CN118060650B - Welding device for processing semiconductor lighting device - Google Patents
Welding device for processing semiconductor lighting deviceInfo
- Publication number
- CN118060650B CN118060650B CN202410494695.7A CN202410494695A CN118060650B CN 118060650 B CN118060650 B CN 118060650B CN 202410494695 A CN202410494695 A CN 202410494695A CN 118060650 B CN118060650 B CN 118060650B
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- China
- Prior art keywords
- support plate
- welding
- semiconductor
- circuit board
- lighting device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 75
- 238000003466 welding Methods 0.000 title claims abstract description 59
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 238000005476 soldering Methods 0.000 claims abstract description 28
- 238000005507 spraying Methods 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 39
- 238000003860 storage Methods 0.000 claims description 12
- 238000007731 hot pressing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 5
- 239000007921 spray Substances 0.000 abstract description 5
- 230000008602 contraction Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention belongs to the technical field of welding of semiconductor devices, in particular to a welding device for processing a semiconductor lighting device, which comprises an operation table, a circuit board and a semiconductor device, wherein the circuit board and the semiconductor device are placed on the operation table, a bottom plate is fixedly arranged on the upper surface of the operation table, a first support plate and a second support plate are symmetrically distributed on the upper surface of the bottom plate in a left-right manner, and a soldering paste spraying mechanism and a mobile hot welding mechanism are sequentially arranged below the circuit board. This welding set is used in processing of semiconductor lighting device, through setting up the solder paste and scribble the mechanism, replaced artifical manual mode of scribbling the solder paste, rotate through first gear and second gear and drive two racks and remove, and then drive the nozzle and control and remove, simultaneously drive the nozzle through the flexible of hydraulic shear frame and reciprocate to drive the nozzle through electric telescopic handle and reciprocate, thereby be convenient for drive the nozzle and be close to the pin of semiconductor device, do benefit to the nozzle and spray the solder paste on the pin of semiconductor device, improve welding efficiency.
Description
Technical Field
The invention relates to the technical field of welding of semiconductor devices, in particular to a welding device for processing a semiconductor lighting device.
Background
Semiconductor lighting products are lighting fixtures manufactured using LEDs as light sources. The semiconductor lighting has the remarkable characteristics of high efficiency, energy conservation, environmental protection, easy maintenance and the like, and is an effective way for realizing energy conservation and emission reduction.
At present, a semiconductor lighting device is connected to a circuit board in a general way by firstly coating a layer of soldering paste on pins of the semiconductor lighting device, then placing the soldering paste on corresponding positions on the circuit board, and finally melting and fixing the soldering paste on a bonding pad through heating, so that the connection between the semiconductor lighting device and the circuit board is realized.
However, in most cases, the method is to use manual smearing of solder paste on pins of the semiconductor lighting device, so that uneven smearing of the solder paste is easy to occur in the processing process, the welding efficiency is affected, and the manual smearing is too long, so that the welding efficiency is reduced.
Disclosure of Invention
Based on the technical problems presented above, the invention provides a welding device for processing a semiconductor lighting device.
The invention provides a welding device for processing a semiconductor lighting device, which comprises an operation table, a circuit board and a semiconductor device, wherein the circuit board and the semiconductor device are placed on the operation table, the surface of the circuit board is provided with through holes in a penetrating way, pins of the semiconductor device penetrate through the through holes, a bottom plate is fixedly arranged on the upper surface of the operation table, a first support plate and a second support plate are symmetrically distributed on the upper surface of the bottom plate in a left-right way, placing grooves are formed in the upper surfaces of the first support plate and the second support plate, the surface of the circuit board is in sliding connection with the inner wall of the placing grooves, and a soldering paste spraying mechanism and a mobile hot welding mechanism are sequentially arranged below the circuit board.
The soldering paste spraying mechanism is used for uniformly spraying soldering paste onto pins of the semiconductor device.
The movable hot welding mechanism is used for heating and melting the soldering paste and applying pressure to enable the soldering paste to form connection, so that the connection between the semiconductor device and the circuit board is achieved.
Preferably, a mini-conveyor for transporting the semiconductor device is fixedly installed at one side of the upper surface of the operation table.
