CN117961312A - Machining system and machining method for improving laser thermal protection performance of material - Google Patents

Abstract

The invention provides a processing system and a processing method for improving laser thermal protection performance of materials, and relates to the technical field of laser protection. According to the invention, the laser is vertically transmitted to the processing platform, so that the surface structure of the workpiece is carved and processed, the complexity of the surface of the workpiece is enhanced, the laser reflectivity is increased, the incident energy is reduced, the surface area of the workpiece is increased, the heat radiation capacity of the material is increased, and the laser thermal protection performance of the material is improved.

Description

Machining system and machining method for improving laser thermal protection performance of material

Technical Field

The invention relates to the technical field of laser protection, in particular to a processing system and a processing method for improving laser thermal protection performance of materials.

Background

Lasers are used in the field of military weapons because of their ability to focus extremely high power over long distances onto tiny spots. In order to avoid and resist the threat of high-energy laser weapons, the most common protection mode at present is to use a laser protection material, but the main current laser protection material is a common smooth single-layer material, and due to the complexity of the action of the laser weapons and the material and the uncertainty of the material preparation, the protection effect of various smooth surface materials on the laser weapons is limited, and the protection purpose cannot be achieved.

Disclosure of Invention

The invention aims to improve the protective performance of a laser protective material.

Therefore, the invention provides a processing system for improving the laser thermal protection performance of a material, which comprises a laser emitter, a laser beam shaping system, a processing platform and a laser focusing system, wherein the processing platform is used for bearing a workpiece, the laser beam shaping system is used for shaping and conducting laser emitted by the laser emitter to the surface of the workpiece, the laser focusing system is positioned on a laser path between the laser beam shaping system and the processing platform and used for conducting the laser to the surface of the workpiece perpendicular to the processing platform, and the processing platform is used for driving the workpiece to move in space so as to enable the laser to process a surface structure on the surface of the workpiece, the surface structure is a plurality of cone structures, and a plurality of cone structure arrays are closely arranged.

Optionally, the laser focusing system includes laser mirror group, the laser beam shaping system includes by the iris, beam expander, mirror group, focusing mirror, fiber coupler, optic fibre, collimating mirror and focusing objective that laser passed through in proper order, the laser mirror group sets up the collimating mirror with between the focusing objective, the collimating mirror the laser mirror group is located first straight line light path, the laser mirror group the focusing objective the processing platform is located with first straight line light path is on the second straight line light path that is perpendicular, the second straight line light path with the processing platform is perpendicular.

Optionally, the processing system for improving the laser thermal protection performance of the material further comprises a focusing observation system, wherein the focusing observation system is positioned on the second linear optical path, and the laser reflecting mirror group is used for adjusting the imaging definition of the workpiece on the focusing observation system.

Optionally, the focusing observation system comprises an attenuation sheet, an optical filter, a CCD and an optical lens which are sequentially arranged along the second linear light path, and the optical lens is used for observing the workpiece.

Optionally, the processing system for improving the laser thermal protection performance of the material further comprises a red light source, wherein the red light source is used for irradiating the workpiece.

Optionally, the processing system for improving the laser thermal protection performance of the material further comprises a gas protection system for spraying a protection gas to the workpiece.

Optionally, the processing system for improving the laser thermal protection performance of the material further comprises a control system, and the control system is electrically connected with the laser emitter, the laser focusing system and the processing platform.

Compared with the prior art, the processing system for improving the laser thermal protection performance of the material has the beneficial effects that:

according to the invention, the laser is emitted by the laser emitter, the laser beam shaping system is arranged behind the laser emitter, the laser passes through the laser beam shaping system, stray light at the edge of the laser can be filtered, the laser beam is expanded, the processing platform is arranged behind the laser beam shaping system, a workpiece can be placed on the processing platform, the laser focusing system is also arranged, the laser passes through the laser focusing system, the laser direction can be changed, the laser is vertically transmitted to the processing platform, the workpiece on the processing platform is depicted and processed, the processing platform can drive the workpiece to randomly move in space, the laser position is not moved, so that the laser is enabled to process and depicted a surface structure on the surface of the workpiece according to a laser processing path, the surface structure is a plurality of cone structures which are closely arranged in an array, and the root parts of the adjacent cone structures are closely adjacent to each other without intervals.

