CN117976559B - Vacuum lamination device and vacuum lamination method for semiconductor products - Google Patents
Vacuum lamination device and vacuum lamination method for semiconductor products Download PDFInfo
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- CN117976559B CN117976559B CN202410031635.1A CN202410031635A CN117976559B CN 117976559 B CN117976559 B CN 117976559B CN 202410031635 A CN202410031635 A CN 202410031635A CN 117976559 B CN117976559 B CN 117976559B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 258
- 238000003475 lamination Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000003825 pressing Methods 0.000 claims abstract description 57
- 238000012545 processing Methods 0.000 claims abstract description 41
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims description 112
- 238000013519 translation Methods 0.000 claims description 15
- 239000000872 buffer Substances 0.000 claims description 13
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000012797 qualification Methods 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 74
- 230000003139 buffering effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
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Abstract
The application discloses a vacuum lamination device and a vacuum lamination method for semiconductor products, which relate to the field of semiconductor manufacturing. According to the application, the film is conveyed into the processing chamber by the feeding mechanism and is attached to the adhesive layer of the semiconductor product in the vacuum state, the pressing mechanism presses the semiconductor product in the vacuum state, and the film is in the vacuum state in the attaching and pressing processes, so that bubbles are not easy to occur, the qualification rate of the semiconductor product is improved, and the film can be added into the feeding chamber in advance in the pressing process of the semiconductor product, so that the production efficiency of the semiconductor product is improved.
Description
Technical Field
The application relates to the field of semiconductor manufacturing, in particular to a vacuum lamination device and a vacuum lamination method for semiconductor products.
Background
The semiconductor product refers to electronic components and integrated circuits made of semiconductor materials, is an important component of the modern electronic industry, is widely applied to various fields such as computers, communication, consumer electronics, industrial control and the like, and has important significance for promoting technological development and improving the life quality of people.
At present, referring to fig. 1, when two rectangular semiconductor products 22 are pressed, the two semiconductor products 22 are placed in a pressing device, the sidewalls of the two semiconductor products 22 close to each other are coated with adhesive layers 23, a film 24 is attached to the adhesive layers 23 of one semiconductor product, the two semiconductor products 22 are pressed by the pressing device, and the two adhesive layers 23 are bonded to two sides of the film 24, so that the pressing of the two semiconductor products 22 can be completed. After the lamination is completed, the semiconductor product is taken out from the lamination device, and then the two semiconductor products 22 are put into the lamination device and the film 24 is attached, so that the next lamination can be performed.
The film is easy to generate bubbles in the attaching and pressing processes, and the bubbles generated in the film can lead to disqualification of the semiconductor finished product, thereby reducing the qualification rate of the semiconductor finished product; after the first semiconductor finished product is pressed and taken out, a new semiconductor product can be put in and a film is attached, so that the production efficiency of the semiconductor finished product is reduced.
Disclosure of Invention
In order to improve the production efficiency and the yield of semiconductor products, the application provides a vacuum lamination device and a vacuum lamination method for semiconductor products.
In a first aspect, the present application provides a vacuum lamination device for semiconductor products, which adopts the following technical scheme:
The vacuum pressing device for the semiconductor product comprises a base, wherein a processing chamber and a feeding chamber are arranged on the base, a first vacuum chamber is formed in the processing chamber, a second vacuum chamber is formed in the feeding chamber, a vacuumizing mechanism is arranged on the base and is respectively communicated with the first vacuum chamber and the second vacuum chamber and vacuumizes, and a connecting mechanism is arranged on the base and is used for connecting the processing chamber and the feeding chamber and is used for communicating or disconnecting the first vacuum chamber and the second vacuum chamber; the processing chamber is provided with a first sealing door in an opening and closing manner, a pressing mechanism for placing two semiconductor products and pressing the two semiconductor products is arranged in the processing chamber, the feeding chamber is provided with a second sealing door in an opening and closing manner, and a feeding mechanism for placing a film is arranged in the feeding chamber and conveys the film into the first vacuum chamber and attaches the film to a semiconductor product adhesive layer; when the feeding mechanism conveys the film, the first vacuum cavity and the second vacuum cavity are communicated and are in a vacuum state; when the pressing mechanism is used for pressing, the first vacuum cavity and the second vacuum cavity are disconnected, the first vacuum cavity is in a vacuum state, the second vacuum cavity breaks the vacuum state, and the second sealing door is opened to put the film into the feeding mechanism; after the pressing mechanism completes pressing, the first vacuum cavity and the second vacuum cavity are disconnected, the first vacuum cavity breaks the vacuum state, the second vacuum cavity is in the vacuum state, and the first sealing door is opened to take out and put the semiconductor finished product into a new semiconductor product.
By adopting the technical scheme, when the semiconductor product is pressed, the first sealing door is opened to put two semiconductor products into the pressing mechanism, the second sealing door is opened to put the film into the feeding mechanism, the vacuumizing mechanism vacuumizes the first vacuum cavity and the second vacuum cavity, the connecting mechanism is communicated with the first vacuum cavity and the second vacuum cavity, the feeding mechanism conveys the film into the first vacuum cavity and attaches the film to the adhesive layer of the semiconductor product, after the feeding mechanism returns to reset, the connecting mechanism cuts off the first vacuum cavity and the second vacuum cavity, the pressing mechanism presses the semiconductor product again, and the film is in a vacuum state in the attaching and pressing processes, so that bubbles are not easy to occur, and the qualification rate of the semiconductor product is improved; in the pressing process of the semiconductor product, the second vacuum cavity breaks the vacuum state, a film is placed in the feeding mechanism and vacuumizes the second vacuum cavity, after the pressing is completed, the vacuum state of the first vacuum cavity is broken, after the semiconductor product is taken out, a new semiconductor product is placed in, after the first vacuum cavity completes vacuumization, the connecting mechanism is communicated with the first vacuum cavity and the second vacuum cavity, the feeding mechanism conveys the film again, and in the pressing process of the semiconductor product, the film can be added in advance, so that the production efficiency of the semiconductor product is improved.