Preferably, the operation panel is close to the upper surface one side of mini conveyer belt is bilateral symmetry distribution and installs from the drive slide rail, two from the equal fixedly connected with first connecting plate of slider upper surface of drive slide rail, the upper surface fixed mounting of first connecting plate has the transportation arm, vacuum chuck is installed to the front end of transportation arm.
Through the technical scheme, the conveying mechanical arm drives the vacuum chuck to clamp the semiconductor device on the small conveyor belt, and drives the conveying mechanical arm to plug in the clamped semiconductor device with the through hole on the circuit board through the sliding block and the first connecting plate under the starting of the self-driven sliding rail.
Preferably, the soldering paste spraying mechanism comprises fixing seats respectively fixedly installed on the surfaces of one opposite sides of the first support plate and the second support plate, two supporting sliding grooves are formed in the surfaces of the fixing seats, two supporting sliding grooves are formed in the inner walls of the supporting sliding grooves in a sliding mode, racks are fixedly connected to the upper surfaces of the L-shaped blocks, a driving motor is fixedly installed on one side surface of each first support plate, one end of an output shaft of each driving motor is fixedly sleeved with a worm, one end of each worm, away from each driving motor, is fixedly sleeved with a rotating shaft, one end of each rotating shaft, extending out of each first support plate, is fixedly sleeved with a first gear, and the surface of each first gear is meshed with the surface of each rack.
Through above-mentioned technical scheme, through the rotation drive of driving motor output shaft with the worm rotation of being connected, the rotation of worm drives the pivot rotation of being connected with it, the rotation of pivot drives the first gear rotation of being connected with it, the rotation of first gear drives the rack of rather than meshing and removes, the removal of this rack drives L shape piece and removes along supporting spout inner wall.
Preferably, the inner wall of first extension board passes through the bearing and installs first transmission shaft, first transmission shaft is close to the fixed worm wheel that has cup jointed of one end of worm, the second transmission shaft is installed through the bearing to the inner wall of second extension board, first transmission shaft with the second transmission shaft extends respectively first extension board with the one end of second extension board is connected with conveyer through the belt pulley transmission, the connecting axle is installed through the bearing to the inner wall of second extension board, the second transmission shaft keep away from conveyer one end pass through bevel gear group with the one end transmission of connecting axle is connected, the connecting axle extends the one end of second extension board is fixed to be cup jointed the second gear, the surface of second gear with the surface engagement of rack.
Through above-mentioned technical scheme, the rotation of worm drives the worm wheel and rotates, and the rotation of worm wheel drives the first transmission shaft that is connected rather than rotating, and first transmission shaft passes through conveyer and drives the rotation of second transmission shaft, and the rotation of second transmission shaft drives the connecting axle through bevel gear group and rotates, and the rotation of connecting axle drives the second gear that is connected rather than rotating, and the rotation of second gear drives the rack that meshes rather than moving.
Preferably, grooves are formed in the surfaces, close to the fixing base, of the first support plate and the second support plate, first guide rails are fixedly arranged on the inner walls of the two grooves, a hydraulic shear rest is fixedly arranged on the surface of a sliding block of the first guide rails, and one side surface of the hydraulic shear rest is fixedly connected with one side surface of the L-shaped block.
Through the technical scheme, the movement of the rack drives the L-shaped block to move, and the movement of the L-shaped block drives the hydraulic scissor frame to move along the surface of the first guide rail through the sliding block.
Preferably, the L-shaped block is far away from a side surface fixedly connected with supporting block of fixing base, the upper surface fixedly connected with electric telescopic handle of supporting block, the one end fixedly connected with storage casing of electric telescopic handle, the both sides surface of storage casing all fixedly communicates there is the nozzle.
Through above-mentioned technical scheme, the removal of L shape piece drives the supporting shoe and removes, and the flexible of electric telescopic handle drives the storage casing and reciprocates, and the nozzle spouts the solder paste in the storage casing on the pin.
Preferably, the mobile heat welding mechanism comprises a mounting groove formed in the upper surface of the bottom plate, a screw is mounted on the inner wall of the mounting groove through a bearing, a servo motor is fixedly mounted on one side surface of the bottom plate, one end of an output shaft of the servo motor is fixedly sleeved with one end of the screw, a thread block is sleeved on the surface thread of the screw, the surface of the thread block is slidably clamped with the inner wall of the mounting groove, a second connecting plate is fixedly mounted on the upper surface of the thread block, and a hot pressing mechanical arm is fixedly mounted on the upper surface of the second connecting plate.