In addition, in order to solve the problems, the invention also provides a processing method for improving the laser thermal protection performance of the material, which is used for the processing system for improving the laser thermal protection performance of the material, and comprises the following steps,

Placing white paper on a processing platform, turning on a laser emitter with first power, and adjusting a laser focusing system until light spots on the white paper are circular;

Taking the white paper, placing a standard sample on the processing platform, moving the processing platform, and adjusting the laser focusing system until the light spot irradiated by the laser on the standard sample is the minimum light spot;

Taking the standard sample, and placing a machined part on the machining platform;

And adjusting the power of the laser transmitter to the second power and the first frequency, and moving the processing platform for a plurality of times until the surface of the workpiece is processed into a surface structure.

Optionally, the first power is 0 to 50mw, the second power is 10 to 50w, the first frequency is 20kHz to 100mHz, the moving speed of the processing platform is 1 to 25mm/s, and the moving number of the processing platform is 1 to 25 times.

Optionally, the processing method for improving the laser thermal protection performance of the material further comprises the following steps:

Observing the processing depth of the surface structure and comparing the processing depth with a standard depth;

If the machining depth is greater than the standard depth, reducing the second power and the moving times, improving the moving speed, and reprocessing;

And if the machining depth is smaller than the standard depth, the second power and the moving times are increased, the moving speed is reduced, and the machining is restarted.

Compared with the prior art, the control method of the processing system for improving the laser thermal protection performance of the material has the technical effects approximately the same as those of the processing system for improving the laser thermal protection performance of the material, and the technical effects are not repeated here.

Drawings

FIG. 1 is a schematic diagram of a processing system for improving laser thermal protection performance of a material according to an embodiment of the present invention;

FIG. 2 is a laser processing path diagram of a processing system for improving laser thermal protection performance of a material according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a surface structure of a processing system for improving laser thermal protection performance of a material according to an embodiment of the present invention;

FIG. 4 is an overall system diagram of a processing system for improving laser thermal protection of a material according to an embodiment of the present invention;

Fig. 5 is a flowchart of a processing method for improving laser thermal protection performance of a material according to an embodiment of the present invention.

Reference numerals illustrate:

1-a power supply; 2-a laser emitter; 3-a laser beam shaping system; 301-an iris; 302, a beam expander; 303—a mirror group; 304-a focusing mirror; 305-a set of fiber optic couplers; 306-an optical fiber; 307-collimator lens; 308-focusing an objective lens; 4-a laser focusing system; 401-focusing drive; 402-a laser mirror group; 5-a gas protection system; 501-a gas output path; 502-gas injection holes; 6-a red light source; 7-focusing an observation system; 701-an attenuation sheet; 702-an optical filter; 703-CCD; 704-an optical lens; 8-a processing platform; 801-XY axis two-dimensional displacement platform; 802-Z axis electric lifting platform; 9-a control system; 901-a laser parameter control system; 902—a focus-observing control system; 903—a gas parameter control system; 904—a motion parameter control system; 10-machining a workpiece; 11-laser processing path.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.

It should be noted that, in the description of the present disclosure, the directions or positional relationships indicated by "upper", "lower", "left", "right", "top", "bottom", "front", "rear", "inner" and "outer", etc. are used based on the directions or positional relationships shown in the drawings, only for convenience of describing the present disclosure, and are not intended to indicate or imply that the apparatus referred to must have a specific direction, be configured and manipulated in a specific direction, and therefore should not be construed as limiting the scope of protection of the present disclosure.

In the coordinate system XYZ provided herein, the X-axis forward direction represents the right, the X-axis reverse direction represents the left, the Y-axis forward direction represents the front, the Y-axis reverse direction represents the rear, the Z-axis forward direction represents the upper, and the Z-axis reverse direction represents the lower. Also, it is noted that the terms "first," "second," and the like in the description and claims of the present invention and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein.

