing 61 and the second package housing 63 are manufactured by cutting, etching, etc. the sheet material such as aluminum sheet or copper sheet; a first capillary structure layer 66 is provided on a first side 651 of the intermediate plate 65, and a second capillary structure layer 67 is provided on a second side 652; assembling the first packaging wall 614 of the first packaging shell 61 to the first side 651 of the middle plate 65 through TIG welding technology, so that the first packaging wall 614 is connected around the first capillary structure layer 66 in a sealing manner, and one end of the first supporting portion 615, which faces away from the first supporting plate 612, abuts against the first capillary structure layer 66; assembling the second package wall 634 of the second package housing 63 to the second side 652 of the intermediate plate 65 by TIG welding technology, such that the second package wall 634 is sealingly connected to the second capillary structure layer 67, and an end of the second support 635 facing away from the second support plate 632 abuts against the second capillary structure layer 67; the plurality of through holes 653 are close to the liquid filling channel 62, and the plurality of through holes 653 communicate the first fluid space 610 and the second fluid space 630, the plurality of through grooves 655 are arranged at intervals along the edge of the first package housing 61, specifically, the first through groove 6552 is close to one side edge of the first package housing 61 and extends along the one side edge, one end of the first through groove 6552 is close to the plurality of through holes 653, the opposite end of the first through groove 6552 is close to the second fluid region 6303, the second through groove 6554 is close to the opposite side edge of the first package housing 61 and extends along the other side edge, one end of the second through groove 6554 is located in the first fluid region 6301, the opposite end of the second through groove 6554 is located in the second fluid region 6303, and the third through groove 6556 is close to the one end edge far from the liquid filling channel 62 and extends along the end edge; sintering flattening the first package housing 61 and the second package housing 63, the orthographic projection area of the first package wall 614 on the first side 651 (or the second side 652) of the intermediate plate 65 being located within the orthographic projection area of the second package wall 634 on the first side 651 (or the second side 652) of the intermediate plate 65; connecting the liquid filling pipe to the liquid filling channel 62, and allowing the liquid medium to enter the first fluid space 610 and the second fluid space 630 through the liquid filling pipe and the liquid filling channel 62 at one time; the first degassing process is performed, followed by a second degassing and sealing of the liquid injection channel 62. The surface of the soaking plate 60 is coated with corrosion-resistant and high-temperature-resistant paint by baking varnish. The temperature equalization plate 60 is subjected to strict quality detection to ensure that the performance of the temperature equalization plate 60 meets the requirements. Since the manufacturing process of the temperature equalization plate 60 only needs one liquid medium injection process and two degassing processes, the steps of the manufacturing process of the temperature equalization plate 60 are reduced, and the process yield sliding risk of the temperature equalization plate 60 is reduced. The liquid medium may be, but is not limited to, water, methanol, ethanol, acetone, nanofluids, and the like.

As shown in fig. 1-4, the assembled temperature uniformity plate 60 and other accessories are assembled to form an electronic device 100. Specifically, the side surface of the second package housing 63 facing away from the first package housing 61 is attached to a high-power electronic device such as a processor, a memory, etc. on the circuit board 40, so that the position where the second support plate 632 of the second package housing 63 is attached to the electronic device is a heat source area, and the heat source area can transfer heat generated by the electronic device to the second package housing 63 and the first package housing 61; and a heat sink is assembled to a side of the first casing 61 facing away from the second casing 63. When the electronic device 100 operates, heat generated by the operation of the processor and the memory is conducted to the heat source area of the second package housing 63, the liquid medium in the second fluid space 630 evaporates along with the increase of heat in the heat source area, part of the vapor enters the first fluid space 610 through the through holes 653 and the through grooves 655 and is condensed by the first package housing 61 to form the liquid medium, and the other part of the vapor enters the position of the second package housing 63 with a lower temperature and is condensed by the middle plate 65 to form the liquid medium, and the liquid medium flows back to the heat source area in the second fluid space 630 through the first capillary structure layer 66, the through holes 653, the through grooves 655 and the second capillary structure layer 67 to form a gas-liquid circulation, so that the heat of the heat source is continuously dissipated. The infrared image of the temperature equalization plate 60 can show that the temperature equalization plate 60 has good performance and no obvious hot spots and cold areas. The first support portion 615 of the first package housing 61 and the second circular protrusion 6351, the third circular protrusion 6353, the support bar 6354, and the inclined bar 6356 of the second package housing 63 can increase the heat dissipation area of the temperature uniformity plate 60, which is beneficial to better heat dissipation of the temperature uniformity plate 60.

In some embodiments, the electronic device 100 includes a back shell connected to the back of the middle frame 22, the circuit board 40 is sandwiched between the back shell and the middle frame 22, and the temperature equalizing plate 60 is connected to a side of the circuit board 40 facing away from the middle frame 22, so that the temperature equalizing plate 60 dissipates heat from the electronic devices on the circuit board 40.

The foregoing is a description of embodiments of the present invention, and it should be noted that, for those skilled in the art, modifications and variations can be made without departing from the principles of the embodiments of the present invention, and such modifications and variations are also considered to be within the scope of the present invention.

Claims (20)

1. The temperature equalization plate is characterized by comprising a first packaging shell, a second packaging shell and a middle plate, wherein the first packaging shell is connected to the first side surface of the middle plate in a sealing way so as to form a first fluid space; the second packaging shell is connected to the opposite second side face of the middle plate in a sealing mode so as to form a second fluid space; and a through hole and/or a through groove for communicating the first fluid space and the second fluid space is formed in the middle plate, and a liquid injection channel is formed between the first packaging shell and the middle plate or between the second packaging shell and the middle plate.