Through above-mentioned technical scheme, the screw rod that is connected with it is rotated through the rotation drive of servo motor output shaft, and the screw rod is rotated and is driven the screw thread piece that is connected with it and remove along the inner wall of mounting groove, and the removal of screw thread piece drives the second connecting plate and removes, and the removal of second connecting plate drives hot pressing arm and removes.
Preferably, the two sides of the bottom plate, which are close to the upper surface of the mounting groove, are symmetrically provided with second guide rails, and the upper surfaces of the sliding blocks of the two second guide rails are fixedly connected with the lower surface of the second connecting plate.
Through the technical scheme, the movement of the second connecting plate drives the sliding block to move along the surface of the second guide rail, so that the movement of the second connecting plate is balanced conveniently.
Preferably, the upper surfaces of the first support plate and the second support plate are fixedly provided with connecting seats, the inner walls of the two connecting seats are provided with movable shafts through bearings, the surfaces of the movable shafts are fixedly sleeved with clamping plates, one side surfaces of the two connecting seats are fixedly provided with stepping motors, and one end of an output shaft of each stepping motor is connected with one end of each movable shaft.
Through above-mentioned technical scheme, the rotation of step motor output shaft drives the loose axle rotation of being connected with it, and the rotation of loose axle drives the cardboard and rotates for the cardboard carries out the centre gripping to the circuit board.
The beneficial effects of the invention are as follows:
1. Through setting up the mechanism is paintd to the soldering paste, replaced artifical manual mode of paining the soldering paste, rotate through first gear and second gear and drive two racks and remove, and then drive the nozzle and control the removal, simultaneously drive the nozzle through the flexible of hydraulic shear frame and reciprocate to drive the nozzle through electric telescopic handle and reciprocate, thereby be convenient for drive the nozzle and be close to the pin of semiconductor device, do benefit to the nozzle and spray the soldering paste on the pin of semiconductor device, improve welding efficiency.
2. Through setting up and remove heat welding mechanism, mutually support with soldering paste spraying mechanism, be convenient for with the pressurization solidification after the soldering paste melts, and then make semiconductor device and circuit board link together, reach the welding effect, hot press welding has the advantage that joint strength is high, the welding area is big, the welding is stable simultaneously to improve welding efficiency.
Drawings
Fig. 1 is a schematic view of a welding device for processing a semiconductor lighting device according to the present invention;
Fig. 2 is a perspective view of a bottom plate structure of a welding device for processing a semiconductor lighting device according to the present invention;
Fig. 3 is a perspective view of a transporting mechanical arm structure of a welding device for processing a semiconductor lighting device according to the present invention;
fig. 4 is a perspective view of a second support plate of the welding device for processing a semiconductor lighting device according to the present invention;
Fig. 5 is a perspective view of a hot pressing mechanical arm structure of a welding device for processing a semiconductor lighting device according to the present invention;
fig. 6 is a perspective view of a screw structure of a welding device for processing a semiconductor lighting device according to the present invention;
fig. 7 is a perspective view of a rack structure of a welding device for processing a semiconductor lighting device according to the present invention;
fig. 8 is a perspective view of a first gear structure of a welding device for processing a semiconductor lighting device according to the present invention;
FIG. 9 is a perspective view of a nozzle structure of a welding device for processing a semiconductor lighting device according to the present invention;
fig. 10 is a perspective view of an L-shaped block structure of a welding device for manufacturing a semiconductor lighting device according to the present invention;
fig. 11 is a perspective view of a hydraulic shear blade carrier structure of a welding device for processing a semiconductor lighting device according to the present invention;
Fig. 12 is a perspective view of a second gear structure of a welding device for processing a semiconductor lighting device according to the present invention.