Preferably, the connecting mechanism comprises a connecting chamber, a third sealing door and a fourth sealing door, the connecting chamber is arranged on the base and is connected with the processing chamber and the feeding chamber, a third vacuum chamber is formed in the connecting chamber, the third sealing door is opened and closed on one side, close to the processing chamber, of the third vacuum chamber of the connecting chamber and is used for connecting or disconnecting the first vacuum chamber and the third vacuum chamber, and the fourth sealing door is opened and closed on one side, close to the feeding chamber, of the third vacuum chamber of the connecting chamber and is used for connecting or disconnecting the second vacuum chamber and the third vacuum chamber.
By adopting the technical scheme, the first vacuum cavity and the second vacuum cavity can be communicated by simultaneously opening the third sealing door and the fourth sealing door; in the pressing process of the semiconductor product, the fourth sealing door is opened, the third sealing door is closed, when the second vacuum cavity breaks the vacuum state, the third vacuum cavity also breaks the vacuum state, at the moment, the first vacuum cavity is in the vacuum state, and the air pressure in the third vacuum cavity acts on the third sealing door, so that the sealing effect of the third sealing door is better; in the process of taking out the semiconductor finished product, the third sealing door is opened, the fourth sealing door is closed, when the vacuum state is broken by the first vacuum cavity, the vacuum state is broken by the third vacuum cavity, at the moment, the second vacuum cavity is in the vacuum state, and the air pressure in the third vacuum cavity acts on the fourth sealing door, so that the sealing effect of the fourth sealing door is better.
Preferably, the pressing mechanism comprises an upper die assembly, a lower die assembly and a driving assembly, the upper die assembly is arranged in the processing chamber and used for limiting one semiconductor product, the feeding mechanism is used for conveying the film to be attached to the semiconductor product in the upper die assembly, the lower die assembly is arranged in the processing chamber and used for limiting the other semiconductor product, and the driving assembly is arranged in the processing chamber and used for driving the lower die assembly to move up and down.
By adopting the technical scheme, the film is attached to the semiconductor product in the upper die assembly, and the driving mechanism drives the lower die assembly to move and press. So set up, go up the mould subassembly and do not remove, feeding mechanism carries attached film all in same position at every turn to make the film attached more accurate.
Preferably, the upper die assembly comprises a top plate, two butt straps and a plurality of lifting pieces, wherein the top plate is fixedly arranged at the top of the first vacuum cavity of the processing chamber, the lifting pieces are symmetrically arranged at two sides of the top plate, the butt straps are symmetrically arranged at two sides of the top plate and are positioned below the top plate, the butt straps are fixedly connected with lifting ends of the lifting pieces, the semiconductor product is placed on the two butt straps, and the lifting pieces tightly prop the semiconductor product on the bottom wall of the top plate through the butt straps.
Through adopting above-mentioned technical scheme, when carrying out spacing fixed to first semiconductor product, place the semiconductor product on two access boards earlier, promote the piece shrink and drive two access boards and rise, the access board drives the semiconductor product and rises, after the roof of semiconductor product removes the diapire of supporting the tight roof, can be fixed in the bottom of roof by spacing.
Preferably, the lower die assembly comprises a bottom plate and a plurality of first limiting pins, the bottom plate is arranged at the bottom of the first vacuum cavity of the processing chamber, the bottom plate is located right below the top plate and fixedly connected with the driving end of the driving assembly, the top wall of the bottom plate is provided with the plurality of first limiting pins, the semiconductor product is placed on the top wall of the bottom plate, and the plurality of first limiting pins are abutted to the peripheral side wall of the semiconductor product.
Through adopting above-mentioned technical scheme, place the semiconductor product on the bottom plate, a plurality of first spacer pins carry out spacingly to the semiconductor product for the semiconductor product is placed more accurately, and drive assembly drives the bottom plate and upwards moves, and the bottom plate drives the semiconductor product and upwards moves, thereby makes two semiconductor products accurate pressfitting.
Preferably, the butt strap comprises a connecting plate body and a supporting plate body, the connecting plate body is fixedly arranged at the driving end of the lifting piece, the supporting plate body is arranged at the bottom end, close to the central side wall of the top plate, of the connecting plate body, the thickness of the supporting plate body is smaller than that of the connecting plate body, the semiconductor product is placed on the supporting plate body, and the side wall of the semiconductor product abuts against the side wall of the connecting plate body.
Through adopting above-mentioned technical scheme, when the semiconductor product was placed on the strap, the diapire butt backup pad body of semiconductor product's diapire, the lateral wall butt backup pad body of semiconductor product's lateral wall, after the semiconductor product is spacing fixed, the diapire of roof is butt roof to the roof of semiconductor product to make the semiconductor product by fixed more firm.
Preferably, the connecting plate body is close to the side wall of the supporting plate body and is provided with a chamfer at the installation side of the semiconductor product, the top wall of the connecting plate body is provided with a limit groove, and the semiconductor product is positioned in the limit groove.
Through adopting above-mentioned technical scheme, the chamfer on two connecting plate bodies is convenient for rectangle semiconductor product slip and is placed on two backup pad bodies, after the semiconductor product was placed on the backup pad body, promotes the semiconductor product and slides on the backup pad body, when the semiconductor product slip drops to the spacing inslot, can be with the stable lay of semiconductor product on the strap.
Preferably, the feeding mechanism comprises a feeding plate, a translation assembly, a lifting assembly and a plurality of second limiting pins, wherein the translation assembly is arranged in the feeding chamber, the lifting assembly is arranged at the driving end of the translation assembly, the feeding plate is arranged at the driving end of the lifting assembly, a thin film is placed on the feeding plate, and the second limiting pins are arranged on the top wall of the feeding plate and limit the thin film.
Through adopting above-mentioned technical scheme, place the film on the delivery sheet, the second spacer pin is spacing to the film, and translation subassembly drives the delivery sheet through lifting unit and removes along the horizontal direction, and the delivery sheet drives the film and removes to under the semiconductor product, and lifting unit drives the delivery sheet again and removes along vertical direction, and the delivery sheet drives the film and pastes on the semiconductor product that is located the top. So set up, use translation subassembly and lifting unit to drive the charge plate and remove, the charge plate drives the film and removes to make the attached position of film more accurate.