Moreover, although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the different dependent claims and the features described herein may be combined in ways not otherwise described in the original claims. It is also to be understood that features described in connection with separate embodiments may be used in other described embodiments.

In order to solve the above problems, as shown in fig. 1 and 3, the present invention provides a processing system for improving the laser thermal protection performance of a material, which includes a laser emitter 2, a laser beam shaping system 3, a processing platform 8, and a laser focusing system 4, wherein the processing platform 8 is used for carrying a workpiece 10, the laser beam shaping system 3 is used for shaping and conducting the laser emitted by the laser emitter 2 to the surface of the workpiece 10, the laser focusing system 4 is located on a laser path between the laser beam shaping system 3 and the processing platform 8, and is used for conducting the laser perpendicular to the processing platform 8 to the surface of the workpiece 10, and the processing platform 8 is used for driving the workpiece 10 to move in space so as to make the laser process a surface structure on the surface of the workpiece 10, the surface structure is a plurality of cone structures, and a plurality of cone structure arrays are closely arranged.

In this embodiment, through setting up laser emitter 2 and setting up laser beam shaping system 3 behind laser emitter 2, laser beam passes through laser beam shaping system 3, but the stray light at laser edge is filtered, and expand laser beam, set up processing platform 8 behind laser beam shaping system 3, work piece 10 can place on processing platform 8, still set up laser focusing system 4, laser beam passes through laser focusing system 4, can change the direction of laser, make laser vertically transmit to processing platform 8, carry out the depiction processing to work piece 10 on processing platform 8, processing platform 8 can drive work piece 10 and move wantonly in the space, the laser position is motionless, so that laser is according to laser processing route 11 at work piece 10 surface processing and is depicted surface structure, surface structure is a plurality of cone structures that the array was closely arranged, see the fig. 3, a plurality of cone structures array arrangement and adjacent cone structure's root closely adjoin the no interval, set up like this can strengthen the surface complexity of work piece 10 on the one side, increase the reflectivity to laser, reduce the incident energy of laser that transmits to work piece 10 surface, on the other hand improved work piece 10 surface structure's area, increase material heat dissipation, the realization material, the thermal energy is of material has, the realization, the protective effect is large is wide, the protective effect is covered.

Specifically, the laser transmitter 2 may be a picosecond laser transmitter 2, the processing platform 8 may include an XY-axis two-dimensional displacement platform 801 and a Z-axis electric lifting platform 802, the XY-axis two-dimensional displacement platform 801 may drive the workpiece 10 to move in a horizontal plane, the Z-axis electric lifting platform 802 may drive the workpiece 10 to move in a height direction, the XY-axis two-dimensional displacement platform 801 and the Z-axis electric lifting platform 802 cooperate to drive the workpiece 10 to move randomly in a space, so as to facilitate processing a surface structure, the laser processing path 11 is shown in fig. 2, and is integrally in a grid shape, and is composed of a plurality of transverse straight lines and a plurality of longitudinal straight lines, and is arranged in the same-direction straight lines at equal intervals, the distance is 10 μm, the different-direction straight lines are mutually perpendicular, each straight line is ensured to intersect all the different-direction straight lines, two ends are 10 μm longer, the height of the cone structure is 20 μm, and the surface roughness of the workpiece 10 is lower than 1 μm.

Optionally, the laser focusing system 4 includes a laser mirror group 402, the laser beam shaping system 3 includes an iris 301, a beam expander 302, a mirror group 303, a focusing mirror 304, an optical fiber coupler 305, an optical fiber 306, a collimating mirror 307, and a focusing objective 308 that the laser beam sequentially passes through, the laser mirror group 402 is disposed between the collimating mirror 307 and the focusing objective 308, the collimating mirror 307 and the laser mirror group 402 are located on a first linear optical path, the laser mirror group 402, the focusing objective 308, and the processing platform 8 are located on a second linear optical path perpendicular to the first linear optical path, and the second linear optical path is perpendicular to the processing platform 8.