In the figure: 1. an operation table; 2. a circuit board; 3. a semiconductor device; 4. perforating; 5. a bottom plate; 6. a first support plate; 7. a second support plate; 8. a placement groove; 9. a fixing seat; 901. a supporting chute; 902. an L-shaped block; 903. a rack; 904. a driving motor; 905. a worm; 906. a rotating shaft; 907. a first gear; 908. a first drive shaft; 909. a worm wheel; 910. a second drive shaft; 911. a conveyor belt; 912. a connecting shaft; 913. a second gear; 914. a groove; 915. a first guide rail; 916. a hydraulic shear blade holder; 917. a support block; 918. an electric telescopic rod; 919. a storage housing; 920. a nozzle; 10. a mounting groove; 101. a screw; 102. a servo motor; 103. a screw block; 104. a second connecting plate; 105. a hot-pressing mechanical arm; 106. a second guide rail; 11. a small conveyor belt; 12. self-driven slide rail; 13. a first connection plate; 14. a transport robot arm; 15. a vacuum chuck; 16. a connecting seat; 17. a movable shaft; 18. a clamping plate; 19. a stepper motor.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-12, a welding device for processing a semiconductor lighting device comprises an operation table 1, a circuit board 2 and a semiconductor device 3, wherein the circuit board 2 and the semiconductor device 3 are placed on the operation table 1, a through hole 4 is formed in the surface of the circuit board 2 in a penetrating mode, pins of the semiconductor device 3 penetrate through the through hole 4, a bottom plate 5 is fixedly installed on the upper surface of the operation table 1, a first support plate 6 and a second support plate 7 are symmetrically distributed on the upper surface of the bottom plate 5 in a left-right mode, a placing groove 8 is formed in the upper surfaces of the first support plate 6 and the second support plate 7, the surface of the circuit board 2 is in sliding connection with the inner wall of the placing groove 8, and a soldering paste spraying mechanism and a mobile hot welding mechanism are sequentially arranged below the circuit board 2.
In order to transport the semiconductor device 3 onto the circuit board 2, a mini conveyor belt 11 is fixedly installed on one side of the upper surface of the operation table 1, the mini conveyor belt 11 is used for transporting the semiconductor device 3, self-driven sliding rails 12 are symmetrically distributed on one side of the operation table 1, which is close to the upper surface of the mini conveyor belt 11, first connecting plates 13 are fixedly connected to the upper surfaces of sliding blocks of the two self-driven sliding rails 12, a transporting mechanical arm 14 is fixedly installed on the upper surface of the first connecting plates 13, a vacuum chuck 15 is installed at the front end of the transporting mechanical arm 14, the sliding blocks on the surface of the first connecting plates 12 are enabled to move through the starting of the self-driven sliding rails 12, so that the first connecting plates 13 are driven to move, the transporting mechanical arm 14 is driven to move through the movement of the first connecting plates 13, the vacuum chuck 15 on the transporting mechanical arm 14 adsorbs the semiconductor device 3 and the through holes 4 on the circuit board 2 under the action of the self-driven sliding rails 12 and the transporting mechanical arm 14.
In order to fix the circuit board 2 placed in the placing groove 8, the connecting seats 16 are fixedly installed on the upper surfaces of the first support plate 6 and the second support plate 7, the movable shafts 17 are installed on the inner walls of the two connecting seats 16 through bearings, clamping plates 18 are fixedly sleeved on the surfaces of the movable shafts 17, step motors 19 are fixedly installed on one side surfaces of the two connecting seats 16, one end of an output shaft of each step motor 19 and one end of each movable shaft 17 are driven to rotate through rotation of the output shaft of each step motor 19, and the clamping plates 18 are driven to rotate through rotation of the movable shafts 17, so that the clamping plates 18 clamp the circuit board 2.
Wherein the solder paste spraying mechanism is used for uniformly spraying the solder paste onto the pins of the semiconductor device 3.
In order to facilitate the spraying of solder paste onto the surfaces of the pins of the semiconductor device 3 on the circuit board 2, the solder paste spraying mechanism includes a nozzle 920, and the nozzle 920 sprays solder paste onto the pins of the semiconductor device 3.