Preferably, one the internal spout of having seted up of connecting plate, the connecting plate body is located the spout and has installed the slider along perpendicular butt strap elevating direction slidable, the wedge groove has been seted up on the top of slider, the internal wedge picture peg that is provided with along butt strap elevating direction slidable of connecting plate, the top of wedge picture peg stretches out the connecting plate body, and the bottom slides and peg graft in the wedge groove of slider, works as when the butt strap upwards moves, wedge picture peg top butt roof and moves towards being close to the semiconductor product direction through wedge groove drive slider, the connecting plate body is located the slider and is close to semiconductor product one side and be provided with the push pedal, the lateral wall butt semiconductor product of slider is kept away from to the push pedal, be provided with the buffering elastic component between slider and the push pedal, one side that the slider was kept away from to the push pedal is provided with the reset elastic component that is connected with the connecting plate body.
Through adopting above-mentioned technical scheme, when the semiconductor product was placed on the backup pad body, the push pedal was located one side of semiconductor product, and the strap upwards moved, and when the strap was close the roof, the top butt roof of wedge picture peg, along with the continuous upwards movement of strap, the roof promoted wedge picture peg and moved downwards, wedge picture peg moved in the wedge inslot to promote the slider towards being close to the semiconductor product direction and remove, the slider passes through the buffer elastic component and promotes the push pedal removal, and the push pedal removes to support the semiconductor product tightly, thereby carries out accurate location to the semiconductor product, makes the film attached be difficult for appearing the error. When the pushing plate abuts against the semiconductor product, the buffer elastic piece buffers the pushing force of the sliding block, so that the pushing plate can abut against the semiconductor product and is not easy to damage the semiconductor product; when the pressing of the semiconductor product is finished and the bonding plate moves downwards, the reset elastic piece pulls the sliding block to move and reset, and the sliding block moves to enable the wedge-shaped inserting plate to move upwards and reset, so that the accurate positioning of the semiconductor product is facilitated again.
In a second aspect, the present application provides a method for vacuum lamination of semiconductor products, which adopts the following technical scheme:
the vacuum lamination method of the semiconductor product adopts the vacuum lamination device of the semiconductor product, and comprises the following steps:
s1: placing two semiconductor products on a pressing mechanism in a processing chamber, placing a film on a conveying mechanism in a feeding chamber, opening a third sealing door, closing a fourth sealing door, and aligning a first vacuum chamber with a second vacuum chamber
Vacuumizing the vacuum cavity;
S2: after the vacuumizing is finished, the fourth sealing door is opened, the film is firstly sent into the first vacuum cavity by the feeding mechanism, then the film is driven to be movably attached to the adhesive layer of the semiconductor product, after the feeding mechanism is moved and reset,
Closing the third sealing door;
s3: the pressing mechanism presses the two semiconductor products, and simultaneously, the second vacuum cavity breaks the vacuum state, the second sealing door is opened, the film is put on the conveying mechanism in the feeding chamber, and the second sealing is closed
Vacuumizing the second vacuum cavity after the door;
S4: after the semiconductor products are pressed, the fourth sealing door is closed, the third sealing door is opened, the vacuum state of the first vacuum cavity is broken, the first sealing door is opened, and the semiconductor products are taken out and put into the two halves
The conductor product closes the first sealing door and vacuumizes the first vacuum cavity;
s5: repeating the steps S2-S4 to press the semiconductor product again
By adopting the technical scheme, the film is in a vacuum state in the attaching and pressing processes, so that bubbles are not easy to occur, and the qualification rate of semiconductor finished products is improved; in the lamination process of the semiconductor product, a film can be added in advance, so that the production efficiency of the semiconductor product is improved.
In summary, the present application includes at least one of the following beneficial technical effects:
1. The film is conveyed into the first vacuum cavity by the feeding mechanism and is attached to the adhesive layer of the semiconductor product in a vacuum state, the pressing mechanism presses the semiconductor product in the vacuum state, and the film is in the vacuum state in the attaching and pressing processes, so that bubbles are not easy to occur, the qualification rate of the semiconductor product is improved, and the film can be added into the feeding chamber in advance in the pressing process of the semiconductor product, so that the production efficiency of the semiconductor product is improved;
2. By means of the connecting plate body and the supporting plate body, when the semiconductor product is placed on the butt strap, the bottom wall of the semiconductor product is abutted against the top wall of the supporting plate body, the side wall of the semiconductor product is abutted against the side wall of the supporting plate body, and after the semiconductor product is limited and fixed, the top wall of the semiconductor product is abutted against the bottom wall of the top plate, so that the semiconductor product is fixed more firmly;
3. Through carrying out accurate location to the semiconductor product for the film is attached difficult for error to appear, and when the semiconductor product was placed on the backup pad body, the push pedal was located one side of semiconductor product, and the strap upwards moved, and when the strap was close to the roof, the top butt roof of wedge picture peg, along with the strap constantly upwards moved, the roof promoted wedge picture peg to move down, and wedge picture peg moves in wedge inslot, thereby promotes the slider towards being close to the semiconductor product direction and remove, and the slider passes through buffering elastic component and promotes the push pedal and remove, and the push pedal removes to support tight semiconductor product, thereby carries out accurate location to the semiconductor product.
Drawings
FIG. 1 is a schematic diagram illustrating lamination of a semiconductor product according to the background of the application;
Fig. 2 is a schematic diagram of the overall structure of a vacuum lamination device for semiconductor products in embodiment 1 of the present application;
Fig. 3 is a schematic diagram illustrating an internal structure of a vacuum lamination device for a semiconductor product according to embodiment 1 of the present application;
fig. 4 is a schematic view showing a part of the structure of the vacuum lamination device for semiconductor products in embodiment 1 of the present application;
Fig. 5 is a schematic view of a part of the structure of the vacuum lamination device for semiconductor products in embodiment 1 of the present application, which is a protruding display board;
fig. 6 is a schematic view of a part of the structure of the vacuum lamination device for semiconductor products in embodiment 1 of the present application as a protruding feeding mechanism;
Fig. 7 is a schematic diagram showing the internal structure of the vacuum lamination device for semiconductor products in the state of transporting thin films in embodiment 1 of the present application;
fig. 8 is a schematic view of a part of the vacuum lamination device for semiconductor products according to embodiment 1 of the present application, which is a schematic view showing the driving manner of the third sealing door and the fourth sealing door;
fig. 9 is a schematic view of a part of the structure of the vacuum lamination device for semiconductor products in embodiment 1 of the present application showing the driving mode of the second sealing door in a protruding manner;
Fig. 10 is a schematic view showing a part of the structure of the vacuum lamination device for semiconductor products in embodiment 2 of the present application;
FIG. 11 is a cross-sectional view showing a part of the structure of the bonding board for protruding display of the vacuum bonding apparatus for semiconductor products in embodiment 2 of the present application;
FIG. 12 is a sectional view showing a portion of the vacuum pressing apparatus for semiconductor products according to embodiment 2 of the present application, wherein the portion is protruded to show the state that the pushing plate abuts against the semiconductor products;
fig. 13 is a flowchart of a vacuum lamination method of a semiconductor product in embodiment 3 of the present application.