In this embodiment, by sequentially setting the iris 301, the beam expander 302, the mirror group 303, the focusing mirror 304, the fiber coupler 305, the fiber 306, the collimator 307 and the focusing objective 308, the iris 301 can filter out stray light at the edge of the laser beam generated by the laser transmitter 2, the beam expander 302 can expand the diameter of the laser beam, so that the focusing mirror 304 can obtain a light spot with smaller diameter, and the mirror group 303 can reflect the laser beam to the focusing mirror 304; the focusing mirror 304 can focus the transmitted laser beam into the optical fiber coupler 305 to be transmitted by the optical fiber 306, the optical fiber coupler 305 can couple the focused laser beam into the optical fiber 306 to the greatest extent and transmit the focused laser beam along the optical fiber 306, so as to ensure that the loss of laser energy in the transmission of the optical fiber 306 is minimum, the collimating mirror 307 can adjust outgoing light emitted by the optical fiber coupler 305 into parallel light, the focusing objective 308 can focus the laser parallel beam to the surface of the workpiece 10, the laser reflecting mirror group 402 is arranged between the collimating mirror 307 and the focusing objective 308, the collimating mirror 307 and the laser reflecting mirror group 402 are positioned on a first straight line, the laser reflecting mirror group 402 and the focusing objective 308 are positioned on a second straight line, namely, the laser reflecting mirror group 402 is positioned on the intersection point of the first straight line and the second straight line, and the laser reflecting mirror group 402 can change the transmission direction of the laser, so that the laser can be vertically transmitted to the processing platform 8 through the focusing objective 308.

Specifically, the laser beam shaping system 3 further includes a ruby nozzle disposed between the focusing objective 308 and the processing platform 8, and the ruby nozzle has the characteristics of high wear resistance, high hardness and high stability, so as to improve the stability of laser transmission. The laser focusing system 4 further comprises a focusing driver 401, the laser mirror group 402 comprises a first laser mirror and a second laser mirror, the first laser mirror is located on the first linear light path, the second laser mirror is located on the intersection point of the first linear light path and the second linear light path, the position and the angle of the first laser mirror and the second laser mirror can be adjusted by the focusing driver 401, so that laser can be vertically transmitted to the processing platform 8 through the focusing objective 308, the area of a light spot formed by the laser on the workpiece 10 can be minimized, the light spot area is smaller, the energy which can be transmitted is larger, and the processing of the surface of the workpiece 10 is facilitated.

Optionally, as shown in fig. 1, the processing system for improving the laser thermal protection performance of the material further includes a focusing observation system 7, the focusing observation system 7 is located on the second linear optical path, and the laser mirror group 402 is used for adjusting the imaging definition of the workpiece 10 on the focusing observation system 7.

In this embodiment, by setting the focusing observation system 7, on the second straight line optical path of the focusing observation system 7, the light reflected by the processing platform 8 is transmitted to the focusing observation system 7 through the laser mirror group 402, the shape of the surface structure processed by the workpiece 10 can be observed through the focusing observation system 7, the angle and the position of the laser mirror group 402 can be adjusted, the imaging definition in the focusing observation system 7 can be changed, the focusing depth and the focusing state of the observed laser on the surface of the workpiece 10 can be used in cooperation with the laser mirror group 402, the area of the light spot formed by the laser on the workpiece 10 is minimum, the light spot area is about small, the larger the energy which can be transmitted is, the processing on the surface of the workpiece 10 is facilitated, and the processing efficiency of the workpiece 10 is facilitated to be adjusted.

Optionally, as shown in fig. 1, the focusing observation system 7 includes an attenuation plate 701, an optical filter 702, a CCD703, and an optical lens 704 sequentially disposed along a second straight optical path, and the optical lens 704 is used for observing the workpiece 10.