In order to drive the nozzle 920 to move left and right, the soldering paste spraying mechanism further comprises fixing seats 9 which are respectively and fixedly arranged on the surfaces of one side opposite to the first support plate 6 and the second support plate 7, the surfaces of the two fixing seats 9 are respectively provided with a support chute 901, the inner walls of the two support chutes 901 are respectively and slidably connected with an L-shaped block 902, the upper surfaces of the two L-shaped blocks 902 are respectively and fixedly connected with a rack 903, a driving motor 904 is fixedly arranged on one side surface of the first support plate 6 far away from the rack 903, one end of an output shaft of the driving motor 904 is fixedly sleeved with a worm 905, one end of the worm 905 far away from the driving motor 904 is fixedly sleeved with a rotating shaft 906, one end of the rotating shaft 906 extending out of the first support plate 6 is fixedly sleeved with a first gear 907, the surface of the first gear 907 is meshed with the surface of the rack 903, the rotation of the worm 905 drives the rotating shaft 906 connected with the worm 903 to rotate, the rotation of the rotating shaft 906 drives the rotating shaft 906 connected with the first gear 907 to rotate, and the rotation of the first gear 907 drives the rack 903 meshed with the rack 903 to move along the inner wall of the support chute 901.
In order to drive the racks 903 on the second support plate 7 to move, a first transmission shaft 908 is installed on the inner wall of the first support plate 6 through a bearing, a worm wheel 909 is fixedly sleeved at one end, close to the worm 905, of the first transmission shaft 908, a second transmission shaft 910 is installed on the inner wall of the second support plate 7 through a bearing, the first transmission shaft 908 and the second transmission shaft 910 extend out of the first support plate 6 and one end of the second support plate 7 respectively, a transmission belt 911 is connected through belt pulley transmission, a connecting shaft 912 is installed on the inner wall of the second support plate 7 through a bearing, one end, far away from the transmission belt 911, of the second transmission shaft 910 is connected with one end of the connecting shaft 912 through a bevel gear set, a second gear 913 is fixedly sleeved at one end, extending out of the connecting shaft 912, of the second support plate 7, a surface of the second gear 913 is meshed with the surface of the worm wheel 903, rotation of the worm wheel 905 drives rotation of the worm wheel 909, rotation of the first transmission shaft 908 connected with the worm wheel 908 drives rotation of the second transmission shaft 910, rotation of the second transmission shaft 910 is driven by the bevel gear set 912, rotation of the connecting shaft 912, rotation of the second transmission shaft is driven by the connection shaft 912, the rotation of the second transmission shaft is driven by the bevel gear set, and the rotation of the second gear 913 is driven by the rotation of the second gear 913 connected with rotation of the second gear 913.
In order to balance the left-right movement of the nozzle 920 and drive the nozzle 920 to move back and forth, grooves 914 are formed in the surfaces of one side, close to the fixed seat 9, of the first support plate 6 and the second support plate 7, first guide rails 915 are fixedly arranged on the inner walls of the two grooves 914, hydraulic shear blades 916 are fixedly arranged on the surfaces of sliding blocks of the first guide rails 915, one side surface of each hydraulic shear blade 916 is fixedly connected with one side surface of each L-shaped block 902, the L-shaped blocks 902 are driven to move through movement of racks 903, the hydraulic shear blades 916 are driven to move along the surfaces of the first guide rails 915 through sliding blocks, and the L-shaped blocks 902 are driven to move back and forth through expansion and contraction of the hydraulic shear blades 916.
In order to drive the nozzle 920 to move up and down, a supporting block 917 is fixedly connected to a surface of one side of the L-shaped block 902 far away from the fixing seat 9, an electric telescopic rod 918 is fixedly connected to an upper surface of the supporting block 917, one end of the electric telescopic rod 918 is fixedly connected to a storage shell 919, the nozzle 920 is fixedly communicated with the surface of the storage shell 919, the storage shell 919 is driven to move up and down by stretching of the electric telescopic rod 918, and the nozzle 920 sprays solder paste in the storage shell 919 onto pins.
Through setting up the mechanism is paintd to the soldering paste, replaced manual mode of painting the soldering paste, rotate through first gear 907 and second gear 913 and drive two racks 903 and remove, and then drive nozzle 920 and control the removal, simultaneously drive nozzle 920 back and forth movement through the flexible of hydraulic shear frame 916 to drive nozzle 920 through electric telescopic handle 918 and reciprocate, thereby be convenient for drive nozzle 920 and be close to the pin of semiconductor device 3, do benefit to nozzle 920 and spray the soldering paste on the pin of semiconductor device 3, improve welding efficiency.