Reference numerals: 1. a base; 2. a processing chamber; 3. a feeding chamber; 4. a first vacuum chamber; 5. a second vacuum chamber; 6. a vacuum pumping mechanism; 7. a connecting mechanism; 71. a connection chamber; 72. a third sealing door; 73. a fourth sealing door; 8. a pressing mechanism; 81. an upper die assembly; 811. a top plate; 812. a butt strap; 8121. a connecting plate body; 8122. a support plate body; 813. a lifting member; 82. a lower die assembly; 821. a bottom plate; 822. a first limit pin; 83. a drive assembly; 9. a feeding mechanism; 91. a feeding plate; 92. a translation assembly; 93. a lifting assembly; 94. a second limiting pin; 10. a first sealing door; 11. a second sealing door; 12. a third vacuum chamber; 13. chamfering; 14. a limit groove; 15. a chute; 16. a slide block; 17. wedge-shaped grooves; 18. wedge-shaped plugboards; 19. a push plate; 20. a buffer elastic member; 21. a return elastic member; 22. a semiconductor product; 23. a glue layer; 24. a film.
Detailed Description
The application is described in further detail below with reference to fig. 2-13.
Example 1:
The embodiment of the application discloses a vacuum lamination device for a semiconductor product.
Referring to fig. 2 and 3, a vacuum pressing apparatus for semiconductor products includes a base 1, and a processing chamber 2 and a feeding chamber 3 are installed on the base 1. A sealed first vacuum cavity 4 is formed in the processing chamber 2, and a first sealing door 10 is arranged on the side wall of the processing chamber 2 in an opening and closing manner; a sealed second vacuum cavity 5 is formed in the feeding chamber 3, and a second sealing door 11 is arranged on the top wall of the feeding chamber 3 in an opening and closing manner.
Install evacuating mechanism 6 on the base 1, evacuating mechanism 6 communicates first vacuum chamber 4 and second vacuum chamber 5 respectively, evacuating mechanism 6 can carry out the evacuation to first vacuum chamber 4 and second vacuum chamber 5 for first vacuum chamber 4 and second vacuum chamber 5 are in the vacuum state, and simultaneously, evacuating mechanism 6 still can break the vacuum state of first vacuum chamber 4 and second vacuum chamber 5. A connecting mechanism 7 is arranged between the processing chamber 2 and the feeding chamber 3 on the base 1, the connecting mechanism 7 is connected with the processing chamber 2 and the feeding chamber 3, and the connecting mechanism 7 can be connected with or disconnected from the first vacuum chamber 4 and the second vacuum chamber 5.
The processing chamber 2 is internally provided with a pressing mechanism 8, and the first sealing door 10 is opened, so that two semiconductor products can be respectively arranged on the upper side and the lower side of the pressing mechanism 8.
Specifically, the pressing mechanism 8 includes an upper die assembly 81, a lower die assembly 82 and a driving assembly 83, the upper die assembly 81 is installed at the top of the first vacuum chamber 4 in the processing chamber 2 and limits and fixes one semiconductor product, the lower die assembly 82 is installed at the bottom of the first vacuum chamber 4 in the processing chamber 2 and limits and fixes another semiconductor product, the driving assembly 83 is installed below the lower die assembly 82 in the processing chamber 2, in the application, the driving assembly 83 can be a plurality of cylinders, and the driving assembly 83 can also be a servo motor and a screw rod. The driving assembly 83 drives the lower die assembly 82 to move up and down, thereby pressing the two semiconductor products.
Referring to fig. 3 and 4, the upper mold assembly 81 includes a top plate 811, two straps 812, and a plurality of lifters 813, wherein the top plate 811 is fixedly installed at the top of the first vacuum chamber 4 in the processing chamber 2, and the plurality of lifters 813 are fixedly installed at the top of the first vacuum chamber 4 in the processing chamber 2 and symmetrically located at both sides of the top plate 811 in the horizontal direction, and in the present application, the lifters 813 may be selected as cylinders. Two access boards 812 are located below the top plate 811 and close to two sides of the lifting member 813, the access boards 812 are installed at lifting ends of the lifting member 813, and the plurality of lifting members 813 can drive the two access boards 812 to synchronously lift and move.
Referring to fig. 4 and 5, the access plate 812 includes a connection plate body 8121 and a support plate body 8122, the connection plate body 8121 is fixedly installed at a lifting end of the lifting member 813, the support plate body 8122 is integrally formed on a side wall of the connection plate body 8121 near a center of the top plate 811, a bottom wall of the support plate body 8122 is flush with a bottom wall of the connection plate body 8121, and a thickness of a support plate bottom is smaller than that of the connection plate body 8121. The top wall of the support plate 8122 is provided with a limiting groove 14, and the side wall of the plate body, which is close to the support plate 8122 and is positioned on the mounting side of the semiconductor product, is provided with a chamfer 13.
When the first semiconductor product is mounted, the lifting member 813 drives the two connection plates 812 to synchronously descend, the rectangular semiconductor product is placed on the support plate 8122 in a sliding manner through the two chamfers 13, the semiconductor product is pushed to slide on the support plate 8122, and when the semiconductor product slides and falls into the limiting groove 14, the semiconductor product can be stably placed on the connection plates 812. At this time, the bottom wall of the semiconductor product abuts against the top wall of the support plate body 8122, and the side wall of the semiconductor product abuts against the side wall of the support plate body 8122. The lifting member 813 drives the two butt straps 812 to synchronously lift, so that the top wall of the semiconductor product abuts against the bottom wall of the top plate 811, and the semiconductor product can be limited and fixed, so that the semiconductor product is fixed more firmly.