In this embodiment, by sequentially disposing the attenuation sheet 701, the optical filter 702, the CCD703, and the optical lens 704, the optical filter 702 is mainly used for changing the color and brightness of light, the attenuation sheet 701 is mainly used for weakening the light intensity, and the optical lens 704 can sense and receive the observation light; CCD703 (Charged Coupled Device) can convert the optical signals perceived by the lens into electrical signals to facilitate observation of the depth of focus and the state of focus of work piece 10 and the laser light on the surface of work piece 10.

Optionally, as shown in fig. 1, the processing system for improving the laser thermal protection performance of the material further includes a red light source 6, where the red light source 6 is used to irradiate the workpiece 10.

In this embodiment, by setting the red light source 6, the attenuation sheet 701 and the optical filter 702 are used in cooperation, and the attenuation sheet 701 and the optical filter 702 can filter out light rays with other wavelengths, so as to ensure the accuracy of observation.

Optionally, the processing system for improving laser thermal protection performance of the material further comprises a gas protection system 5, wherein the gas protection system 5 is used for spraying protection gas to the workpiece 10.

In this embodiment, by providing the gas protection system 5, the gas protection system 5 can spray gas onto the surface of the workpiece 10, so as to prevent the waste generated during processing of the workpiece 10 from splashing, and interfere with the optical lens 704, and affect the optical measurement result, thereby improving the accuracy of observation of the optical lens 704.

Specifically, the workpiece 10 may be a metal material, splash of metal droplets may occur during processing, the optical lens 704 may be polluted, and the gas protection system 5 is required to protect, as shown in fig. 1, the gas protection system 5 includes a gas output passage 501 and a gas injection hole 502, the gas injection hole 502 is disposed towards the workpiece 10, the speed of the output gas is 0.5-1L/s, and the gas protection is not required when the workpiece 10 is a nonmetallic material.

Optionally, the processing system for improving the laser thermal protection performance of the material further comprises a control system 9, wherein the control system 9 is electrically connected with the laser emitter 2, the laser focusing system 4 and the processing platform 8, so that the whole processing system automatically operates, and the working efficiency is improved.

In this embodiment, by providing the control system 9, the control system 9 can adjust the power of the laser transmitter 2, control the position and angle of the focusing system, and control the movement of the processing platform 8 in space.

Specifically, as shown in fig. 1 and 5, the device further includes a power supply 1, the power supply 1 is electrically connected with the laser emitter 2, the focusing and observing system 7, the processing workbench, the processing control system 9 and the gas protection system 5, and provides power for the processing system, the control system 9 includes a laser parameter control system 9019, a focusing and observing control system 9029, a gas parameter control system 9039 and a motion parameter control system 9049, the laser parameter control system 9019 can adjust the power and the frequency of the laser emitter 2, the focusing and observing control system 9029 is electrically connected with the focusing and observing drive 401, the focusing and observing drive 401 sends a signal to the focusing and observing control system 9029, the focusing and observing control system 9029 adjusts the position and the angle of the laser reflector set 402, the gas parameter control system 9039 can adjust the speed of the ejected gas, and the motion parameter control system 9049 can control the moving distance and the moving times of the processing platform 8.

In addition, as shown in fig. 4, another embodiment of the present invention provides a processing method for improving the laser thermal protection performance of a material, for the processing system for improving the laser thermal protection performance of a material, comprising the steps of,

Placing white paper on a processing platform 8, turning on a laser emitter 2 with first power, and adjusting a laser focusing system 4 until light spots on the white paper are circular;

taking the white paper, placing a standard sample on the processing platform 8, moving the processing platform 8, and adjusting the laser focusing system 4 until the light spot irradiated by the laser on the standard sample is the minimum light spot;

removing the standard sample and placing a workpiece 10 on the processing platform 8;

the laser transmitter 2 is powered to a second power and a first frequency and the work platform 8 is moved a plurality of times to work the surface of the work piece 10 to form a surface structure.