Wherein the mobile thermal welding mechanism is used for heating and melting the soldering paste and applying pressure to enable the soldering paste to form connection, so that the connection of the semiconductor device 3 and the circuit board 2 is realized.
To facilitate the application of pressure to the solder paste, the mobile thermal welding mechanism includes a thermal press robot arm 105.
In order to drive the hot-press welding arm to move left and right, the movable hot-welding mechanism comprises a mounting groove 10 formed in the upper surface of a bottom plate 5, a screw rod 101 is mounted on the inner wall of the mounting groove 10 through a bearing, a servo motor 102 is fixedly mounted on one side surface of the bottom plate 5, one end of an output shaft of the servo motor 102 is fixedly sleeved with one end of the screw rod 101, a threaded block 103 is fixedly sleeved on the surface of the screw rod 101, the surface of the threaded block 103 is slidably clamped with the inner wall of the mounting groove 10, a second connecting plate 104 is fixedly mounted on the upper surface of the threaded block 103, a hot-press mechanical arm 105 is mounted on the upper surface of the second connecting plate 104, the screw rod 101 connected with the hot-press mechanical arm is driven to rotate through rotation of the output shaft of the servo motor 102, the threaded block 103 connected with the screw rod 101 moves along the inner wall of the mounting groove 10, the movement of the threaded block 103 drives the second connecting plate 104 to move, and the movement of the second connecting plate 104 drives the hot-press mechanical arm 105 to move.
In order to support the movement of the second connecting plate 104, the second guide rails 106 are symmetrically distributed on two sides of the upper surface of the bottom plate 5, which is close to the mounting groove 10, the upper surfaces of the sliding blocks of the two second guide rails 106 are fixedly connected with the lower surface of the second connecting plate 104, and the movement of the second connecting plate 104 drives the sliding blocks to move along the surface of the second guide rails 106, so that the movement of the second connecting plate 104 is balanced.
Through setting up and remove heat welding mechanism, mutually support with soldering paste spraying mechanism, be convenient for with the pressurization solidification after the soldering paste melts, and then make semiconductor device 3 and circuit board 2 link together, reach the welding effect, hot press welding has the advantage that joint strength is high, the welding area is big, the welding is stable simultaneously to improve welding efficiency.
Working principle: when the circuit board clamping device is used, the circuit board 2 is firstly placed in the placing grooves 8 of the first support plate 6 and the second support plate 7, the stepping motor 19 is started, the rotation of the output shaft of the stepping motor 19 drives the movable shaft 17 connected with the stepping motor to rotate, and the rotation of the movable shaft 17 drives the clamping plate 18 to rotate, so that the clamping plate 18 clamps the circuit board 2;
the semiconductor device 3 is transported by a small conveyor belt 11, a vacuum chuck 15 on a transporting mechanical arm 14 adsorbs the transported semiconductor device 3, and the transporting mechanical arm 14 is driven by a sliding block to plug the semiconductor device 3 into a through hole 4 of the circuit board 2 under the action of a self-driving sliding rail 12;
Then, the driving motor 904 is started, the rotation of the output shaft of the driving motor 904 drives the worm 905 connected with the driving motor 904 to rotate, the rotation of the worm 905 drives the rotating shaft 906 connected with the worm to rotate, the rotation of the rotating shaft 906 drives the first gear 907 connected with the worm to rotate, the rotation of the first gear 907 drives the racks 903 meshed with the first gear 907 to move, the movement of the racks 903 drives the L-shaped blocks 902 to move along the inner wall of the supporting chute 901, meanwhile, the rotation of the worm 905 drives the worm wheel 909 to rotate, the rotation of the worm wheel 909 drives the first transmission shaft 908 connected with the worm wheel 909 to rotate, the first transmission shaft 908 drives the second transmission shaft 910 to rotate through the transmission belt 911, the rotation of the second transmission shaft 910 drives the connecting shaft 912 to rotate through the bevel gear group, the rotation of the connecting shaft 912 drives the second gear 913 connected with the connecting shaft, the rotation of the second gear 913 drives the racks 903 meshed with the racks, the movement of the two racks 903 drives the L-shaped blocks 902 to move, and the movement of the L-shaped blocks 902 drives the supporting blocks 917 to move, and the movement of the supporting blocks 917 drives the nozzles 920 to move left and right through the electric telescopic rods 918;