Referring to fig. 4, the lower die assembly 82 includes a bottom plate 821 fixedly installed at the driving end of the driving assembly 83 and located directly under the top plate 811, and a plurality of first limiting pins 822 installed on the top wall of the bottom plate 821. The second semiconductor product is placed on the bottom plate 821, and the plurality of first limiting pins 822 are located around the semiconductor product and are in abutting limiting connection with the semiconductor product, so that limiting fixation is performed on the second semiconductor product. The driving component 83 drives the bottom plate 821 to move upwards, and the bottom plate 821 drives the semiconductor products to move upwards, so that the two semiconductor products can be pressed together.
Referring to fig. 2 and 3, a feeding mechanism 9 is installed in the feeding chamber 3, and a film can be placed on the feeding mechanism 9 by opening a first sealing door 10.
Referring to fig. 6, specifically, the feeding mechanism 9 includes a feeding plate 91, a translation assembly 92, a lifting assembly 93 and a plurality of second limiting pins 94, the translation assembly 92 is fixedly installed at the bottom of the second vacuum chamber 5 in the feeding chamber 3, the lifting assembly 93 is fixedly installed at the driving end of the translation assembly 92, and the feeding plate 91 is fixedly installed at the lifting end of the lifting assembly 93. In the present application, the translation assembly 92 may be a linear module, and the lifting assembly 93 may be a plurality of cylinders. The plurality of second limiting pins 94 are arranged on the top wall of the feeding plate 91, the film is placed on the feeding plate 91, and the plurality of second limiting pins 94 are located around the film and limit the film in an abutting mode.
Referring to fig. 7, when a film needs to be conveyed, the translation assembly 92 drives the lifting assembly 93 to move through the connection mechanism 7, the translation assembly 92 drives the film to move right under the semiconductor product in the upper die assembly 81 through the feeding plate 91, and the lifting assembly 93 drives the film to rise through the feeding plate 91, so that the film is accurately attached to the adhesive layer of the semiconductor product.
Referring to fig. 2 and 3, after the semiconductor product and the film are placed, the first sealing door 10 and the second sealing door 11 are closed, the first vacuum chamber 4 and the second vacuum chamber 5 are vacuumized by the vacuumizing mechanism 6, the connecting mechanism 7 is communicated with the first vacuum chamber 4 and the second vacuum chamber 5, the feeding mechanism 9 can send the film into the first vacuum chamber 4, and the thin plate is attached to the adhesive layer of the semiconductor product above the inside of the pressing mechanism 8. The film is attached under the vacuum state, so that bubbles are not easy to generate in the film.
After the feeding mechanism 9 retreats into the second vacuum cavity 5, the connecting mechanism 7 disconnects the first vacuum cavity 4 and the second vacuum cavity 5, and the pressing mechanism 8 drives the semiconductor products below to move upwards, so that the two semiconductor products are pressed. The semiconductor product is pressed in a vacuum state, so that bubbles are not easy to generate in the film, and the qualification rate of the semiconductor product is improved.
In the lamination process of the semiconductor product, the vacuum state of the second vacuum cavity 5 is broken, the next film is placed on the film feeding mechanism, and then the second vacuum cavity 5 is vacuumized. After the semiconductor products are pressed, the vacuum state of the first vacuum cavity 4 is broken, the semiconductor finished products are taken out, two semiconductor products are put in, and then the first vacuum cavity 4 is vacuumized. After the first vacuum cavity 4 and the second vacuum cavity 5 are in the vacuum state, the connecting mechanism 7 is communicated with the first vacuum cavity 4 and the second vacuum cavity 5, and the feeding mechanism 9 conveys and attaches the film again. In the lamination process of the semiconductor product, the film can be added into the feeding chamber 3 in advance, so that the production efficiency of the semiconductor product is improved.
Referring to fig. 3 and 8, and in particular, the connection mechanism 7 includes a connection chamber 71, a third sealing door 72, and a fourth sealing door 73, the connection chamber 71 is fixedly installed on the base 1 and fixedly connected with the processing chamber 2 and the feeding chamber 3, a third vacuum chamber 12 is formed in the connection chamber 71, and the third vacuum chamber 12 communicates with the first vacuum chamber 4 and the second vacuum chamber 5. The third sealing door 72 is arranged on one side of the connecting chamber 71 close to the processing chamber 2 in an opening and closing manner, and the third sealing door 72 can be used for connecting or disconnecting the third vacuum chamber 12 with the first vacuum chamber 4; the fourth sealing door 73 is installed on one side of the connecting chamber 71 close to the feeding chamber 3 in an opening and closing manner, and the fourth sealing door 73 can be used for connecting or disconnecting the third vacuum chamber 12 with the second vacuum chamber 5.
In the film conveying and attaching process, the third sealing door 72 and the fourth sealing door 73 are opened, and the first vacuum cavity 4 and the second vacuum cavity 5 are communicated through the third vacuum cavity 12; in the lamination process of the semiconductor product, the third sealing door 72 is closed, the fourth sealing door 73 is opened, when the second vacuum cavity 5 breaks the vacuum state, the third vacuum cavity 12 breaks the vacuum state, at the moment, the first vacuum cavity 4 is in the vacuum state, and the air pressure in the third vacuum cavity 12 acts on the third sealing door 72, so that the sealing effect of the third sealing door 72 is better; in the process of taking out the semiconductor finished product, the third sealing door 72 is opened, the fourth sealing door 73 is closed, when the first vacuum cavity 4 breaks the vacuum state, the third vacuum cavity 12 breaks the vacuum state, at the moment, the second vacuum cavity 5 is in the vacuum state, and the air pressure in the third vacuum cavity 12 acts on the fourth sealing door 73, so that the sealing effect of the fourth sealing door 73 is better.