In this embodiment, a blank is placed on the surface of a processing table, a laser transmitter 2 is turned on with a first power, the first power is low, the low power laser does not damage the blank, the position of a reflector group is adjusted until a light spot formed by the laser on the blank is in a complete circle, at this time, the laser vertically irradiates the blank, the blank is taken out, a standard sample is placed on a processing platform 8, the processing platform 8 is moved, a laser focusing system 4 is adjusted, the standard sample is moved to a laser focus, 10 points are continuously punched on the standard sample by moving the processing platform 8 in the height direction at intervals of a first distance height, for example, 0.5mm, the radius of 10 points is observed, the position indicated by the minimum radius indicates that the laser spot is minimum when the laser focus is punched, the laser focus position is identified, the calibration of laser focus is completed, a standard sample wafer is taken down, the workpiece 10 is placed on the processing platform 8, at the moment, the position of the workpiece 10 is the position of the laser focus, the laser transmitter 2 is adjusted to be at a second power and a first frequency, the second power is high, the surface of the workpiece 10 is convenient to be marked and processed, the processing platform 8 is moved according to the laser processing path 11 shown in fig. 2 repeatedly, a surface structure is formed on the surface of the workpiece 10, on one hand, the surface complexity of the workpiece 10 can be enhanced, the reflectivity of laser is increased, the incident energy of the laser transmitted to the surface of the workpiece 10 is reduced, on the other hand, the area of the surface structure of the workpiece 10 is increased, the heat dissipation capacity of materials is increased, the improvement of the laser thermal protection performance of the materials is realized, and the laser focus calibration device has the advantages of low energy consumption, large coverage and good protection effect.

Specifically, in the process of irradiating laser on white paper, the processing platform 8 is moved in a direction away from the laser, so that the processing platform 8 is away from the laser focus, the area of a circular light spot formed by the laser on the white paper is increased, the observation is convenient, the laser focusing system 4 can be adjusted when a standard sample is placed on the processing platform 8, the laser focus is found, the clearest standard sample image for calibration can be observed in the optical lens 704, before the processing of the workpiece 10 is depicted, the laser processing path 11 can be input into the controller, and the controller controls the processing platform 8 to move according to the laser processing path 11.

Optionally, the first power is 0to 50mw, the second power is 10 to 50w, the first frequency is 20kHz to 100mHz, the moving speed of the processing platform 8 is 1 to 25mm/s, and the number of times of moving the processing platform 8 is 1 to 25 times.

In this embodiment, the first power is set to be between 0 and 50mw, most preferably 30mw, and is low power, so that damage to white paper is avoided, energy is saved, the second power is set to be between 10 and 50w, most preferably 40w, and is high power, the first frequency is set to be between 20kHz and 100mHz, preferably 80mHz, so that the workpiece 10 can be conveniently processed, the moving speed of the processing platform 8 is set to be between 1 and 25mm/s, preferably 20mm/s, the repeated moving times of the processing platform 8 are between 1 and 25 times, preferably 20 times, and the processing platform 8 is moved at the speed and times so that the surface of the workpiece 10 can be conveniently processed, and a surface structure is formed.

Optionally, the processing method for improving the laser thermal protection performance of the material further comprises the following steps:

Observing the processing depth of the surface structure and comparing the processing depth with a standard depth;

If the machining depth is greater than the standard depth, reducing the second power and the moving times, improving the moving speed, and reprocessing;

And if the machining depth is smaller than the standard depth, the second power and the moving times are increased, the moving speed is reduced, and the machining is restarted.

In this embodiment, during laser processing, the slower the moving speed, the deeper the processing depth, the observing the surface structure of the workpiece 10 by the laser observing system, the processing depth is compared with the standard depth, the standard depth may be 20mm, if the processing depth is greater than 20mm, the second power and the moving times are reduced, the moving speed is increased, and the workpiece 10 is replaced for reprocessing until the processing depth is 20mm; if the machining depth is less than 20mm, the second power and the number of movements are increased, the movement speed is reduced, the workpiece 10 is replaced for reprocessing until the machining depth is 20mm, and the surface structure of the workpiece 10 reaches the standard.

Although the present disclosure is described above, the scope of protection of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the invention.