Simultaneously, the hydraulic shear knife rest 916 is started, the expansion and contraction of the hydraulic shear knife rest 916 drives the L-shaped block 902 to move back and forth, the moving belt supporting block 917 of the L-shaped block 902 moves, and then the nozzle 920 is driven to move back and forth, so that the movement of the nozzle 920 is prevented from colliding with the movement track of the hot-press welding arm, the expansion and contraction of the electric telescopic rod 918 drives the nozzle 920 to move up and down, the mutual coordination of the driving motor 904, the hydraulic shear knife rest 916 and the electric telescopic rod 918 is facilitated, the nozzle 920 is close to the pin of the semiconductor device 3, and solder paste in the storage shell 919 is sprayed on the pin of the semiconductor device 3 through the nozzle 920;
Then, the servo motor 102 is started, the rotation of the output shaft of the servo motor 102 drives the screw rod 101 connected with the screw rod 101 to rotate, the rotation of the screw rod 101 drives the threaded block 103 connected with the screw rod to move along the inner wall of the mounting groove 10, the movement of the threaded block 103 drives the second connecting plate 104 to move, the movement of the second connecting plate 104 drives the hot-pressing mechanical arm 105 to move, and the movement of the second connecting plate 104 drives the sliding block to move along the surface of the second guide rail 106, so that the hot-pressing mechanical arm 105 aligns with pins, and the semiconductor device 3 and the circuit board 2 are connected together conveniently.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (7)
1. The utility model provides a welding set is used in semiconductor lighting device processing, includes operation panel (1) and places circuit board (2) and semiconductor device (3) on operation panel (1), its characterized in that: the surface of the circuit board (2) is provided with through holes (4) in a penetrating mode, pins of the semiconductor device (3) penetrate through the through holes (4), a bottom plate (5) is fixedly arranged on the upper surface of the operating platform (1), a first support plate (6) and a second support plate (7) are symmetrically distributed on the upper surface of the bottom plate (5), a placing groove (8) is formed in the upper surface of the first support plate (6) and the upper surface of the second support plate (7), the surface of the circuit board (2) is in sliding connection with the inner wall of the placing groove (8), and a soldering paste spraying mechanism and a movable heat welding mechanism are sequentially arranged below the circuit board (2);
wherein the solder paste spraying mechanism is used for uniformly spraying solder paste onto pins of the semiconductor device (3);
The soldering paste spraying mechanism comprises fixing seats (9) which are respectively and fixedly arranged on the surfaces of one side opposite to the first support plate (6) and the second support plate (7), support sliding grooves (901) are formed in the surfaces of the two fixing seats (9), L-shaped blocks (902) are slidably connected to the inner walls of the two support sliding grooves (901), racks (903) are fixedly connected to the upper surfaces of the two L-shaped blocks (902), a driving motor (904) is fixedly arranged on one side surface, away from the racks (903), of the first support plate (6), a worm (905) is fixedly sleeved at one end of an output shaft of the driving motor (904), a rotating shaft (906) is fixedly sleeved at one end, away from the driving motor (904), of the worm (905), a first gear (907) is fixedly sleeved at one end, extending out of the first support plate (6), of the rotating shaft (906), and the surface of the first gear (907) is meshed with the surface of the racks (903);
Grooves (914) are formed in the surfaces, close to the fixed seat (9), of the first support plate (6) and the second support plate (7), first guide rails (915) are fixedly arranged on the inner walls of the two grooves (914), a hydraulic shear rest (916) is fixedly arranged on the surface of a sliding block of each first guide rail (915), and one side surface of each hydraulic shear rest (916) is fixedly connected with one side surface of each L-shaped block (902);
A supporting block (917) is fixedly connected to the surface of one side, far away from the fixed seat (9), of the L-shaped block (902), an electric telescopic rod (918) is fixedly connected to the upper surface of the supporting block (917), a storage shell (919) is fixedly connected to one end of the electric telescopic rod (918), and nozzles (920) are fixedly communicated with the surfaces of two sides of the storage shell (919);
wherein the mobile heat welding mechanism is used for heating and melting soldering paste and applying pressure to enable the soldering paste to form connection, so that the connection of the semiconductor device (3) and the circuit board (2) is realized.