Referring to fig. 2, 8 and 9, in the present application, the first sealing door 10, the second sealing door 11, the third sealing door 72 and the fourth sealing door 73 are opened and closed with two strokes. When the sealing door is opened, one group of air cylinders drives the sealing door to move a first stroke along the direction vertical to the sealing surface so that the sealing door is separated from the sealing surface, and the other group of air cylinders drives the sealing door to move a second stroke along the direction parallel to the sealing surface so that the sealing door is opened. Similarly, the sealing door is closed after two strokes. The sealing door is opened and closed by two strokes, so that the sealing effect of the sealing door is better.
The implementation principle of the vacuum lamination device for the semiconductor product provided by the embodiment of the application is as follows: when the semiconductor products are pressed, the first sealing door 10 is opened to put the two semiconductor products into the pressing mechanism 8, the second sealing door 11 is opened to put the film into the feeding mechanism 9, the vacuumizing mechanism 6 vacuumizes the first vacuum cavity 4 and the second vacuum cavity 5, the connecting mechanism 7 is communicated with the first vacuum cavity 4 and the second vacuum cavity 5, the feeding mechanism 9 conveys the film into the first vacuum cavity 4 and attaches the film to the adhesive layer of the semiconductor products, after the feeding mechanism 9 returns to reset, the connecting mechanism 7 cuts off the first vacuum cavity 4 and the second vacuum cavity 5, the pressing mechanism 8 presses the semiconductor products again, and the films are in vacuum states in the attaching and pressing processes, so that bubbles are not easy to occur, and the qualification rate of the semiconductor products is improved; in the process of pressing the semiconductor product, the second vacuum cavity 5 breaks the vacuum state, a film is placed in the feeding mechanism 9 and vacuumizes the second vacuum cavity 5, after the pressing is completed, the vacuum state of the first vacuum cavity 4 is broken, after the semiconductor product is taken out, a new semiconductor product is placed in, after the first vacuum cavity 4 completes vacuumization, the connecting mechanism 7 is communicated with the first vacuum cavity 4 and the second vacuum cavity 5, the feeding mechanism 9 conveys the film again, and in the process of pressing the semiconductor product, the film can be added in advance, so that the production efficiency of the semiconductor product is improved.
Example 2:
Referring to fig. 10 and 11, this embodiment is different from embodiment 1 in that a chute 15 is provided in a horizontal direction in a connection plate 8121 at a side far from the feeding chamber 3, the chute 15 is provided near an opening at one end of the semiconductor product, and a slider 16 is slidably mounted in the chute 15 in a horizontal direction.
A plurality of reset elastic pieces 21 are fixedly arranged on the side wall, far away from the semiconductor product, of the sliding block 16 at intervals along the horizontal direction, the end parts, far away from the sliding block 16, of the elastic reset pieces are fixedly connected with the inner side wall, located at the sliding groove 15, of the connecting plate body 8121, and a plurality of buffer elastic pieces 20 are fixedly arranged on the side wall, close to the semiconductor product, of the sliding block 16 at intervals along the horizontal direction. In the present application, the return elastic member 21 and the buffer elastic member 20 are both springs.
The one end fixed mounting that slider 16 was kept away from to a plurality of buffering elastic component 20 has push pedal 19, and push pedal 19 along horizontal direction looks adaptation slidable mounting in spout 15, and the lateral wall that push pedal 19 is close to the semiconductor product flushes with the lateral wall that connecting plate body 8121 is close to the semiconductor product, and the lateral wall that push pedal 19 is close to the semiconductor product and semiconductor product butt laminating.
Wedge-shaped grooves 17 are formed in the top ends of the sliding blocks 16, wedge-shaped inserting plates 18 are slidably mounted in the connecting plate body 8121 above the sliding blocks 16 in the vertical direction, the top ends of the wedge-shaped inserting plates 18 extend out of the connecting plate body 8121, and the bottom ends of the wedge-shaped inserting plates 18 are slidably inserted into the wedge-shaped grooves 17.
Referring to fig. 11 and 12, when the semiconductor product is placed on the support plate body 8122, the push plate 19 is located at one side of the semiconductor product and is adhered to the side wall of the semiconductor product. When the access plate 812 moves upward and approaches the top plate 811, the top end of the wedge plate 18 abuts the top plate 811, and as the access plate 812 moves upward, the top plate 811 pushes the wedge plate 18 downward, and the wedge plate 18 moves downward in the wedge groove 17, thereby pushing the slider 16 to move toward the semiconductor product. When the sliding block 16 moves, the reset elastic piece 21 is pulled to stretch and deform, meanwhile, the sliding block 16 also drives the buffer elastic piece 20 to move, and the buffer elastic piece 20 acts on the pushing plate 19, so that the pushing plate 19 abuts against a semiconductor product, and the semiconductor product is accurately positioned, so that errors are not easy to occur in film attachment.
When the pushing plate 19 is abutted against the semiconductor product, the sliding block 16 extrudes the buffering elastic piece 20, so that the buffering elastic piece 20 contracts and deforms, the buffering elastic piece 20 buffers the thrust of the sliding block 16, and the pushing plate 19 can always be abutted against the semiconductor product and is not easy to damage the semiconductor product due to overlarge extrusion force.
When the pressing of the semiconductor product is completed and the butt strap 812 moves downwards, the top end of the wedge-shaped plugboard 18 is separated from the top plate 811, the reset elastic piece 21 is contracted and reset, the buffer elastic piece 20 is stretched and reset, the reset elastic piece 21 and the buffer elastic piece 20 act on the sliding block 16 together in the reset process, the sliding block 16 moves and resets, the sliding block 16 moves and acts on the wedge-shaped plugboard 18 through the wedge-shaped groove 17, the wedge-shaped plugboard 18 moves upwards and resets, and therefore accurate positioning of the semiconductor product is facilitated again.
The implementation principle of the embodiment 2 is as follows: when the butt strap 812 moves upward, the wedge-shaped plugboard 18 acts on the push plate 19 through the sliding block 16 and the buffer elastic piece 20, so that the push plate 19 abuts against the semiconductor product, and the semiconductor product is accurately positioned, so that errors are not easy to occur in film attachment.
Example 3:
the embodiment of the application discloses a vacuum lamination method for a semiconductor product.