Claims (10)

1. The utility model provides a processing system for improving material laser thermal protection performance, its characterized in that includes laser emitter (2), laser beam shaping system (3), processing platform (8), laser focusing system (4), processing platform (8) are used for bearing machined part (10), laser beam shaping system (3) are used for with laser shaping of laser emitter (2) transmission and conduction extremely machined part (10) surface, laser focusing system (4) are located on the laser path between laser beam shaping system (3) to processing platform (8), are used for making laser perpendicular to processing platform (8) conduction extremely machined part (10) surface, processing platform (8) are used for driving machined part (10) are removed in the space, so that laser is in machined part (10) surface processing surface structure, surface structure is a plurality of cone structures, a plurality of cone structure arrays closely set up.

2. The processing system for improving laser thermal protection performance of a material according to claim 1, wherein the laser focusing system (4) comprises a laser mirror group (402), the laser beam shaping system (3) comprises an iris (301), a beam expander (302), a mirror group (303), a focusing mirror (304), an optical fiber coupler (305), an optical fiber (306), a collimating mirror (307) and a focusing objective lens (308) which are sequentially penetrated by the laser, the laser mirror group (402) is arranged between the collimating mirror (307) and the focusing objective lens (308), the collimating mirror (307) and the laser mirror group (402) are positioned on a first linear light path, the laser mirror group (402), the focusing objective lens (308) and the processing platform (8) are positioned on a second linear light path perpendicular to the first linear light path, and the second linear light path is perpendicular to the processing platform (8).

3. The processing system for improving laser thermal protection of a material according to claim 2, further comprising a focusing and viewing system (7), the focusing and viewing system (7) being located on the second linear optical path, the laser mirror group (402) being used to adjust the imaging sharpness of the workpiece (10) on the focusing and viewing system (7).

4. A processing system for improving laser thermal protection performance of a material according to claim 3, wherein the focusing observation system (7) comprises an attenuation sheet (701), an optical filter (702), a CCD (703) and an optical lens (704) arranged in this order along a second straight optical path, and the optical lens (704) is used for observing the workpiece (10).

5. The processing system for improving laser thermal protection of a material according to claim 4, further comprising a red light source (6), the red light source (6) being adapted to impinge on the work piece (10).

6. The processing system for improving laser thermal protection of a material according to claim 1, further comprising a gas protection system (5), the gas protection system (5) being adapted to inject a shielding gas towards the work piece (10).

7. The processing system for improving laser thermal protection of a material according to claim 2, further comprising a control system (9), said control system (9) being electrically connected to said laser transmitter (2), said laser focusing system (4), said processing platform (8).

8. A processing method for improving laser thermal protection performance of a material based on the processing system for improving laser thermal protection performance of a material according to any one of claims 1 to 7, characterized by comprising the steps of:

Placing white paper on a processing platform (8), turning on a laser emitter (2) with first power, and adjusting a laser focusing system (4) until light spots on the white paper are round;

Taking out the white paper, placing a standard sample wafer on the processing platform (8), moving the processing platform (8), and adjusting the laser focusing system (4) until the light spot irradiated by the laser on the standard sample wafer is the minimum light spot;

taking the standard sample and placing a workpiece (10) on the processing platform (8);

Adjusting the power of the laser transmitter (2) to a second power and a first frequency, and moving the machining platform (8) a plurality of times until the surface of the workpiece (10) is machined to form a surface structure.

9. The method of claim 8, wherein the first power is 0 to 50mw, the second power is 10 to 50w, the first frequency is 20kHz to 100mHz, the speed of movement of the processing table (8) is 1 to 25mm/s, and the number of movements of the processing table (8) is 1 to 25.

10. The method of claim 9, further comprising the step of:

Observing the processing depth of the surface structure and comparing the processing depth with a standard depth;

If the machining depth is greater than the standard depth, reducing the second power and the moving times, improving the moving speed, and reprocessing;

And if the machining depth is smaller than the standard depth, the second power and the moving times are increased, the moving speed is reduced, and the machining is restarted.