2. The welding device for manufacturing a semiconductor lighting device according to claim 1, wherein: a mini-conveyor belt (11) is fixedly arranged on one side of the upper surface of the operating table (1), and the mini-conveyor belt (11) is used for conveying the semiconductor devices (3).
3. The welding device for semiconductor lighting device processing according to claim 2, wherein: the utility model discloses a small-size conveyer belt, including operation panel (1), vacuum chuck (15) are installed to the front end of transportation arm (14), operation panel (1) is close to upper surface one side of small-size conveyer belt (11) is bilateral symmetry distribution and installs from driving slide rail (12), two the slider upper surface of from driving slide rail (12) is all fixedly connected with first connecting plate (13), the upper surface fixed mounting of first connecting plate (13) has transportation arm (14), vacuum chuck (15) are installed to the front end of transportation arm (14).
4. The welding device for manufacturing a semiconductor lighting device according to claim 1, wherein: first transmission shaft (908) is installed through the bearing to the inner wall of first extension board (6), first transmission shaft (908) is close to one end of worm (905) is fixed to be cup jointed worm wheel (909), second transmission shaft (910) is installed through the bearing to the inner wall of second extension board (7), first transmission shaft (908) with second transmission shaft (910) extend respectively first extension board (6) with one end of second extension board (7) is connected with conveyer belt (911) through the belt pulley transmission, connecting axle (912) is installed through the bearing to the inner wall of second extension board (7), one end that second transmission shaft (910) is kept away from conveyer belt (911) is connected through bevel gear group with one end transmission of connecting axle (912), connecting axle (912) extend the one end of second extension board (7) is fixed to be cup jointed second gear (913), the surface of second gear (913) with the surface engagement of rack (903).
5. The welding device for manufacturing a semiconductor lighting device according to claim 1, wherein: the movable heat welding mechanism comprises a mounting groove (10) formed in the upper surface of a bottom plate (5), a screw (101) is mounted on the inner wall of the mounting groove (10) through a bearing, a servo motor (102) is fixedly mounted on one side surface of the bottom plate (5), one end of an output shaft of the servo motor (102) is fixedly sleeved with one end of the screw (101), a threaded block (103) is sleeved on the surface thread of the screw (101), the surface of the threaded block (103) is in sliding clamping connection with the inner wall of the mounting groove (10), a second connecting plate (104) is fixedly mounted on the upper surface of the threaded block (103), and a hot pressing mechanical arm (105) is fixedly mounted on the upper surface of the second connecting plate (104).
6. The welding device for manufacturing a semiconductor lighting device according to claim 5, wherein: second guide rails (106) are symmetrically distributed on two sides of the bottom plate (5) close to the upper surface of the mounting groove (10), and the upper surfaces of sliding blocks of the two second guide rails (106) are fixedly connected with the lower surface of the second connecting plate (104).
7. The welding device for manufacturing a semiconductor lighting device according to claim 1, wherein: the utility model discloses a motor, including first extension board (6) and upper surface of second extension board (7), connecting seat (16) are all fixed mounting, two the inner wall of connecting seat (16) is installed through the bearing movable shaft (17), the fixed surface of movable shaft (17) cup joints cardboard (18), two the equal fixed mounting of one side surface of connecting seat (16) has step motor (19), step motor (19) output shaft one end with the one end of movable shaft (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410494695.7A CN118060650B (en) | 2024-04-24 | Welding device for processing semiconductor lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410494695.7A CN118060650B (en) | 2024-04-24 | Welding device for processing semiconductor lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118060650A CN118060650A (en) | 2024-05-24 |
| CN118060650B true CN118060650B (en) | 2024-07-02 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025095A (en) * | 2020-09-15 | 2020-12-04 | 王志兵 | Laser welding device |
| CN114659043A (en) * | 2022-03-18 | 2022-06-24 | 临海市名佳自动化设备有限公司 | Full-automatic rubber-insulated-wire lamp paster point glues combination machine |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025095A (en) * | 2020-09-15 | 2020-12-04 | 王志兵 | Laser welding device |
| CN114659043A (en) * | 2022-03-18 | 2022-06-24 | 临海市名佳自动化设备有限公司 | Full-automatic rubber-insulated-wire lamp paster point glues combination machine |
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