Referring to fig. 13, a vacuum lamination method for semiconductor products, which adopts the vacuum lamination device for semiconductor products, comprises the following steps:
S1: placing one semiconductor product on the butt strap 812 of the upper die assembly 81, the upper die assembly 81 performs limit fixation on the first semiconductor product, placing the second semiconductor product on the bottom plate 821 of the lower die assembly 82, the lower die assembly 82 performs limit fixation on the second semiconductor product, placing the film on the feeding plate 91 of the conveying mechanism in the feeding chamber 3, closing the first sealing door 10, closing the second sealing door 11, opening the third sealing door 72, closing the fourth sealing door 73, and sealing the first vacuum chamber 4 and the second vacuum chamber
Vacuumizing the cavity 5;
S2: the third vacuum cavity 12 is communicated with the first vacuum cavity 4, after the first vacuum cavity 4 and the second vacuum cavity 5 are vacuumized, the third vacuum cavity 12 is also in a vacuum state, the fourth sealing door 73 is opened, at the moment, the first vacuum cavity 4 and the second vacuum cavity 5 are communicated through the third vacuum cavity 12, the film is firstly fed into the first vacuum cavity 4 by the feeding mechanism 9, the film is positioned under the semiconductor product in the upper die assembly 81, the film is then driven to move upwards and be attached to the adhesive layer of the semiconductor product, and the feeding mechanism 9 moves and resets
Thereafter, the third sealing door 72 is closed;
S3: the driving assembly 83 drives the lower die assembly 82 to move upwards and press the two semiconductor products, and simultaneously, the second vacuum chamber 5 breaks the vacuum state, the second sealing door 11 is opened, the film is put on the feeding plate 91 in the feeding chamber 3, and after the second sealing door 11 is closed, the second vacuum chamber 5 and the third vacuum
The cavity 12 is communicated, and the second vacuum cavity 5 is vacuumized;
S4: when the semiconductor products are pressed and the first vacuum cavity 4 and the second vacuum cavity 5 are in a vacuum state, the fourth sealing door 73 is closed, the third sealing door 72 is opened, the vacuum state of the first vacuum cavity 4 is broken, the first sealing door 10 is opened, the semiconductor products are taken out and put into the two semiconductor products, the first sealing door 10 is closed, the first vacuum cavity 4 is communicated with the third vacuum cavity 12, and the first vacuum cavity 4 is vacuumized, so that the first vacuum cavity 4 and the second vacuum cavity 5 are in a vacuum state;
S5: repeating the steps S2-S4, and pressing the semiconductor product again.
The implementation principle of the embodiment 3 is as follows: the film is in a vacuum state in the attaching and pressing processes, so that bubbles are not easy to occur, and the qualification rate of semiconductor finished products is improved; in the lamination process of the semiconductor product, a film can be added in advance, so that the production efficiency of the semiconductor product is improved.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (10)
1. A semiconductor product vacuum lamination device is characterized in that: the vacuum feeding device comprises a base (1), wherein a processing chamber (2) and a feeding chamber (3) are arranged on the base (1), a first vacuum chamber (4) is formed in the processing chamber (2), a second vacuum chamber (5) is formed in the feeding chamber (3), a vacuumizing mechanism (6) is arranged on the base (1), the vacuumizing mechanism (6) is respectively communicated with the first vacuum chamber (4) and the second vacuum chamber (5) and vacuumizes, a connecting mechanism (7) is arranged on the base (1), and the connecting mechanism (7) is connected with the processing chamber (2) and the feeding chamber (3) and is used for communicating or disconnecting the first vacuum chamber (4) and the second vacuum chamber (5);
the processing chamber (2) is provided with a first sealing door (10) in an opening and closing manner, the processing chamber (2) is internally provided with a pressing mechanism (8) for placing two semiconductor products and pressing, the feeding chamber (3) is provided with a second sealing door (11) in an opening and closing manner, the feeding chamber (3) is internally provided with a feeding mechanism (9) for placing films, and the feeding mechanism (9) conveys the films into the first vacuum chamber (4) and attaches the films to a semiconductor product adhesive layer;
When the feeding mechanism (9) conveys the film, the first vacuum cavity (4) is communicated with the second vacuum cavity (5) and is in a vacuum state; when the pressing mechanism (8) is used for pressing, the first vacuum cavity (4) and the second vacuum cavity (5) are disconnected, the first vacuum cavity (4) is in a vacuum state, the second vacuum cavity (5) breaks the vacuum state, and the second sealing door (11) is opened to put the film into the feeding mechanism (9); after the pressing mechanism (8) completes pressing, the first vacuum cavity (4) and the second vacuum cavity (5) are disconnected, the first vacuum cavity (4) breaks the vacuum state, the second vacuum cavity (5) is in the vacuum state, and the first sealing door (10) is opened to take out the semiconductor finished product and put the semiconductor finished product into a new semiconductor product.
2. The semiconductor product vacuum lamination device according to claim 1, wherein: the connecting mechanism (7) comprises a connecting chamber (71), a third sealing door (72) and a fourth sealing door (73), wherein the connecting chamber (71) is arranged on the base (1) and is connected with the processing chamber (2) and the feeding chamber (3), a third vacuum chamber (12) is formed in the connecting chamber (71), the third sealing door (72) is arranged on one side, close to the processing chamber (2), of the third vacuum chamber (12) of the connecting chamber (71) in an opening and closing mode and is used for connecting or disconnecting the first vacuum chamber (4) and the third vacuum chamber (12), and the fourth sealing door (73) is arranged on one side, close to the feeding chamber (3), of the third vacuum chamber (12) of the connecting chamber (71) in an opening and closing mode and is used for connecting or disconnecting the second vacuum chamber (5) and the third vacuum chamber (12).
3. The semiconductor product vacuum lamination device according to claim 1, wherein: the pressing mechanism (8) comprises an upper die assembly (81), a lower die assembly (82) and a driving assembly (83), wherein the upper die assembly (81) is arranged in the processing chamber (2) and used for limiting a semiconductor product, the feeding mechanism (9) is used for conveying a film to be attached to the semiconductor product in the upper die assembly (81), the lower die assembly (82) is arranged in the processing chamber (2) and used for limiting another semiconductor product, and the driving assembly (83) is arranged in the processing chamber (2) and used for driving the lower die assembly (82) to move up and down.