2. The temperature equalization plate of claim 1, wherein said intermediate plate is provided with a plurality of through holes, a plurality of said through holes being adjacent to said fluid injection passage.

3. The temperature uniformity plate according to claim 2, wherein the through holes are circular holes, and the diameter of the through holes is not less than 2mm.

4. The temperature equalization plate of claim 1, wherein a plurality of through slots are provided in the intermediate plate, the plurality of through slots being spaced apart from one another along an edge of the first package body, each through slot having a width of not less than 2 mm.

5. The temperature uniformity plate of claim 4, wherein said plurality of through slots comprises a first through slot adjacent to and extending along one of said side edges of said first package housing, a second through slot adjacent to and extending along an opposite side edge of said first package housing, and a third through slot adjacent to and extending along an end edge remote from said liquid injection channel.

6. The temperature equalization plate according to claim 1, wherein a plurality of through holes and a plurality of through grooves are formed in the intermediate plate, the through holes are close to the liquid injection passage, the through grooves are arranged at intervals along the edge of the first package shell, the inner diameter of each through hole is not smaller than 2mm, and the width of each through groove is not smaller than 2 mm.

7. The isopipe of claim 1 wherein the thickness of the intermediate plate is no greater than 0.3 mm.

8. The temperature equalization plate of claim 1, further comprising a first wicking layer attached to a first side of the intermediate plate and received in the first fluid space and a second wicking layer attached to a second side of the intermediate plate and received in the second fluid space; the through holes and the through grooves are communicated with the first capillary junction layer and the second capillary structure layer.

9. The temperature equalization plate of claim 8, wherein said first package housing comprises a first support plate, a first package wall surrounding an edge of said first support plate, and a plurality of first support portions spaced apart from each other, said plurality of first support portions being respectively connected to a first inner surface of said first support plate; the second packaging shell comprises a second supporting plate, a second packaging wall and a plurality of second supporting parts, wherein the second packaging wall is arranged on the edge of the second supporting plate in a surrounding mode, the second supporting parts are mutually spaced, and the second supporting parts are respectively connected to the second inner surface of the second supporting plate.

10. The temperature equalization plate of claim 9, wherein an end of the first support portion facing away from the first support plate abuts against the first capillary structure layer, and an end of the second support portion facing away from the second support plate abuts against the second capillary structure layer.

11. The temperature equalization plate of claim 9, wherein the first package housing further comprises a first liquid injection nozzle connected to the first package wall, the first liquid injection nozzle is provided with the liquid injection channel, one end of the liquid injection channel is communicated with the first fluid space, and the opposite end of the liquid injection channel penetrates through an end face of the first liquid injection nozzle, which faces away from the first package wall.

12. The temperature equalization plate of claim 9, wherein the second package housing further comprises a second liquid injection nozzle connected to the second package wall, the second liquid injection nozzle is provided with the liquid injection channel, one end of the liquid injection channel is communicated with the second fluid space, and the opposite end of the liquid injection channel penetrates through an end face of the second liquid injection nozzle, which faces away from the second package wall.

13. The isopipe of claim 9 wherein the orthographic projection area of the first enclosure wall on the first side of the intermediate plate is located within the orthographic projection area of the second enclosure wall on the first side of the intermediate plate.

14. The temperature uniformity plate according to claim 9, wherein the first supporting portion is a first circular protrusion protruding from the first supporting plate toward the first fluid space, and a plurality of the first circular protrusions are uniformly spaced apart from an inner surface of the first supporting plate.

15. The temperature equalization plate of claim 9, wherein the second support plate includes a first support section and a second support section at opposite ends thereof, the first inner surface of the first support section being further from the intermediate plate than the second inner surface of the second support section, the intermediate plate being provided with the through-hole opposite the first support section, the intermediate plate being provided with the through-slot opposite the second support section.

16. The temperature equalization plate of claim 15, wherein the second fluid space comprises a first fluid region and a second fluid region at opposite ends of the second package housing, the first support section and the second package wall at the edge thereof enclose the first fluid region, the second support section and the second package wall at the edge thereof enclose the second fluid region, the liquid injection channel is located at one end of the first fluid region away from the second fluid region, the through hole is close to the liquid injection channel, at least one through slot is communicated with the second fluid region and the first fluid space, and the through hole is communicated with the first fluid region and the first fluid space.

17. The temperature uniformity plate according to claim 15, wherein said second support portion comprises a second circular protrusion protruding from an inner surface of said first support section and a third circular protrusion protruding from an inner surface of said second support section, an axial dimension of said second circular protrusion being larger than an axial dimension of said third circular protrusion, a diameter of said second circular protrusion being larger than a diameter of said third circular protrusion.

18. The temperature equalization plate according to claim 17, wherein the second supporting portion further comprises a supporting bar and an inclined bar protruding from an inner surface of the first supporting section, one end of the supporting bar is close to the second supporting section, and a length direction of the supporting bar is parallel to a length direction of the second package housing; the inclined strip is located at one end of the first support section, far away from the second support section, the inclined strip is close to the through hole, and the length direction of the inclined strip is inclined to the length direction of the second support section.

19. A housing comprising a central frame and a temperature equalization plate according to any one of claims 1-18, said temperature equalization plate being positioned within said central frame.

20. An electronic device comprising the housing of claim 19.