4. A semiconductor product vacuum bonding apparatus according to claim 3, wherein: go up mould subassembly (81) including roof (811), two butt strap (812) and a plurality of lifting part (813), roof (811) is fixed to be set up at the top of processing chamber (2) first vacuum chamber (4), a plurality of lifting part (813) symmetry set up in the both sides of roof (811), two butt strap (812) symmetry set up in the both sides of roof (811) and lie in roof (811) below, butt strap (812) and lifting part (813) lift end fixed connection, and semiconductor product is placed on two butt strap (812), just lifting part (813) support semiconductor product tightly on the diapire of roof (811) through butt strap (812).
5. The apparatus of claim 4, wherein: the lower die assembly (82) comprises a bottom plate (821) and a plurality of first limiting pins (822), the bottom plate (821) is arranged at the bottom of a first vacuum cavity (4) of the processing chamber (2), the bottom plate (821) is located under the top plate (811) and fixedly connected with the driving end of the driving assembly (83), a plurality of first limiting pins (822) are arranged on the top wall of the bottom plate (821), a semiconductor product is placed on the top wall of the bottom plate (821), and a plurality of first limiting pins (822) are abutted to the peripheral side wall of the semiconductor product.
6. The apparatus of claim 4, wherein: the access board (812) comprises a connecting plate body (8121) and a supporting plate body (8122), the connecting plate body (8121) is fixedly arranged at the driving end of the lifting part (813), the supporting plate body (8122) is arranged at the bottom end, close to the central side wall of the top plate (811), of the connecting plate body (8121), the thickness of the supporting plate body (8122) is smaller than that of the connecting plate body (8121), the semiconductor product is placed on the supporting plate body (8122), and the side wall of the semiconductor product is abutted against the side wall of the connecting plate body (8121).
7. The apparatus of claim 6, wherein: the connecting plate body (8121) is close to the side wall of the supporting plate body (8122) and is positioned on the installation side of the semiconductor product, a chamfer (13) is formed in the top wall of the connecting plate body (8121), a limiting groove (14) is formed in the top wall of the connecting plate body (8121), and the semiconductor product is positioned in the limiting groove (14).
8. The semiconductor product vacuum lamination device according to claim 1, wherein: feeding mechanism (9) are including delivery board (91), translation subassembly (92), lifting unit (93) and a plurality of second spacer pin (94), translation subassembly (92) set up in pay-off room (3), lifting unit (93) set up the drive end at translation subassembly (92), delivery board (91) set up the drive end at lifting unit (93), and the film is placed on delivery board (91), and is a plurality of second spacer pin (94) set up on the roof of delivery board (91) and spacing to the film.
9. The apparatus of claim 6, wherein: one connecting plate body (8121) has seted up spout (15) in, connecting plate body (8121) is located in spout (15) along perpendicular butt strap (812) direction of lifting sliding mounting have slider (16), wedge groove (17) have been seted up on the top of slider (16), along butt strap (812) direction of lifting sliding in connecting plate body (8121) be provided with wedge picture peg (18), connecting plate body (8121) are stretched out on the top of wedge picture peg (18), and the bottom slip grafting is in wedge groove (17) of slider (16), works as when butt strap (812) upwards move, wedge picture peg (18) top butt roof (811) and drive slider (16) towards being close to the semiconductor product direction through wedge groove (17), connecting plate body (8121) are located slider (16) and are close to semiconductor product one side and are provided with push pedal (19), the lateral wall butt semiconductor product of slider (16) is kept away from to push pedal (19), be provided with between slider (16) and push pedal (19) buffer elastic component (20), slider (19) one side that slider (16) kept away from is provided with reset elastic component (21).
10. A vacuum lamination method for semiconductor products is characterized in that: a vacuum lamination device for semiconductor products according to any one of claims 1 to 9, comprising the steps of:
S1: placing two semiconductor products on a pressing mechanism (8) in a processing chamber (2), placing a film on a conveying mechanism in a feeding chamber (3), opening a third sealing door (72), closing a fourth sealing door (73), and vacuumizing a first vacuum chamber (4) and a second vacuum chamber (5);
s2: after the vacuumizing is finished, opening a fourth sealing door (73), firstly conveying the film into the first vacuum cavity (4) by a feeding mechanism (9), then driving the film to be movably attached to a glue layer of a semiconductor product, and closing the third sealing door (72) after the feeding mechanism (9) is moved and reset;
s3: the pressing mechanism (8) presses the two semiconductor products, simultaneously, the second vacuum cavity (5) breaks the vacuum state, the second sealing door (11) is opened, the film is put on the conveying mechanism in the feeding chamber (3),
After the second sealing door (11) is closed, vacuumizing the second vacuum cavity (5);
S4: after the semiconductor products are pressed, the fourth sealing door (73) is closed, the third sealing door (72) is opened, the vacuum state of the first vacuum cavity (4) is broken, the first sealing door (10) is opened, the semiconductor products are taken out and put into two semiconductor products, the first sealing door (10) is closed, and the first vacuum cavity (4) is vacuumized;
S5: repeating the steps S2-S4, and pressing the semiconductor product again.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137509A (en) * | 2011-12-02 | 2013-06-05 | 上海微电子装备有限公司 | Device for wafer bonding and wafer bonding method |
| CN114412752A (en) * | 2022-03-28 | 2022-04-29 | 常州铭赛机器人科技股份有限公司 | Segmented vacuum working apparatus and method of using the same |
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| KR101664090B1 (en) * | 2014-12-08 | 2016-10-10 | (주)다인스 | Vacuum laminator and method for laminating using the same |
| CN114801149B (en) * | 2022-04-29 | 2024-01-12 | 北海惠科半导体科技有限公司 | Film pressing method of vacuum film press and vacuum film press |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137509A (en) * | 2011-12-02 | 2013-06-05 | 上海微电子装备有限公司 | Device for wafer bonding and wafer bonding method |
| CN114412752A (en) * | 2022-03-28 | 2022-04-29 | 常州铭赛机器人科技股份有限公司 | Segmented vacuum working apparatus and method of using the same |
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